JPH08162750A - Partial soldering machine - Google Patents

Abstract

PURPOSE: To obtain a partial soldering system in which solder baths each provided with a nozzle are disposed, by the same number as the points to be soldered, under a conveyor and the soldering is carried out point by point in each solder bath. CONSTITUTION: Two solder baths 23a, 23b are provided, respectively, for two points being soldered partially to a printed board. The solder bath 23a, 23b is provided with a molten bath 24 equipped with a heater 24a for melting solder, and a nozzle 25 for causing the molten solder to flow upward. The nozzle 25, 25 is arranged to be located vertically under a predetermined point to be soldered when a printed board is carried by the arm 19 of a feeder mechanism 15 and located above the solder bath 23a, 23b. Since the solder baths 23a, 23b each equipped with the nozzle 25, are the same in number as the points to be soldered partially to the printed board, the printed board can be partially soldered point by point in each solder bath.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partial soldering apparatus suitable for partially soldering a plate-shaped product to be soldered, such as a circuit board on which electronic parts are mounted. .

[0002]

2. Description of the Related Art Conventionally, a jet soldering method and a reflow soldering method are generally used for soldering a product to be soldered such as a printed circuit board. As is well known, in a jet soldering method, a printed board on which electronic components are mounted is brought into contact with or immersed in jet solder in a solder bath to perform soldering. On the other hand, in the reflow soldering method, a predetermined amount of viscous solder is supplied onto the printed circuit board in advance, and after mounting electronic components, the printed circuit board is passed through a heating furnace to melt the solder. I am supposed to do it.

By the way, in recent years, with the high integration and miniaturization of electronic parts, highly integrated parts such as ICs and chip parts, and parts having lead wires such as capacitors are densely arranged on a printed circuit board. It is mixed.

When applying a conventional jet soldering method when soldering such a printed circuit board,
In order to partially solder a plurality of places on the printed circuit board, for example, a partial soldering device as shown below is used. As shown in FIG. 4, one solder bath 1 has the same number of nozzle openings 2, 3, as the number of places to be partially soldered.
4 is provided, and solder is jetted from the nozzle openings 2, 3 and 4, respectively. Further, the transport conveyor 5 is configured to include an up-and-down mechanism (not shown) that raises and lowers its height.

In this case, in order to partially solder the printed circuit board P, at the time when the printed circuit board P is conveyed to above the solder bath 1 by the conveyer conveyor 5, the conveyer conveyor 5 is lowered by the above-mentioned vertical mechanism, The lower surface of P is brought into contact with the jet flow solder from the nozzle openings 2, 3, and 4, so that partial soldering is performed only on a predetermined portion.

[0006]

However, the above-described conventional partial soldering apparatus has the following problems. As a matter of course, depending on the shape of the parts to be soldered and the like, the soldering area may be different for each place to be soldered even on the same printed circuit board P. In this case, the sizes of the openings of the nozzle openings 2, 3 and 4 provided in one solder bath 1 are different accordingly. In this way, when the sizes of the openings of the nozzle openings 2, 3, 4 are different, the jet heights of solder from the respective nozzles are different, so that even the same printed circuit board P can be soldered depending on the location. There is a problem that quality is different and it is difficult to set soldering conditions. Furthermore, when the parts to be soldered are close to each other, the nozzle openings become narrower, which may be affected by the jet flow from another adjacent nozzle opening. The present invention has been made in view of the above points, and an object of the present invention is to provide a partial soldering apparatus capable of improving soldering quality and facilitating soldering conditions.

[0007]

According to the present invention, there is provided a conveyor for conveying a plate-shaped article to be soldered in one direction,
It is characterized in that the same number of solder baths as the number of locations to be soldered to the article to be soldered are provided below the transfer conveyor, each of which is provided with a nozzle for jetting solder.

