JPH04109695A - Reflow soldering method of printed board and device thereof - Google Patents
Reflow soldering method of printed board and device thereofInfo
- Publication number
- JPH04109695A JPH04109695A JP19477290A JP19477290A JPH04109695A JP H04109695 A JPH04109695 A JP H04109695A JP 19477290 A JP19477290 A JP 19477290A JP 19477290 A JP19477290 A JP 19477290A JP H04109695 A JPH04109695 A JP H04109695A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- reflow
- chamber
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 1
- 230000007306 turnover Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 241000208125 Nicotiana Species 0.000 description 1
- 235000002637 Nicotiana tabacum Nutrition 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000742 single-metal deposition Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、耐熱温度の低いリード線付きの電子部品と
耐熱温度の高いチップ部品やフラットパッケージ等の電
子部品（以下、ＳＭＤという）との混載基板をリフロー
はんだ付け装置ではんだ付け処理ができるようにしたリ
フローはんだ付け方法とその装置に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is directed to the combination of electronic components with lead wires that have a low heat resistance and electronic components such as chip components and flat packages that have a high heat resistance (hereinafter referred to as SMD). The present invention relates to a reflow soldering method and an apparatus for soldering a mixed board using a reflow soldering apparatus.
従来は、比較的耐熱温度の高いＳＭＤが装着されたプリ
シト基板は、リフローはんだ付け装置で２１０〜２５０
℃位の温度で均一に保持された高温度雰囲気中ではんだ
付けが行われていた。Conventionally, pre-soldering boards on which SMDs with a relatively high heat resistance temperature were attached were soldered with a reflow soldering machine of 210 to 250 Hz.
Soldering was performed in a high-temperature atmosphere that was maintained at a uniform temperature of around °C.
また、耐熱温度の高いＳＭＤと耐熱温度の低いリード線
付きの電子部品との混載基板の場合は、はんだペースト
を塗布したプリンｌ−基板にＳＭＤを装着してからリフ
ローはんだ付け装置ではんだ付けを行い、次いで、リー
ド線付き電子部品を上記のプリント基板に装着してから
フラックス塗布。In addition, in the case of a mixed board with an SMD with a high heat-resistant temperature and an electronic component with a lead wire with a low heat-resistant temperature, the SMD is mounted on a printed circuit board coated with solder paste, and then soldered using a reflow soldering machine. Then, attach the electronic components with lead wires to the above printed circuit board and apply flux.
予備加熱を行った後、噴流式はんだ槽やフローデイツプ
式のはんだ層ではんだ付けを行い、さらにフレオン（デ
ュポン社の商品名）液等で洗浄を行っていた。After preheating, soldering was performed using a jet solder bath or a flow dip type solder layer, and cleaning was performed using Freon (trade name of DuPont) liquid.
ところで、表面実装技術の多様化およびプリン＋４；１
ｊＥの低コスｌ−化に伴って、今までフローデイツプ式
はんだ槽や噴流式はんだ槽で行っていたリード線付きの
電子部品のうち、耐熱温度が１２０℃程度の低い電子部
品はリフローはんだ付け装置ではんだ付けすることが行
われていなかった。By the way, the diversification of surface mount technology and pudding +4;1
With the reduction in cost of JE, reflow soldering equipment is now used for electronic components with lead wires that have a low heat resistance temperature of around 120℃, which had previously been done in flow dip type soldering baths or jet type soldering baths. No soldering was done.
このため、現在使用されているリフローはんだ付け装置
では、加熱室が２１０〜２５０℃位の温度で均一化され
ているので、耐熱温度が１２０℃程度の低いリード線を
有する電子部品ののはんだ付けを行うには不向きである
という問題点があった。For this reason, in currently used reflow soldering equipment, the heating chamber has a uniform temperature of about 210 to 250°C, so electronic components with lead wires with a low heat resistance temperature of about 120°C can be soldered. The problem was that it was not suitable for carrying out.
また、リード線付き電子部品を噴流式はんだ槽やフロー
デイツプ式のはんだ槽ではんだ付けを行うには、フラッ
クス塗布装置、予備加熱装置および洗浄装置が必要にな
り、特に洗浄装置にはフレオン（デュポン社の商品名＞
ｗＲを使用するため、その上記の一部が外部へ排出され
ると洗浄液が無駄に消費されて製品のコストが上昇する
ばかりでなく、作業環境が悪化し、さらに公害の原因と
もなる等の問題点があった。Additionally, in order to solder electronic components with lead wires in a jet soldering bath or a flow dip type soldering bath, flux application equipment, preheating equipment, and cleaning equipment are required. Product name＞
Because wR is used, if some of the above is discharged outside, the cleaning fluid is wasted, which not only increases product costs, but also worsens the working environment and causes pollution. There was a point.
この発明は、上記の問題点を解決するためになされたも
ので、リフロー室の下部側を走行するプリント基板の主
面と裏面とにそれぞれ加熱される温度の差をつけること
によって耐熱温度の低い電子部品でもリフローはんだ付
け装置ではんだ付けできるようにしたプリンＩ・基板の
リフローはんだ付け方法およびその装置を得ることを目
的とする。This invention was made to solve the above problems, and by creating a difference in the temperature at which the main surface and back surface of the printed circuit board running in the lower part of the reflow chamber are heated, the heat resistant temperature is low. The purpose of the present invention is to provide a reflow soldering method and device for a printed circuit board, which enables electronic components to be soldered using a reflow soldering device.
