JPH08162752A - Partial soldering machine - Google Patents

Abstract

PURPOSE: To obtain a partial soldering machine in which the failure rate can be lowered by restraining the device from floating. CONSTITUTION: The partial soldering machine 1 comprises rails 9, 10 for conveying a printed board P, solder baths 6a, 6b, and a mechanism 60 for pressing a device mounted on the upper surface of the printed board P disposed above the solder baths 6a, 6b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partial soldering apparatus suitable for soldering a plate-shaped article to be soldered such as a circuit board on which electronic parts are mounted.

[0002]

2. Description of the Related Art Conventionally, a jet soldering method and a reflow soldering method are generally used for soldering a product to be soldered such as a printed circuit board. As is well known, in a jet soldering method, a printed board on which electronic components are mounted is brought into contact with or immersed in jet solder in a solder bath to perform soldering. On the other hand, in the reflow soldering method, a predetermined amount of viscous solder is supplied onto the printed circuit board in advance, and after mounting electronic components, the printed circuit board is passed through a heating furnace to melt the solder. I am supposed to do it.

By the way, in recent years, with the high integration and miniaturization of electronic parts, highly integrated parts such as ICs and chip parts, and parts having lead wires such as capacitors are densely arranged on a printed circuit board. It is mixed.

When applying a conventional jet soldering method when soldering such a printed circuit board,
In order to partially solder a plurality of places on the printed circuit board, for example, a partial soldering device as shown below is used. That is, the conventional jet type partial soldering apparatus is provided with a conveyer conveyor composed of two rails that are parallel to each other, and conveys a printed circuit board in one direction. Below the transport conveyor, a fluxer, a preheater, a solder tank, a cooling fan, etc. are sequentially arranged from the inlet side of the apparatus toward the outlet side.

With this structure, the printed circuit board carried into the soldering device from the entrance side of the conveyor is first coated with flux by the fluxer and then preheated by the preheater. After that, the printed circuit board is partially soldered at a predetermined position in a solder bath, further cooled by the cooling fan, and then carried out to the next step.

[0006]

However, the above-described conventional partial soldering apparatus has the following problems. In the conventional partial soldering apparatus, an electronic component or the like mounted in the previous step may be lifted from the printed circuit board that has been transported on the transport rail, for some reason. As described above, if the parts are partially soldered in the solder bath while the parts are still floating, there is a problem that the printed board becomes a defective product. The present invention has been made in consideration of the above points, and an object of the present invention is to provide a partial soldering device capable of suppressing the rise of parts and reducing the occurrence of defective products.

[0007]

SUMMARY OF THE INVENTION According to the present invention, a pair of transport rails extending parallel to each other for transporting a plate-shaped article to be soldered in one direction, and a pair of transport rails provided below the transport rail are provided. A solder bath for partial soldering of soldered products,
And a holding member that holds down a component mounted on the upper surface of the soldered product from above when the soldered product on the transport rail is located above the solder bath. There is.

[0008]

In the partial soldering apparatus of the present invention, a pair of carrier rails, a solder tank provided below the carrier rails,
When the article to be soldered on the transport rail is located above the solder bath, a pressing member is provided to hold the component mounted on the upper surface of the article to be soldered from above. As a result, when the soldered product transported by the transport rail is partially soldered in the solder bath, the component on the soldered product is pressed by the pressing member, so that the soldered product is securely soldered without floating.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an embodiment shown in the drawings. Here, the present invention will be described using an example in which the present invention is applied to, for example, a jet type partial soldering apparatus for performing partial soldering of a printed circuit board. 1 and 2 show a schematic configuration of a partial soldering apparatus 1 according to the present invention. As shown in these drawings, the partial soldering apparatus 1 is provided on a base 2 with a lower surface of a printed circuit board (soldered product) P to be soldered from an inlet side (left side in the drawing) toward an outlet side. A fluxer 3 for applying flux to the preheater 5, preheater 5 for drying the applied flux to preheat the printed circuit board P, solder baths 6a and 6b for soldering the printed circuit board P, and a cooling fan for cooling the soldered part ( (Not shown) are sequentially arranged. Then, above the fluxer 3, the preheater 5, the solder baths 6a and 6b, and the cooling fan (not shown),
A conveyor 8 is provided which extends in one direction from the inlet side toward the outlet side and conveys the printed circuit board P to be soldered.

