JP2011218416A - Soldering device and movable partitioning member structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To freely adjust the hanging distance of a labyrinth section in accordance with the attachment height of an electronic component by engineering the structure of the labyrinth section hanging down on the side of a heat treatment unit, a cooling unit, etc.SOLUTION: The soldering device includes a plurality of covers 31 that seal the top of a heat treatment unit that heat-treats a substrate. Each cover 31 has a movable partitioning member mechanism 40 that includes: a main housing 301 that has a plurality of slits 41 on one side and long hole sections 42a to 42d on the other side; the labyrinth section 43, one end of which is threaded through the slits 41, which hangs down on the side where the heat treatment unit is; a sliding substrate 44, to which the other ends of the labyrinth section 43 are attached, which is installed inside the main housing 301 and engages so as to be able to slide in the substrate transport direction of the main housing 301; and affixing members 45a and 45b that affix the sliding substrate 44 to the main housing 301 via the long hole sections 42a and 42d.

Description

  The present invention relates to a solder reflow device for surface mounting of electronic components having a labyrinth mechanism for defining a soldering atmosphere, a soldering device applicable to a jet soldering device for inserting and mounting electronic component pins, and a partition member movable structure. Is.

  Conventionally, a solder reflow device or a jet soldering device is often used for soldering an electronic component to a printed circuit board. According to the jet soldering apparatus, a fluxer, a pre-heater, a jet solder tank, a cooler, and the like are arranged at predetermined positions. When soldering electronic components to a printed circuit board with this jet soldering device, flux is applied to the entire back surface of the printed circuit board with a fluxer, and then the printed circuit board is preheated with a preheater, and the printed circuit board is used with a jet solder bath. And the electronic component are soldered, and the printed circuit board is cooled by a cooler to complete the soldering process.

  In relation to this type of jet soldering apparatus, Patent Document 1 discloses a soldering apparatus. According to this soldering apparatus, a transport means, a tunnel-like chamber body, an inert gas supply means, a molten solder supply means, a cooling means, and a printed circuit board rapid cooling means are provided. The conveying means conveys the printed wiring board toward the chamber body. The chamber body is provided along the transfer means, and the inert gas supply means supplies an inert gas into the chamber body.

  The molten solder supply means supplies the molten solder to a soldered portion on the soldered surface side of the printed wiring board conveyed into the chamber body. The cooling means takes in the air outside the chamber body and cools it to generate cold air.

  The rapid cooling means for the printed wiring board includes a cold air supply means, a cold air port housing, a heat exhaust port housing, and a heat removal port housing. The cold air supply means is composed of air blowing means capable of adjusting the flow rate of the cold air cooled by the cooling means. The cold air outlet casing operates to blow out the cold air supplied from the cold air supply means toward the printed circuit board supplied with the molten solder from the air outlet. The heat exhaust port casing operates so that the cold air cools the printed wiring board and collects the hot air heated to be discharged from the air exhaust port. The heat removal port housing is configured such that the air exhaust port of the heat exhaust port housing surrounds the side periphery of the air blowing port of the cold air port housing, and the heat removal port is formed. The quenching means has an air exhaust means, and the air exhaust means adjusts the exhaust air flow rate that exhausts the exhaust air from the heat sink housing to the atmosphere outside the chamber body.

  On the premise of this, the heat-dissipating port of the heat-dissipating port housing is provided in the chamber body immediately behind the molten solder supply means so as to face the soldered surface side of the printed wiring board. When the soldering apparatus is configured in this manner, the molten solder supplied to the soldered portion of the printed circuit board can be rapidly cooled before it is completely solidified. The air can be cooled with excellent cooling efficiency while maintaining the flow state and oxygen concentration of the inert gas atmosphere having a low oxygen concentration stably.

  Further, in this type of soldering apparatus, a partition member or deterrent member called a labyrinth that delimits (divides) the atmosphere, a heat treatment region, a cooling treatment region, etc., and separates the heat treatment region from the cooling treatment region. Etc. are often used. In relation to the labyrinth, Patent Document 2 discloses a soldering apparatus. According to the soldering apparatus, a cooler is provided in addition to the conveying means, the chamber, and the molten solder supply means. Further, a deterrent plate that forms a labyrinth portion is provided at the entrance of the chamber. When performing soldering while transporting the printed circuit board into the chamber, a cooler that can be freely changed and attached / detached is provided adjacent to the chamber, and the printed circuit board that has completed the soldering process passes. Cool the chamber. Based on this assumption, the cooler cools the chamber and the restraining plate together. When the soldering apparatus is configured as described above, the printed circuit board can be efficiently cooled by cooling the atmosphere of the portion forming the labyrinth flow path.

  Further, Patent Document 3 discloses an automatic soldering apparatus related to labyrinth. According to this automatic soldering apparatus, in order to perform soldering in an inert gas atmosphere with a low oxygen concentration, in addition to the conveying means, the preheater, the chamber, the jet solder tank, and the cooling device as described above, a printed circuit board is used. A seal member is provided so that an inert gas, air, etc. cannot flow in and out from a portion other than the portion where the gas is taken in and out. The seal member includes an inlet side labyrinth tape and an outlet side labyrinth tape. Many inlet side labyrinth tapes are suspended from the pre-heater side, and many outlet side labyrinth tapes are suspended from the cooling device side.

  The cooling device is provided in the vicinity of the jet solder bath of the outlet side labyrinth tape. The cooling device is provided with a blow-out port, and a low-temperature inert gas is blown from the blow-out port onto the soldering surface of the printed circuit board. The exhaust device is installed on the inlet side labyrinth tape side. On the premise of this, the exhaust device sucks the inert gas flowing into the chamber.

  By configuring the automatic soldering device in this way, the soldered surface of the printed circuit board immediately after soldering can be rapidly cooled with a low-temperature inert gas, preventing cracks and cracks from being generated even if vibration or impact is applied during transportation. It can be done.

  Patent Document 4 discloses a reflow furnace. According to this reflow furnace, two or more compartments are provided in the substrate transport direction when an inert gas is introduced to create an inert atmosphere in the furnace. Each of the compartments is provided with an air intrusion prevention zone at the entrance and exit of the reflow furnace, and the air intrusion prevention zone blocks the flow of gas and is partitioned by a resistor that is a flexible heat-resistant resin piece or metal piece. Has been. By configuring the furnace in this way, air can be prevented from entering, so that it is not only easier to use than a reflow furnace using a shutter, but also the amount of nitrogen supplied into the reflow furnace is smaller than in the conventional example. That's all you need.

  Furthermore, in relation to the height adjustment mechanism of the labyrinth, Patent Document 5 discloses a reflow furnace. According to this reflow furnace, the labyrinth mounting body and the vertical movement means are provided, and a resistance body (labyrinth) is attached to the labyrinth mounting body. It moves up and down in the vertical direction perpendicular to the transport direction.

  When the height adjustment mechanism is configured in this way, the resistor is in a position where it does not contact the entire electronic component and does not allow outside air to enter, and is in an optimal position where it does not cause a positional shift with respect to the high-level electronic component. The labyrinth mounting body can be maintained.

  Further, in relation to the labyrinth height adjusting mechanism, Patent Document 6 discloses a heating furnace for soldering. The soldering heating furnace includes a heating chamber, an upper seal plate unit, a lower seal plate unit, a position adjusting mechanism, and a pair of shielding plates. The upper seal plate unit is installed between the upper wall of the inlet passage and the outlet passage of the heating chamber and the conveyor, and a large number of seal plates provided at predetermined intervals in the conveyor running direction are provided on the upper end side thereof. Integrated with the top plate.

  The lower seal plate unit is installed between the lower wall of the entrance passage and the exit passage of the heating chamber and the conveyor, and a plurality of seal plates provided at predetermined intervals in the conveyor running direction are provided on the lower end side thereof. It is integrated with the bottom plate.

  The position adjusting mechanism has a position adjusting screw, and adjusts the position so as to move in the vertical direction of the upper seal plate unit and the lower seal plate unit. Assuming this, one shield plate is attached to the wall surface of the heating chamber along the upper seal plate unit in the inlet passage and outlet passage of the heating chamber, and the other shield plate is heated along the lower seal plate unit. It is attached to the wall of the room.

  When the position adjusting mechanism is configured in this way, the one shielding plate can prevent gas from flowing between the upper surface walls of the inlet passage and the outlet passage and the upper surface plate of the upper seal plate unit. The other shielding plate can prevent the gas from flowing between the lower surface walls of the inlet passage and the outlet passage and the lower surface plate of the lower seal plate unit.

  Further, in relation to the labyrinth height adjusting mechanism, Patent Document 7 discloses a reflow furnace. According to this reflow furnace, a heater and a cooler are installed in the tunnel, and a gas seal device is provided at the entrance and exit of the tunnel. A vertical movement device is attached to the gas seal device. Based on this premise, the vertical movement device has a computer-controlled motor, and by driving this motor, the labyrinth mounting body attached to the resistor (labyrinth) is moved up and down in the vertical direction perpendicular to the substrate transport direction. Made.

  When the gas seal device is configured in this way, the labyrinth is in an optimal position where the resistor contacts the entire electronic component and does not allow outside air to enter, and does not cause a positional shift with respect to the electronic component having a high height. The attachment body can be maintained.

JP 2001-044611 A (page 5 FIG. 1) Japanese Patent Laid-Open No. 07-202405 (page 5 FIG. 6) Japanese Unexamined Patent Publication No. 2009-038401 (FIG. 1 on page 6) No. 07-053807 (page 3 on page 3) Japanese Patent Laying-Open No. 2006-185983 (FIG. 1 on page 6) JP 05-305429 A (page 3 FIG. 1) Japanese Patent Laying-Open No. 2004-181383 (FIG. 2 on page 4)

  By the way, according to the soldering device and the reflow device according to the conventional example, as seen in Patent Documents 1 to 3, the labyrinth portion is suspended from the upper side inside the chamber, and a mechanism for fixing at the upper portion is adopted. It has been.

  On the other hand, electronic components such as connectors mounted on a printed circuit board have conventionally been large in size. In recent years, due to the demand for miniaturization of electronic devices, insert-type electronic components have also been manufactured in small sizes. In many cases, the heights of the electronic components constituting the electronic device also differ depending on the electronic device.

  In general, the soldering process is performed in units of several to several hundreds per lot. Therefore, it is necessary to adjust the hanging length of the labyrinth part according to the height of the electronic component for each lot. In order to solve this problem, Patent Documents 4 to 7 disclose a soldering furnace equipped with a height adjusting mechanism for a labyrinth part, a reflow device, and the like.

  According to the height adjustment mechanism of the labyrinth portion applied to this type of soldering heating furnace, a reflow apparatus, etc., the labyrinth mounting body itself with the labyrinth portion is moved up and down in the vertical direction perpendicular to the substrate transport direction. The method is taken. For this reason, a movable range (space) for moving the labyrinth mounting body up and down must be ensured in the vertical direction inside the apparatus, and there is a problem that the apparatus becomes large and its drive mechanism becomes complicated.

  Therefore, the present invention solves such problems, and devise a partition member that hangs down to a heat treatment section, a cooling processing section, etc., and hangs down the partition member according to the mounting height of the electronic component. It is an object of the present invention to provide a soldering apparatus and a partition member movable structure that can adjust freely.

  In order to solve the above-mentioned problem, the soldering apparatus according to claim 1 is configured to heat-treat a substrate on which the electronic component is mounted, to thereby solder the electronic component to the substrate, and to cool the substrate after the soldering. The soldering apparatus includes: a heat treatment portion that has an opening in the upper portion and heat-treats the substrate; and a lid that closes the opening of the heat treatment portion, and the lid includes a plurality of slits on one surface side. Each of the partition members, and a partition member that has an elongated hole portion on the other surface side, a partition member that has one end passed through a slit of the body portion and hangs down to the processing unit side, and The other end of the main body is mounted in the main body, and is slidably engaged with the main body in the substrate transport direction. Fixing part for fixing the moving substrate to the main body It is characterized in that it has a partition member movable structure including.