この発明に係るプリント基板のリフローはんだ付け方法
は、その主面にＳＭＤがはんだ付けされたブ’ｌ−／ｌ
・基板を反転してプリント基板の裏面の電子部品のリー
ド線を挿入する透孔にはんだペーストを塗布した後、再
び反転して透孔に電子部品のリード線を挿入し、次いで
、予備加熱室とリフロー室とを順次設けたリフローはん
だ付け装置の搬送コシベヤにプリンＩ・基板の前段のプ
リント基板と後段のブリット基板とを順次密着するよう
に連続して搬送させ、予備加熱室の上部側とリフロー室
の上部側を低温に加熱し、予備加熱室の下部側とリフロ
ー室の下部側を高温に加熱することによりプリント基板
の裏面のはんだペーストを溶融した後、凝固させて電子
部品をプリント基板にはんだ付けするものである。The reflow soldering method for a printed circuit board according to the present invention is a method for reflow soldering a printed circuit board having an SMD soldered to its main surface.
・After flipping the board and applying solder paste to the through hole for inserting the lead wire of the electronic component on the back side of the printed circuit board, flip it again and insert the lead wire of the electronic component into the through hole, then place it in the preheating chamber. A conveyor belt of a reflow soldering machine, which has a reflow soldering chamber and By heating the upper side of the reflow chamber to a low temperature and heating the lower side of the preheating chamber and the lower side of the reflow chamber to a high temperature, the solder paste on the back of the printed circuit board is melted and solidified to attach electronic components to the printed circuit board. It is to be soldered.
また、この発明に係るプリント基板のリフローはんだ付
け装置は、予備加熱室の上部側とりフロ室の上部側を低
温に保持し、予備加熱室の下部側とり７０−室の下部側
を高温に保持して温度差をつけプリント基板の裏面には
んだ付けを行うために、予備加熱室とリフロー室の各側
壁と各搬送チェーンのガイドレールを有するチェーンガ
イドとの間にリフロー室の下部側で加熱された熱雰囲気
が上方へ流れるのを防止する遮蔽板を設けたものである
。Further, in the printed circuit board reflow soldering apparatus according to the present invention, the upper part of the preheating chamber is held at a low temperature, and the lower part of the preheating chamber is kept at a high temperature. In order to create a temperature difference and perform soldering on the back side of the printed circuit board, heating is performed at the lower side of the reflow chamber between the preheating chamber, each side wall of the reflow chamber, and the chain guide with the guide rail of each conveyor chain. A shield plate is provided to prevent the hot atmosphere from flowing upward.
また、プリン）・基板の裏面を加熱する輻射ヒタを予備
加熱室の下部側とリフロー室の下部側で、かつ搬送され
るプリント基板の近傍に設けたものである。In addition, radiant heaters for heating the back side of printed circuit boards are provided in the lower part of the preheating chamber and the lower part of the reflow chamber, and near the printed circuit board being transported.
さらに、リフロー室の上部側の内部で発生した輻射熱が
プリント基板に吸収されるのを防止する打抜き鋼板をリ
フロー室の上部側の下方に設けたものである。Further, a punched steel plate is provided below the upper side of the reflow chamber to prevent radiant heat generated inside the upper side of the reflow chamber from being absorbed by the printed circuit board.
この発明においては、プリント基板の主面にＳＭＤがは
んだ付けされたプリント基板を反転してプリント基板の
裏面にはんだペーストを透孔の部分に塗布した後、再度
反転してジー１：締付きの電子部品のリード線を透孔に
挿入してから、プリント基板の裏面のリフローはんだ付
けを行う。In this invention, the printed circuit board with the SMD soldered to the main surface of the printed circuit board is turned over, solder paste is applied to the through holes on the back side of the printed circuit board, and then the printed circuit board is turned over again. After inserting the lead wires of the electronic components into the through holes, reflow soldering is performed on the back side of the printed circuit board.
また、予備加熱室とリフロー室の側壁と搬送チェーンの
ガイドレールを有するチェーンガイドとの間に遮蔽板を
設けることにより予備加熱室の下部側とリフロー室の下
部側の熱雰囲気が予備加熱室の上部側とリフロー室の上
部側に入るのが防止される。In addition, by providing a shielding plate between the side walls of the preheating chamber and the reflow chamber and the chain guide having the guide rail of the conveyance chain, the thermal atmosphere at the lower side of the preheating chamber and the lower side of the reflow chamber can be changed from that of the preheating chamber. It is prevented from entering the upper side and the upper side of the reflow chamber.
また、プリント基板の裏面を加熱するヒータを設けたこ
とにより、プリン）・基板の裏面のみが容易に加熱され
、さらに打抜き鋼板を設けたことにより、プリント基板
の主面が低温に保持される。Furthermore, by providing a heater that heats the back surface of the printed circuit board, only the back surface of the printed circuit board can be easily heated, and by providing a punched steel plate, the main surface of the printed circuit board can be maintained at a low temperature.
第１図（ａ）〜（ｅ）はこの発明の一実施例を示すもの
で、第１図（ａ）はこの側断面図、第１図（ｂ）は、第
１図（ａ）のＩ−Ｉ綿による断面図、第１図（ｅ）は、
第１図（ａ）のｌ−ｌ１１１による断面図、第１図（ｄ
）は、第１図（Ｃ）の遮蔽板の部分を拡大して示した側
断面図、第２図（ａ）〜（Ｃ）、第３図は、第１図（ａ
）のプリント基板の形状を示すもので、第２図（ａ）〜
（Ｃ）は斜視図、第３図は、第２図（Ｃ）の要部を示す
側断面図である。これらの図において、１はプリント基
板、２は耐熱温度の高いチップ部品、３ははんだペース
Ｉ−、第２図、第３図において、４は耐熱温度の高いフ
ラットパッケージ、５はプリン）・回路、６は前記プリ
ント基板１に形成された透孔、７は後述のリード線が付
いている電子部品、８は前記透孔６に挿入される電子部
品７のリード線である。また、ｌａは前記チップ部品２
゜フラットパッケージ４．電子部品７が装着される表面
側の主面、１ｂは前記主面１ａの裏面側になる裏面であ
る。FIGS. 1(a) to (e) show one embodiment of the present invention, FIG. 1(a) is a side sectional view of this, and FIG. 1(b) is an I - I cotton cross-sectional view, FIG. 1(e),
Cross-sectional view taken along l-l111 in Figure 1(a), Figure 1(d)
) is a side sectional view showing an enlarged portion of the shielding plate in FIG. 1(C), FIGS. 2(a) to (C), and FIG.
