JPH035068A - Automatic soldering device - Google Patents

Abstract

PURPOSE:To execute good soldering by transporting carriers holding circuit boards along an elliptical endless track within the horizontal plane and ejecting molten solder to the circuit boards which are coated with a flux and are preheated in a jet type solder tank disposed nonperpendicularly to the transporting direction of the circuit boards. CONSTITUTION:The circuit boards mounted with electronic parts are held in the carriers 6 and the carriers 6 are contimuously transported by a transporting device 2 along the elliptical emdless track formed within the horizontal plane. The flux is applied on the circuit boards by a fluxer 3 disposed in the direction nonperpendicular to the circuit board transporing direction. The circuit boards are preheated by a heater 4 disposed below the transporting device 2. The molten solder is injected from the jet type solder tank 5 disposed below the transporting device 2 in the direction circuit board to the circuit board transporting direction on the downstream side in the circuit board transporting direction of the heater 4. The working efficiency is improved in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an automatic soldering device, and in particular to an automatic soldering device that continuously transports a board along an elliptical endless track and in a horizontal plane with respect to the board transport direction. By arranging the jet soldering tank at a non-perpendicular direction, the total length of the automatic soldering device can be extremely shortened, and the soldering bath can be soldered more easily without bridges.
This invention relates to an automatic soldering and soldering device that enables soldering.

Prior Art In conventional automatic soldering equipment, each component part was arranged in a straight line with respect to the direction of conveyance of the board, and the jet soldering tank was arranged at right angles to the direction of conveyance. Automatic soldering requires a relatively long installation space to install the device, and has the drawback of being limited in the installation location. In addition, when the molten solder separates from the board, so-called solder breakage, the molten solder also separates from the board at the same time, causing bridges, icicles, or bumps in which the glue wires of electronic components placed in close proximity are soldered together. However, there was a drawback that the finished board was a defective product. Furthermore, the defective soldering must be manually corrected on the board, resulting in poor work efficiency.

Purpose The present invention has been made in order to eliminate the drawbacks of the prior art described above, and its purpose is to continuously transport a carrier holding a substrate along an elliptical endless track. , :1- The purpose of automatic soldering is to simplify the structure by eliminating the need for a vertical movement mechanism (such as an electric heater mechanism) to return the middle rear to its original position, and to shorten the length of the device. The aim is to effectively utilize the factory site by eliminating restrictions on the installation location in the length direction of the equipment. Another purpose is to improve work efficiency by allowing one person to carry in and out substrates at one location. Still another object is to always cut the solder at one end of the board by causing a flow of molten solder in a direction perpendicular to the direction of transport of the board, thereby preventing the occurrence of bridging, icicles, and bumps. The purpose is to make it possible to perform good soldering, and thereby eliminate the need to repair the board for defective soldering.

Configuration In short, the present invention provides a transport device that continuously transports a carrier holding a board on which electronic components are mounted along an elliptical endless track formed in a horizontal plane, and a transport device that continuously transports a carrier holding a board on which electronic components are mounted, a fluxer which is disposed at a non-perpendicular direction and disposed below the transfer device and sprays flux to apply the flux to the substrate; and a heater disposed below the transfer device and which preheats the substrate. , a jet-flow type solder tank that is disposed on the downstream side of the heater in a direction in which the substrate is carried, is inclined in a non-perpendicular direction within a horizontal plane with respect to the direction of carrying the substrate, and is disposed below the carrying device, and that spouts out molten solder. It is characterized by the fact that it is equipped with

The present invention will be explained below based on embodiments shown in the drawings. 1st
In the figures and FIG. 2, an automatic soldering device 1 according to the present invention includes a general feed device 2, a fluxer 3, a heater 4, and a jet type semicircular tank 5.

The transport device 2 includes a carrier 6 holding a substrate (not shown).
An endless chain 9 is wound around a pair of sprockets 8A and 8B in a horizontal plane. A plurality of connecting members 10 are fixed. The other end 6b of the carrier 6 is held and guided by a guide rail 12 fixed to a base 11. Then, a drive device (not shown) rotates the marisuke 13 to make the chain 9 run, and the carrier 6 is moved by the arrows A and B.
It is configured to continuously convey along the oval endless track 32 in the direction of the object.

The fluxer 3 is disposed below the board to be transported, and applies flux to make it easier for solder to adhere to the required soldering points on the board, and is directed in the direction of transport of the board (in the direction of the arrow). It is disposed at an angle of approximately 45° in the horizontal plane.

The heater 4 heats the substrate to a predetermined temperature (for example, about 11.0'C).
), and the electric heater 14 is arranged to have a length of about 1 m. In this embodiment, the length of the heater is adjusted to the front end 4a of the heater in accordance with the slope of the jet soldering bath 5. By configuring the length to be gradually longer and the length to be shorter at the rear end portion 4b, the preheating time is the same over the entire surface of the substrate, and the substrate is heated uniformly.

The jet flow type semicircular tank 5 consists of a primary solder tank 15 and a secondary solder tank 16, in which molten solder (not shown) melted by a heater (not shown) is stored, and a motor 18, An impeller 22 driven via a pulley 19, a belt 2o, and a pulley 21 squirts molten solder from each nozzle 23 and 24 to contact the lower surface of the substrate being transported. The nozzles 23 and 24 of the primary solder tank 15 and the secondary solder tank 16 are arranged at an angle of about 45 degrees in a horizontal plane with respect to the substrate conveyance direction, and the nozzles 23 and 24 of the primary solder tank 15 A parallel rotary plate 25 is disposed along the longitudinal direction of the nozzle 23, and is configured to generate pulse-like waves in the molten solder spouted from the nozzle 23 by rotating it in one direction with the motor 2G.