As shown in FIGS. 1 and 3, the transfer conveyor 8 includes two transfer rails 9, which are provided in parallel with each other.
A rail portion 11 provided with 10 and a delivery mechanism 12 for delivering the printed circuit board P on the transport rails 9 and 10 in one direction.
It consists of and.

The rail portion 11 has the following structure. As shown in FIGS. 4 and 5, rail members 9a and 10a that support both ends of the printed circuit board P are integrally provided inside the transport rails 9 and 10, and the printed circuit board P to be transported is These rail members 9
It is designed to slide on the upper surfaces of a and 10a.

A support rail 13 extending parallel to the transport rails 9 and 10 is disposed on the side of the transport rail 10. The support rail 13 is integrated with the transport rail 9 via connection shafts 14, 14, ... That extend in a direction orthogonal to the support rail 13. The transport rail 10 is provided so as to be movable along these connection shafts 14. As shown in FIG. 5, the transport rail 10 can be fixed at any position on these connecting shafts 14 by operating a clamp lever of a clamp mechanism 15 provided integrally with the transport rail 10. In this way, the separation distance between the transport rails 9 and 10, that is, the transport width can be changed / adjusted according to the width of the printed circuit board P to be transported.

As shown in FIGS. 4 and 5, on the base 2, there is provided a frame 16 in which angle members having a substantially U-shaped cross section are assembled into a substantially E shape in a plan view. The frame 16 is supported by, for example, air cylinders 17 and 17 installed on the base 2 and driven to expand and contract in the vertical direction, and guide members 18, 18, ... As a result, the frame 16 is attached to the air cylinder 1
When 7 and 17 are driven to expand and contract, they move up and down with a constant stroke.

As shown in FIGS. 5 and 6, columns 19, 19, ... Are provided on the upper surface of the E-shaped frame 16 at a position vertically below the transport rail 9. A shaft 19a extending parallel to the transport rail 9 is provided at an upper end portion of each column 19, and each shaft 19a is rotatably provided with a mounting member 20 fixed to a lower surface of the transport rail 9. It is pivotally supported. By this, the transport rail 9,
10 is configured to be swingable about the shaft 19a of each column 19.

The transport rails 9 and 10 are provided with a swing mechanism 21 having the following structure as a drive source for swinging the transport rails 9 and 10. As shown in FIGS. 4, 5, and 7, support members 22, 22 are attached to the upper surface of the frame 16 at regular intervals. A shaft 23 extending in parallel with the transport rail 10 is provided at the upper ends of the support members 22 and 22 so as to be rotatable around the axis thereof. Shaft 23
Timing pulleys 24 are integrally provided at both end portions of each. As shown in FIGS. 5 and 7, a timing pulley 25 having a rotation axis parallel to the shaft 23 is rotatably provided at the lower end of each support member 22, and one of the timing pulleys 25 has a timing pulley 25. Is connected to a rotary shaft 27a of a drive motor 27 (see FIG. 7). Between these timing pulleys 24, 25,
An endless timing belt 28 is wound around each. As a result, the timing pulley 25 of the one support member 22 and the timing pulley 2 of the other support member 22.
5 is a timing belt 28, 28 and a shaft 23
Drive motor 27.
Then, when one of the timing pulleys 25 is rotationally driven, both timing pulleys 25, 25 are synchronously rotated at a constant speed.

Further, each timing pulley 25 is integrally provided with a disk-shaped plate 29, and a crank pin 29a is attached to this plate 29 at a position eccentric to the rotation shaft of the timing pulley 25. Has been. The base end of the connecting rod 30 is rotatably joined to the crank pin 29a,
A mounting member 31 is rotatably supported by the tip portion thereof via a shaft 31a. In this way, the support member 22,
The mounting members 31 and 31 provided on the respective 22 are mounted on the lower surface of the support rail 13.

As shown in FIG. 5, in the rail portion 11 provided with the swinging mechanism 21 having such a structure, the drive motor 27 is used.
When the timing pulleys 25, 25 are driven to rotate by rotating, the rotation of the timing pulleys 25, 25 passes through the plates 29, 29, the connecting rod 30, and the mounting member 31.
Is transmitted to At this time, the rotational movement of the crank pin 29a on the lower end side of the connecting rod 30 is converted into a vertical reciprocating motion at the upper end portion, whereby the support rail 13 has a constant angle about the shaft 23 of the transport rail 9. It will swing in an arc shape within the range. Then, along with this, the transport rails 9 and 10 swing about an axis parallel to this, that is, the axis 19a.