) shows the shape of the printed circuit board shown in Figures 2(a) to 2(a).
(C) is a perspective view, and FIG. 3 is a side sectional view showing the main part of FIG. 2(C). In these figures, 1 is a printed circuit board, 2 is a chip component with a high heat-resistant temperature, 3 is a solder paste I-, in Figures 2 and 3, 4 is a flat package with a high heat-resistant temperature, and 5 is a printed circuit. , 6 is a through hole formed in the printed circuit board 1, 7 is an electronic component with a lead wire to be described later, and 8 is a lead wire of the electronic component 7 inserted into the through hole 6. In addition, la is the chip component 2
゜Flat package 4. The main surface 1b on the front side on which the electronic component 7 is attached is the back surface that is the back side of the main surface 1a.
また、第１図（ａ）、（ｂ）において、１１は前記プリ
ント基板１を搬送する搬送コンベヤのうち、−例として
搬送チェーンを示している。１２はスプロケット、第１
図（ｄ）において、１３は保持爪、１４は前記搬送チェ
ーン１１のガイドレール、１５はチェーンカバーである
。第１図（ａ）〜（Ｃ）において、２１はリフローはん
だ付け装置の全体を示す。２２．２３は前記はんだベー
スト３の融解点未満の温度に加熱された空気によりブリ
ット基板１を加熱する１次子備加熱室と２次子備加熱室
で、プリント基板１の走行方向（矢印Ａ方向）の後方と
前方に設けられたもので、２２Ａ、２３Ａは前記各予備
加熱室２２，２３の上部側、２２Ｂ、２３Ｂは前記各予
備加熱室２２．２３の下部側、２４は前記プリント基板
１のはんだ付けを行うリフロー室で、２４Ａは前記リフ
ロー室２４の上部側、２４Ｂは前記リフロー室２４の下
部側、２２ａは前記１次子惰加熱室２２の側壁、２３ａ
は前記２次子備加熱室２３の側壁、２４ｍはリフロー室
２４の側壁である。２５は前記プリント基板１の走行方
向（矢印Ａ方向）と平行に形成された各側壁２２ａ、２
３ａ、２４ａに取り付けられ空気を加熱するヒータで、
シーズヒータまたは遠赤外線ヒータ等が使用される。２
６は前記ヒータ２５から発生する遠赤外線等を含む輻射
熱が各予備加熱室２２，２３、リフロー室２４内に放射
されるのを遮蔽する遮蔽板で、輻射熱により、走行する
プリント基板１．チップ部品２が加熱されるのを防止す
るためのものである。２７は前記遮蔽板２６によって形
成された加熱部である。２８は前記加熱された空気を循
環させる送風ファンで、多羽根送風機等が使用されてい
る。２９は前記各送風ファン２８のモータ、３ｏは前記
はんだベスｌ−３を溶解するため加熱された空気を排出
する排出口、３１は前記加熱部２７の下方に形成された
吸入口、３２は前記各予備加熱室２２，２３、リフロー
室内２４の排出口３０に形成された整流板で、送風ファ
ン２８によって乱読となった空気を整流させる。３３ば
冷却ファン、３４は排気ファン、３５は前記加熱部２７
から送風ファン２８内部に通ずる空気の流通路である。Further, in FIGS. 1(a) and 1(b), reference numeral 11 indicates a conveyor chain as an example of the conveyor for conveying the printed circuit board 1. As shown in FIG. 12 is sprocket, 1st
In figure (d), 13 is a holding claw, 14 is a guide rail of the conveyance chain 11, and 15 is a chain cover. In FIGS. 1(a) to 1(C), 21 indicates the entire reflow soldering apparatus. Reference numerals 22 and 23 denote a primary heating chamber and a secondary heating chamber for heating the bullet board 1 with air heated to a temperature lower than the melting point of the solder base 3, in the running direction of the printed circuit board 1 (arrow A 22A and 23A are the upper sides of the respective preheating chambers 22 and 23, 22B and 23B are the lower sides of the respective preheating chambers 22 and 23, and 24 is the printed circuit board. 1, in which 24A is an upper side of the reflow chamber 24, 24B is a lower side of the reflow chamber 24, 22a is a side wall of the primary inertia heating chamber 22, and 23a is a reflow chamber in which soldering is performed.
is a side wall of the secondary heating chamber 23, and 24m is a side wall of the reflow chamber 24. Reference numeral 25 denotes each side wall 22a, 2 formed parallel to the running direction (direction of arrow A) of the printed circuit board 1.
A heater attached to 3a and 24a that heats the air,
A sheathed heater or far-infrared heater is used. 2
Reference numeral 6 denotes a shielding plate that shields radiant heat including far infrared rays generated from the heater 25 from being radiated into each of the preheating chambers 22, 23 and the reflow chamber 24, and the radiant heat protects the running printed circuit board 1. This is to prevent the chip component 2 from being heated. 27 is a heating section formed by the shielding plate 26. Reference numeral 28 is a blower fan that circulates the heated air, and a multi-blade blower or the like is used. 29 is the motor of each of the blower fans 28; 3o is an exhaust port for discharging heated air for melting the solder paste l-3; 31 is an inlet formed below the heating section 27; 32 is the A rectifying plate formed at the discharge port 30 of each of the preheating chambers 22 and 23 and the reflow chamber 24 rectifies the air that has been disturbed by the blower fan 28. 33 is a cooling fan, 34 is an exhaust fan, and 35 is the heating section 27.
This is an air flow path leading from the air blower fan 28 to the inside of the blower fan 28.