  According to the soldering apparatus of the first aspect, the main body portion of the lid casing structure has a plurality of slits on one surface side, and has a long hole portion on the other surface side. One end of the partition member is passed through the slit of the main body part and hangs down to the heat treatment part side. Based on this assumption, a heat treatment part having an opening in the upper part thereof is a case where the board on which the electronic component is mounted is heat-treated, the electronic part is soldered to the heat-treated board, and the soldered board is cooled. When the partition member that hangs down to the side is movable corresponding to the electronic component, loosening the fixing portion is a sliding substrate that is fixed through the elongated hole portion of the main body, and each of the partition members An end is attached, and the sliding substrate incorporated in the main body is slidably engaged with the substrate transport direction of the main body.

  Therefore, when the sliding substrate is moved within the range regulated by the long hole portion, the length of the partition member hanging from the slit of the main body portion to the heat treatment portion side can be freely adjusted.

  The soldering device according to claim 2 is provided with an infarct seat member having a predetermined shape having a width and a length covering at least a long hole portion of the main body portion according to claim 1, and the fixing portion includes the infarction member. The sliding substrate is fixed to the main body through a seat member.

  The soldering apparatus according to claim 3 is the position according to claim 2, wherein the infarct seat member is provided with an index portion having a predetermined shape, and one end of the index portion is indicated on the main body portion. The scale portion is provided with a scale capable of reading the exposed length of the partition portion.

  According to a fourth aspect of the present invention, there is provided the soldering apparatus according to the first aspect, wherein the lid having the partition member movable structure includes at least a vicinity of a carry-in entrance of a heat treatment unit that performs a preheating treatment on the substrate on which the electronic component is attached. Near the inlet of the processing unit for soldering the electronic component to the substrate after the heat treatment, near the inlet of the cooling processing unit for cooling the substrate after the soldering, and an outlet for discharging the substrate after the cooling process It is provided in this.

  The partition member movable structure according to claim 5 is a partition member movable structure that moves a partition member that hangs down to a processing container side having an opening at an upper portion thereof, and has a plurality of slits on one surface side, and the other A main body part having a long hole part on the surface side, a partition member whose one end is passed through the slit of the main body part and hangs down to the processing part side, and the other end of each of the partition members is attached. A sliding board incorporated in the main body part and slidably engaged with the main body part, and a fixing part for fixing the sliding board to the main body part through an elongated hole part of the main body part Are provided.

  According to the partition member movable structure of the fifth aspect, the main body portion of the housing structure has a plurality of slits on one surface side and has a long hole portion on the other surface side. One end of the partition member is passed through the slit of the main body part and hangs down to the processing part side. Based on this assumption, when moving the partition member hanging from the processing container having an opening in the upper part, when the fixing part is loosened, the sliding substrate is fixed through the long hole part of the main body part. The other end of each of the partition members is attached and the sliding board incorporated in the main body is slidably engaged with the main body. Therefore, when the sliding substrate is moved within the range regulated by the long hole portion, the length of the partition member hanging from the slit of the main body portion to the processing container side can be freely adjusted.

  According to the soldering apparatus of the present invention, the lid includes a cover that covers the heat treatment part, and the cover is attached to the other end of each partition member that is passed through the slit of the main body part and hangs down to the process part. And a sliding substrate that is incorporated in the main body and is slidably engaged with the substrate transport direction of the main body.

  With this configuration, when the sliding substrate is moved within a range regulated by the long hole portion, the length of the partition member hanging from the slit of the main body portion toward the heat treatment portion can be freely adjusted. Accordingly, the exposed length of the partition member can be freely set corresponding to the mounting height of the electronic component with respect to the substrate. Moreover, when compared with the conventional labyrinth height adjustment mechanism, the mechanism for moving the main body itself supporting the partition member in the height direction can be omitted, and the means for shutting off the outside air can also be omitted. The labyrinth height adjusting mechanism can be simplified.

  According to the partition member movable structure according to the present invention, the other end of each of the partition members whose one end is passed through the slit of the main body part and hangs down to the processing part side is attached and incorporated in the main body part, and the substrate of the main body part It comprises a sliding substrate that is slidably engaged in the transport direction.

  With this configuration, when the sliding substrate is moved within a range regulated by the long hole portion, the length of the partition member hanging from the slit of the main body portion toward the processing container can be freely adjusted.

It is a conceptual diagram which shows the structural example of the jet soldering apparatus 100 as embodiment which concerns on this invention. It is a perspective view which shows the example of a cover body support sealing structure as a 1st Example. FIG. 5 is an exploded perspective view showing an assembly example (No. 1) of the lid support sealing mechanism 30; 6 is an exploded perspective view showing an assembly example (No. 2) of the lid support sealing mechanism 30. FIG. 10 is an exploded perspective view showing an assembly example (No. 3) of the lid support sealing mechanism 30. FIG. FIG. 6 is an exploded perspective view showing an assembly example (No. 4) of the lid support sealing mechanism 30; (A) And (B) is a key map showing the example of handling (the 1) of lid support sealing mechanism 30. (A)-(C) are the conceptual diagrams which show the handling example (the 2) of the cover body support sealing mechanism 30. FIG. It is a perspective view which shows the partition member movable structure example as a 2nd Example. FIG. 6 is an exploded perspective view showing an assembly example (part 1) of the partition member movable mechanism 40; FIG. 6 is an exploded perspective view showing an assembly example (part 2) of the partition member movable mechanism 40; FIG. 6 is an exploded perspective view showing an assembly example (part 3) of the partition member moving mechanism 40; (A)-(B) are perspective views which show the operation example of the partition member movable mechanism 40. FIG. It is a perspective view which shows the structural example of the both-ends gas supply mechanism 70 as a 3rd Example. FIG. 6 is a perspective view illustrating a configuration example of a nozzle conduit 75. It is sectional drawing which shows the structural example of the diffusing member 76a and its peripheral part. It is sectional drawing which shows the function example of the diffusion member 76a. It is a perspective view which shows the structural example of the nozzle pipe line 75 for nitrogen gas supply. It is a conceptual diagram which shows the example of relationship between the gas supply parts 71 and 72, the nozzle pipe line 75, and an electrical circuit. It is a perspective view which shows the structural example of the cover body unit 80 as a 4th Example. 5 is an exploded perspective view showing an assembly example (No. 1) of the lid unit 80. FIG. 6 is a conceptual diagram showing an assembly example (No. 2) of the lid unit 80. FIG. 5 is a conceptual diagram showing an operation example of a lid unit 80. FIG. It is a block diagram which shows the structural example of the control system of the jet soldering apparatus. It is a flowchart which shows the operation example of the jet soldering apparatus 100. FIG.

Hereinafter, a soldering apparatus and a partition member movable structure according to the present invention will be described with reference to the drawings.
<Embodiment>
A jet soldering apparatus 100 shown in FIG. 1 pre-heats a printed circuit board 1 to which electronic components are attached, conveys the pre-heated printed circuit board 1 into an inert gas atmosphere, and performs electronic processing in the inert gas atmosphere. The components are soldered to the printed circuit board 1 and the printed circuit board 1 after soldering is cooled. In this example, the side where the printed circuit board 1 is taken into the jet soldering apparatus 100 is referred to as the upstream side, and the side where the printed circuit board 1 is taken out is referred to as the downstream side. It is assumed that the printed circuit board 1 is transported from the upstream side to the downstream side. The conveyance direction of the printed circuit board 1 is conveyed from the left end side to the right end side as shown by a white arrow I in FIG.

  The jet soldering apparatus 100 has a main body base 101. The main body frame 101 includes a transport unit 10, a heat treatment unit 20, a lid support sealing mechanism 30, a partition member movable mechanism 40, a chamber 50, a jet solder tank 60, a gas supply mechanism 70 at both ends, a lid unit 80, and a cooling processing unit 90. And an air curtain mechanism 99 is provided.

  The main body base 101 includes at least beam frames 102 and leg portions 103 and 104 and leg portions 105 and 106 (not shown) at four corners of the beam frame member 102. The beam frame member 102 and the legs 103 to 106 are made of steel members.

  A conveying unit 10 is provided on the beam frame member 102. The transport unit 10 is disposed through the chamber 50 and upstream and downstream. In order to improve the cutting of the molten solder 7, the transport unit 10 is obliquely attached to the main body base 101 with a predetermined elevation angle θ. The elevation angle θ is, for example, about 5 ° to 10 °.

  The transport unit 10 transports the printed circuit board 1 attached with electronic components in the direction of the chamber 50. In addition to resistors, capacitors, and IC chips, electronic components include a PGA (Pin Grid Array: PGA) or dual package, where a large number of leads are installed on one electronic component, and connectors Including an electrode that is electrically connected to a number of jacks.

  The transport unit 10 includes an endless chain member 11 and a plurality of L-shaped claw-shaped transport chucks 12. The chain members 11 are provided on both sides of the printed board 1 in the conveyance direction. The conveyance chuck 12 is attached to the chain member 11 at a predetermined arrangement pitch. The printed circuit board 1 is set so as to be transported with the printed circuit board 1 sandwiched between the transport chucks 12 on both sides.

  A heat treatment unit 20 is provided on the upstream side of the chamber 50. The heat treatment part 20 has an opening 201 in the upper part, and heats the printed circuit board 1. Of course, the opening 201 is closed so as to be sealed with a plurality of predetermined lid bodies 31, 32, 33, 34. The heat treatment unit 20 has a tunnel shape, and for example, heats the printed circuit board 1 attached with electronic components to a predetermined temperature.

  In this example, the heat treatment unit 20 is provided so as to cover the transport unit 10 on the upstream side with respect to the chamber 50. A substrate carry-in port 202 is provided on the most upstream side of the heat treatment unit 20. The printed circuit board 1 is set in the transport unit 10 at the board carry-in port 202. The heat treatment section 20 is composed of, for example, four preheating zones 21, 22, 23, and 24 (preheater zones).

  In the heat treatment unit 20, the preheating zones 21 to 24 each form a heating atmosphere in order to gradually heat the printed circuit board 1 to which electronic components are attached and to heat the printed circuit board 1 to an optimum soldering temperature. A substrate communication port 203 reaching the chamber 50 is provided on the downstream side of the heat treatment unit 20. The transport unit 10 transports the pre-heated printed circuit board 1 through the substrate communication port 203 and into the chamber 50. The heat treatment unit 20 is provided with a lid support sealing mechanism 30. The lid support sealing mechanism 30 supports the lids 31, 32, 33, and 34 to seal the opening 201 (see FIGS. 2 to 8).

  In this example, the lid members 31 and 34 are provided with a partition member moving mechanism 40. The partition member moving mechanism 40 is configured to hold a plurality of labyrinth portions 43 that are examples of the partition member in a movable manner (see FIGS. 9 to 13). The labyrinth unit 43 prevents dust and the like from entering the heat treatment unit 20 from the outside, and prevents leakage of nitrogen gas from the chamber 50 to the outside.

A chamber 50 (processing vessel) is connected to the substrate communication port 203 of the heat treatment unit 20. In the chamber 50, an inert gas is introduced to form an inert gas atmosphere. Nitrogen gas (N ₂ ) or argon gas (Ar) is generally used as the inert gas. The chamber 50 solders electronic components to the printed circuit board 1 in an inert gas atmosphere.

  Below the chamber 50, a jet solder bath 60 is provided. The jet solder bath 60 accommodates the molten solder 7 heated to a predetermined temperature. The jet solder bath 60 ejects molten solder 7 in an atmosphere of nitrogen gas, and solders electronic components to the printed circuit board 1. The jet solder bath 60 has two systems of jet nozzles 61 and 62. The ejection nozzles 61 and 62 are arranged side by side in the transport direction of the printed circuit board 1.

  The upstream ejection nozzle 61 is used during a primary soldering process in which molten solder is roughly jetted and soldered. The jet nozzle 62 on the downstream side is used for a secondary soldering process (for finishing) in which molten solder is finely jetted and soldered. The jet solder bath 60 is configured by, for example, forming a stainless (SUS) plate into a box shape. In the jet solder bath 60, two cylinder type jet pumps (hereinafter simply referred to as pumps 8 and 9) that do not use a rectifying plate are provided. For the pumps 8 and 9, for example, a totally sealed screw pump (impeller pump) is used.

