JPH08162751A - Method and machine for partial soldering - Google Patents

Abstract

PURPOSE: To obtain a method and a machine for partial soldering in which the soldering quality can be enhanced, along with high efficiency, by preventing the solder from drooping or bridging. CONSTITUTION: In the soldering machine 1, transfer rails 9, 10 are provided with a mechanism 21 for oscillating the transfer rails 9, 10 about an axis extending in parallel with the transferring direction of a printed board P. The printed board P is brought into contact with a solder jet in a solder bath and then elevated while oscillating the transfer rails 9, 10 by means of the oscillation mechanism 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partial soldering apparatus and a soldering method suitable for partial soldering of a plate-like product to be soldered, such as a circuit board on which electronic parts are mounted. It is a thing.

[0002]

2. Description of the Related Art Conventionally, a jet soldering method and a reflow soldering method are generally used for soldering a product to be soldered such as a printed circuit board. As is well known, in a jet soldering method, a printed board on which electronic components are mounted is brought into contact with or immersed in jet solder in a solder bath to perform soldering. On the other hand, in the reflow soldering method, a predetermined amount of viscous solder is supplied onto the printed circuit board in advance, and after mounting electronic components, the printed circuit board is passed through a heating furnace to melt the solder. I am supposed to do it.

[0003]

By the way, in recent years,
Along with the high integration and miniaturization of electronic parts, highly integrated parts such as ICs and chip parts and parts having lead wires such as capacitors are mixedly mounted on a printed circuit board at high density.

When a conventional jet soldering method is applied when soldering such a printed circuit board,
Especially in highly integrated parts such as ICs, the pin spacing is narrow,
There is a problem that the solder dripping from the soldered portion is solidified as it is, and a phenomenon such as a bridge occurs in which adjacent pins are electrically connected to each other, resulting in a defective product.

In order to solve such problems, it is possible to prevent defects such as bridges by soldering components such as ICs by the reflow soldering method described above.
However, with this reflow soldering method, it is difficult to successfully solder components such as capacitors having lead wires. Therefore, when soldering a printed circuit board on which multiple types of components are mixed together at high density as described above, after soldering by the reflow soldering method, the parts that cannot be handled by this method must be manually processed. The reality is that soldering is done, and of course it is difficult to improve work efficiency.
The present invention has been made in consideration of the above points,
An object of the present invention is to provide a partial soldering device and a soldering method capable of preventing generation of flicker or bridges after soldering and improving soldering quality and working efficiency.

[0006]

The invention according to claim 1 is
A pair of transport rails extending parallel to each other for transporting the plate-shaped soldered article in one direction, a solder tank provided below the transport rails for partially soldering the soldered article, and An elevating mechanism that elevates and lowers the transport rail,
A swing mechanism for swinging the transport rail around an axis parallel to the axis thereof is provided.

According to a second aspect of the present invention, a plate-like article to be soldered is a partial soldering device provided with a pair of transport rails extending in parallel to each other and a solder bath provided below the transport rails. When partial soldering is performed, both ends of the product to be soldered are held by the transport rails and transported in one direction, and the solder bath is used to move the soldered product to a predetermined position on the lower surface of the product to be soldered. After being brought into contact with or immersed in the jet solder of the tank, the transport rail is raised by swinging the transport rail in a plane orthogonal to its axis by a swing mechanism provided in advance on the transport rail. There is.

[0008]

According to the first aspect of the invention, in the partial soldering device, a pair of carrier rails, a solder tank provided below the carrier rails, an elevating mechanism for elevating and lowering the carrier rails, and a carrier rail with its axis. It is configured to include a swinging mechanism that swings about parallel axes. As a result, after the soldered product transported by the transport rail is brought into contact with or immersed in the jet solder in the solder tank, the transport mechanism is swung by the swing mechanism and lifted by the lifting mechanism. The soldered product is pulled up from the solder bath while inclining, which can improve the sharpness of the solder when the soldered product is pulled up from the solder bath.

