JP2007035774A - Reflow soldering equipment and reflow soldering method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide reflow soldering equipment which is simple-structured and can solder each mount component on a substrate by properly and easily heating it, even if a plurality of mount components having different heat capacities are to be soldered to one and the same substrate, and also to provide a reflow soldering method. <P>SOLUTION: A heating-up portion of a reflow furnace includes a nozzle 20 which blows off hot air H2 obliquely in the transferring direction X of the substrate 5 whereon the mount components 6A and 6B having different heat capacities are mounted on a cream solder 7. The hot air H2 blown off from the nozzle 20 is blown against the top and side faces of the mount component 6A having a larger heat capacity and against only the top face of the mount component 6B having a smaller heat capacity, reducing a temperature difference between the mount component 6A having a larger heat capacity and the mount component 6B having a smaller heat capacity. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a reflow apparatus and a reflow soldering method, and in particular, a reflow solder for soldering a mounting component to a substrate by heating the substrate on which the mounting component is mounted on cream solder to a predetermined temperature. The present invention relates to a reflow soldering method in which a mounting component is mounted on a cream solder applied to a substrate and transported through a reflow furnace to solder the mounting component to the substrate.

  In order to solder a mounting component to a substrate, reflow soldering is generally performed in which cream solder is applied to the substrate, the mounting component is mounted on the cream solder, and heated to a predetermined temperature. And as for a general reflow apparatus, as FIG. 1 refers, the reflow furnace 1 raises the board | substrate 5 with which mounting components were mounted on the cream solder to the predetermined temperature, 2A, 2B, The mounting parts are composed of temperature equalizing portions 3A, 3B, 3C, 3D, etc. that hold the substrate 5 mounted on the cream solder at a predetermined temperature, and the mounting parts are moved up the substrate 5 mounted on the cream solder. Conveying means 4 such as a conveyor that conveys inside the warming parts 2A, 2B and the soaking parts 3A, 3B, 3C, 3D, etc., the heating parts 2A, 2B of the reflow furnace 1, and the soaking parts 3A, 3B, 3C, Means for supplying hot air H2 and H3 having a predetermined temperature to 3D and the like, respectively. The substrate 5 on which the mounting component is mounted on the cream solder is placed on the conveying means 4 and sequentially inside the temperature raising parts 2A, 2B and the temperature equalizing parts 3A, 3B, 3C, 3D, etc. of the reflow furnace 1. When the cream solder is melted by being heated by the hot air H2 and H3 blown from the nozzles provided in the temperature raising parts 2A and 2B and the temperature equalizing parts 3A, 3B, 3C and 3D, etc. The mounted component is soldered (mounted) at a predetermined position on the substrate 5. And nozzles, such as temperature rising part 2A, 2B and temperature equalization part 3A, 3B, 3C, 3D of the conventional reflow furnace, are generally with respect to the conveyance direction X of the board | substrate 5 with which mounting components were mounted on the cream solder. It was provided so that hot air was ejected in a direction almost perpendicular to each other.

  By the way, when a plurality of mounting parts having different sizes are mixed and mounted on the same substrate by using such a reflow soldering apparatus, the heat capacity varies depending on the size of the mounting parts. In addition, when hot air H is blown from both the upper and lower directions in a direction substantially orthogonal to the surface of the substrate 5 on which the mounting components 6A and 6B are mounted in the reflow furnace, the mounting components 6A and 6B mounted on the substrate 5 are heated. Since the amount of heat supply is large, the temperature of the small mounting component 6B is relatively high compared to the large mounting component 6A. Also, as shown in FIG. 7, when the hot air H is blown and heated almost perpendicularly only to the upper surface of the substrate 5 on which the mounting components 6A and 6B are mounted in the reflow furnace, the large mounting component 6A becomes Since heat is absorbed only from the upper surface, the temperature rise is relatively slow compared to the small mounting component 6B. Therefore, even when hot air H is blown on both sides or one side of the substrate 5, as shown in FIG. 8, the temperature difference in the substrate 5 to which the cream solder 7 is applied depending on the sizes 6A and 6B of the mounted components. T will occur.