  The pump 8 is driven by a motor 68 and supplies the molten solder 7 accommodated in the jet solder bath 60 to the jet nozzle 61 at a predetermined pressure. The pump 9 is driven by a motor 69 and supplies the molten solder 7 accommodated in the jet solder bath 60 to the jet nozzle 62 at a predetermined pressure. The molten solder 7 ejected from the ejection nozzles 61 and 62 is controlled by a jet solder driving unit 66 shown in FIG. The chamber 50 and the jet solder bath 60 constitute a soldering processing unit.

In this example, a gas supply mechanism 70 at both ends is provided below the main body frame 101 and adjacent to the jet solder bath 60. The both-end gas supply mechanism 70 ejects, for example, nitrogen gas (N ₂ ) onto the liquid surface of the jet solder bath 60 and forms a nitrogen gas atmosphere on the side where the electronic components are soldered. The both-end gas supply mechanism 70 includes, for example, gas supply units 71 and 72, an N2 gas tank 74, and a nozzle conduit 75. One end of each of the gas supply units 71 and 72 is connected to the N2 gas tank 74.

  The other end of the gas supply unit 71 is connected to one end of the nozzle conduit 75, and the other end of the gas supply unit 72 is connected to the other end of the nozzle conduit 75. The gas supply units 71 and 72 individually adjust the nitrogen gas for making the nitrogen gas atmosphere on the liquid surface of the jet solder bath 60 via the nozzle conduit 75. In addition, the gas supply part 73 adjusts the flow volume of the nitrogen gas for making the inside of the chamber 50 into a nitrogen gas atmosphere (refer FIGS. 14-19).

  In this example, a lid unit 80 is detachably attached above the chamber 50 so as to close (cover) an opening 501 (see FIG. 23) on the chamber 50. The lid unit 80 has an atmosphere inlet / outlet 801 and an atmosphere outlet 802.

  An atmosphere cleaning unit 81 is connected to the atmosphere inlet 801 and the atmosphere outlet 802. The atmosphere inlet 801 is a portion that feeds the nitrogen gas atmosphere into the chamber 50 after the flux fume is removed by the atmosphere cleaning unit 81. The atmosphere discharge port 802 is a portion that discharges a nitrogen gas atmosphere containing flux fume in the chamber 50 to the atmosphere cleaning unit 81 (see FIGS. 20 to 25).

  The atmosphere cleaning unit 81 cleans a nitrogen gas atmosphere containing flux fumes discharged from the atmosphere discharge port 802 and supplies the cleaned nitrogen gas atmosphere to the atmosphere inlet 801. For example, the atmosphere cleaning unit 81 includes a casing 83 having an atmosphere inlet 803 and an atmosphere outlet 804, and a plurality of pipes 82 provided in the casing 83. Air (cold air) is ventilated inside the pipe 82.

  The nitrogen gas atmosphere (nitrogen gas + atmosphere) containing the flux fume is introduced into the housing 83, and when passing through the outside of the pipe 82, the flux fume strikes the pipe 82 and is cooled, and the flux fume is condensed (condensed). And adheres to the outside of the pipe 82. As a result, the flux fume and the nitrogen gas atmosphere can be separated.

  A cooling processing unit 90 is provided on the downstream side of the chamber 50. For example, the cooling processing unit 90 is provided so as to cover the transport unit 10 on the downstream side with respect to the chamber 50. The above-described transport unit 10 transports the printed circuit board 1 after the soldering process to the cooling processing unit 90. The cooling processing unit 90 cools the printed circuit board 1 to which the electronic component is soldered that is transported by the transport unit 10.

  The cooling processing unit 90 has an opening 901 at the top, and the opening 901 is closed by a plurality of predetermined lids 91 and 92, and the cooling processing unit 90 forms a tunnel shape. The lid bodies 91 and 92 are provided with a partition member moving mechanism 40, and the lid body supporting and sealing mechanism 30 is provided between the opening 901 and the lid bodies 91 and 92 (see FIGS. 7 and 8). .

  The cooling processing unit 90 is provided with an air cooling fan (not shown), and a cooling process is performed on the printed circuit board 1 by blowing nitrogen gas or cold air onto the upper and lower surfaces of the printed circuit board 1 to which electronic components are attached. A substrate carry-out port 902 extending to the outside is provided on the downstream side of the cooling processing unit 90. The printed circuit board 1 after cooling is taken out from the board carry-out port 902.

  An air curtain mechanism 99 is provided at the substrate carry-out port 902. The air curtain mechanism 99 is provided with a blower 904 such as a cross flow fan, a lower guide plate 905 and an upper guide plate 906. The blower 904 is attached to the main body base 101. The lower guide plate 905 is provided below the transport unit 10, and the upper guide plate 906 is provided above the transport unit 10. The lower guide plate 905 and the upper guide plate 906 have substantially the same length as the width direction of the transport unit 10, and the inner surface has, for example, an R shape. Of course, the lower guide plate 905 and the upper guide plate 906 may be L-shaped or straight. The lower guide plate 905 and the upper guide plate 906 are made of a metal member such as stainless steel or an iron plate, or a hard resin.

  For example, when the air blower 904 blows air upward, the upper guide plate 906 guides the air received from the air blower 904 to face downward. The lower guide plate 905 guides air received from above so as to face upward. The air curtain mechanism 99 forms air curtain by convection of air to the substrate carry-out port 902. This air curtain is composed of an air curtain made of convection air from the air blower 904 to the upper guide plate 906, from the upper guide plate 906 to the lower guide plate 905, and from the lower guide plate 905 to the upper guide plate 906. Is done.

  Thereby, the air curtain mechanism 99 causes air to convect (circulate) between the lower guide plate 905 and the upper guide plate 906, so that dust and the like can be prevented from entering the cooling processing unit 90 from the outside. The leakage of nitrogen gas from the chamber 50 to the outside can be prevented. As a result, nitrogen gas resources can be used efficiently.

  In this example, the case where the atmosphere inlet / outlet 801 and the atmosphere outlet 802 are configured as the lid unit 80 has been described, but the chamber 50 may be integrally provided. In this example, the case of soldering in a nitrogen gas atmosphere (inert gas atmosphere) has been described, but soldering in an air atmosphere may be used. Hereinafter, examples of the lid unit 80 and a nitrogen gas atmosphere (inert gas atmosphere) will be described.

  Next, an example of a lid support sealing structure as a first embodiment will be described with reference to FIG. The lid support sealing mechanism 30 shown in FIG. 2 forms a lid support sealing structure, and is provided in the heat treatment unit 20 and the cooling processing unit 90 of the jet soldering apparatus 100. The heat treatment section 20 and the cooling processing section 90 described above have a long groove structure with a concave cross section as shown in FIG. The heat treatment unit 20 has an opening 201 at the upper part of the groove structure, and the cooling processing unit 90 has an opening 901 at the upper part of the groove structure. The lid support sealing mechanism 30 provides a top plate mounting mechanism for sealing the opening 201, the opening 901, and the like.

  The lid support sealing mechanism 30 includes four rectangular lids 31 to 34 (only the lid 32 is shown in the figure), two lids 91 and 92, and a pair of long sliding supports. It has the members 35a and 35b. The lid body 32 does not include the partition member moving mechanism 40.

  The lid body 32 constitutes an example of a plurality of lid members, and the inside thereof has a heat insulating structure. On a predetermined surface of the lid 32, in this example, a surface facing the opening 201 of the heat treatment unit 20, engagement groove portions 36 a and 36 b having a pair of short cross-sectional comb blade shapes are provided. The engaging groove portions 36 a and 36 b are disposed on a predetermined surface of the lid body 32 along the conveyance direction of the printed circuit board 1. The engaging groove portion 36a is provided with a plurality of concave and convex groove portions having a comb blade shape in cross section, and the engaging groove portion 36a forms a multi-groove rail shape. The number of groove portions is six. The engaging groove portion 36b is configured similarly. The lid body 32 is handled so as to seal the opening 201 of the heat treatment section 20.

  The sliding support member 35a to which the above-described lid body 32 is attached has an engaged groove portion 37a having a long cross-sectional comb blade shape. In this example, the engaged groove portion 37a is provided with a plurality of concave and convex groove portions having a comb blade shape in cross section, and the engaged groove portion 37a forms a multi-groove rail shape. The number of groove portions is six. The engaged groove portion 37b is similarly configured. The sliding support members 35 a and 35 b are disposed along sides facing each other at the opening 201 of the heat treatment unit 20.

  The engaging groove portions 36a and 36b of the lid body 32 are fitted into the engaged groove portions 37a and 37b of the sliding support members 35a and 35b, respectively. For example, the convex portions of the engaging groove portions 36a and 36b are assembled (engaged) corresponding to the concave portions of the engaged groove portions 37a and 37b. In this example, an air heat insulating layer is formed in the engaging groove portions 36a and 36b and the concave and convex engaging portions of the engaged groove portions 37a and 37b. Compared with the conventional silicone rubber contact surface, the heat insulation effect can be improved.

  In addition, aluminum, iron, stainless steel, etc. are used for the rail material of engagement groove part 36a, 36b and to-be-engaged groove part 37a, 37b. In order to align thermal expansion vertically, it is preferable to use the same rail material for the engaging groove portions 36a and 36b and the engaged groove portions 37a and 37b.

  Subsequently, an assembly example (parts 1 to 4) of the lid support sealing mechanism 30 will be described with reference to FIGS. In this example, it is assumed that the lid support sealing mechanism 30 shown in FIG. 2 is assembled. First, short and multi-groove rail-like engagement grooves 36a and 36b are attached to a predetermined surface of the lid 32 shown in FIG.

  The lid 32 is prepared with a heat insulating material (may be a space) inside. The lengths of the engaging grooves 36a and 36b are prepared so as to be equal to the length of the lid 32. The engagement grooves 36a and 36b are attached to a predetermined surface of the lid 32 using a heat-resistant double-sided tape or a heat-resistant adhesive. Alternatively, the engaging groove portions 36 a and 36 b are screwed to a predetermined surface of the lid body 32.

  Next, the gap filling members 38a and 38b are attached to the respective small edge surfaces of the lid 32 to which the engaging groove portions 36a and 36b shown in FIG. 4 are attached. The gap filling members 38a and 38b are formed so as to represent the cross section of the multi-groove rail shape of the engaging groove portions 36a and 36b and the adjacent surface (small edge surface) of the lid 32. Here, the adjacent surface refers to a surface on the side where the two lid bodies 31 and the lid body 32 are adjacent. A heat-resistant silicone rubber sheet is used for the gap filling members 38a and 38b.

  The gap filling member 38a is attached to the cross section and the fore edge surface after aligning the cross section of the multi-groove rail shape of the engaging groove portions 36a and 36b and the fore edge surface of the lid 32. A heat-resistant adhesive is used for attaching the gap filling member 38a. The gap filling member 38b is also joined in the same manner. The gap filling members 38a and 38b may be configured by dividing a rectangular portion on the lid 32 side and a comb blade portion on the engagement groove portions 36a and 36b side.

  In this example, the gap filling member 38a is formed between the one lid body 32 and the other adjacent lid body 31, and between the engaging groove portions 36a and 36b of the one lid body 32 and the other lid body adjacent to each other. It is provided between the 31 engaging groove portions 36a and 36b to maintain airtightness. The gap filling member 38b is engaged between the one lid body 32 and the other adjacent lid body 33, and between the engaging groove portions 36a and 36b of the one lid body 32 and the other lid body 33 adjacent to each other. It is provided between the groove portions 36a and 36b to maintain airtightness.

  Next, the multi-groove rail-shaped sliding support member 35a shown in FIG. 5 is attached to the right end portion inside the upper edge of the heat treatment portion 20. Similarly, the multi-groove rail-like sliding support member 35b is attached to the left end portion inside the upper edge of the heat treatment portion 20. The sliding support members 35a and 35b are firmly fixed to the inside of the upper edge of the heat treatment section 20 with an engaging member such as a screw or a clasp (not shown). The side of the cooling processing unit 90 shown in FIG.