As shown in FIGS. 5, 8 and 9, the delivery mechanism 12 is configured as follows.
A guide rail 43 extending in parallel with the transport rails 9 and 10 (see FIGS. 5 and 9) is provided between the upper ends of the columns 40, 41, and 42 erected on the base 2. . Slide units 45, 45, 45 are provided on the guide rail 43 so as to be slidable along the guide rail 43.
These slide units 45 are attached to both end portions and an intermediate portion of the plate 46, whereby the slide units 45, 45, 45 are attached to the guide rails 43.
It is designed to slide together along.

Such slide units 45, 45,
A shaft 47 extending parallel to the guide rail 43 is attached to the shaft 45 so as to be rotatable around its axis. Arms 48, 48, ... That extend in a direction orthogonal to the shaft 47 are provided at regular intervals, that is,
The fluxer 3, preheater 5, and solder bath 6 shown in FIG.
The stations a, 6b and cooling fans (not shown) are attached at approximately the same intervals as the stations.

As shown in FIGS. 5 and 10, each arm 48 is provided with a pusher 49 for pushing the printed circuit board P on the transport rails 9 and 10 on the lower surface of its tip. As a result, the pushers 49, 49, ... Of the arms 48, 48 ,.
It is configured to be swingable about its axis and slidable along the guide rail 43.

As shown in FIGS. 5 and 8, in order to swing these arms 48, 48, ..., A swing mechanism 50 having the following structure is provided. Plate 4
A mounting plate 51 located in the vertical plane is mounted on the mounting plate 6, and the mounting plate 51 is provided with a shaft 51 a having an axis parallel to the shaft 47. And this axis 5
A base end portion 52a of an air cylinder 52, which is driven to expand and contract along one direction, is rotatably supported by 1a. Figure 5
As shown in, the shaft 52 a extending parallel to the shaft 47 is provided at the tip of the telescopic rod of the air cylinder 52. A base end portion of a swing arm 53 extending toward the shaft 47 is rotatably supported by the shaft 52a, and a tip end portion of the swing arm 53 is connected to the shaft 4a.
It is fixed integrally to 7. When the air cylinder 52 is driven to expand and contract by the swinging mechanism 50 having such a configuration, the shaft 47 rotates about its axis, and the arms 48, 48 ,. .

Further, as shown in FIGS. 8 and 10 (b), as a slide mechanism 54 for sliding the arms 48, 48, ... Along the guide rail 43, for example, a rodless cylinder 55, columns 40, 56. (See FIG. 8). The rodless cylinder 55 is provided with a slide base 55a that is slidably driven with a constant stroke.
In addition, the slide unit 45a is fixed. As a result, when the rodless cylinder 55 is reciprocally driven to slide the slide base 55a, the pushers 49, 49, ... Of the arms 48, 48 ,.
Is configured to reciprocate integrally with the shaft 47 along the guide rail 43 with a constant stroke.

As shown in FIG. 8, a guide rail 57 extending in parallel with the rodless cylinder 55 is arranged below the rodless cylinder 55. A guide roller 58 guided along the guide rail 57 is provided at the lower end of the mounting plate 51, so that when the arms 48, 48, ... It is designed to prevent it.

Further, as shown in FIGS. 5 and 9, above the solder baths 6a and 6b (see FIG. 1), respectively,
A pressing mechanism (pressing member) 60 having the following configuration is provided. A guide member 61 having a fixed length is provided at a position corresponding to each of the solder baths 6a and 6b (see FIG. 1) on the transport rail 10. A slide block 62 is provided on each guide member 61 so as to be movable along the slide block 62.
2 can be fixed at any position by a stopper bolt or the like (not shown). As shown in FIG.
The slide block 62 extends upward,
A substantially L-shaped mounting plate 63 having an upper end bent in the horizontal direction is mounted. An arm 64, which extends in the horizontal direction and is located above the transport rails 9 and 10, is fixed to the upper end of the mounting plate 63 with a positioning bolt 65. As shown in FIG. 9, a long hole 64a having a constant length is formed in the arm 64, so that the overhanging dimension of the arm 64 toward the transport rail 9 can be adjusted.