  In this case, if it is attempted to heat in accordance with the mounting component 6B having a small heat capacity, the temperature of the mounting component 6A having a large heat capacity does not rise sufficiently, and therefore the cream solder 7 does not melt sufficiently, resulting in poor soldering. Will occur. In order to avoid this, if an attempt is made to heat the solder paste 7 of the large mounting component 6A until it is sufficiently melted, the temperature of the mounting component 6B having a small heat capacity will rise quickly and exceed its heat resistance temperature. Therefore, it is difficult to mix a plurality of mounting components 6A and 6B having different sizes and perform reflow soldering on the same substrate 5.

Therefore, as a conventional technique for providing a reflow apparatus and a reflow soldering method using the reflow apparatus that can reduce the temperature difference between a mounting component that easily rises in temperature and a mounting component that hardly raises temperature, Patent Document 1 is known.
In Patent Document 1, in a reflow apparatus that heats a printed wiring board in a furnace body and reflow-solders mounting components to the printed wiring board, a plurality of local portions that can heat each part of the printed wiring board are disclosed. In this reflow apparatus, a preheating part (temperature raising part) and a main heating part (temperature equalizing part) are provided in the furnace body, and the main heating part is provided with the plurality of local portions. A reflow apparatus characterized by having a heating means is disclosed.
In Patent Document 1, a plurality of local heating means of a reflow apparatus is provided with a temperature distribution pattern that uniformly heats the printed wiring board on which the mounting component is mounted, and the printed wiring board is heated. A reflow soldering method is disclosed.

  On the other hand, in another conventional reflow soldering apparatus, an electric heater is provided in addition to a blowout nozzle that blows hot air in order to sufficiently heat the substrate on which the mounting component is mounted on the cream solder. was there.

JP 2002-324972 A

  However, among the conventional techniques described above, the reflow apparatus disclosed in Patent Document 1 is provided with a plurality of local heating means capable of heating each part of the printed wiring board. When mounting mounting parts of different sizes on the wiring board, in order to eliminate the temperature rise due to the heat capacity of the mounting parts, the mounting capacity of the mounting parts and the placement of the mounting parts on the board Accordingly, it is necessary to control each local heating means, and there are problems that the configuration of the reflow apparatus is complicated and the control is complicated.

  In addition, among the above conventional techniques, in addition to the blowout nozzle that blows hot air, an electric heater is provided, and wiring for supplying electric power to the electric heater is required, resulting in a complicated configuration. At the same time, there is a problem in that it is not only necessary to provide an electric heater, but also because it requires electric power to be supplied to the heater.

The present invention has been made in order to solve the above-described problems in an advantageous manner. Even when a plurality of mounting parts having different heat capacities are soldered to a single board with a simple configuration, the present invention is suitable and An object of the present invention is to provide a reflow soldering apparatus and a reflow soldering method capable of easily heating and soldering each mounted component to a substrate.
In addition, the present invention was made to solve the above-described problems in an advantageous manner, and is a reflow soldering apparatus capable of soldering each mounted component to a substrate by heating it appropriately and inexpensively with a simple configuration. An object is to provide a reflow soldering method.