  Then, the opening part 201 on the heat processing part 20 is covered with the cover body 32 shown in FIG. For example, the convex portion of the engaging groove portion 36a is assembled (engaged) corresponding to the concave portion of the engaged groove portion 37a, and the convex portion of the engaging groove portion 36b is the concave portion of the engaged groove portion 37b. Are combined correspondingly. An air heat insulating layer is formed in the engaging groove portions 36a and 36b and the concave and convex engaging portions of the engaged groove portions 37a and 37b.

  Thus, the lid 32 and the like can be slidably supported by the sliding support members 35a and 35b. Further, the opening 201 on the rectangular heat treatment section 20 shown in FIG. 1 can be sealed with the four lid bodies 31 to 34 (lid members). Furthermore, since the lid 32 and the like can be slid, the lid 32 and the like can be easily attached to the opening 201, and the heat treatment unit 20 can be easily inspected and restored.

  Subsequently, with reference to FIGS. 7A and 7B and FIGS. 8A to 8C, handling examples (parts 1 and 2) of the lid support sealing mechanism 30 will be described. In this example, as shown in FIG. 7A, the lid body 31 and the lid body 34 with the partition member moving mechanism 40 are attached to the opening 201 of the heat treatment section 20, and the partition between the lid body 31 and the lid body 34 is attached. The case where the lid 32 and the lid 33 without the member movable mechanism 40 are attached and the case where the lid 91 and the lid 92 with the partition member movable mechanism 40 are attached to the opening 901 of the cooling processing unit 90 will be described. To do.

  Of course, the lid bodies 91 and 92 are provided with a pair of multi-groove rail-like engaging groove portions 36 a and 36 b arranged along a predetermined direction as described in the lid body 32. The lids 91 and 92 are handled so as to seal the opening 901 of the cooling processing unit 90. The sliding support members 35a and 35b on the cooling processing unit 90 side also have a pair of engaged grooves 37a and 37b in the form of multi-groove rails arranged along the sides facing each other at the opening 901. The lids 91 and 92 are slidably supported.

  Under these handling conditions, the lid 34 shown in FIG. 7B is aligned with the opening 201 on the heat treatment section 20, and the lid 34 is placed on the sliding support members 35 a and 35 b on the heat treatment section 20 side. In this state, the lid body 34 is slid from the upstream side to the downstream side in the direction shown by the white arrow II in the drawing, the end of the lid body 34 is pressed against the left outer wall of the chamber 50, and the lid is covered with an engagement member (not shown). The body 34 is fixed to the chamber 50.

  Similarly, the lid body 91 is aligned with the opening 901 on the cooling processing section 90 in the direction of the white arrow III shown in FIG. 7B, and the lid body 91 is slid like a multi-groove rail on the cooling processing section 90 side. It mounts on the moving support members 35a and 35b. At this time, the multi-groove rail-shaped engaging groove portion 36a of the lid 91 is fitted into the engaged groove portion 37a of the sliding support member 35a, and the engaging groove portion 36b is engaged with the engaged groove portion 37b of the sliding support member 35b. Respectively. In this state, the lid body 91 is slid from the downstream side to the upstream side in the direction of the white arrow IV shown in the figure, the end of the lid body 91 is pressed against the right end outer wall of the chamber 50, and the lid is covered with an engagement member (not shown). The body 91 is fixed to the chamber 50.

  Next, the lid 33 is aligned with the opening 201 on the heat treatment section 20 in the direction of the white arrow V shown in FIG. 8A, and the lid 33 is placed on the sliding support members 35a and 35b on the heat treatment section 20 side. Put. In this state, the lid body 33 is slid from the upstream side to the downstream side in the direction of the white arrow VI shown in the figure, and the end portion of the lid body 33 is pressed against the end portion of the lid body 34, and the engagement member (not shown) The lid 33 is fixed to the lid 34.

  Similarly, the lid 92 is aligned with the opening 901 on the cooling processing unit 90 in the direction of the white arrow VII shown in FIG. 8A, and the lid 92 is slid on the sliding support member 35a on the cooling processing unit 90 side. 35b. In this state, the lid 92 is slid from the downstream side to the upstream side, the end of the lid 92 is pressed against the end of the lid 91, and the lid 91 is fixed to the lid 92 with an engagement member (not shown). With this structure, the lids 91 and 92 can be supported with good airtightness by the cooling processing unit 90, and the cooling processing unit 90 can be hermetically sealed with the lids 91 and 92.

  Similarly, the lid body 32 shown in FIG. 8B is aligned with the opening 201 on the heat treatment section 20, and the lid body 32 is placed on the sliding support members 35 a and 35 b on the heat treatment section 20 side. In this state, the lid body 32 is slid from the upstream side to the downstream side in the direction of the white arrow VIII shown in the figure, and the end portion of the lid body 32 is pressed against the end portion of the lid body 33 with an engagement member not shown. The lid body 32 is fixed to the lid body 33.

  After that, the lid body 31 is aligned with the opening 201 on the heat treatment section 20 in the direction of the white arrow IX shown in FIG. 8B, and the end of the lid body 31 is pressed against the end of the lid body 33, The lid body 31 is fixed to the lid body 32 by an engaging member (not shown). Accordingly, as shown in FIG. 8C, the lid body 31 and the lid body 34 with the partition member moving mechanism 40 are attached to the opening 201 of the heat treatment section 20, and the partition member is provided between the lid body 31 and the lid body 34. The lid body 32 and the lid body 33 without the movable mechanism 40 can be attached, and the lid body 91 and the lid body 92 with the partition member movable mechanism 40 can be attached to the opening 901 of the cooling processing unit 90.

  Thus, according to the jet soldering apparatus 100 as the first embodiment, the lid bodies 31 to 34 have a pair of engaging groove portions 36a and 36b arranged along their predetermined directions. . The sliding support members 35a and 35b provided on the heat treatment portion 20 side have a pair of engaged groove portions 37a and 37b disposed along sides facing each other at the opening 201 of the heat treatment portion 20. ing.

  On the premise of this, when the upper part 201 of the heat treatment part 20 is sealed with the four cover bodies 31, 32, 33, 34, the engagement groove part 36a of the cover body 31 to the cover body 33 is a sliding support member. 35a is engaged with the engaged groove 37a, and the engagement groove 36b is engaged with the engaged groove 37b of the sliding support member 35b.

  Therefore, for example, the other lid body 32 to 34 except for the lid body 31 are supported (sealed) slidably and airtightly on the heat treatment unit 20, and the last lid body. The heat treatment part 20 can be hermetically sealed at 31.

  The lids 91 and 92 have a pair of engaging groove portions 36a and 36b arranged along their predetermined directions. The sliding support members 35a and 35b provided on the cooling processing unit 90 side include a pair of engaged groove portions 37a and 37b disposed along sides facing each other at the opening 901 of the cooling processing unit 90. Have.

  On the premise of this, when the upper portion 901 of the cooling processing unit 90 is sealed with the two lids 91, 92, the engagement groove 36a of the lid 91 is engaged with the engaged groove 37a of the sliding support member 35a. The engaging groove portions 36b are respectively engaged with the engaged groove portions 37b of the sliding support member 35b.

  Therefore, the lid body 91 except for the lid body 92 to be attached at the end is supported (sealed) slidably and airtightly on the cooling processing unit 90, and the last lid body 92 is airtight. The cooling processing unit 90 can be sealed. Thereby, the jet soldering apparatus provided with the said lid support sealing mechanism 30 can be provided.

  Note that the order of attaching the lids 31 to 34 and the lids 91 and 92 to the openings 201 and 901 is not limited to the order of the above-described embodiments, and can be appropriately changed as necessary. In this example, the lids 31 to 34 and the lids 91 and 92 have been described as being removable. However, the present invention is not limited to this and can be applied to lids that can be opened and closed by a hinge mechanism.

  Next, with reference to FIGS. 9 and 10, an example of the partition member movable structure and its assembly example as the second embodiment will be described. The partition member moving mechanism 40 shown in FIG. 9 seals the lids 31 and 34 that seal the opening 201 of the heat treatment unit 20 of the jet soldering apparatus 100 shown in FIG. 1 and the opening 901 of the cooling processing unit 90. The lids 91 and 92 are provided.

  In FIG. 9, the lid body 31 has a main body 301 having a housing structure. The main body 301 is provided with a partition member moving mechanism 40 as shown in FIG. The partition member moving mechanism 40 includes a plurality of labyrinth portions 43, one sliding substrate 44, eleven locking members 47, and two locking members 48, as well as four fixing members 45a shown in FIG. ˜45b and two infarct seat members 46a and 46b having a concave cross section. The partition member moving mechanism 40 is handled so as to adjust a hanging length at which the labyrinth portion 43 constituting an example of the partition member is exposed to the outside (hereinafter referred to as exposure lengths L1, L2, and L3: see FIG. 13).

  In this example, the infarct seat members 46 a and 46 b are provided with an index portion 401 having a predetermined shape, and the main body portion 301 has a scale portion 402 at a position indicated by one end of the index portion 401. The indicator unit 401 is, for example, a red triangle mark.

  The scale portion 402 is provided with a scale that can read the exposed lengths L1 to L3 of the labyrinth portion 43. The scale is formed in black with an equally divided scale of 1 mm unit, for example. Of course, the indicator portion 401 may be provided on the fixed side, and the scale portion 402 may be provided on the movable side. Thereby, the exposed lengths L <b> 1 to L <b> 3 of the labyrinth portion 43 can be confirmed on the lid 31 without opening the lid 31.

  Next, an assembly example of the lid body 31 including the partition member moving mechanism 40 will be described with reference to FIGS. In this example, eleven slits 41 shown in FIG. 12 are opened at predetermined positions of the lower plate 304 so that the labyrinth portion 43 passes through each slit 41. All the labyrinth portions 43 are attached to the sliding substrate 44 in common. At that time, the labyrinth portion 43 is inserted into the slit 49 of the sliding substrate 44 for each column. One end of the labyrinth part 43 is passed through each slit 41 of the lower plate 304 and is suspended from the heat treatment part 20 (in a state of hanging down).

  Using these as assembling conditions, the labyrinth portion 43 having a strip shape is used. The labyrinth portion 43 is arranged in a matrix with respect to the sliding substrate 44. The labyrinth portion 43 and the adjacent labyrinth portion 43 are preferably attached so as to overlap each other in order to improve airtightness. In this example, a total of 110 labyrinth portions 43 of 11 columns × 10 rows are attached to the sliding substrate 44. The labyrinth portion 43 is composed of a heat-resistant rubber-based resin member. As the sliding substrate 44, an iron plate having a predetermined thickness and having 11 slits 49 opened is used.

  In this example, the other end of each of the labyrinth portions 43 is attached to the sliding substrate 44 shown in FIG. 10, and an intermediate assembly including the labyrinth portion 43 and the sliding substrate 44 is incorporated into the main body portion 301. For example, in the sliding substrate 44 having eleven slits 49, the end of the labyrinth portion 43 is fixed by the locking member 47 at the upper portion so that the end portion of the labyrinth portion 43 is bent at a substantially right angle. Here, the end portion of the labyrinth portion 43 attached so as to fold the slit 49 of the sliding substrate 44 at a right angle is formed by a pair of locking members 48 in the row direction and eleven locking members 47 in the column direction. Assemble to 44 and fix it in a cross beam. Thereby, the intermediate assembly which consists of the sliding board | substrate 44 to which the labyrinth part 43 was fixed is obtained.

  Next, an intermediate assembly composed of the labyrinth portion 43 and the sliding substrate 44 is mounted inside the main body portion 301. A main body 301 shown in FIG. 11 includes a rectangular frame member 302 and an upper plate 303, and a rectangular lower plate 304 shown in FIG. The main body 301 has a plurality of slits 41 as shown in FIG. 12 in a lower plate 304 constituting one surface side thereof, and an upper plate 303 constituting the other surface side as shown in FIG. And a pair of long hole portions 42a to 42d.

  Four long hole portions 42a to 42d are opened at predetermined positions of the upper plate 303, and the sliding position of the sliding substrate 44 is set via the long hole portions 42a to 42d and the fixing members 45a to 45d. Made. In this example, the horizontal movement of the sliding substrate 44 is converted into the vertical movement of the labyrinth portion 43 (see FIG. 13).

