JPH0823199A - Printed board supporting device - Google Patents

Abstract

PURPOSE:To do without requiring much labor in attaching or detaching a backup pin for supporting a printed board corresponding to a magnitude of the board. CONSTITUTION:When a support plate moving motor 33 is rotated by size data of a printed board, a screw axis 32 is rotated, and when a support plate 14 fixed to a nut part 31 in mesh with the screw axis 32 moves along a guide rod 25, each support plate 14 moves via a coupling plate 29 to obtain an arrangement conforming to a size of the board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board supporting device for supporting a lower surface of a printed circuit board guided by a pair of chutes by a plurality of supporting members.

[0002]

2. Description of the Related Art A printed circuit board supporting device of this type is disclosed in Japanese Patent Application Laid-Open No.
Japanese Patent Laid-Open No. 301029 discloses that a removable backup pin is inserted on a table and supports the lower surface of the printed circuit board guided by the backup pin to the transport chute.

[0003]

However, in the above-mentioned prior art, when the interval between the transfer chutes is changed depending on the size of the printed circuit board to be supported, it is moved to support a substrate smaller than the conventional one. By setting up so that the backup pin is not placed at the lower end of the chute, and to support a larger board up to now, the range of placement is increased according to the size of the board. The position of the backup pin had to be inserted and removed and changed, which was troublesome.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to eliminate the trouble of inserting and removing a backup pin for supporting a printed circuit board according to the size of the board.

[0005]

For this reason, the present invention provides a printed circuit board supporting apparatus for supporting the lower surface of a printed circuit board guided by a pair of chutes by a plurality of supporting members, which is one of a plurality of the supporting members. A support range changing mechanism for changing the distance between the support members and changing the supportable range of the substrate only by driving one support member is provided.

Further, the present invention provides a printed circuit board supporting device which supports a lower surface of a printed circuit board guided by a pair of chutes by a plurality of supporting members and is movable such that the chutes have variable chutes. A moving mechanism that moves the positions of the plurality of support members in accordance with the movement of the chute in accordance with the interval between the chutes is provided.

Further, according to the present invention, the lower surface of the printed circuit board guided by a pair of chutes is supported by a plurality of supporting members, and the chutes are driven by a chute-interval changing drive source so that the intervals between the chutes can be varied. In a possible printed circuit board supporting device, a moving driving means separate from a chute interval changing driving source for changing the positions of the plurality of supporting members is provided.

[0008]

According to the structure of claim 1, the support changing mechanism changes the supportable range of the substrate by changing the distance between the supporting members only by driving one supporting member. According to the structure of claim 2, the movement mechanism moves the position of the support member in accordance with the movement of the chute in accordance with the interval of the chute.

According to the structure of claim 3, the movement drive means changes the positions of the plurality of support members separately from the chute interval changing drive source.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. In FIG. 2, reference numeral 1 is a base of the electronic component automatic mounting apparatus, and 2 is a rotary table having a mounting head 3 on the periphery. The mounting head 3 takes out a chip-shaped electronic component 13 (see FIG. 4) from a component supply unit (not shown) and conveys the component by intermittent rotation of the rotary table 2. 4 is X
Reference numeral 6 denotes an X table that moves in the X direction with respect to the base 1 in the horizontal plane by driving the motor 5, and 6 moves on the X table 4 in the Y direction orthogonal to the X direction by driving the Y motor 7. As a result, the XY table moves in the XY directions in the horizontal plane. Electronic component 1 carried by the head 3
3 is mounted by moving the table 6 at a desired position on a printed circuit board 8 which will be described later and is positioned and fixed on a fixed transfer chute 11 and a movable transfer chute 12 as a substrate guide member on the XY table 6. . 9 is a transfer chute 11, 12 for transferring the printed circuit board 8 from an upstream device.
And a discharge conveyor 10 for discharging and transporting the substrate 8 on the transport chutes 11 and 12 to a downstream device.

As shown in FIGS. 1 and 4, on the XY table 6, the transfer chutes 11 and 12 are provided so as to be movable up and down by a cylinder (not shown), and the chutes 11 and 12 are guided and transferred. A support plate 14 as a support member that abuts and supports the lower surface of the substrate 8 is provided in parallel with the plurality of chutes 11 and 12. The support plate 1
The upper surface of 4 is a horizontal flat surface so that the entire surface can contact the substrate 8. The movable conveying chute 12 is rotated by a chute moving motor 16 via a belt 17 and is rotated by ball screw shafts 18, 19, and a nut 20 is screwed to the screw shafts 18, 19 attached to the chute 12. , 21 to move toward and away from the chute 11. The movement is guided by the linear guides 22 and 23.