In order to achieve the above object, the reflow soldering apparatus according to claim 1 heats the mounting component to the substrate by heating the substrate mounted on the cream solder to a predetermined temperature while transporting the substrate. A reflow soldering apparatus for soldering, wherein the mounting component includes a nozzle that blows hot air in a direction inclined toward a conveying direction of a substrate mounted on cream solder.
In order to achieve the above object, the invention according to the reflow soldering apparatus of claim 2 mounts the mounting component on the substrate by heating the mounting component to a predetermined temperature while transporting the substrate mounted on the cream solder inside. A reflow soldering apparatus for soldering, wherein a nozzle that blows hot air at a predetermined temperature, and a mounting path where the mounting component is mounted on a cream solder and facing the nozzle are arranged to face the nozzle. And an infrared radiator that emits infrared rays by receiving hot air blown out.
In order to achieve the above object, the invention according to the third aspect of the reflow soldering method mounts the mounting component on the cream solder applied to the substrate, conveys the inside of the reflow furnace, and mounts the mounting component on the substrate. A reflow soldering method for soldering is characterized in that hot air of a predetermined temperature is sprayed in a direction in which the mounting component is inclined toward a conveying direction of a substrate mounted on cream solder.
In order to achieve the above object, the reflow soldering method according to claim 4 mounts the mounting component on the cream solder applied to the substrate, conveys the inside of the reflow furnace, and mounts the mounting component on the substrate. A reflow soldering method for soldering, wherein a nozzle that blows hot air at a predetermined temperature and an infrared radiator that emits infrared rays by receiving hot air blown from the nozzle are mounted on the cream solder. When the substrate on which the mounting component is mounted on the cream solder is not positioned between the nozzle and the infrared radiator, the substrate is blown out from the nozzle. When an infrared radiator receives hot air, and the substrate on which the mounting component is mounted on the cream solder is transported between the nozzle and the infrared radiator. Is characterized in that the heating and held at a predetermined temperature by the infrared rays emitted from the hot air and infrared radiator to be blown from the nozzle.

In the first aspect of the present invention, the mounting component is mounted on the cream solder from the nozzle in a direction orthogonal to the transport direction (in the case where the transport direction is a horizontal direction, the vertical direction or the lateral direction). In addition, when hot air of a predetermined temperature is blown in a direction inclined toward the conveying direction, a single or a plurality of mounting parts having substantially the same heat capacity according to the size are mounted. Even when multiple mounting components with different heat capacities are mounted on a single board, hot air is blown evenly over each mounting component, so each mounting component is heated appropriately and easily. The cream solder is melted and soldered to the substrate.
According to a second aspect of the present invention, a nozzle that blows hot air at a predetermined temperature and a hot air that blows out from the nozzle are disposed so as to face the nozzle across the conveyance path of the substrate on which the mounting component is mounted on the cream solder. And an infrared radiator that emits infrared rays, so that when the substrate on which the mounting component is mounted on the cream solder is not positioned between the nozzle and the infrared radiator, the nozzle is blown out from the nozzle. The hot air is received by the infrared radiator, and when the substrate on which the mounting component is mounted on the cream solder is transported between the nozzle and the infrared radiator, the hot air blows out from the nozzle and is emitted from the infrared radiator. Since it is heated and held at a predetermined temperature by infrared rays, each mounted component is soldered to the substrate by being heated appropriately and inexpensively.
In the invention of claim 3, the mounting component is not in the direction orthogonal to the transport direction (up and down direction or lateral direction when the transport direction is horizontal) with respect to the substrate mounted on the cream solder, By blowing hot air at a predetermined temperature in a direction inclined toward the transport direction, the heat capacity varies depending on the size, as well as when mounting a plurality of mounting parts having a single heat capacity or substantially the same heat capacity. Even when multiple mounting components are mounted on a single board, hot air is blown evenly over each mounting component, so each mounting component is heated appropriately and easily to melt cream solder. Soldered to the board.
According to a fourth aspect of the present invention, a nozzle that blows hot air at a predetermined temperature, and an infrared radiator that emits infrared rays by receiving hot air blown from the nozzle, a transport path for a substrate on which the mounting component is mounted on cream solder When the substrate on which the mounting component is mounted on the cream solder is not positioned between the nozzle and the infrared radiator, the hot air blown from the nozzle is irradiated with infrared radiation. When the substrate on which the mounting component is mounted on the cream solder is conveyed between the nozzle and the infrared radiator, the hot air blown from the nozzle and the infrared ray radiated from the infrared radiator are predetermined. By heating / holding to a temperature, each mounted component is soldered to the substrate by being heated appropriately and inexpensively.