According to the second aspect of the invention, when the plate-like soldered product is partially soldered by the partial soldering device, the predetermined position of the soldered product in the solder bath is set as the jet solder of the solder bath. After contact or immersion, the swing mechanism provided in advance on the transport rail causes the transport rail to swing in a plane orthogonal to the axis of the transport rail and lifted by the elevating mechanism. Then, the product to be soldered on the transport rail is pulled up from the solder bath while inclining, which can improve the sharpness of the solder when the product to be soldered is pulled up from the solder bath.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an embodiment shown in the drawings. Here, the present invention will be described with reference to an embodiment in which the present invention is applied to, for example, a jet type partial soldering apparatus for soldering a printed circuit board. 1 and 2
Shows a schematic configuration of the partial soldering apparatus 1 according to the present invention. As shown in these drawings, the partial soldering apparatus 1 is provided on a base 2 with a lower surface of a printed circuit board (soldered product) P to be soldered from an inlet side (left side in the drawing) toward an outlet side. The fluxer 3 for applying the flux to the printed circuit board P
A preheater 5 for remaining heat of the printed circuit board, solder baths 6a and 6b for soldering the printed circuit board P, and a cooling fan (not shown) for cooling the soldered portion are sequentially arranged. Then, above the fluxer 3, the preheater 5, the solder baths 6a and 6b, and the cooling fan (not shown),
A conveyor 8 is provided which extends in one direction from the inlet side toward the outlet side and conveys the printed circuit board P to be soldered.

As shown in FIGS. 1 and 3, the transfer conveyor 8 includes two transfer rails 9, which are provided in parallel with each other.
A rail portion 11 provided with 10 and a delivery mechanism 12 for delivering the printed circuit board P on the transport rails 9 and 10 in one direction.
It consists of and.

The rail portion 11 has the following structure. As shown in FIGS. 4 and 5, rail members 9a and 10a that support both ends of the printed circuit board P are integrally provided inside the transport rails 9 and 10, and the printed circuit board P to be transported is These rail members 9
It is designed to slide on the upper surfaces of a and 10a.

A support rail 13 extending parallel to the transport rails 9 and 10 is provided on the side of the transport rail 10. The support rail 13 is integrated with the transport rail 9 via connection shafts 14, 14, ... That extend in a direction orthogonal to the support rail 13. The transport rail 10 is provided so as to be movable along these connection shafts 14. As shown in FIG. 5, the transport rail 10 can be fixed at any position on these connecting shafts 14 by operating a clamp lever of a clamp mechanism 15 provided integrally with the transport rail 10. In this way, the separation distance between the transport rails 9 and 10, that is, the transport width can be changed / adjusted according to the width of the printed circuit board P to be transported.

As shown in FIGS. 4 and 5, on the base 2, there is provided a frame 16 in which angle members having a substantially U-shaped cross section are assembled into a substantially E shape in a plan view. The frame 16 is, for example, air cylinders (elevating mechanism) 17, 17 that are installed on the base 2 and are driven to expand and contract in the vertical direction.
It is supported by vertically movable guide members 18, 18 ,. Thus, the frame 16 moves up and down with a constant stroke when the air cylinders 17 are driven to expand and contract.

As shown in FIGS. 5 and 6, columns 19, 19, ... Are provided on the upper surface of the E-shaped frame 16 at a position vertically below the transport rail 9. A shaft 19a extending parallel to the transport rail 9 is provided at an upper end portion of each column 19, and each shaft 19a is rotatably provided with a mounting member 20 fixed to a lower surface of the transport rail 9. It is pivotally supported. By this, the transport rail 9,
10 is configured to be swingable about the shaft 19a of each column 19.