３６は前記プリント基板１の裏面１ｂを加熱する輻射ヒ
ータで、搬送チェーン１１の下方に設けられている。３
７は前記チェンカバー１５と各側壁２２ａ、２３ａ。A radiation heater 36 heats the back surface 1b of the printed circuit board 1, and is provided below the conveyance chain 11. 3
7 is the chain cover 15 and each side wall 22a, 23a.
２４ａとの間を閉塞する遮蔽板で、リフロー室２４の下
部側２１Ｂ内で加熱された熱風が上方へ流れるのを防止
している。３８は前記リフロー室２４の上部側２４Ａの
下方に設けられた打抜き鋼板で、第１図（ａ） （
Ｃ）では破線で示してあり、図示されない多数の透孔が
形成されている。24a, and prevents hot air heated within the lower side 21B of the reflow chamber 24 from flowing upward. 38 is a punched steel plate provided below the upper side 24A of the reflow chamber 24, as shown in FIG.
In C), a large number of through holes (not shown) are formed, which are indicated by broken lines.
なお、第１図において、各予備加熱室２３゜２４の上部
側２２Ａ、２３Ａ、下部側２２Ｂ、２３Ｂとリフロー室
２４の上部側２４Ａ、下部側２４Ｂとは搬送チェーン１
１を中心にして上下対称に設けられている。In FIG. 1, the upper sides 22A, 23A, lower sides 22B, 23B of each preheating chamber 23° 24 and the upper side 24A, lower side 24B of the reflow chamber 24 are the conveyor chain 1.
They are arranged vertically symmetrically with 1 as the center.
次に、動作について説明する。Next, the operation will be explained.
第４図（ａ）〜（ｃ）はプリント基板１のはんだ付けの
工程を示す図である。FIGS. 4(a) to 4(c) are diagrams showing the process of soldering the printed circuit board 1. FIG.
まず、第４図（ａ）は、第２図（ａ）に示すように、プ
リント基板１の上方側の主面１ａにチップ部品２がはん
だ付けされている。First, in FIG. 4(a), as shown in FIG. 2(a), a chip component 2 is soldered to the upper main surface 1a of a printed circuit board 1. As shown in FIG.
次いで、第４図（ｂ）は、第２図（ｂ）に示すように、
プリンＩ・基板１を反転し、主面１ａを下方側にし、裏
面１ｂを上方側にした後、電子部品７のリード綿８を挿
入する透孔６の部分にはんだペースＩ−３を塗布する。Next, as shown in FIG. 2(b), FIG. 4(b)
After flipping the printed circuit board 1 so that the main surface 1a is on the lower side and the back surface 1b is on the upper side, apply solder paste I-3 to the through hole 6 where the lead cotton 8 of the electronic component 7 is inserted. .
このはんだベースト３の塗布は注入晋により、またはプ
リント基板１と同一の透孔を形成した板状のスクリーン
をプリント基板１かぶせて透孔６の部分のみ行う。The solder base 3 is applied only to the portions of the through holes 6 by pouring or by covering the printed circuit board 1 with a plate-shaped screen in which the same through holes as the printed circuit board 1 are formed.
次いで、第４図（Ｃ）は、第２図（Ｃ）に示すように、
再びプリント基板１を反転して主面１ａを上方側にし、
裏面１ｂを下方側にして電子部品７のリードａＳを透孔
６に挿通し、第１図に示すリフローはんだ付け装置２１
へ搬送する。Then, as shown in FIG. 2(C), FIG. 4(C)
Flip the printed circuit board 1 again so that the main surface 1a is on the upper side,
The lead aS of the electronic component 7 is inserted into the through hole 6 with the back surface 1b facing downward, and the reflow soldering device 21 shown in FIG.
Transport to.
次に、リフローはんだ付け装置２１では、各予備加熱室
２２．２３の上部側２２Ａ、２３Ａ、下部側２２Ｂ、２
３Ｂとも図示しない前段のりフロはんだ付け装置ではん
だ付けされたはんだベスト３を、再び溶融させない１３
０℃位の温度雰囲気に保持する。また、リフロー室２４
の上部側２ｄＡ内は、１００℃位の温度の雰囲気に保持
されている。また、打抜き鋼板３８によりリフロー室２
４の上部側２４Ａ内の近赤外線がプリント基板１の主面
１ａに吸収されるのを防止する。Next, in the reflow soldering apparatus 21, the upper sides 22A, 23A, the lower sides 22B, 2
3B Do not melt the solder vest 3 that was soldered using the pre-stage glue-flow soldering device (not shown) again 13
The temperature atmosphere is maintained at around 0°C. In addition, the reflow chamber 24
An atmosphere at a temperature of about 100° C. is maintained within 2 dA on the upper side of. In addition, the reflow chamber 2 is provided with a punched steel plate 38.
4 is prevented from being absorbed by the main surface 1a of the printed circuit board 1.
また、リフロー室２４の下部側２４Ｂ内は、熱風と輻射
ヒータ３６から発生する近赤外線により４００℃位の温
度に加熱される。Further, the inside of the lower side 24B of the reflow chamber 24 is heated to a temperature of about 400° C. by hot air and near infrared rays generated from the radiant heater 36.
なお、遮蔽板３７を設けたことにより、リフロー室２４
の下部側２４Ｂ内の熱風や輻射熱等の熱雰囲気が各予備
加熱室２２，２３の上部側２２Ａ２２３Ａおよびリフロ
ー室２４の上部側２４Ａの中に流入するのを防止してい
る。Note that by providing the shielding plate 37, the reflow chamber 24
The thermal atmosphere such as hot air or radiant heat in the lower side 24B of the reflow chamber 24 is prevented from flowing into the upper side 22A 223A of each preheating chamber 22, 23 and the upper side 24A of the reflow chamber 24.