According to the first aspect of the present invention, the mounting component is provided with the nozzle that blows hot air in the direction inclined toward the transport direction of the substrate mounted on the cream solder, so that the heat capacity according to the size or the size can be increased. When mounting multiple mounting components that are almost equivalent, it is also possible to heat each mounting component appropriately and easily, even when mounting multiple mounting components with different heat capacities depending on the size. Thus, a reflow soldering apparatus capable of melting the cream solder and soldering it to the substrate can be provided.
According to invention of Claim 2, the hot air which blows off from the nozzle which blows off the nozzle which blows off the hot air of predetermined temperature, and the said mounting component across the conveyance path | route of the board | substrate mounted on the cream solder An infrared radiator that emits infrared rays by receiving the nozzle, and when the substrate on which the mounting component is mounted on the cream solder is not located between the nozzle and the infrared radiator, the nozzle The infrared radiator receives the hot air blown out from the nozzle and emits the hot air blown from the nozzle and the infrared radiator when the substrate on which the mounting component is mounted on the cream solder is transported between the nozzle and the infrared radiator. Reflow soldering that can be soldered to the board appropriately and inexpensively by being heated and held at a predetermined temperature by infrared rays It is possible to provide a joining apparatus.
According to the invention of claim 3, by blowing hot air of a predetermined temperature in a direction in which the mounting component is inclined toward the transport direction of the substrate mounted on the cream solder, the heat capacity according to the single or the size is substantially reduced. Of course, when mounting multiple equivalent mounting components, even when mounting multiple mounting components with different heat capacities depending on the size, the mounting components are heated appropriately and easily. Thus, it is possible to provide a reflow soldering method capable of melting the cream solder and soldering it to the substrate.
According to invention of Claim 4, the nozzle which blows off the hot air of predetermined temperature, and the infrared radiator which radiates | emits infrared by receiving the hot air blown off from this nozzle are the board | substrate with which the said mounting component was mounted on the cream solder. When the substrate on which the mounting component is mounted on the cream solder is not located between the nozzle and the infrared radiator, hot air blown out from the nozzle is arranged so as to face each other across the conveyance path. When the infrared radiator is received and the substrate on which the mounting component is mounted on the cream solder is transported between the nozzle and the infrared radiator, hot air blown from the nozzle and infrared radiation emitted from the infrared radiator, Reflow soldering method that allows each mounted component to be soldered to the board appropriately and inexpensively by heating and holding at a predetermined temperature It is possible to provide.

First, an embodiment of the reflow soldering apparatus of the present invention will be described in detail with reference to FIGS. In addition, the same code | symbol shall show the same part or an equivalent part.
The reflow soldering apparatus of the present invention generally includes a reflow furnace 1 and transport means 4 such as a conveyor for transporting the substrate 5 in a state where the mounting components 6A and 6B are mounted on the cream solder 7 inside the reflow furnace 1. And means for supplying hot air at a predetermined temperature to the reflow furnace 1. The reflow furnace 1 sets the substrate 5 in a state where the mounting components 6A and 6B are mounted on the cream solder 7 to a predetermined temperature. The temperature raising parts 2A, 2B to be raised, and the temperature equalizing parts 3A, 3B, 3C, 3D for holding the substrate 5 in a state where the mounting components 6A, 6B are mounted on the cream solder 7 at a predetermined temperature. The temperature raising parts 2A, 2B and the temperature-equalizing parts 3A, 3B, 3C, 3D blow hot air to heat the substrate 5 with the mounting components 6A, 6B mounted on the cream solder 7, respectively. Nozzle 20, 3 It is equipped with a. The nozzles 20 of the temperature raising units 2A and 2B are configured to blow hot air H2 in a direction inclined toward the transport direction X of the substrate 5 in a state where the mounting components 6A and 6B are mounted on the cream solder 7. Yes. Further, the soaking parts 3A, 3B, 3C, 3D are further arranged so as to face the nozzle 30 across the conveyance path of the substrate 5 in a state where the mounting components 6A, 6B are mounted on the cream solder 7, An infrared radiator 31 that emits infrared rays H4 by receiving hot air H3 blown from the nozzles 30; In this embodiment, cream solder 7 is applied to the surface of the substrate 5 in a predetermined pattern, and the mounted parts 6A and 6B having different sizes are mounted on the cream solder 7 by the conveyor 4. In the following description, the mounting components 6A and 6B are heated in the reflow furnace 1 and soldered to the substrate 5.