The transport rails 9 and 10 are provided with a swing mechanism 21 having the following structure as a drive source for swinging the transport rails 9 and 10. As shown in FIGS. 4, 5, and 7, support members 22, 22 are attached to the upper surface of the frame 16 at regular intervals. A shaft 23 extending in parallel with the transport rail 10 is provided at the upper ends of the support members 22 and 22 so as to be rotatable around the axis thereof. Shaft 23
Timing pulleys 24 are integrally provided at both end portions of each. As shown in FIGS. 5 and 7, a timing pulley 25 having a rotation axis parallel to the shaft 23 is rotatably provided at the lower end of each support member 22, and one of the timing pulleys 25 has a timing pulley 25. Is connected to a rotary shaft 27a of a drive motor 27 (see FIG. 7). Between these timing pulleys 24, 25,
An endless timing belt 28 is wound around each. As a result, the timing pulley 25 of the one support member 22 and the timing pulley 2 of the other support member 22.
5 is a timing belt 28, 28 and a shaft 23
Drive motor 27.
Then, when one of the timing pulleys 25 is rotationally driven, both timing pulleys 25, 25 are synchronously rotated at a constant speed.

Further, each timing pulley 25 is integrally provided with a disc-shaped plate 29, and a crank pin 29a is attached to this plate 29 at a position eccentric to the rotation shaft of the timing pulley 25. Has been. The base end of the connecting rod 30 is rotatably joined to the crank pin 29a.
A shaft 31a is provided at the tip of the connecting rod 30.
The mounting member 31 is rotatably supported via the shaft. The mounting members 31, 31 provided on the support members 22, 22 in this way are mounted on the lower surface of the support rail 13.

As shown in FIG. 5, in the rail portion 11 provided with the swinging mechanism 21 having such a structure, the drive motor 27 is used.
When the timing pulleys 25, 25 are driven to rotate by rotating, the rotation of the timing pulleys 25, 25 passes through the plates 29, 29, the connecting rod 30, and the mounting member 31.
Is transmitted to At this time, the rotary motion of the crank pin 29a on the lower end side of the connecting rod 30 is converted into a vertical reciprocating motion at the upper end, which causes the support rail 13 to have a constant angle about the shaft 23 of the transport rail 9. It will swing in an arc shape within the range. Then, the transport rails 9 and 10 swing around an axis parallel to this, that is, the axis 19a.

As shown in FIGS. 5, 8 and 9, the delivery mechanism 12 is configured as follows.
A guide rail 43 extending in parallel with the transport rails 9 and 10 (see FIGS. 5 and 9) is provided between the upper ends of the columns 40, 41, and 42 erected on the base 2. . Slide units 45, 45, 45 are provided on the guide rail 43 so as to be slidable along the guide rail 43.
These slide units 45 are attached to both end portions and an intermediate portion of the plate 46, whereby the slide units 45, 45, 45 are attached to the guide rails 43.
It is designed to slide together along.

Such slide units 45, 45,
A shaft 47 extending parallel to the guide rail 43 is attached to the shaft 45 so as to be rotatable around its axis. Arms 48, 48, ... That extend in a direction orthogonal to the shaft 47 are provided at regular intervals, that is,
The fluxer 3, preheater 5, and solder bath 6 shown in FIG.
The stations a, 6b and cooling fans (not shown) are attached at approximately the same intervals as the stations.

As shown in FIGS. 5 and 10, each arm 48 has a pusher 49 for pushing the printed circuit board P on the transport rails 9 and 10 on the lower surface of its tip. As a result, the pushers 49, 49, ... Of the arms 48, 48 ,.
It is configured to be swingable about its axis and slidable along the guide rail 43.