[0008]

In the partial soldering apparatus of the present invention, the solder tanks each having a nozzle are provided below the conveyor.
The number of parts to be soldered is the same as the number of parts to be soldered. As a result, it is possible to perform soldering at one place in each solder bath. Further, since each solder tank is provided with a nozzle, the soldering conditions can be set independently for each solder tank.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an embodiment shown in the drawings. Here, the present invention is applied to, for example, an automatic soldering device for a printed circuit board, and
A description will be given using an example in which partial soldering is performed at a place. As shown in FIGS. 1 to 3, in the partial soldering device 10, a printed board (soldered product) to be soldered on a base 11 from an inlet side (left side in the drawing) toward an outlet side. A transport conveyor 12 for transporting P is provided.

As shown in FIGS. 2 and 3, the transport conveyor 12 feeds two transport rails 13 and 14 provided in parallel to each other and a printed circuit board P on the transport rails 13 and 14 in one direction. And a delivery mechanism 15 for

As shown in FIG. 3, the carrier rails 13, 1 are
The frame 4 is supported by the frame 16. This frame 1
6, an air cylinder (not shown) provided on the base 11 moves up and down with a constant stroke, and the transport rails 13 and 14 move up and down integrally with the air cylinder. Rail members 13a and 14a that support both ends of the printed circuit board P are integrally provided inside the transport rails 13 and 14, and the printed circuit board P slides on the rail members 13a and 14a. It is designed to be transported.

As shown in FIGS. 1 to 3, the feeding mechanism 15 includes a guide rail 17 provided in parallel with the transport rail 14, and a shaft 18 movably provided along the guide rail 17. .. for moving the printed circuit board P on the transfer rails 13 and 14 which are provided on the shaft 18 at regular intervals. The shaft 18 is provided with a slide mechanism such as a rodless cylinder for reciprocating the shaft 18 along the guide rail 17 with a constant stroke. Further, the shaft 18 is provided with a swing mechanism 20 for rotating the shaft 18 around its axis.
When the swing mechanism 20 is driven, the shaft 18 rotates about its axis, and the arms 19, 19, ... Swing.

In the delivery mechanism 15 having such a structure,
.. are kept horizontal and the shaft 18 is moved by a slide mechanism (not shown), the pushers 19a provided on the lower surface of the tip of each arm 19 are moved.
The printed circuit board P on the transfer rails 13 and 14 is pushed and conveyed by (see FIG. 3). After the shaft 18 has moved by a predetermined stroke, the swing mechanism 20 rotates the shaft 18 to move the arms 19, 1.
Bounce up 9, ... Subsequently, the shaft 18 is moved back by the slide mechanism (not shown) to return to the original position, and then the shaft 18 is rotated by the swing mechanism 20 to bring the arms 19, 19, ... Return to. By repeating the above operation cycle of the delivery mechanism 15, the printed circuit board P on the transport rails 13 and 14 is transported by a constant stroke.

On the other hand, as shown in FIGS. 1 and 2, flux is applied to the lower surface of the printed circuit board P to be soldered on the base 11 below the transport conveyor 12 having the above-described structure. The fluxer 21, the preheater 22 for drying the flux to preheat the printed circuit board P, and the two solder baths 23 for partially soldering the printed circuit board P
a and 23b and a cooling fan (not shown) for cooling the soldered portion are provided.

Here, the solder baths 23a and 23b are provided in the number corresponding to the places (for example, two places) to be partially soldered to the printed circuit board P, that is, two solder baths are provided. Each of the solder baths 23a and 23b includes a melting bath 24 having a heater 24a for melting the solder, and a nozzle 25 for causing the molten solder to flow upward. And the nozzles 2 of the solder baths 23a and 23b
5 and 25, the printed circuit board P transported by the arm 19 of the delivery mechanism 15 is the solder bath 23a, 23b.
Are installed so as to be located vertically below predetermined locations to be soldered, respectively.