  Using these as assembling conditions, the frame member 302 and the lower plate 304 are assembled to create a casing. An intermediate assembly composed of the above-mentioned sliding substrate 44 is mounted inside the main body 301 constituting the housing. At that time, the labyrinth part 43 is passed through every 11 slits 41 opened at a predetermined position of the lower plate 304. Thereafter, the upper plate 303 is attached on the sliding substrate 44. Further, the fixing members 45 a and 45 b are screwed into one end portion of the sliding substrate 44 through the long hole portions 42 a and 42 b and the infarct seat member 46 a.

  Further, the fixing members 45c and 45d are screwed into the other end portion of the sliding substrate 44 through the long hole portions 42c and 42d and the infarct seat member 46b. For the fixing members 45a to 45d, bolt screws having anti-slip processing on the heads are used. As the infarct seat member 46a, a member having a concave cross section having a width and a length covering at least the long hole portions 42a to 42d of the main body portion 301 is used. As a result, the sliding substrate 44 can be slidably engaged substantially parallel to the substrate transport direction of the main body 301. In that case, exposure length L1-L3 of the labyrinth part 43 is adjusted. Thereafter, the fixing members 45a to 45d are fixed. Then, the gap filling members 38a and 38b are bonded to the adjacent surface of the lid 31 (see FIG. 4). Thereby, the cover body 31 including the partition member moving mechanism 40 as shown in FIG. 9 is completed.

  The lid body 31 having the partition member moving mechanism 40 thus completed is provided in the vicinity of the substrate carry-in port 202 of the heat treatment unit 20 (preheating zone 21). The lid 34 having the same mechanism is provided in the vicinity of the substrate communication port 203 of the chamber 50 (preheating zone 24), and the lid 91 having the same mechanism is provided in the vicinity of the substrate communication port 903 of the cooling processing unit 90. The lid 92 having the same mechanism is provided at the board carry-out port 902 for discharging the printed board 1 after the cooling process (see FIG. 7).

  Subsequently, an operation example of the partition member moving mechanism 40 will be described with reference to FIGS. In this example, the partition member movable mechanism 40 can change the exposed lengths L1 to L3 of the labyrinth portion 43 in accordance with the mounting height of the electronic component. The labyrinth portion 43 is lowered from the slit 41 to the outside with exposure lengths L1 to L3.

  L1 shown in FIG. 13A is the maximum exposed length of the labyrinth portion 43. V1 shown in the figure is the minimum separation distance related to the position of the fixing member 45a. The minimum separation distance V1 is a distance from the axis of the fixing member 45a to the end of the lid 31. In this example, when the fixing member 45a is positioned at the minimum separation distance V1, the labyrinth portion 43 can be set to the maximum exposure length L1.

  L <b> 2 shown in FIG. 13B is an intermediate exposure length of the labyrinth portion 43. V2 shown in the figure is an intermediate separation distance related to the position of the fixing member 45a. The intermediate separation distance V2 is a distance from the axial center of the fixing member 45a after the fixing member 45a is moved to the right side from the position shown in FIG. In this example, when the fixing member 45a is located at the intermediate separation distance V2, the labyrinth part 43 can be set to the intermediate exposure length L2.

  L3 shown in FIG. 13C is the minimum exposed length of the labyrinth portion 43. V3 shown in the figure is the maximum separation distance related to the position of the fixing member 45a. The maximum separation distance V3 is a distance from the axis of the fixing member 45a to the end of the lid 31 after the fixing member 45a is moved further to the right side from the position shown in FIG. 13B. In this example, when the fixing member 45a is located at the maximum separation distance V3, the labyrinth portion 43 can be set to the minimum exposure length L3 (L1> L2> L3).

  Note that the labyrinth portion 43 taken in from the slit 41 is housed in a form of being pulled between the inside of the lower plate 304 of the lid 31 and the sliding substrate 44. Further, since the other lids 34, 91, 92 having the partition member moving mechanism 40 function in the same manner, the description thereof is omitted.

  As described above, according to the jet soldering apparatus 100 as the second embodiment, the heat treatment unit 20 including the lids 31, 34, 91, 92 having the partition member moving mechanism 40 and having the opening 201 in the upper part. When the labyrinth portion 43 that hangs down to the side is movable corresponding to the electronic component, when the pair of fixing members 45a to 45d are loosened, the sliding is fixed through the long hole portions 42a to 42d of the main body portion 301. The other end of each of the labyrinth portions 43 is attached to the substrate 44, and the sliding substrate 44 incorporated in the main body portion 301 is slidably engaged with the substrate conveyance direction of the main body portion 301. Will come to be.

  Therefore, when the sliding substrate 44 is moved within a range regulated by the lengths of the long hole portions 42a to 42d, the length of the labyrinth portion 43 that hangs down from the slit 41 of the main body portion 301 toward the heat treatment portion 20 is freely adjusted. become able to. Accordingly, the exposed lengths L1 to L3 of the labyrinth portion 43 can be freely set according to the mounting height of the electronic component with respect to the printed circuit board 1.

  Moreover, when the partition member moving mechanism 40 of the present invention is compared with the conventional labyrinth height adjusting mechanism, the labyrinth attachment body itself that supports the labyrinth portion (resistor) as in the conventional system is increased in the present invention. The mechanism that moves in the vertical direction can be omitted, and the means for shutting off the outside air can be omitted, and the partition member movable mechanism 40 of the present invention can be simplified as compared with the conventional labyrinth height adjusting mechanism.

  Furthermore, since the distance between the lid 31 having the partition member moving mechanism 40 and the upper surface of the transfer unit 10 of the heat treatment unit 20 is constant as compared with the conventional method even if the labyrinth height is adjusted, the labyrinth height is high. The amount of nitrogen gas introduced after adjusting the thickness can be kept substantially constant. In the conventional system, nitrogen gas is required for the volume of the labyrinth raised in the vertical direction.

  In this example, the case where the sliding substrate 44 is fixed by the fixing members 45a to 45d such as bolt screws has been described. However, the present invention is not limited to this, and a drive unit is provided in the lid 31 to measure the height of the component. Based on the result, the sliding substrate 44 may be driven by the driving unit, and the height of the labyrinth unit 43 may be automatically adjusted.

  Next, a configuration example of the both-end gas supply mechanism 70 will be described as a third embodiment with reference to FIGS. 14 and 15. A double-end gas supply mechanism 70 shown in FIG. 14 is provided in the jet soldering apparatus 100 shown in FIG. The both-end gas supply mechanism 70 includes a pair of gas supply units 71 and 72, a nozzle pipe 75, and diffusion members 76a and 76b shown in FIG.

  The nozzle line 75 has gas supply ports at both ends and a plurality of gas outlets 704 at predetermined positions, and jets nitrogen gas in a predetermined direction on the jet solder bath 60. For example, the nozzle conduit 75 is a peripheral portion on the jet solder bath 60 and is disposed along a direction substantially orthogonal to the transport direction in which the printed circuit board 1 is transported. Nitrogen gas is supplied to the nozzle pipe 75 individually from both ends. For the nozzle pipe 75, a copper pipe, a stainless steel pipe, or the like is used.

  In this example, diffusion members 76 a and 76 b are provided at the peripheral edge on the jet solder bath 60, and the nitrogen gas ejected from the nozzle conduit 75 is diffused to the peripheral edge on the jet solder bath 60. The The diffusion members 76 a and 76 b are disposed below the opening 501 of the chamber 50.

  The nozzle conduit 75 shown in FIG. 15 includes U-shaped portions 75a and 75b, a horizontal portion 75c, and conduit connection portions 701, 702, 711, and 712. In this example, eight gas outlets 704 are opened in the horizontal portion 75c. Four gas outlets 704 are arranged in a row at the same pitch from the center of the horizontal portion 75c to the left and right. The opening direction of the gas outlet 704 is the direction in which the printed circuit board 1 is conveyed, and is the upper right portion in the drawing.

  One end of the U-shaped portion 75a is connected to one end of the horizontal portion 75c via a pipe connection portion 711. The other end of the U-shaped portion 75a is connected to the pipe connection portion 701. One end of the U-shaped portion 75b is connected to the other end of the horizontal portion 75c via a pipe connection portion 712. The other end of the U-shaped portion 75b is connected to the pipe connection portion 702. The pipe connection portions 701 and 702 are attached to an angle mount 77 having an L-shaped cross section. The angle mount 77 is fixed to the peripheral edge on the jet solder bath 60 shown in FIG. As a result, the nozzle pipe 75 can be fixed to the angle frame 77 via the pipe connecting portions 701 and 702.

  The pipe connection parts 701 and 702 constitute gas supply ports at both ends of the nozzle pipe line 75. The pipe connection part 701 is connected to a gas pipe (not shown) and connected to the gas supply part 71, and nitrogen gas is supplied. The pipe connection part 702 is also connected to a gas pipe (not shown) and connected to the gas supply part 72, and nitrogen gas is supplied. The U-shaped portions 75a and 75b and the horizontal portion 75c may be formed from a single pipe. If comprised in this way, the pipe connection part 711,712 will become unnecessary.

  When such a nozzle pipe 75 is disposed on the jet solder bath 60, nitrogen is introduced in the width direction of the printed circuit board 1 conveyed in a predetermined direction at a so-called beer back point immediately before and after the completion of soldering of the printed circuit board 1. Gas can be injected. For example, the gas supply units 71 and 72 can eject nitrogen gas evenly in the width direction of the printed circuit board 1 with P1 = P2.

  In this example, the nozzle conduit 75 has a detour structure in which a part of the portion from both ends to the gas ejection port 704 is guided and immersed in the jet solder bath 60. For example, the U-shaped portions 75 a and 75 b are immersed in the jet solder bath 60. If the nozzle conduit 75 is configured in this manner, the nitrogen gas can be preheated before the nitrogen gas is ejected from the gas ejection port 404.

  In this example, the pipe connection part 703 is attached to the angle mount 77 adjacent to the pipe connection part 702. An open pipeline 78 for detecting nitrogen gas is connected to the pipeline connection portion 703. An open line 78 is provided for measuring the concentration of nitrogen gas on the jet solder bath 60. The open pipe 78 has an open port 708 for taking in nitrogen gas. The opening 708 is set so as to face the downstream side in the conveyance direction of the printed circuit board 1. The reason why the opening 708 faces the downstream side is to measure the nitrogen gas in the diffusion member 76a more accurately and to prevent the molten solder 7 from entering the opening 708.

  Then, with reference to FIG.16 and FIG.17, the diffusing member 76a, 76b, the structural example of the peripheral part, and its function example are demonstrated. The chamber 50 shown in FIG. 16 has a box, and has openings on the top, bottom, left, and right of the box. A lid unit 80 described later is combined with the opening 501 on the upper side. The jet solder bath 60 is combined with the lower opening 502. The heat treatment unit 20 is combined with the left side opening 503 (substrate communication port 203). The cooling processing unit 90 is combined with the opening 504 (substrate communication port 903) on the right side.

  In this example, diffusion members 76 a and 76 b are provided on the peripheral edge portion on the jet solder bath 60. The diffusion members 76 a and 76 b are attached to the lower surface side of the opening 502 of the chamber 50. A partition wall 58 is provided on the lower surface side of the opening 502, and the diffusion member 76 a is attached along the partition wall 58. As the diffusion members 76a and 76b, a bent iron plate, stainless steel plate or the like is used.

  The diffusion member 76a described above is assembled in a form including the nozzle conduit 75 as shown in FIG. The diffusion member 76a includes a partition wall portion 722 including an inclined guide portion 721 that guides nitrogen gas ejected from the nozzle pipe line 75 to a beer back point in a predetermined direction, for example, the inclined guide portion 721 and the partition wall portion 722. A diffusion structure including a plurality of holes 706 and 707 for gas diffusion that are opened to the surface. The hole 706 is provided in the inclined guide portion 721, and the hole 707 is provided in the partition wall 722 (see FIG. 18). Moreover, the partition wall part 722 is provided so that it may always be immersed in the molten solder 7 of the jet solder bath 60. This is to avoid a change in the concentration of the nitrogen gas atmosphere.

  In FIG. 17, as indicated by an arrow in the drawing, the nitrogen gas is located on the inner side of the diffusing member 76 a on the side facing the partition wall 722 from the gas outlet 704 of the nozzle pipe 75 or on the side adjacent to the inclined guide portion 721. Erupted toward the. The direction of the gas outlet 704 is to prevent the nitrogen gas from directly blowing on the liquid surface of the jet solder bath 60.