次に、プリン１〜基板１に装着された電子部品７のリー
ド線８をはんだ付けするため、プリシト基板１を第１図
（ｄ）に示すように、搬送チェーン１１の保持爪１３に
装着し、リフローはんだ付け装置２１の各予備加熱室２
２，２３を通って予備加熱され、次いで、リフロー室２
４の下部側２４Ｂではんだ付けされる。Next, in order to solder the lead wires 8 of the electronic components 7 mounted on the printed circuit board 1 to the printed circuit board 1, the printed circuit board 1 is mounted on the holding claws 13 of the conveyor chain 11 as shown in FIG. 1(d). , each preheating chamber 2 of the reflow soldering device 21
2, 23, and then reflow chamber 2.
4 is soldered on the lower side 24B.
ＩＪ フロー室２４では、プリンＩ・基板１の主面１ａ
はリフロー室２４の上部側２４Ａ内が１００℃位の温度
であるため、また、打抜き鋼板３８により近赤外線の影
響を防止しているため、１００℃位の低温度が保持され
ている。In the IJ flow chamber 24, the main surface 1a of the print I/substrate 1
Since the temperature inside the upper side 24A of the reflow chamber 24 is about 100°C, and because the punched steel plate 38 prevents the influence of near-infrared rays, the low temperature of about 100°C is maintained.
また、リフロー室２４の下部側２４Ｂ内は４００℃位の
熱風と輻射ヒータ３６からの近赤外線とによりはんだベ
ースト３が溶融してはんだ付けされ、次いで、冷却ファ
ン３３により冷却され固着される。Further, inside the lower side 24B of the reflow chamber 24, the solder base 3 is melted and soldered by hot air of about 400° C. and near infrared rays from the radiant heater 36, and then cooled by the cooling fan 33 and fixed.
また、リフローはんだ付け装置２１ではんだ付けが行う
とき、リフロー室２４の下部側２４８カ）らの熱風が各
搬送チェーン１１の間から各予備加熱室２２．２３の上
部側２２Ａ、２３Ａおよびリフロー室２４の上部側２４
Ａへ流れるのを防止するためにプリント基板１が搬送チ
ェーン１１に装着されないときでも、第５図（ａ）、（
ｂ）に示すように蓋板４１を搬送チェーン１１に連続し
て隙間がないように装着して搬送する。もちろん、プリ
ント基板１の場合も、同様に第５図（ａ）。Furthermore, when soldering is performed in the reflow soldering device 21, hot air from the lower side 248) of the reflow chamber 24 flows from between each conveyor chain 11 to the upper sides 22A, 23A of each preheating chamber 22, 23 and the reflow chamber. 24 upper side 24
Even when the printed circuit board 1 is not attached to the conveyor chain 11 in order to prevent it from flowing to the
As shown in b), the cover plate 41 is continuously attached to the conveyor chain 11 so that there is no gap and is conveyed. Of course, the same applies to the printed circuit board 1 as shown in FIG. 5(a).
（ｂ）に示すようにして搬送する。さらに、当初のプリ
ント基板１を装着した後、次のプリンＩ・基板１の装着
に間隔が生したときは、次のプリント基板１が装着され
るまで蓋板４１を装着し続ける。Convey as shown in (b). Furthermore, if there is a gap between the mounting of the next printed circuit board 1 after the initial printed circuit board 1 is mounted, the cover plate 41 is continued to be mounted until the next printed circuit board 1 is mounted.
第６図は、第１図（ｄ）に示す遮蔽板３７の他の形状を
示した側断面図で、プリント基板１の幅に対応して搬送
チェーン１１を移動させたとき遮蔽板も調整ができるよ
うにしたもので、３９は前記側壁２４ａに固定された固
定側の遮蔽板、４ｏは前記チエ−シカバー１５に固着さ
れた可動側の遮蔽板、３９ａ、４０ａは前記各遮蔽板３
９，４０の係合部で、Ｌ形に形成されている。FIG. 6 is a side sectional view showing another shape of the shielding plate 37 shown in FIG. 39 is a fixed shielding plate fixed to the side wall 24a, 4o is a movable shielding plate fixed to the chase cover 15, and 39a and 40a are each of the shielding plates 3.
The engaging portions 9 and 40 are formed into an L shape.
また、第７図（ａ）、（ｂ）は、第５図の蓋板４１の他
の形状を示した平面図と側断面図で、ブリシト基板１の
寸法が小さくて搬送チェーン１１の幅の調節に対処でき
ない場合、また、プリント基板１の連続搬送ができない
場合、蓋板４１にプリント基板１に対応する透孔４２を
形成したもので、この透孔４２の部分にプリント基板１
を載置する。Moreover, FIGS. 7(a) and 7(b) are a plan view and a side sectional view showing other shapes of the cover plate 41 in FIG. In cases where adjustment cannot be made or continuous conveyance of the printed circuit board 1 is not possible, a through hole 42 corresponding to the printed circuit board 1 is formed in the cover plate 41, and the printed circuit board 1 is inserted into the through hole 42.
Place.
第８図（ａ）、（ｂ）はシャーシ付きプリント基板を使
用した場合の実施例を示すもので、第８図（ａ）は平面
図、第８図（ｂ）は、第８図（ａ）のＸ−Ｘ５による断
面図である。これらの図において、第１図〜第７図と同
一符号は同一部分を示し、５１は前記プリント基板１を
固着した磁性体からなるシャーシ、５２は前記シャーシ
５１に形成された磁性体からなる仕切板、５３は前記ン
ヤノ５１から外方に突出したリード線、５４は搬送チェ
ーン、５５は前記搬送チェーン５４と一体に取り付けら
れたロッド、５６は前記ロッド５５゜に取り付けられた
マグネッ１−チャックで、シャシ５１および仕切板５２
の上面が永久磁石５７で吸着されることにより保持され
る。8(a) and 8(b) show an example in which a printed circuit board with a chassis is used. FIG. 8(a) is a plan view, and FIG. 8(b) is a plan view of FIG. ) is a sectional view taken along line X-X5. In these figures, the same reference numerals as in FIGS. 1 to 7 indicate the same parts, 51 is a chassis made of a magnetic material to which the printed circuit board 1 is fixed, and 52 is a partition made of a magnetic material formed on the chassis 51. A plate, 53 is a lead wire protruding outward from the Nyano 51, 54 is a conveyance chain, 55 is a rod integrally attached to the conveyance chain 54, and 56 is a magnetic chuck attached to the rod 55°. , chassis 51 and partition plate 52
The top surface of is held by being attracted by a permanent magnet 57.