As shown in FIGS. 5 and 8, in order to swing these arms 48, 48, ..., A swing mechanism 50 having the following structure is provided. Plate 4
A mounting plate 51 located in the vertical plane is mounted on the mounting plate 6, and the mounting plate 51 is provided with a shaft 51 a having an axis parallel to the shaft 47. And this axis 5
An air cylinder 52, which is driven to expand and contract in one direction, is provided at 1a with its base end rotatably supported. As shown in FIG. 5, a shaft 52 a extending parallel to the shaft 47 is provided at the tip of the telescopic rod of the air cylinder 52. A base end portion of a swing arm 53 extending toward the shaft 47 is rotatably supported by the shaft 52a, and a tip end portion of the swing arm 53 is
It is fixed integrally to the shaft 47. When the air cylinder 52 is driven to expand and contract by the swinging mechanism 50 having such a configuration, the shaft 47 rotates about its axis, and the arms 48, 48 ,. .

Further, as shown in FIGS. 8 and 10 (b), as a slide mechanism 54 for sliding the arms 48, 48, ... Along the guide rails 43, for example, a rodless cylinder 55, columns 40, 56. (See FIG. 8), and is provided in parallel with the guide rail 43. The rodless cylinder 55 is provided with a slide base 55a that is slidably driven with a constant stroke.
The slide unit 4 is attached to the slide base 55a.
5a is fixed. As a result, the rodless cylinder 55 is reciprocally driven to move the slide base 5
When the slide 5a is slid, the pushers 49, 49, ... Of the arms 48, 48 reciprocate integrally with the shaft 47 along the guide rail 43 at a constant stroke.

As shown in FIG. 8, a guide rail 57 extending in parallel with the rodless cylinder 55 is arranged below the rodless cylinder 55. The guide rail 57 is attached to the lower end of the mounting plate 51 that supports the swing mechanism 50.
A guide roller 58 is provided to be guided along the guide roller 58, so that the guide rollers 58 are prevented from grabbing when the arms 48, 48, ... Are slid.

Further, as shown in FIG. 9, the transport rail 1
A guide member 59 having a constant length is provided at a position corresponding to each of the solder baths 6a and 6b (see FIG. 1) on the 0. On each guide member 59, a mounting member 60 assembled in a substantially L shape is provided movably along the mounting member 60. As shown in FIG. 5, a pressing plate (pressing member) 62 located above the mounting rails 60 between the transfer rails 9 and 10 is mounted on the mounting bracket 60 via an air cylinder 61 that is vertically expanded and contracted. It is provided. This holding plate 62
When the swinging mechanism 50 swings the transport rails 9 and 10 to incline, the components mounted on the printed circuit board P on the transport rails 9 and 10 are displaced or dropped. It is provided to prevent it.

Next, the operation of the partial soldering apparatus 1 having the above structure will be described. First, the printed circuit board P to be soldered is carried along the carrying rails 9 and 10 as follows.

As shown in FIG. 8, the arms 48, 48, ... Of the rail portion 11 are set in a horizontal state, the rodless cylinder 55 of the slide mechanism 54 is driven, and the slide base 55a is moved in the conveying direction (right in the figure). Toward)). Then, the pushers 4 of the arms 48, 48, ...
9, 49, ... (see FIG. 5), the transport rails 9, 1
The printed circuit board P on 0 is moved by the stroke of the rodless cylinder 55. Next, the air cylinder 52 of the swinging mechanism 50 shown in FIG. 5 is contracted, and the arms 48, 48, ... Are flipped up. Subsequently, after driving the rodless cylinder 55 of the slide mechanism 54 shown in FIG. 8 to return the slide base 55a to the original position,
The air cylinder 52 of the swinging mechanism 50 shown in FIG. 2 is extended to lower the arms 48, 48, ...

By repeating the above cycle,
The printed circuit boards P, P, ... On the transport rails 9, 10 are transported by the stroke of the rodless cylinder 55. As a result, that is, the printed circuit board P includes the fluxer 3, the preheater 5, the solder bath 6a, the solder bath 6b, and the solder bath 6b each time the arm 48 makes one stroke.
It is designed to be sequentially sent to each station of a cooling fan (not shown).