Further, on the downstream side of the jet soldering tank 5, there is a cooling fan 28 for cooling the board that has become hot due to soldering, and above the main body cover 29 there is a cooling fan 28 for cooling the board, which is heated to a high temperature due to soldering. An exhaust fan 30 for discharging the air is provided, and a control device 31 for controlling the various devices described above at predetermined timings is further provided.

Function The present invention is constructed as described in item 1 below, and its function will be explained below. In FIGS. 1 and 2, the solder in the primary solder tank 15 and the secondary solder tank 16 is heated and melted by energizing a heater (not shown), and the solder is melted by the motor 18.
The impeller 22 is rotated via the belt 20, and molten solder is spouted upward from the respective nozzles 23 and 24. A parallel rotary plate 25 driven by a motor 26 and rotating in the molten solder acts on the molten solder spouted from the nozzle 23 to generate pulse-like waves in the solder jet. (not shown) is arranged and is guided by this and ejected from the nozzle 24? A flat portion is formed at the wave crest of the molten solder.

When the sprocket 8A is driven and rotated by a motor (not shown), the chain 9 moves counterclockwise as shown by arrows A and B in FIG. 1, and moves one end 6a of the carrier 6 in the direction of arrow A via the connecting member 10. Therefore, the carrier 6 also moves in the direction of the arrow by one-point cantilever drive while the other end 6b is guided by the guide rail 12.

Here, a substrate (not shown) is placed on the carrier 6, for example at a position C.
When loaded, the board is transported together with the carrier 6, and a fluxer 3 applies flux to the parts of the board that require soldering. The fluxer 3 is approximately 4 in the horizontal plane with respect to the substrate transport direction.
Since they are arranged at an angle of 5°, the effective flux application opening area is approximately 1.4 times larger than the actual opening area, and flux application is performed efficiently.

During automatic soldering, the board pretreated with the fluxer 3 changes the transport direction from the direction of arrow A to the direction of arrow B at the right end 1a of the apparatus 1, and is transported above the heater 4 at an angle of approximately 110°.
It is gradually preheated to C.

The front end 4a and the rear end 4b of the heater 4 are connected to a jet solder tank 5.
Since the board is tilted approximately 45° in the horizontal plane in parallel with Even when the substrate is transported, there is no temperature variation in the substrate, and the substrate is sufficiently preheated.

When the board is transported to the primary soldering tank 15, primary soldering is performed, but since the molten solder spouted from the nozzle 23 generates pulse-like waves as described above, the flux is heated and the gas generated is efficiently exhausted from the bottom surface of the substrate by the pulse wave, uniformly wetting the substrate with molten solder. Next, the secondary solder tank 1 forms the wave crest of the molten solder in the flat part.
6, ideal soldering is performed by contacting with molten solder for about 3 seconds.

Since the solder tank 5 is inclined at approximately 45° in the horizontal plane with respect to the substrate conveyance direction (direction of arrow B), the nozzles 23 and 24
The flow of molten solder ejected from the board will solder while producing a component flow in a direction approximately perpendicular to the general direction (direction of arrow B) relative to the board. It starts at the left end of the board in the direction of travel and ends at the right end. Therefore, the molten solder is not concentrated at one point in the center in the width direction of the board, and soldering defects such as bridges, icicles, and bumps are prevented from occurring.

After the soldered board is cooled by the cooling fan 28, the conveyance direction is changed again at the left end 1b of the soldering device 1 and returned to the original position C. The operator removes the completed board and transfers the new board to the carrier. Load on 6. In this manner, soldering of the boards is performed one after another in succession.

Effects In the present invention, the carrier holding the substrate is continuously conveyed along the oval endless track as described above.
The structure can be simplified by eliminating the need for a vertical movement mechanism (such as an electric heater mechanism) to return the carrier to its original position, and automatic soldering can shorten the length of the device, making it possible to reduce the length of the device relative to the installation location. (excluding restrictions on) - has the effect of making effective use of the site. Moreover, this allows one person to carry in and out the substrates into and out of the apparatus at one location, which has the effect of improving work efficiency. Furthermore, since the solder is cut while the molten solder flows in a direction perpendicular to the direction in which the board is transported, the solder can always be cut at one end of the board, thereby preventing bridging, icicles, and bouncing. This has the effect of making it possible to perform good solder joints, and thereby eliminating the need to repair defective soldering.

[Brief explanation of the drawing]

The drawings relate to embodiments of the present invention, and FIG. 1 is a plan view showing the entire automatic soldering apparatus, and FIG. 2 is a side view. 1 is an automatic soldering device, 2 is a conveyance device, 3 is a fluxer,
4 is a heater, 5 is a jet soldering tank, 6 is a carrier, and 32 is an oval endless track.

Claims (1)

[Scope of Claims] 1. A transport device that continuously transports a carrier holding a board on which electronic components are mounted along an elliptical endless track formed in a horizontal plane; a fluxer disposed at a non-perpendicular direction and disposed below the transfer device and spraying flux to apply the flux to the substrate; a heater disposed below the transfer device preheating the substrate; A jet-flow type solder tank is provided on the downstream side of the heater in the direction of conveyance of the substrate, and is disposed below the conveyance device and inclined in a non-perpendicular direction in a horizontal plane with respect to the direction of conveyance of the substrate, and spouts out molten solder. An automatic soldering device characterized by: 2. The automatic soldering apparatus according to claim 1, wherein the inclination angle of the jet soldering bath in a horizontal plane with respect to the conveyance direction of the substrate is approximately 45 degrees.