このように、プリント基＠１が固着されたシャーシ５１
は、マグネットチャック５５に吸着されて保持され、プ
リント基板１の主面１ａと裏面１ｂに図示しないリフロ
ーはんだ付け装置によりチップ部品２がはんだ付けされ
、次いで、第４図（、）〜（ｅ）と同一の工程でプリン
ト基板１の透孔６に電子部品７のリードｉｆ！Ｊ８を挿
入してからはんだベースト３を塗布した後、シャーシ５
１を第７図に示す蓋板４１の透孔４２に対応して載置し
、第１図に示すリフローはんだ付け装置２１ではんだ付
けされる。In this way, the chassis 51 to which the printed circuit board @1 is fixed
is attracted and held by the magnetic chuck 55, and the chip component 2 is soldered to the main surface 1a and back surface 1b of the printed circuit board 1 by a reflow soldering device (not shown), and then, as shown in FIGS. 4(,) to (e). Connect the leads of the electronic component 7 to the through hole 6 of the printed circuit board 1 in the same process as if! After inserting J8 and applying solder base 3,
1 is placed corresponding to the through hole 42 of the cover plate 41 shown in FIG. 7, and soldered using the reflow soldering device 21 shown in FIG.
以上説明したように、この発明のプリント基板のり７０
−はんだ付け方法は、その主面にＳＭＤがはんだ付けさ
れたブリット基板を反転してブリット基板の裏面の電子
部品のリード線を挿入する透孔にはんだペーストを塗布
した後、再び反転して透孔に電子部品のリード線を挿入
し、次いで、予備加熱室とリフロー室とを順次設けたリ
フ口はんだ付け装置の搬送コンベヤにプリント基板の前
段のブリ、）・基板と後段のプリン）・基板とを順次密
着するように連続して搬送させ、予備加熱室の上部側と
リフロー室の上部側を低温に加熱し、予備加熱室の下部
側とリフロー室の下部側を高温に加熱することによりプ
リント基板の裏面のはんだベーストを溶融した後、凝固
させて電子部品をブリシト基板にはんだ付けするので、
耐熱温度の低いリード線付きの電子部品のリード線部分
をリフローはんだ付け方法でのはんだ付けが可能となっ
たため、フラックス塗布装置とフラックスが塗布された
あとの洗浄装置が不要となり、したがって、洗浄液のフ
し・オン液を使用しないのでフレオン液の蒸気の排出に
よる公害がなく、かつプリンｌ・基板の製造コス１−が
低減できる利点を有する。As explained above, the printed circuit board glue 70 of the present invention
- The soldering method is to invert the bullet board with the SMD soldered to its main surface, apply solder paste to the through hole on the back side of the bullet board into which the lead wire of the electronic component is inserted, then turn it over again and use the transparent Lead wires of electronic components are inserted into the holes, and then the printed circuit board is transferred to the conveyor of the re-opening soldering machine, which has a preheating chamber and a reflow chamber in sequence. The upper side of the preheating chamber and the upper side of the reflow chamber are heated to a low temperature, and the lower side of the preheating chamber and the lower side of the reflow chamber are heated to a high temperature. After melting the solder base on the back of the printed circuit board, it is solidified and electronic components are soldered to the printed circuit board.
It is now possible to solder the lead wires of electronic components with lead wires that have low heat resistance using the reflow soldering method, which eliminates the need for flux application equipment and cleaning equipment after flux has been applied. Since no liquid is used, there is no pollution caused by the discharge of vapor from the Freon liquid, and there is an advantage that the manufacturing cost of substrates and substrates can be reduced.
また、この発明のプリント基板のり７０−はんだ付け装
置は、予備加熱室の上部側とリフロー室の上部側を低温
に保持し、予備加熱室の下部側とリフロー室の下部側を
高温に保持して温度差をっけプリント基板の裏面にはん
だ付けを行うために、予備加熱室とリフロー室の各側壁
と各搬送チェーンのガイドレールを有するチェーンガイ
ドとの間にリフロー室の下部側で加熱された熱雰囲気が
上方へ流れるのを防止する遮蔽板を設け、また、プリン
ト基板の裏面を加熱するヒータを予備加熱室の下部側と
リフロー室の下部側で、かつ搬送されるプリント基板の
近傍に設け、さらに、リフロー室の上部側の内部で発生
した放射熱がプリント基板に吸収されるのを防止する打
抜き鋼板をリフロー室の上部側の下方に設けたので、リ
フローはんだ付け装置でプリント基板の裏面のみが容易
に加熱されてリフローはんだ付けができるため、耐熱温
度の低いリード線付きの電子部品のリード線部分のリフ
ローはんだ付けを行ってもプリン）、基板の主面ば低温
に保持されているので、電子部品の熱による破損を防止
することができる利点を有する。Further, the printed circuit board glue 70-soldering apparatus of the present invention maintains the upper side of the preheating chamber and the upper side of the reflow chamber at a low temperature, and maintains the lower side of the preheating chamber and the lower side of the reflow chamber at a high temperature. In order to solder the back side of the printed circuit board by creating a temperature difference, a heating chamber is heated at the lower side of the reflow chamber between the preheating chamber, each side wall of the reflow chamber, and the chain guide with the guide rail of each conveyor chain. A shield plate is installed to prevent the heated atmosphere from flowing upward, and a heater that heats the back side of the printed circuit board is installed at the lower part of the preheating chamber and the lower part of the reflow chamber, and near the printed circuit board being transported. In addition, a punched steel plate was installed below the upper part of the reflow chamber to prevent the radiant heat generated inside the upper part of the reflow chamber from being absorbed by the printed circuit board. Only the back side can be easily heated and reflow soldered, so even if you reflow solder the lead wire part of an electronic component with a lead wire that has a low heat-resistant temperature, the main surface of the board will remain at a low temperature. This has the advantage of preventing damage to electronic components due to heat.