Next, the operation of the partial soldering apparatus 10 having the above-mentioned structure will be described. As described above, the printed circuit board P to be partially soldered with components mounted in advance at predetermined positions in the previous step, each time the arms 19, 19, ... Make one stroke by the delivery mechanism 15 of the conveyor 12. Fluxer 21, Preheater 2
2, the solder bath 23a and the solder bath 23b are sequentially sent to each station.

The printed circuit board P conveyed in this way
First, the flux is applied to the soldering surface in the fluxer 21, and then the flux is dried by the preheater 22 and preheated.

Next, when the printed circuit board P to be partially soldered is transported to above the solder bath 23a, an air cylinder (not shown) is contracted so that the transport rails 13 and 14 are integrated with the frame 16. Lower to. Then, the printed circuit board P on the transfer rails 13 and 14 is lowered accordingly, and the predetermined position on the lower surface of the printed circuit board P is changed to the solder bath 2
It contacts the jet solder from the nozzle 25 of 3a. After that, the air cylinder (not shown) is extended to raise the transport rails 13 and 14 integrally with the frame 16 and raise the printed circuit board P.

In this way, the printed circuit board P partially soldered at predetermined locations in the solder bath 23a is then conveyed to the solder bath 23b. And this solder bath 2
Also in 3b, other predetermined portions are partially soldered in the same manner as above.

After that, a soldering portion of the printed circuit board P is cooled by a cooling fan (not shown), and then the printed circuit board P is carried out to a subsequent process.

As described above, the partial soldering apparatus 10
The solder bath 23 is provided with nozzles 25, respectively.
The number of a and 23b is the same as the number of places to be partially soldered on the printed circuit board P, that is, two are provided. As a result, the printed circuit board P can be partially soldered in each of the solder baths 23a and 23b one by one. Therefore, the soldering conditions such as the jet height from the nozzle 25 can be set independently in the solder baths 23a and 23b, so that the soldering conditions can be set easily and optimally. Then, the partial soldering is performed under the optimum soldering condition in this manner, so that the soldering quality can be improved. Further, even when the places to be soldered are close to each other, the partial soldering can be performed without any trouble without being affected by the jet flow from the adjacent nozzle as in the conventional case.

Although the two solder baths 23a and 23b are installed in the partial soldering apparatus 10 in the above-described embodiment, if there are three or more spots to be partially soldered to the printed board P, the soldering baths 23a and 23b are not limited to the above. Needless to say, the number of solder baths 23 is set to correspond to this.
Further, for example, the configuration of the other parts of the partial soldering device 10 such as the transport conveyor 12 is not limited at all, and the same effect as above can be obtained even if other configurations are applied. .

[0023]

As described above, according to the partial soldering apparatus of the present invention, the number of solder baths each having a nozzle is provided below the transport conveyor in the same number as the number of places to be soldered. did. As a result, partial soldering can be performed in each solder bath one by one. Therefore, the soldering conditions such as the jet height from the nozzle
Since it can be set independently for each solder tank, it becomes possible to easily and optimally set the soldering conditions. Then, by performing partial soldering under the optimum soldering condition in this way, the soldering quality can be improved. Further, even when the places to be partially soldered are close to each other, the soldering can be performed without any trouble.

[Brief description of drawings]

FIG. 1 is a front view showing an example of a partial soldering apparatus according to the present invention.

FIG. 2 is a plan view of the partial soldering device.

FIG. 3 is a side sectional view of the partial soldering device.

FIG. 4 is a front sectional view showing a solder bath provided in a conventional partial soldering apparatus.

[Explanation of symbols]

 10 Partial Soldering Device 12 Transport Conveyor 23 Solder Tank 25 Nozzle P Printed Circuit Board (Soldered Product)

Claims (1)

[Claims] 1. A transport conveyor for transporting a plate-shaped product to be soldered in one direction, and a solder tank provided with nozzles for jetting solder is provided below the transport conveyor. Partial soldering device characterized in that the same number of parts as the number of parts to be soldered are provided.