As shown in FIG. 5, an air cylinder 66, which is driven to extend and contract vertically downward, is attached to the tip of this arm 64. At the tip of the telescopic rod 66a of the air cylinder 66, a pressing plate 67 is provided between the transfer rails 9 and 10 and above the transfer rails 9 and 10. On the lower surface of the pressing plate 67, the transfer rails 9 and 10 are provided.
In order to hold down each component mounted on the upper printed circuit board P, for example, bolt members 67a, 67a, ... Are provided. A guide rod 66b is provided on the upper surface of the pressing plate 67 to prevent the pressing plate 67 from rotating around the telescopic rod 66a of the air cylinder 66.

In each holding mechanism 60 having such a structure,
The positions of the slide block 62 and the arm 64 are adjusted in advance in accordance with the positions of the parts to be partially soldered in each of the solder baths 6a and 6b. And
When the transfer rails 9 and 10 are rocked and tilted by the rocking mechanism 50, the air cylinder 66 is extended to press the pressing plate 6.
The bolt members 67a, 67a, ... Of 7 hold down the components mounted on the printed circuit board P.

Next, the operation of the partial soldering apparatus 1 having the above structure will be described. First, the partially soldered printed circuit board P is transported along the transport rails 9 and 10 as follows.

The arm 4 of the rail portion 11 shown in FIG.
8, 48, ... Are set horizontally and the slide mechanism 54
The rodless cylinder 55 is driven to move the slide base 55a in the transport direction (rightward in the drawing).
Then, the pushers 49, 4 of the arms 48, 48, ...
.. (see FIG. 5), the printed circuit board P on the transfer rails 9 and 10 is moved by the stroke of the rodless cylinder 55. Next, the air cylinder 52 of the swinging mechanism 50 shown in FIG.
Bounce up 8, ... Subsequently, the rodless cylinder 55 of the slide mechanism 54 shown in FIG. 8 is driven to return the slide base 55a to the original position, and then the air cylinder 52 of the swing mechanism 50 shown in FIG. 5 is extended. Arm 4
Lower 8, 48, ... to a horizontal position.

By repeating the above cycle,
The printed circuit boards P, P, ... On the transport rails 9, 10 are transported by the stroke of the rodless cylinder 55. As a result, the printed circuit board P is sequentially delivered to each station of the fluxer 3, preheater 5, solder bath 6a, solder bath 6b, and cooling fan (not shown) shown in FIG. 1 every time the arm 48 makes one stroke. It is being sent.

The printed circuit board P conveyed in this way
First, after the flux is applied to the soldering surface in the fluxer 3, the flux is dried by the pre-heater 5 and preheated.

Subsequently, the solder bath 6a is approached and partial soldering is performed at a predetermined position in the solder bath 6a. First, when the printed circuit board P to be partially soldered is conveyed to above the solder bath 6a, as shown in FIG. 5, a pressing mechanism 60 provided above the solder bath 6a. The air cylinder 66 of the above is extended, and the bolt members 67a, 67a, ...
Each component on the printed circuit board P to be partially soldered is pressed by the solder bath 6a.

Subsequently, the air cylinder 17 shown in FIG.
17 is contracted, and the horizontal transfer rails 9 and 10 are lowered together with the frame 16. Then, as shown in FIG. 11, the printed circuit board P on the transport rails 9 and 10 is lowered accordingly (state shown by reference numeral (a) in the figure), and a predetermined position on the lower surface is out of the nozzle of the solder bath 6a. Contact the jet solder.

Thereafter, the drive motor 27 of the swing mechanism 21 shown in FIG. 7 is driven to swing the transport rails 9 and 10 about the shaft 23 to incline them (reference numeral (b) in FIG. 11). State). Then, the transfer rail 10 side of the printed circuit board P is pulled up above the solder bath 6, and the end on the transfer rail 9 side remains in contact with the solder in the solder bath 6. Subsequent to the tilting operation of the carrier rails 9 and 10, the air cylinders 17 and 17 are extended to raise the carrier rails 9 and 10 to separate the printed circuit board P from the jet solder. Then, the drive motor 27 shown in FIG.
Are driven to bring the transport rails 9 and 10 into a horizontal state (state indicated by reference numeral (c) in FIG. 11). In this way,
By pulling up the printed circuit board P from the solder bath 6 while inclining it, the sharpness of the solder on the lower surface of the printed circuit board P is improved.

At the same time, the air cylinder 66 is contracted to raise the pressing plate 67.

In this way, the solder bath 6 shown in FIG.
The printed circuit board P partially soldered in a is then sent to the solder bath 6b, and the same operation as described above is repeated to partially solder other predetermined positions. Also at this time, similarly to the above, the air cylinder 66 of the pressing mechanism 60 provided above the solder bath 6b is extended, and the bolt members 67a, 67a, ...
Each part to be partially soldered is held in the solder bath 6b.