第１図（ａ）〜（ｃ）ばこの発明の一実施例を示すもの
で、第１図（ａ）は側断面図、第１図（ｂ）は、第１図
（ａ）の■−■線による断面図、第１図（ｃ）は、第１
図（ａ）の１−ＩＩ線による断面図、第１図（ｄ）は、
第１図（ｅ）の遮蔽板の部分を拡大して示した側断面図
、第２図（ａ）〜（Ｃ）、第３図は、第１図（ａ）のプ
リント基板の形状を示すもので、第２図（ａ）〜（Ｃ）
は斜視図、第３図は、第２図（ｃ）の要部を示す側断面
図、第４図（ａ）〜（ｃ）はプリント基板のはんだ付け
の工程を示す図、第５図（ａ） （ｂ）は蓋板また
はプリント基板の搬送状態を示す平面図とＳ面図、第６
図は、第１図（ｄ＞の第２の遮蔽板の他の形状を示した
側断面図、第７図（ａ）（ｂ）は、第５図（ａ）、（ｂ
）の蓋板の他の形状を示した平面図と側断面図、第８図
（ａ）（ｂ）はシャーシ付きプリント基板を使用した場
合の実施例を示すもので、第８図（ａ）は平面図、第８
図（ｂ）は、第８図（ａ）のＩＩ−Ｉ線による断面図で
ある。
図中、１はプリント基板、１ａは主面、１ｂは裏面、２
はチップ部品、３ははんだベース■・、６は透孔、７は
電子部品、８ばリード線、１１は搬送チェーン、１４は
ガイドレールｂ１１５はチェーンカバー、２１はリフロ
ーはんだ付け装置、２２は１次子備加熱室、２３は２次
子備加熱室、２２Ａ、２３Ａは上部側、２２Ｂ、２３Ｂ
は下部側、２４はリフロー室、２ｄＡは上部側、２．４
１Ｂは下部側、２２ａ、２３ａ、２４ａは側壁、３７は
遮蔽板である。
第１ 図（Ｃ）
２］
１５ チェーンカハー
第
図（ｄ）
ガイドし−ル
第
図
透孔
第
図
第５図
（ａ）
第
図
′１
第
図
第
図
（ａ）
１゜FIGS. 1(a) to (c) show an embodiment of the tobacco invention, FIG. 1(a) is a side sectional view, and FIG. 1(b) is a side view of FIG. 1(a). ■The cross-sectional view drawn by the line, Figure 1 (c) is the 1st
The sectional view taken along line 1-II in Figure (a) and Figure 1 (d) are:
A side sectional view showing an enlarged portion of the shielding plate in FIG. 1(e), FIGS. 2(a) to (C), and FIG. 3 show the shape of the printed circuit board in FIG. 1(a). Figure 2 (a) to (C)
is a perspective view, FIG. 3 is a side sectional view showing the main part of FIG. 2(c), FIGS. a) (b) is a plan view and an S side view showing the conveyance state of the cover plate or printed circuit board, No. 6
The figure is a side sectional view showing another shape of the second shielding plate in Figure 1 (d>), and Figures 7 (a) and (b) are
8(a) and 8(b) show an example in which a printed circuit board with a chassis is used. is a plan view, No. 8
FIG. 8(b) is a sectional view taken along line II-I in FIG. 8(a). In the figure, 1 is a printed circuit board, 1a is the main surface, 1b is the back surface, 2
1 is a chip component, 3 is a solder base, 6 is a through hole, 7 is an electronic component, 8 is a lead wire, 11 is a conveyor chain, 14 is a guide rail b115 is a chain cover, 21 is a reflow soldering device, 22 is 1 Secondary heating chamber, 23 is secondary heating chamber, 22A, 23A are upper side, 22B, 23B
is the lower side, 24 is the reflow chamber, 2dA is the upper side, 2.4
1B is a lower side, 22a, 23a, 24a are side walls, and 37 is a shielding plate. Figure 1 (C) 2] 15 Chain cover diagram (d) Guide rule diagram Through hole diagram Figure 5 (a) Figure '1 Figure '1 Figure (a) 1゜
Claims (4)
ント基板を反転して前記プリント基板の裏面の電子部品
のリード線を挿入する透孔にはんだペーストを塗布した
後、再び反転して前記透孔に前記電子部品のリード線を
挿入し、次いで、予備加熱室とリフロー室とを順次設け
たリフローはんだ付け装置の搬送コンベヤに前記プリン
ト基板の前段のプリント基板と後段のプリント基板とを
順次密着するように連続して搬送させ、前記予備加熱室
の上部側と前記リフロー室の上部側を低温に加熱し、前
記予備加熱室の下部側と前記リフロー室の下部側を高温
に加熱することにより前記プリント基板の裏面の前記は
んだペーストを溶融した後、凝固させて前記電子部品を
前記プリント基板にはんだ付けすることを特徴とするプ
リント基板のリフローはんだ付け方法。(1) Turn over the printed circuit board with the surface mount components soldered to its main surface, apply solder paste to the through holes on the back side of the printed circuit board into which the lead wires of the electronic components will be inserted, and then turn it over again. The lead wire of the electronic component is inserted into the through hole, and then the preceding printed circuit board and the subsequent printed circuit board are sequentially transferred to a conveyor of a reflow soldering device that is provided with a preheating chamber and a reflow chamber in sequence. Continuously conveying the materials in close contact with each other, heating the upper side of the preheating chamber and the upper side of the reflow chamber to a low temperature, and heating the lower side of the preheating chamber and the lower side of the reflow chamber to a high temperature. A reflow soldering method for a printed circuit board, characterized in that the electronic component is soldered to the printed circuit board by melting the solder paste on the back surface of the printed circuit board and then solidifying the solder paste.