  Further, the separation wall 79 in the figure is made of a sheet metal member having a predetermined thickness, and is a position facing the substantially central portion of the horizontal portion 75c of the nozzle pipe 75, and is a partition wall below the chamber 50. 58 so as to protrude from 58. The separation wall 79 includes a diffusion region of nitrogen gas ejected from the four gas ejection ports 704 on the left side of the nozzle conduit 45 and a diffusion region of nitrogen gas ejected from the four gas ejection ports 704 on the right side. Functions to separate.

  In addition, since the diffusing member 76b is configured similarly, the description thereof is omitted. When such diffusion members 76a and 76b are provided, nitrogen gas can be injected to the beer back point, and nitrogen gas can be diffused more flexibly in the direction of the peripheral edge on the jet solder bath 60. .

  In this example, as shown in FIG. 16, two bowl-shaped diffusion nozzles 51 and 52 that constitute an example of the gas ejection portion are provided in the chamber 50, and nitrogen is also introduced into the chamber from the upper side of the jet solder bath 60. It is made to spout gas. The diffusion nozzle 51 includes a nozzle conduit 505, a diffusion plate 507, and a nozzle body 509. The nozzle main body 509 has an arcuate cross section that is obtained by cutting a cylindrical body in half, and the cut portion is an opening. In the drawing, a portion indicated by a two-dot chain line is a labyrinth (partition) member, and also hangs down from the upper part to the lower part in the chamber 50. If necessary, some or all may be deleted as appropriate.

  The nozzle conduit 505 is included in the nozzle body 509, and the nozzle conduit 505 is rotatably engaged with the pair of brackets 53. The bracket 53 has a bearing function with the nozzle conduit 505 as a shaft body. The bracket 53 is attached to an L-shaped hanging portion 55 in the chamber 50. The nozzle conduit 505 is connected to the gas supply unit 73. The diffusion plate 507 has a plurality of gas ejection holes not shown, and is attached so as to cover the opening of the nozzle body 509.

  The diffusion nozzle 52 includes a nozzle conduit 506, a diffusion plate 508, and a nozzle main body 510. The nozzle main body 510 has an arcuate cross-section that is obtained by cutting a cylindrical body in half, and the cut portion serves as an opening. The nozzle conduit 506 is included in the nozzle body 510, and the nozzle conduit 506 is rotatably engaged with the pair of brackets 54. The bracket 54 has a bearing function with the nozzle conduit 506 as a shaft body.

  The bracket 54 is attached to an L-shaped hanging portion 56 in the chamber 50. The nozzle conduit 506 is connected to the gas supply unit 73. The diffuser plate 508 has a plurality of holes for gas ejection (not shown) and is attached so as to cover the opening of the nozzle body 510. In the figure, θ1 and θ2 are diffusion angles.

  For example, the diffusion angle θ1 is an angle between a horizontal base line indicated by a one-dot chain line in the drawing and a diffusion center base line indicated by a broken line. In the diffusion nozzle 51, the diffusion center base line is a line segment that connects the tube center of the nozzle conduit 505 and the center of the diffusion plate 507 in the width direction. The same applies to the diffusion nozzle 52. With these structures, the diffusion nozzles 51 and 52 can freely adjust the diffusion angles θ1 and θ2 with reference to the brackets 53 and 54, respectively.

  Next, a control example of the nozzle conduit 75 will be described with reference to FIG. According to the control system of the nozzle pipe line 75 shown in FIG. 18, the input unit 64 and the supply control unit 605 are provided to control the gas supply units 71 and 72.

  The input unit 64 is operated to input mounting distribution information (hereinafter referred to as mounting distribution data D64). The mounting distribution data D64 is data indicating a mounting distribution of electronic components attached to the printed circuit board 1. For example, the mounting distribution data D64 includes the number of soldering points distributed in the left and right regions that divide the width of the printed circuit board 1 into two at the center in the width direction orthogonal to the conveyance direction of the printed circuit board 1, and the printed circuit board 1 This is information such as the height of the electronic component mounted on the board. The mounting distribution data D64 is output from the input unit 64 to the supply control unit 605.

  A supply control unit 605 is connected to the input unit 64. The supply control unit 605 controls the gas supply units 71 and 72 so as to adjust the supply pressure of nitrogen gas corresponding to the mounting distribution data D64. Nitrogen gas is supplied from one end of each nozzle line 75. The supply control unit 605 generates supply control signals S71 and S72 corresponding to the mounting distribution data D64.

  In this example, when the pressure of the nitrogen gas supplied to one end of the nozzle pipe 75 is P1, and the pressure of the nitrogen gas supplied to the other end of the nozzle pipe 75 is P2, the supply control unit 605 Generates the supply control signals S71 and S72 such that the pressure of the nitrogen gas is P1 = P2 when the mounting distribution data D64 indicates the mounting distribution in which the electronic components are evenly attached to the printed circuit board 1. Such a supply control signal S71 is output to the gas supply unit 71, and a supply control signal S72 is output to the gas supply unit 72.

  Further, when the mounting distribution data D64 indicates a mounting distribution in which the electronic component is attached to one end (for example, the left end) of the printed circuit board 1, the supply pressure of the nitrogen gas is P1> P2. Control signals S71 and S72 are generated. Such a supply control signal S71 is output to the gas supply unit 71, and a supply control signal S72 is output to the gas supply unit 72.

  Further, when the mounting distribution data D64 indicates a mounting distribution in which the electronic component is attached to the other end (right end) side of the printed circuit board 1, the supply control signal is set so that the pressure of the nitrogen gas satisfies P1 <P2. S71 and S72 are generated. The supply control signal S71 is output to the gas supply unit 71, and the supply control signal S72 is output to the gas supply unit 72 to control the gas supply units 71 and 72.

  The gas supply unit 71 supplies nitrogen gas from one end of the nozzle conduit 75 based on the supply control signal S71. The gas supply unit 72 supplies nitrogen gas from the other end of the nozzle conduit 75 based on the supply control signal S72. As a result, nitrogen gas can be individually supplied from the individual gas supply units 71 and 72 to both ends of the nozzle pipe line 75.

  Here, with reference to FIG. 19A and B, the example of relationship between the gas supply parts 71 and 72 and the nozzle pipe line 75, an electric circuit, etc. is demonstrated. The operation of the nitrogen gas supply system shown in FIG. 19A can be considered by replacing the resistors r and R shown in FIG. 19B with an electric circuit connected in a ladder shape.

  The gas supply units 71 and 72 and the N2 gas tank 74 of the nitrogen gas supply system shown in FIG. 19A correspond to DC power supplies E1 and E2 that supply current (nitrogen gas) from both ends of the ladder-like electric circuit shown in FIG. 19B. ing. The atmosphere corresponds to GND (ground).

  Eight gas outlets 704 (points a, b, c, d, e, f, g, and h) opened in the nozzle conduit 75 correspond to the resistance R of the electric circuit. The total resistance of the nozzle line 75 of the nitrogen gas supply system corresponds to the resistance Σr of the electric circuit. The resistance r corresponds to the resistance between the gas outlets 704, for example, between E1-a, between a-b, between bc ... g-h, between h-E2, and the like. The resistance R is larger than the resistance r (R >> r).

  In the nitrogen gas supply system, when the pressure of the nitrogen gas is set to P1 = P2, that is, when the DC power supply of the electric circuit is set to E1 = E2, due to the superposition reason, the distance between the points de Since current does not flow, current (nitrogen gas) flows equally from the eight points a, b, c, d, e, f, g, and h to GND.

  On the other hand, when the pressure of nitrogen gas is set to P1> P2 in the nitrogen gas supply system, that is, when the DC power supply of the electric circuit is set to E1> E2, the distance between the points de Since the current flows in the direction indicated by the solid line arrow, the left half of the four a, f, g, and h currents flowing from the four points e, f, g, h to the GND (nitrogen gas) respectively. The current (nitrogen gas) flowing from the points b, c, and d to GND increases.

  On the other hand, when the pressure of nitrogen gas is set to P1 <P2, that is, when the DC power source of the electric circuit is set to E1 <E2, a broken line arrow is provided between points d and e due to superposition. Since the current flows in the direction shown in FIG. 4, the four e, f, g, and h in the right half are compared to the current (nitrogen gas) that flows from the four a, b, c, and d points in the left half to the GND. The current (nitrogen gas) flowing from each point to GND increases.

  As described above, according to the jet soldering apparatus 100 as the third embodiment, the both end gas supply mechanism 70 is provided, and the supply control unit 605 corresponds to the mounting distribution data D64 of the electronic component attached to the printed circuit board 1. The individual gas supply units 71 and 72 are controlled so as to adjust the supply pressure of the nitrogen gas supplied from one end of the nozzle conduit 75.

  With this adjustment control, nitrogen gas corresponding to the electronic component mounting distribution can be ejected in a predetermined direction on the jet solder bath 60. Accordingly, when the electronic component is mounted on one side of the printed circuit board 1 with the transport direction of the printed circuit board 1 as a reference, a large amount of nitrogen gas can be ejected on the side on which the electronic component is mounted on the other side. It becomes like this. It is also possible to measure the concentration of nitrogen gas sampled in the open line 78 and adjust the concentration (flow rate) of nitrogen gas via the supply control unit 605 based on the measurement result.

  Then, with reference to FIGS. 20-23, the structural example and the functional example of the cover body unit 80 as a 4th Example are demonstrated. A lid unit 80 shown in FIG. 20 is mounted on the chamber 50 of the jet soldering apparatus 100. In this example, a lid unit 80 is attached to the upper side of the chamber 50 containing the diffusion nozzles 51 and 52. The lid unit 80 has a main body 84 having a housing structure (flat housing space) with a slit.

  The main body portion 84 is provided with an atmosphere inlet 801 and an atmosphere outlet 802. The atmosphere inlet / outlet 801 and the atmosphere outlet 802 are provided substantially parallel to the transport direction of the printed circuit board 1. For example, the atmosphere inlet 801 is a surface that is substantially orthogonal to the direction in which the printed circuit board 1 is conveyed, and is provided on one side surface of the main body portion 84, and the atmosphere discharge port 802 faces the one side surface of the main body portion 84. Provided on the other surface.

  An L-shaped intake pipe 88 is connected to the atmosphere inlet 801, and an atmosphere containing nitrogen gas from which flux fumes have been removed is supplied. An L-shaped exhaust pipe 89 is also connected to the atmosphere discharge port 802 to discharge the atmosphere containing flux fume. By arranging the intake pipes 88 and 89 on the side surface of the lid unit 80 in this way, a situation where the pipe members and the like extend in the vertical direction can be avoided, and the overall height of the jet soldering apparatus 100 can be designed to be low. Became.

  A slit 806 is provided in the bottom surface portion of the main body portion 84. The lid unit 80 takes in an atmosphere containing flux fume from the chamber 50 through the slit 806. The number of slits 806 is, for example, about 5 to 10 although it depends on the width and length.

  In this example, two first rectifying plates 85 a and 85 b (filter walls) are provided inside the main body 84 and downstream of the atmosphere inlet 801. Two second rectifying plates 85 c and 85 d are also provided on the upstream side of the atmosphere discharge port 802. Each of the rectifying plates 85a to 85d is provided with a plurality of holes. The rectifying plates 85a and 85b function to adjust the flow by passing an atmosphere containing nitrogen gas from which flux fumes have been removed through a plurality of holes. The rectifying plates 85c and 85d function to adjust the flow by passing an atmosphere containing flux fume through the plurality of holes.

  In this example, a first handle (hereinafter referred to as a handle 87a) is provided on the surface on the atmosphere inlet 801 side of the main body 84, and a second handle (hereinafter referred to as the atmosphere discharge port 802) on the main body 84. A handle 87b) is provided. The handles 87a and 87b are attached to the front side of the left side surface and the back side of the right side surface of the lid unit 80 in order to facilitate carrying the lid unit 80 during inspection. Thereby, the lid unit 80 can be gripped diagonally.