The support plate 14 is supported by a pair of guide rods 25 mounted on the XY table 6 in a direction orthogonal to the chutes 11 and 12, but when the chutes 11 and 12 are lowered. The chutes 11 and 12 are notched so that the guide rod 25 does not come into contact therewith. A connecting plate 29 pivotally supported by shafts 27, 28 is connected and connected between the supporting plates 14 at the lower surface of the supporting plate 14, and the connecting plate 29 is further connected between the supporting plates 14. A shaft portion 30 is rotatably connected at a portion intersecting with each other.

The support plate 1 closest to the movable transport chute 12
4, a pair of nut portions 31 are attached, and a pair of screw shafts 32 screwed into the nut portions 31 are rotated by a support plate moving motor 33 via a belt 34 to rotate the support plate 14. Is capable of reciprocating in the same direction as the moving direction of the chute 12. The support plate 14 closest to the fixed transport chute 11 is fixed to the end of the guide rod 25. By the movement of the support plates 14, the connecting plate 29 rotates around the shaft portion 27, the intervals between the support plates 14 are changed to equal intervals, and the respective support plates 14 move. The shaft portion 28 on the left side of FIG. 1 is planted in the support plate 14 as shown in FIGS. 6 and 7, and is fitted into a long hole portion 35 that is long in the longitudinal direction of the connecting plate 29 formed in the connecting plate 29. I'm standing. Shaft 27 planted in the support plate 14
Is fitted in a round hole formed in the connecting plate 29 to rotate the connecting plate 29 around the shaft portion 27, and the position of the shaft portion 28 of FIG. Even if it changes in the substrate transport direction, it can move within the elongated hole 35.

The linking mechanism for moving the support plate 14 is composed of the shaft portions 27, 28, 30 and the like, and the link mechanism constitutes a support range changing mechanism. The control block of the electronic component automatic mounting apparatus will be described with reference to FIG. 36 is CP
U, which controls various operations relating to component mounting according to programs stored in the ROM 38 based on various data stored in the RAM 37.

A support plate moving motor 33 and a chute moving motor 16 are connected to the CPU 36 via an interface 39 and a drive circuit 40. The RAM 37 stores, for each board type, mounting data in which data indicating the mounting position of the component 13 to be mounted on the board 8 is stored, and the size of the board for each board type as shown in FIG. The board size data shown is stored. X is X
Direction, that is, the size in the direction in which the substrate is transported, Y is X
The size in the direction orthogonal to the direction is shown.

The operation will be described below with the above configuration. First, the automatic operation of the electronic component automatic mounting apparatus is started by operating an operation unit (not shown). That is, CPU
36 reads out the board size data of the board type to be produced, which is stored in the RAM 37. When the board type to be produced is “AAA” in FIG. 9, the size in the Y direction is Y.
1, the screw motor 16 is rotated, the screw shafts 18 and 19 are rotated, and the nuts 20 screwed with the screw shafts 18 and 19,
The movable conveyance chute 12 with the fixed 21 is moved so that the substrate 8 of size Y1 can be conveyed by the chutes 11 and 12, for example, the chute intervals shown in FIGS. 1 and 4.

At the same time when the motor 16 is driven, the support plate moving motor 33 is driven by a command from the CPU 36, and the screw shaft 32 is rotated to shoot the nut portion 31, that is, the support plate 14 on the movable transport chute 12 side in accordance with the size Y1. Guide rod 25 at the position shown in FIGS.
Guide to move and stop. Along with the movement of the support plate 14 fixed to the nut portion 31, the support plates 14 move along the guide rods 25 via the connecting plate 29 while spreading at equal intervals, and as shown in FIG.
It is arranged over the entire surface between 1 and 12 without unevenness. The movement of the chute 12 and the movement of the support plate 14 are performed substantially at the same time,
Since the moving speeds are almost the same, they do not collide with each other.