The printed circuit board P conveyed in this way
First, after the flux is applied to the soldering surface in the fluxer 3 shown in FIG. 1, the flux is dried by the preheater 5 and preheated.

Subsequently, the solder bath 6a is approached and partial soldering is performed at a predetermined position in the solder bath 6a. First, when the printed circuit board P to be partially soldered is conveyed to above the solder bath 6a, the air cylinders 17, 17 shown in FIG. , 10 are lowered together with the frame 16. Then, as shown in FIG. 11, the printed circuit board P on the transfer rails 9 and 10 is lowered accordingly (state shown by reference numeral (a) in the figure), and the predetermined position on the lower surface thereof is the nozzle of the solder bath 6a. Contact the solder that is jetting from.

After that, the drive motor 27 of the swing mechanism 21 shown in FIG. 7 is driven to swing the transport rails 9 and 10 about the shaft 23 to incline them (reference numeral (b) in FIG. 11). State). Then, the transport rail 10 side of the printed circuit board P is pulled up above the solder bath 6, and the end on the transport rail 9 side remains in contact with the jet solder of the solder bath 6. Subsequent to the tilting operation of the carrier rails 9 and 10, the air cylinders 17 and 17 are extended to raise the carrier rails 9 and 10 to separate the printed circuit board P from the jet solder. Then, the drive motor 27 shown in FIG. 7 is driven to bring the transport rails 9 and 10 into a horizontal state (state shown by reference numeral (c) in FIG. 11). In this way, by pulling the printed circuit board P from the solder bath 6 while inclining it, the solder on the lower surface of the printed circuit board P becomes sharper.

The swinging mechanism 21 is used to convey the rails 9 and 10.
The air cylinder 6 shown in FIG.
1 is extended, and the component on the printed board P is pressed by the pressing plate 62.

In this way, the solder bath 6 shown in FIG.
The printed circuit board P partially soldered in a is then sent to the solder bath 6b, and the same operation as described above is repeated to partially solder other predetermined positions. At this time as well, by similarly raising the transport rails 9 and 10 while inclining them, it is possible to improve the sharpness of the solder of the printed circuit board P.

After that, in a cooling fan (not shown), the portions soldered in the solder baths 6a and 6b are cooled and then discharged toward the subsequent process.

As described above, in the partial soldering apparatus 1, the transport rails 9 and 10 are provided with the swing mechanism 21 that swings the transport rails 9 and 10 around the axis parallel to the transport direction of the printed circuit board P. Then, in the solder baths 6a and 6b, after the printed circuit boards P are brought into contact with the jet solder of the solder bath 6, respectively, the swing rails 21 are moved by the swing mechanism 21.
It is configured so that it is raised while swinging. As a result, the printed circuit board P on the transport rails 9 and 10 is pulled up while being inclined, so that it is possible to improve the sharpness of the solder of the printed circuit board P, and the parts to be soldered have lead wires. Not only in the case of parts, but also in the case of highly integrated parts such as ICs, it is possible to suppress the occurrence of flicker and bridges. As a result, when soldering the printed circuit board P on which a plurality of types of components are mounted at high density, it is possible to suppress the generation of defective products and perform partial soldering with good quality. Moreover, since the printed circuit board P can be automatically soldered by the partial soldering apparatus 1 as described above, it is possible to eliminate the conventional manual soldering, thereby significantly improving the work efficiency. be able to. Further, by changing the speed at which the transport rails 9 and 10 swing, even under the soldering conditions that were impossible in the past, the soldering can be performed under conditions suitable for the printed circuit board P and parts to be soldered. It is possible to attach.

Further, the carrier rail 10 has a pressing plate 6 for pressing the components mounted on the upper surface of the printed circuit board P.
2 is provided. As a result, when the transport rails 9 and 10 are swung, it is possible to prevent the components mounted on the printed circuit board P, which are tilted accordingly, from tilting or coming off.