  A top plate member 86 is attached to the upper portion of the main body portion 84. The top plate member 86 is provided with an inspection window 805 so that the inside of the lid unit 80 can be visually inspected. A heat resistant glass is used for the window portion 805.

  Next, an assembly example (parts 1 and 2) of the lid unit 80 will be described with reference to FIGS. In this example, it is assumed that the lid unit 80 shown in FIG. 20 is assembled. First, the main body 84 is prepared. In order to obtain the main body 84, a box made of metal such as an iron plate or stainless steel having an upper portion opened to a predetermined size is prepared. An atmosphere inlet 801, an atmosphere outlet 802, and a slit 806 are formed at predetermined positions of the box. The atmosphere inlet / outlet 801 opens the right side surface of the main body 84 to a size that matches the pipe diameter of the intake pipe 88.

  The atmosphere discharge port 802 opens the left side surface of the main body 84 to a size that matches the tube diameter of the exhaust pipe 89. Further, a screw hole for a handle is formed on the diagonal line on the side surface of the main body 84. The slit 806 is obtained by forming a plurality of line-shaped openings at the bottom of the main body 84.

  When the main body 84 is prepared, the intake pipe 88 and the exhaust pipe 89 are connected to the main body 84. In this example, the intake pipe 88 is joined to the atmosphere inlet 801 by electricity or gas welding. Similarly, the exhaust pipe 89 is joined to the atmosphere discharge port 802. Thereafter, the current plates 85a to 85d are attached. As the rectifying plates 85a to 85d, iron plates or stainless steel plates having a predetermined size and having a plurality of holes or lattice-shaped portions are used.

  Then, handles 87 a and 87 b are attached to the main body portion 84. For the handles 87a and 87b, for example, a round bar is bent into a U shape and both ends are provided with male screws. The handles 87a and 87b are inserted into screw holes that are opened in advance on the side surface of the main body portion 84, and are fixed inside the main body portion 84 with female screws. As a result, the handles 87a and 87b can be attached diagonally.

  Thereafter, the top plate member 86 is attached to the main body portion 84. In order to obtain the top plate member 86, an opening for a window portion is formed in an iron plate or a stainless steel plate for the top plate. A window 805 is attached to this opening. A heat resistant glass is used for the window portion 805. When the top plate member 86 to which the window portion 805 is attached is prepared, the top plate member 86 is aligned with the main body portion 84, and then the top plate member 86 is screwed to the main body portion 84 with screws (not shown). Thereby, the lid unit 80 shown in FIG. 20 is completed.

  The lid unit 80 completed in FIG. 21 is mounted on the chamber 50. At this time, the slit unit 806 side of the lid unit 80 is aligned with the opening 501 of the chamber 50. Thereafter, the exhaust pipe 89 and the intake pipe line 811 are connected. The intake pipe 811 may be set up in advance from the atmosphere cleaning unit 81. Further, the intake pipe 88 and the exhaust pipe line 812 are connected. The exhaust line 812 may be set up from the fan 813. A fan is used as the fan 813. Accordingly, the lid unit 80, the chamber 50, the atmosphere cleaning unit 81, and the fan 813 can be assembled.

  Next, with reference to FIG. 23, an operation example of the lid unit 80 will be described for the flux fume removal method according to the present invention. In this example, the pre-heated printed circuit board 1 with electronic components attached is transported into an atmosphere of nitrogen gas, and the electronic components are soldered to the printed circuit board 1 in the atmosphere, and the lid shown in FIG. It is assumed that flux fume generated during the soldering process is removed using the body unit 80, the atmosphere cleaning unit 81, and the fan 813.

  In the jet soldering apparatus 100 under these flux fume removal conditions, the atmosphere containing the flux fume generated in the chamber 50 shown in FIG. 23 is discharged from the atmosphere outlet 802 of the lid unit 80 to the exhaust pipe 89 and the intake pipe. It is discharged to the atmosphere cleaning unit 81 via the path 811.

  Then, the atmosphere discharged from the lid unit 80 is cleaned by the atmosphere cleaning unit 81 to remove the flux fume. The flux fume is condensed (condensed) by the atmosphere cleaning unit 81 and adheres to the pipe 82. The atmosphere containing nitrogen gas (nitrogen gas atmosphere) after removing the flux fumes is supplied from the atmosphere cleaning unit 81 to the lid unit 80 via the exhaust pipe 812 and the intake pipe 88 via the atmosphere inlet 801. Is done.

  Further, nitrogen gas containing flux fumes newly generated in the chamber is taken into the lid unit 80 through the slit 806. At that time, the atmosphere containing the flux fumes is merged in the flow direction of the atmosphere after the flux fumes are removed and discharged to the atmosphere cleaning unit 81. Through these series of steps, the flux fumes that are sequentially generated in the chamber 50 can be removed.

  Next, a configuration example of a control system of the jet soldering apparatus 100 will be described with reference to FIG. According to the control system of the jet soldering apparatus 100 shown in FIG. 24, in addition to the input unit 64 and the supply control unit 605, the conveyance drive unit 14, the monitor 16, the preheating drive unit 25, the control unit 65, and the jet solder drive unit 66. Further, a cooling drive unit 93, an air curtain drive unit 95, and a fume removal drive unit 97 are provided. These are connected to the control unit 65.

  The monitor 16 displays a setting screen related to the jet soldering process based on the display data D16. As the monitor 16, for example, a liquid crystal display device with a touch panel is used. The touch panel constitutes a part of the input unit 64. The display data D16 includes height information of electronic components soldered to the printed circuit board 1, mounting distribution information of electronic components soldered to the printed circuit board 1, and the like. In addition to this, there are information on the number of substrates on which electronic components are soldered, setting information indicating soldering processing conditions, and the like.

  The control unit 65 outputs the conveyance drive data D14 generated based on a predetermined control program to the conveyance drive unit 14 and executes conveyance control. Similarly, the preheating control data D25 is output to the preheating drive unit 25 to execute the preheating control. Similarly, the solder bath control data D66 is output to the jet solder driving unit 66 to execute jet solder control. Similarly, the cooling control data D93 is output to the cooling drive unit 93 to execute the cooling control.

  Similarly, the control unit 65 outputs curtain control data D95 to the air curtain driving unit 95 to execute motor control. Similarly, the fume removal control data D97 is output to the fume removal drive unit 97 to execute motor control. Similarly, the mounting distribution data D64 is output to the supply control unit 605 to execute nitrogen gas supply control.

  The transport drive unit 14 generates a motor control signal S15 based on the transport drive data D14 input from the control unit 65. A motor 15 that drives the transport unit 10 is connected to the transport drive unit 14. The motor 15 inputs the motor control signal S15 and drives the chain member 11 and the like. The printed circuit board 1 set on the conveyance chuck 12 of the chain member 11 is sequentially conveyed into the chamber 50 through the preheating zones 21, 22, 23, 24, and the like.

  The preheating drive unit 25 generates heat generation control signals S21 to S24 based on the preheating control data D25 input from the control unit 65. A plurality of heaters (heating elements) are connected to the preheating drive unit 25. In this example, the heaters are arranged in four preheating zones 21 to 24 (see FIG. 1). The preheating zone 21 generates heat based on the heat generation control signal S21. The preheating zone 22 generates heat based on the heat generation control signal S22. The preheating zone 23 generates heat based on the heat generation control signal S23. The preheating zone 24 generates heat based on the heat generation control signal S24. The printed circuit board 1 is preheated by these heat generations.

  The jet solder driving unit 66 generates a heat generation control signal S67 and motor control signals S68 and S69 based on the solder bath control data D66 input from the control unit 65. A heater 67 and two motors 68 and 69 are connected to the jet solder driving unit 66. The heater 67 generates heat based on the heat generation control signal S67 and heats the jet solder bath 60 to a predetermined temperature. The motor 68 jets the molten solder 7 to the jet nozzle 61 based on the motor control signal S68. The motor 69 causes the molten solder 7 to jet through the jet nozzle 62 based on the motor control signal S69.

  The cooling drive unit 93 generates a motor control signal S94 based on the cooling control data D93 input from the control unit 65. A fan motor 94 is connected to the cooling drive unit 93. The motor 94 rotates a fan (not shown) based on the motor control signal S94. Thereby, the printed circuit board 1 after soldering an electronic component is cooled.

  The air curtain driving unit 95 generates a motor control signal S96 based on the curtain control data D95 input from the control unit 65. A blower motor 96 is connected to the air curtain drive unit 95. The motor 96 rotates the sirocco type fan shown in FIG. 1 based on the motor control signal S96. As a result, a convection (circulating) air curtain can be formed at the substrate carry-out port 902.

  The fume removal driving unit 97 generates a motor control signal S98 based on the fume removal control data D97 input from the control unit 65. A pump driving motor 98 is connected to the fume removal driving unit 97. The motor 98 drives the pump shown in FIG. 1 based on the motor control signal S98. Thereby, the nitrogen gas from which the flux fumes have been removed can be fed into the chamber 50.

  The supply control unit 605 generates supply control signals S71, S72, S73, and S74 based on the mounting distribution data D64 input from the control unit 65, the N2 concentration detection signal S17 output from an N2 sensor (not shown), and the like. Four gas supply units 71, 72, 73 and 741 are connected to the supply control unit 605. The gas supply unit 71 adjusts the supply pressure of nitrogen gas to P1 based on the supply control signal S71. The gas supply unit 72 adjusts the supply pressure of nitrogen gas to P2 based on the supply control signal S72. As a result, the nitrogen gas supplied to the nozzle conduit 75 can be adjusted.

  The gas supply unit 73 adjusts the supply pressure of nitrogen gas to P3 based on the supply control signal S73. Further, the gas supply unit 741 adjusts the supply pressure of nitrogen gas to P4 based on the supply control signal S74. Thereby, in the cooling process part 90, the cooling process with respect to the said printed circuit board 1 is performed by spraying nitrogen gas on the upper and lower surfaces of the printed circuit board 1 which attached the electronic component. These constitute the control system of the jet soldering apparatus 100.

  Subsequently, an operation example of the jet soldering apparatus 100 including the gas supply control method will be described with reference to FIG. In this example, in a jet soldering apparatus 100 that transports a printed circuit board 1 with electronic components attached thereto in an atmosphere of nitrogen gas and solders the electronic components to the printed circuit board 1 in the atmosphere, pipe connection portions at both ends. It is assumed that nitrogen gas is supplied from both ends of a nozzle pipe 75 having 701 and 702 (gas supply ports) and having gas ejection ports 704 at predetermined positions.

  Further, the exposed length of the labyrinth portion 43 of the partition member moving mechanism 40 is adjusted in advance within the range of L1 to L3 in accordance with the height information of the electronic component. The exposed length of the labyrinth unit 43 is set by reviewing in units of processing lots of the printed circuit board 1. Further, the supply pressures P1 and P2 of the nitrogen gas are adjusted according to the mounting distribution of the electronic components. The adjustment amounts of the supply pressures P1 and P2 of the nitrogen gas are also reviewed and set for each processing lot of the printed circuit board 1.

  With these as jet soldering processing conditions, the control unit 65 inputs the electronic component mounting distribution data D64 in step ST1 of the flowchart shown in FIG. At this time, the user operates the input unit 64 while looking at the monitor 16 and inputs height information of electronic components to be soldered to the printed circuit board 1, mounting distribution information of the electronic components, and the like. Of course, the number information of the printed circuit boards 1 to be subjected to the jet soldering process is also input. This number information is set as a target value when the number of printed circuit boards 1 subjected to the jet soldering process is counted.

  Next, in step ST2, the control unit 65 controls the supply control unit 605 so as to adjust the supply pressures P1 and P2 of the nitrogen gas supplied to the nozzle conduit 75. At this time, the supply control unit 605 individually adjusts the supply pressure of the nitrogen gas corresponding to the electronic component mounting distribution data D64. For example, the supply control unit 605 individually sets the supply pressure of nitrogen gas corresponding to the electronic component mounting distribution data D64 in the gas supply units 71 and 72.

  When the electronic component is mounted on one side of the printed circuit board 1, the supply pressure is set to P1> P2 in order to increase the nitrogen gas on the side mounted on the side. On the other hand, when the electronic component is mounted on the other side of the printed circuit board 1, the supply pressure is set to P1 <P2 in order to increase the nitrogen gas on the side mounted on the other side.