ント基板の裏面の透孔にはんだペーストが塗布され、前
記プリント基板の主面から電子部品のリード線を前記透
孔に挿入して仮着したプリント基板を搬送コンベヤによ
り搬送する搬送手段と、前記プリント基板を加熱する予
備加熱室と、前記はんだペーストを溶融してはんだ付け
を行うリフロー室とを前記搬送コンベヤを中心にして上
下対称に設けたリフローはんだ付け装置であって、前記
予備加熱室の上部側および前記リフロー室の上部側を低
温に保持し、前記予備加熱室の下部側と前記リフロー室
の下部側を高温に保持して温度差をつけ前記プリント基
板の裏面にはんだ付けを行うために、前記予備加熱室と
前記リフロー室の各側壁と各搬送チェーンのガイドレー
ルを有するチェーンガイドとの間に前記リフロー室の下
部側で加熱された熱雰囲気が上方へ流れるのを防止する
遮蔽板を設けたことを特徴とするプリント基板のリフロ
ーはんだ付け装置。(2) Solder paste is applied to the through hole on the back side of the printed circuit board with the surface mount components soldered to its main surface, and the lead wire of the electronic component is inserted into the through hole from the main surface of the printed circuit board and temporarily A conveying means for conveying the attached printed circuit board by a conveyor, a preheating chamber for heating the printed circuit board, and a reflow chamber for melting the solder paste and performing soldering are vertically symmetrical with respect to the conveyor. A reflow soldering apparatus provided with the above, wherein an upper side of the preheating chamber and an upper side of the reflow chamber are maintained at a low temperature, and a lower side of the preheating chamber and a lower side of the reflow chamber are maintained at a high temperature. In order to create a temperature difference and perform soldering on the back side of the printed circuit board, a lower part of the reflow chamber is provided between the preheating chamber, each side wall of the reflow chamber, and a chain guide having a guide rail of each conveyor chain. A reflow soldering device for printed circuit boards, characterized in that a shielding plate is provided to prevent a heated thermal atmosphere from flowing upward.
加熱室の下部側とリフロー室の下部側で、かつ搬送され
る前記プリント基板の近傍に設けたものである請求項（
２）に記載のプリント基板のリフローはんだ付け装置。(3) A radiant heater for heating the back side of the printed circuit board is provided in the lower part of the preheating chamber and the lower part of the reflow chamber, and in the vicinity of the printed circuit board being transported.
2) The printed circuit board reflow soldering apparatus according to item 2).
板に吸収されるのを防止する打抜き鋼板を前記リフロー
室の上部側の下方に設けたものである請求項（２）また
は（３）に記載のプリント基板のリフローはんだ付け装
置。(4) According to claim (2) or (3), a punched steel plate is provided below the upper side of the reflow chamber to prevent radiant heat inside the upper side of the reflow chamber from being absorbed by the printed circuit board. The described printed circuit board reflow soldering equipment.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2194772A JP2509373B2 (en) | 1990-07-25 | 1990-07-25 | Reflow soldering method and device for printed circuit board |
| US07/735,352 US5180096A (en) | 1990-07-25 | 1991-07-24 | Method and apparatus for reflow-soldering of printed circuit boards |
| DE69123095T DE69123095T2 (en) | 1990-07-25 | 1991-07-25 | Method and device for the backflow of printed circuits |
| EP91306792A EP0469788B1 (en) | 1990-07-25 | 1991-07-25 | Method and apparatus for reflow-soldering of print circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2194772A JP2509373B2 (en) | 1990-07-25 | 1990-07-25 | Reflow soldering method and device for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04109695A true JPH04109695A (en) | 1992-04-10 |
| JP2509373B2 JP2509373B2 (en) | 1996-06-19 |
Family
ID=16329989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2194772A Expired - Fee Related JP2509373B2 (en) | 1990-07-25 | 1990-07-25 | Reflow soldering method and device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509373B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005134276A (en) * | 2003-10-31 | 2005-05-26 | Matsushita Electric Ind Co Ltd | Method and system for providing thermal analysis information |
| US6915942B2 (en) | 2001-06-01 | 2005-07-12 | Nec Corporation | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
| KR100524841B1 (en) * | 1996-04-16 | 2005-10-28 | 마쯔시다덴기산교 가부시키가이샤 | Reflow soldering method and reflow soldering apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101327757B1 (en) | 2013-08-29 | 2013-11-11 | 에이에치코리아주식회사 | Method for mounting electronic component on circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6427794A (en) * | 1987-07-23 | 1989-01-30 | Matsushita Electric Ind Co Ltd | Heating equipment |
| JPH0299266A (en) * | 1988-10-04 | 1990-04-11 | Kenji Kondo | Reflow soldering device |
-
1990
- 1990-07-25 JP JP2194772A patent/JP2509373B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6427794A (en) * | 1987-07-23 | 1989-01-30 | Matsushita Electric Ind Co Ltd | Heating equipment |
| JPH0299266A (en) * | 1988-10-04 | 1990-04-11 | Kenji Kondo | Reflow soldering device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100524841B1 (en) * | 1996-04-16 | 2005-10-28 | 마쯔시다덴기산교 가부시키가이샤 | Reflow soldering method and reflow soldering apparatus |
| KR100571873B1 (en) * | 1996-04-16 | 2006-08-03 | 마쯔시다덴기산교 가부시키가이샤 | Reflow Method and Reflow Device |
| US6915942B2 (en) | 2001-06-01 | 2005-07-12 | Nec Corporation | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
| JP2005134276A (en) * | 2003-10-31 | 2005-05-26 | Matsushita Electric Ind Co Ltd | Method and system for providing thermal analysis information |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2509373B2 (en) | 1996-06-19 |
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