In the above embodiment, if the transfer rails 9 and 10 of the partial soldering apparatus 1 are oscillated, for example, the structure of the feeding mechanism 12 and the number of solder tanks 6 and other parts will be described. Is not limited to the above.

[0038]

As described above, according to the partial soldering apparatus of the first aspect, the partial soldering apparatus includes a pair of carrier rails, a solder tank provided below the carrier rails, and a carrier rail. And a swing mechanism that swings the transport rail around an axis parallel to the axis of the transport rail. As a result, after the soldered product conveyed by the transfer rail is brought into contact with or immersed in the jet solder in the solder bath, the transfer rail is swung by the swing mechanism and raised by the elevating mechanism, and the soldered product is removed. The sharpness of the solder when pulled up from the solder tank can be improved, and the occurrence of icicles and bridges can be suppressed. As a result, when soldering a product to be soldered in which a plurality of types of components are mounted at high density, such as highly integrated components such as ICs and components having lead wires, it is possible to suppress the occurrence of defective products It is possible to perform soldering with high quality, and it is possible to significantly improve work efficiency.

According to the soldering method of the second aspect,
When partially soldering a plate-shaped product to be soldered with the partial soldering device, after the specified position of the product to be soldered is contacted with or immersed in the jet solder in the solder tank in the solder tank, it is preliminarily attached to the transport rail. With the swing mechanism provided, the transport rail is swung in a plane orthogonal to the axis of the transport rail while being raised by the lifting mechanism. Then, the items to be soldered on the transport rail will be pulled up while inclining,
This makes it possible to improve the sharpness of the solder when pulling up the soldered product from the solder bath, and suppress the occurrence of icicles and bridges. As a result, I
When soldering a printed circuit board on which multiple types of components are mounted at high density, such as highly integrated components such as C and components with lead wires, suppress the occurrence of defective products and solder with good quality. It is possible to perform the work, and it is possible to significantly improve the work efficiency.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a jet soldering apparatus to which a partial soldering apparatus according to the present invention is applied.

FIG. 2 is a front view of the same device.

FIG. 3 is a side view of the same device.

FIG. 4 is a plan view showing a transport rail provided in the apparatus.

FIG. 5 is a side sectional view showing a main part of the apparatus.

FIG. 6 is a front view showing a swing mechanism provided on the transport rail.

FIG. 7 is a rear view of the swing mechanism.

FIG. 8 is a front view showing a delivery mechanism provided in the apparatus.

FIG. 9 is a plan view of the delivery mechanism.

FIG. 10 is a side view showing an arm provided in the delivery mechanism.

FIG. 11 is a side sectional view showing a state where the transport rail is swung by the swing mechanism by applying the soldering method according to the present invention.

[Explanation of symbols]

 1 Partial Soldering Device 6a, 6b Solder Tank 9, 10 Transport Rail 17 Air Cylinder (Elevating Mechanism) 21 Swinging Mechanism P Printed Circuit Board (Product Soldered)

Claims (2)

[Claims] 1. A pair of transport rails extending parallel to each other for transporting a plate-shaped article to be soldered in one direction, and a part of the article to be soldered provided below the transport rails. A partial soldering apparatus comprising: a solder bath, an elevating mechanism for elevating and lowering the transfer rail, and an oscillating mechanism for oscillating the transfer rail around an axis parallel to its axis. 2. When partially soldering a plate-shaped article to be soldered with a partial soldering device including a pair of transport rails extending in parallel with each other and a solder bath provided below the transport rails. , The transfer rail holds both ends of the product to be soldered and conveys it in one direction, and the solder bath contacts the jet solder of the solder bath at a predetermined position on the lower surface of the product to be soldered. Or after soaking,
A soldering method characterized in that a swing mechanism provided in advance on the transport rail raises the transport rail while swinging the transport rail in a plane orthogonal to its axis.