  And the gas supply part 71 adjusts the supply pressure of nitrogen gas to P1 based on supply control signal S71. The gas supply unit 72 adjusts the supply pressure of nitrogen gas to P2 based on the supply control signal S72. The gas supply unit 73 adjusts the supply pressure of nitrogen gas to P3 based on the supply control signal S73. As a result, nitrogen gas can be optimally supplied from both gas supply portions 71 and 72 to both ends of the nozzle pipe line 75 on the jet solder bath 60. As a result, in the printed circuit board 1 on the jet solder bath 60, a sufficient inert gas can be diffused to the side where a large number of electronic components are attached compared to the side where the number of electronic components is small. Further, nitrogen gas can be supplied to the diffusion nozzles 51 and 52 in the chamber 50.

  Next, in step ST <b> 3, the control unit 65 controls the transport driving unit 14 so as to carry in the printed circuit board 1 with electronic components attached thereto. At this time, the user sets the printed circuit board 1 on the conveyance chuck 12. The transport drive unit 14 generates a motor control signal S15 based on the transport drive data D14. The motor control signal S15 is output from the transport driving unit 14 to the motor 15. The motor 15 inputs the motor control signal S15 and drives the chain member 11 and the like. As a result, the printed circuit board 1 set on the transport chuck 12 is transported to the heat treatment unit 20.

  Next, in step ST4, the control unit 65 controls the preheating drive unit 25 so as to preheat the printed circuit board 1 to which the electronic component is attached. In the preheating drive unit 25, heat generation control signals S21 to S24 are generated based on the preheating control data D25. The heat generation control signals S21 to S24 are output to the corresponding four preheating zones 21 to 24 (see FIG. 1).

  The preheating zone 21 generates heat based on the heat generation control signal S21 and maintains, for example, a temperature of 100 ° C. The preheating zone 22 generates heat based on the heat generation control signal S22 and maintains, for example, a temperature of 140 ° C. The preheating zone 23 generates heat based on the heat generation control signal S23 and has a temperature of 180 ° C. The preheating zone 24 generates heat based on the heat generation control signal S24 and maintains a temperature of 220 ° C. The printed circuit board 1 is preheated by these preheating zones 21 to 24.

  In step ST <b> 5, the control unit 65 controls the jet solder driving unit 66 so that the electronic component is jet soldered to the printed circuit board 1. The jet solder driving unit 66 generates a heat generation control signal S67 and motor control signals S68 and S69 based on the solder bath control data D66. The heater 67 generates heat based on the heat generation control signal S67 and heats the jet solder bath 60 to a predetermined temperature.

  The motor 68 drives the pump 8 based on the motor control signal S68. When the pump 8 pressurizes and sends the molten solder 7 to the ejection nozzle 61, the ejection nozzle 61 ejects the molten solder 7 supplied from the pump 8 so as to rise due to surface tension. The motor 69 drives the pump 9 based on the motor control signal S69. When the pump 9 pressurizes and sends the molten solder 7 to the ejection nozzle 62, the ejection nozzle 62 also ejects the molten solder 7 having a predetermined pressure supplied from the pump 9 so as to rise due to surface tension.

  At this time, individually adjusted nitrogen gas is diffused onto the jet solder bath 60 at both ends of the nozzle conduit 75. In such a nitrogen atmosphere, the electronic component is soldered to the printed circuit board 1. At that time, the atmosphere containing the flux fume generated in the chamber 50 is discharged from the atmosphere discharge port 802 of the lid unit 80 to the atmosphere cleaning unit 81. The atmosphere cleaning unit 81 cleans the atmosphere including the flux fume discharged from the lid unit 80.

  At this time, the fume removal driving unit 97 generates a motor control signal S98 based on the fume removal control data D97. The motor control signal S98 is output from the fume removal driving unit 97 to the fan driving motor 98. The motor 98 drives the fan 813 shown in FIG. 1 based on the motor control signal S98. Then, an atmosphere containing nitrogen gas after removing the flux fumes is supplied to the lid unit 80 via the atmosphere inlet / outlet 801. As a result, an atmosphere (nitrogen gas atmosphere) containing nitrogen gas from which flux fumes have been removed can be fed into the chamber 50.

  In the lid unit 80, an atmosphere containing flux fumes newly generated in the chamber 50 is taken in. The nitrogen gas atmosphere containing the flux fumes merges in the flow direction of the atmosphere after the flux fumes are removed, that is, in a direction substantially parallel to the transport direction of the printed circuit board 1 and is discharged to the atmosphere cleaning unit 81.

  In step ST6, the control unit 65 controls the cooling drive unit 93 so as to cool the printed circuit board 1 to which the electronic component is soldered. The cooling drive unit 93 generates a motor control signal S94 based on the cooling control data D93. The motor control signal S94 is output from the cooling drive unit 93 to the fan motor 94. The motor 94 rotates a fan (not shown) based on the motor control signal S94. Thereby, the printed circuit board 1 after soldering an electronic component is cooled.

  Next, in step ST7, the control unit 65 controls the transport driving unit 14 so as to discharge the printed circuit board 1 on which the electronic component is soldered. At this time, the conveyance driving unit 14 conveys the printed circuit board 1 from the cooling processing unit 90 to the substrate carry-out port 902. The user removes the printed circuit board 1 from the transport chuck 12 at the substrate unloading port 902. Of course, a function of removing the printed circuit board 1 from the transport chuck 12 may be provided in the transport drive unit 14 (discharge process).

  In addition, the air curtain driving unit 95 generates a motor control signal S96 based on the curtain control data D95. The motor control signal S96 is output from the air curtain driving unit 95 to the blower motor 96. The motor 96 can form a circulation type air curtain at the substrate carry-out port 902 by rotating the blower 904 based on the motor control signal S96.

  In step ST8, the control unit 65 determines whether or not the jet soldering process for all the printed circuit boards 1 has been completed. Since the control unit 65 counts the number of printed circuit boards 1 subjected to the jet soldering process, the number of remaining printed circuit boards 1 is calculated by subtracting the current count number from the previously set target number. The remaining number of printed circuit boards 1 is displayed on the monitor 16.

  Therefore, if there is a remaining number, since the jet soldering process for all the printed circuit boards 1 has not been completed, the process returns to step ST3 and the above-described process is repeated. When the remaining number of sheets becomes zero, since the jet soldering process for all the printed circuit boards 1 is completed, the control related to the jet soldering process is ended.

  Thus, according to the jet soldering apparatus 100 as the fourth embodiment, the pre-heated printed circuit board 1 to which the electronic component is attached is transported in an atmosphere of nitrogen gas, and the electronic component is printed in the atmosphere. 1, a lid unit 80 is provided on the chamber 50, and in the lid unit 80, the atmosphere inlet 801 is a surface substantially orthogonal to the direction in which the printed circuit board 1 is conveyed. Thus, the air outlet 802 is provided on one side surface of the main body portion 84, and the other surface facing the one side surface of the main body portion 84 is provided.

  With this structure, the lid unit 80 can be made lower than the case where the atmosphere inlet / outlet 801, the gas outlet / outlet, and the like are provided on the upper surface of the main body 84. Thereby, the lid body unit 80 can be easily removed on the chamber 50 at the time of maintenance, or can be easily attached at the time of recovery. Moreover, the inside of the soldering processing section can be easily inspected with good workability and can be easily cleaned with good workability.

  Further, according to the flux fume removing method according to the present invention, in the lid unit 80, the atmosphere cleaning unit 81 is configured by joining the atmosphere containing the flux fume in the flow direction of the atmosphere containing the nitrogen gas after the flux fume removal. To be discharged. With this configuration, the atmosphere containing the flux fume can be efficiently discharged from the lid unit 80 to the atmosphere cleaning unit 81 as compared with the case where the atmosphere inlet 801, the atmosphere outlet 802, and the like are provided on the upper surface of the main body 84. become. Thereby, since the amount of consumption of an atmosphere can be reduced, it becomes possible to remove flux fumes efficiently.

  The present invention is extremely suitable for application to a solder reflow apparatus for surface mounting of electronic components having a labyrinth mechanism for defining a soldering atmosphere, and a jet soldering apparatus for electronic component pin insertion mounting.

7 Molten solder 8,9 Pump 10 Transport unit 11 Chain member 12 Transport chuck 14 Transport drive unit 15, 94, 96, 98 Motor 16 Monitor 20 Heat treatment unit 21-24 Preheating zone 25 Preheating drive unit
26-29 heater 30 lid support sealing mechanism 31-34, 91, 92 lid 35 sliding support member 36a, 36b, 37a, 37b rail 38a, 38b gap filling member 40 partition member movable mechanism 41, 49 slit 42a-42d Long hole 43 Labyrinth part (partition member)
44 Sliding substrate 45a-45d Fixing member 46a, 46b Infarct seat member 47, 48a, 48b Locking member 50 Chamber (processing container)
51, 52 Diffusion nozzle 53, 54 Bracket 56, 57 Drooping plate 60 Jet solder bath 61, 62 Injection nozzle 64 Input unit 65 Control unit 67 Heater 68, 69 Motor 70 Both ends gas supply mechanism 71-73, 741 Gas supply unit 74 N2 Gas tank 75 Nozzle conduit 76a, 76b Diffusion member 77 Angle mount 78 Sensor conduit 79 Separating wall portion 80 Cover unit 81 Atmosphere cleaning portion 84, 301 Main body portion 85a-85d Current plate 86 Top plate members 87a, 87b Handle 88,812 Intake pipe 89,811 Exhaust pipe 90 Cooling processing part 93 Cooling drive part 99 Air curtain mechanism 100 Jet soldering apparatus
101 Main body frame 102 Beam frame members 103 to 106 Legs
302 Frame member 303 Upper plate 304 Lower plate 605 Supply control unit 701 to 703 Pipe connection unit 801 Atmosphere inlet 802 Atmosphere outlet 807 Filter 813 Fan 904 Blower 905 Lower guide plate 906 Upper guide plate

Claims (5)

In a soldering apparatus for soldering an electronic component to the substrate by heat-treating the substrate on which the electronic component is mounted, and cooling the substrate after soldering,
A heat treatment part for heat-treating the substrate having an opening in the upper part;
A lid for closing the opening of the heat treatment part,
The lid is
A main body portion of a housing structure having a plurality of slits on one surface side and a long hole portion on the other surface side;
A partition member whose one end is passed through the slit of the main body portion and hangs down to the heat treatment portion side;
A sliding substrate that is attached to the other end of each of the partition members, is incorporated in the main body, and is slidably engaged with respect to the substrate transport direction of the main body,
A soldering apparatus comprising: a partition member movable structure including a fixing portion that fixes the sliding substrate to the main body portion through a long hole portion of the main body portion. At least, an infarct seat member having a predetermined shape having a width and a length covering the long hole portion of the main body portion,
The fixing part is
The soldering apparatus according to claim 1, wherein the sliding board is fixed to the main body portion via the infarct seat member. In the infarct seat member,
An indicator portion having a predetermined shape is provided,
In the main body,
Having a scale portion at a position indicated by one end of the indicator portion;
The soldering apparatus according to claim 2, wherein the scale part is provided with a scale capable of reading the exposed length of the partition part. A lid having the partition member movable structure,
At least the vicinity of the carry-in entrance of the heat treatment part for preheating the substrate on which the electronic component is attached,
Near the entrance of the processing section for soldering electronic components to the substrate after the preheating treatment,
Near the inlet of the cooling processing section for cooling the substrate after soldering,
The soldering apparatus according to claim 1, wherein the soldering apparatus is provided at a discharge port for discharging the substrate after the cooling process. In the partition member movable structure that moves the partition member that hangs down to the processing container side having an opening at the top,
A main body portion of a housing structure having a plurality of slits on one surface side and a long hole portion on the other surface side;
A partition member that has one end passed through the slit of the main body and hangs down to the processing container;
The other end of each of the partition members is attached, and is incorporated in the main body portion, and a sliding substrate that is slidably engaged with the main body portion,
A partition member movable structure comprising: a fixing portion that fixes the sliding substrate to the main body portion through a long hole portion of the main body portion.

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