Further, by raising the conveying rails 9 and 10 while inclining them, it is possible to improve the sharpness of the solder on the lower surface of the printed circuit board P.

After that, in a cooling fan (not shown), after the parts soldered in the solder baths 6a and 6b are cooled, they are carried out to a subsequent process.

The partial soldering apparatus 1 described above includes a carrier rail 10, solder baths 6a and 6b, and these solder baths 6
A pressing mechanism 60 for pressing the components mounted on the upper surface of the printed circuit board P is provided above the a and 6b. As a result, when the printed circuit board P is partially soldered in the solder baths 6a and 6b,
By pressing this with the pressing plate 67 of the pressing mechanism 60, not only when the conveyed components on the printed circuit board P are floating for some reason, but also the conveying rails 9 and 10 are swung by the swinging mechanism 21. By doing so, it is possible to prevent the tilted component on the printed circuit board P from tilting or coming off, and it is possible to securely solder the component partially. As a result, it is possible to reduce the soldering failure caused by the partial soldering of the component while the component is floating or detached from the printed board P.

Further, in the partial soldering apparatus 1, the transport rails 9 and 10 are provided with the swing mechanism 21 for swinging the transport rails 9 and 10 around the axis parallel to the transport direction of the printed circuit board P. Then, in the solder baths 6a and 6b, after the printed circuit boards P are brought into contact with the jet solder, respectively, the transport rails 9 and 10 are swung by the swing mechanism 21 and pulled up. As a result, the printed circuit board P on the transport rails 9 and 10 is pulled up while being inclined, so that it is possible to improve the sharpness of the solder on the lower surface of the printed circuit board P and suppress the occurrence of icicles and bridges. You can As a result, it is possible to suppress the generation of defective products and perform partial soldering with good quality. In addition, by changing the speed at which the transport rails 9 and 10 swing, even under the soldering conditions that were not possible in the past, it is possible to perform partial printing under conditions suitable for the printed circuit board P or parts to be soldered. It becomes possible to solder.

In the above embodiment, the transport rails 9 and 10 of the partial soldering apparatus 1 are swung, but the pressing mechanism 60 is of course the normal swinging mechanism 50.
It is needless to say that the present invention can also be applied to a partial soldering apparatus that does not include the above, and thereby the same effect as the above can be obtained.

[0041]

As described above, according to the partial soldering apparatus of the present invention, the pair of carrier rails, the solder tank provided below the carrier rails, and the soldered articles on the carrier rails are soldered. When it is located above the bath, it is configured to include a pressing member that presses down the component mounted on the upper surface of the article to be soldered from above. As a result, when partial soldering of the soldered product transported by the transport rail is performed in the solder bath, the component mounted on the upper surface of the soldered product is pressed by the pressing member, so that the component is securely soldered. Can be soldered to accessories. Even after tilting the carrier rail after soldering to improve the sharpness of the solder on the bottom surface of the soldered product, by holding the component with the pressing member, the component on the inclined soldered product Can be prevented from tilting or coming off.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a jet partial soldering device to which a partial soldering device according to the present invention is applied.

FIG. 2 is a front view of the same device.

FIG. 3 is a side view of the same device.

FIG. 4 is a plan view showing a transport rail provided in the apparatus.

FIG. 5 is a side sectional view showing a main part of the apparatus.

FIG. 6 is a front view showing a swing mechanism provided on the transport rail.

FIG. 7 is a rear view of the swing mechanism.

FIG. 8 is a front view showing a delivery mechanism provided in the apparatus.

FIG. 9 is a plan view of the delivery mechanism.

FIG. 10 is a side view showing an arm provided in the delivery mechanism.

FIG. 11 is a side sectional view showing a state where the transport rail is swung by the swing mechanism.

[Explanation of symbols]

 1 Partial Soldering Device 6a, 6b Solder Tank 9, 10 Transport Rail 60 Holding Mechanism (Holding Member) P Printed Circuit Board (Product Soldered)

Claims (1)

[Claims] 1. A pair of transport rails extending parallel to each other for transporting a plate-shaped article to be soldered in one direction, and a part of the article to be soldered provided below the transport rails. A solder tank and a pressing member for pressing the component mounted on the upper surface of the soldered product from above when the soldered product on the transport rail is located above the solder tank are provided. Partial soldering device characterized in that