Next, when the printed board 8 is supplied from the upstream device by the supply conveyor 9, the transfer arm (not shown) is moved to the transfer chutes 11 and 12 which are elevated to the same height position as the conveyor 9 by the cylinder (not shown). As a result, the substrate 8 moves while being guided in the grooves formed in the chutes 11 and 12, and the substrate 8 is placed on the XY table 6. When the chutes 11 and 12 are lowered by a cylinder (not shown), the upper surface of the support plate 14 contacts the lower surface of the substrate 8 and the chutes 11 and 12 are further lowered to cause the substrate 8 to move.
Is pushed up by the support plate 14 and is supported and fixed in the state shown in FIG. The substrate 8 is fixed laterally to a fixing means (not shown).

Next, the rotary table 2 is rotated and the mounting head 3 sucks and conveys the chip component 13 specified by the mounting data (not shown) from the component supply unit (not shown), and the X motor 5 and the Y motor. The printed circuit board 8 moved in the XY directions by the rotation of 7 and positioned at a predetermined position
The chip component 13 is mounted at a predetermined position in (1) and the component is mounted on the substrate 8 as shown in FIG. Part 13
Are sequentially mounted, and all components 1 to be mounted on the substrate 8
When 3 is mounted, the chutes 11 and 12 are raised by a cylinder (not shown) and are not supported by the support plate 14.

Next, the substrate 8 is transferred onto a discharge conveyor 10 by a transfer arm (not shown), and is discharged and conveyed by the conveyor 10 to a downstream apparatus. Simultaneously with this transfer, the next substrate 8 is transferred onto the chutes 11 and 12. In this way, when a predetermined number of substrates 8 are mounted, the automatic operation of the device is stopped.

Next, when the component type of the board 8 to be produced next is changed by the operation of the operation unit and the board 8 having a small size in the Y direction is designated, the CPU 36 reads this board size data, and the motor 33 and The rotation of the motor 16 causes the nut portion 31 and the chute 12 to move toward the chute 11. In this way, the interval between the chutes 11 and 12 is narrowed according to the width of the substrate 8, and the chutes 11 and 12 are
The support plates 14 are moved and arranged as shown in FIGS. 3 and 5 in a state where the distance between the support plates 14 is narrow so that the substrates 8 can be supported between them, and the substrates are arranged according to the size of the substrate 8.

Next, the substrate 8 is conveyed and placed between the chutes 11 and 12 in the same manner as described above.
By descending by 2, the chip component 13 is supported by the support plate 14 and the chip component 13 is mounted as described above. In this way, every time the size of the substrate 8 changes, the position of the chute 12 and the position of the support plate 14 are changed according to the size in the Y direction.

The movement of the chute 12 and the movement of the support plate 14 are preferably performed at the same time. However, when the chute spreads, the chute moves first, and when the chute narrows, the support plate moves. 14 may be moved first. The position of the support plate 14 may be controlled so that the distance between the chute 12 and the support plate 14 closest to the chute 12 is always constant. May be narrowed, or when the component 8 to be attached in advance is mounted on the lower surface of the substrate 8, that portion can be moved to a position where the support plate 14 can be avoided.

Further, the nut portion 31 screwed with the screw shaft 32.
Is fixed to the one closest to the chute 12, but the support plate 14 does not move in a generally widened or narrowed manner even if it is fixed to any support plate 14 other than the support plate 14 closest to the fixed transfer chute 11. Since it is performed, it may be fixed to any support plate 14 other than the one closest to the chute 11. In addition, in this embodiment, the drive of the two motors 16 and 33 is synchronized with each other to shoot the chute 1.
2 is moved and the support plate 14 is moved, the motor 33,
Instead of using the belt 34, the screw shaft 32, and the nut portion 32, the support plate 14 closest to the chute 12 is attached to the chute 12 at a predetermined interval to move the support plate 14 in conjunction with the movement of the chute 12. You may In this case, in this embodiment, since the chute 12 moves up and down with respect to the support plate 14, the chute 1 is placed at the position of the nut portion 31, for example.
A member that extends from 2 and extends in the up-down direction may be fixedly provided on the support plate 14 so that the pin can be moved by the movement of the pin.

Although the upper surface of the support plate 14 is flat in the present embodiment, the entire surface is not flat, and recesses are provided here and there so as not to come into contact with the substrate 8. Alternatively, a plurality of pins having the same height position on the upper surface may be provided on the support plate at appropriate intervals. As another embodiment, as shown in FIG. 10, a backup pin 45 and a support plate 46 are provided.
Alternatively, they may be removably inserted into the holes 47 formed at substantially equal intervals. In the embodiment of FIG. 10, the support plate 46 is moved by the same link mechanism as the support plate 14 of the first embodiment of FIG.

In this embodiment, the shoots 11 and 12 are XY test.
Shooting 1 though it moved up and down with respect to Bull 6.
The present embodiment is also applicable to a printed circuit board supporting device in which the positions of 1 and 12 do not change with respect to the base, and the XY table moves up and down relative to the base so that the XY table moves up and down relatively. It can be applied as it is. Further, although the chute 12 is moved by the motor 33 in this embodiment, the supporting plate 14, the connecting plate 29, and the guide plate may be moved by a manual method in which the screw shaft is turned by a handle to move the chute 12. The mechanism of the rod 25 may be as in this embodiment, the nut portion 31 may be provided on the support plate 14 closest to the chute 12, and the screw shaft 32 may be rotated by the motor 33. For example, the support plate 14 may be manually moved by manually turning the screw shaft 32 with a handle, or as described above, when the support plate 14 is attached to the chute 12 and the chute 12 is moved, the support plate is interlocked. 14 may be moved.

Further, in the present embodiment, the printed circuit board supporting device used for the electronic component automatic mounting device for mounting the chip component on the printed circuit board has been described. For example, it is provided upstream of the mounting device and mounted by the mounting device. A similar substrate supporting device is also used in an adhesive coating device that coats an adhesive for temporarily fixing the components to be mounted on the substrate.

[0028]

As described above, according to the present invention, the supportable range of the support member of the printed circuit board can be changed only by driving one support member. Therefore, the board can be easily adjusted according to the chute interval or the size of the board. The support of can be appropriate. Further, since the position of the support member is moved in association with the movement of the chute, it is not necessary to individually move the support member, and it is possible to eliminate the trouble of changing the arrangement of the support member.

Further, since the position of the substrate supporting member can be changed separately from the chute interval changing drive source, even if there is a component on the lower surface of the substrate, it can be avoided and the substrate can be easily supported appropriately. Can be

[Brief description of drawings]

FIG. 1 is a plan view showing an XY table provided with a chute and a support plate.

FIG. 2 is a perspective view of an electronic component automatic mounting device to which the present invention is applied.

FIG. 3 is a plan view showing an XY table provided with a chute and a support plate.

FIG. 4 is a side view showing an XY table provided with a chute and a support plate.

FIG. 5 is a side view showing an XY table provided with a chute and a support plate.

FIG. 6 is a side view showing a state in which a connecting plate is connected to a lower portion of a support plate.

FIG. 7 is a view of a state where the connecting plate is connected to the support plate, viewed from below the support plate.

FIG. 8 is a control block diagram of the electronic component automatic mounting apparatus.

FIG. 9 is a diagram showing substrate size data.

FIG. 10 is a perspective view showing a backup pin provided on a support plate according to another embodiment.

[Explanation of symbols]

8 Printed Circuit Board 11 Fixed Conveying Chute (Chute) 12 Movable Conveying Chute (Chute) 14 Support Plate (Supporting Member) 16 Chute Moving Motor (Chute Interval Changing Drive Source) 25 Guide Rod (Support Range Changing Mechanism) 27 Shaft Part (Supporting Range) Change mechanism) 28 Shaft part (support range changing mechanism) 29 Connecting plate (support range changing mechanism) 30 Shaft part (support range changing mechanism) 33 Support plate moving motor (moving drive source)

Claims (3)

[Claims] 1. A printed circuit board supporting device for supporting a lower surface of a printed circuit board guided by a pair of chutes by a plurality of supporting members, by simply driving one supporting member of the plurality of supporting members. A printed circuit board supporting device comprising a support range changing mechanism for changing a mutual distance to change a supportable range of a board. 2. A printed circuit board supporting device in which a lower surface of a printed circuit board guided by a pair of chutes is supported by a plurality of supporting members and the chutes can be moved so that the intervals between the chutes can be varied. A printed circuit board supporting apparatus comprising: a moving mechanism that moves a position of a member in accordance with a movement of a chute according to an interval between the chutes. 3. A print capable of supporting a lower surface of a printed circuit board guided by a pair of chutes by a plurality of supporting members and moving the chutes to be variable by being driven by a chute distance changing drive source. The printed circuit board supporting device is characterized in that a moving driving means separate from a chute interval changing driving source for changing the positions of the plurality of supporting members is provided in the substrate supporting device.