  In this embodiment, the substrate 5 on which the cream solder 7 is applied and the mounting components 6A and 6B are mounted thereon is conveyed from the left to the right in FIG. In the reflow furnace 1, chambers constituting a temperature raising unit 2A, temperature-equalizing units 3A, 3B, and 3C, a temperature raising unit 2B, and a temperature-equalizing unit 3D are sequentially arranged from the carry-in side to the carry-out side. . The conveyor 4 is coated with cream solder 7 between the temperature raising part 2A and the temperature equalizing part 3A, the temperature equalizing parts 3B and 3C, and between the temperature raising part 2B and the temperature equalizing part 3D, and the mounting components 6A and 6B are mounted thereon. Control is performed so that the mounted substrate 5 is conveyed at an appropriate speed over a predetermined time.

  A means for supplying air or an inert gas heated to a predetermined temperature as hot air H2 is connected above the temperature raising units 2A and 2B, and an opening 22 for supplying the hot air H2 is formed. Yes. A partition wall 23 for forming a space communicating with the opening 22 is provided above the temperature raising units 2A and 2B. The partition wall 23 includes a space and a heating chamber in the temperature raising units 2A and 2B. A plurality of nozzles 20 that communicate with each other are provided. At least the tip of the nozzle 20 is between the direction Y perpendicular to the surface of the substrate 5 conveyed by the conveyor 4 in a state where the mounting components 6A and 6B are mounted on the cream solder 7 and the conveyance direction X, preferably the substrate 5 Inclined so that the hot air H2 can be blown out in a direction inclined within a range of about 5 to 30 degrees (about 10 degrees in the embodiment shown in the figure) with respect to the surface Y or the direction Y orthogonal to the conveying direction X Has been. In addition, the direction inclined toward the transport direction X of the substrate 5 in the present invention is not limited to the front of the transport direction X of the substrate 5 (see the arrow on the right in FIG. 2), and the transport of the substrate. Also included is the rear of direction X (see left arrow in FIG. 2). Whether the nozzle 20 is configured to blow the hot air H2 forward in the conveyance direction X of the substrate 5 or whether the nozzle 20 is configured to blow the hot air H2 toward the rear in the conveyance direction X is a mounting component mounted on the substrate 5 It can be determined by the arrangement of 6A and 6B, the direction in which the substrate 5 is placed on the conveyor 4, and the like.

  In the temperature raising units 2A and 2B configured as described above, as shown in FIG. 2, the substrate 5 on which the large and small mounting components 6A and 6B are mounted on the cream solder 7 is transferred by the conveyor 4 to the temperature raising units 2A and 2B. Then, the substrate 5 and the mounting components 6A and 6B are blown with hot air H2 from a nozzle 20 provided in a direction inclined in the transport direction X. At this time, since the nozzle 20 is inclined with respect to the direction Y perpendicular to the surface of the substrate 5, the mounting component 6A having a high (large) height is blown out of the nozzle 20 not only on the top surface but also on the side surface. Since the hot air H2 is received, the area to which the hot air H2 is blown increases. On the other hand, the mounting component 6B having a low height (large) receives the hot air H2 blown out from the nozzle 20 almost only on the upper surface thereof, so that the area to which the hot air H2 is blown becomes small. The hot air H2 received by the mounting component 6B having a low height is reflected by the low mounting component 6B so as to flow to the side surface of the adjacent mounting component 6A having a high height. Therefore, the mounting component 6A having a high height and a large heat capacity receives more hot air H2 than the mounting component 6B having a low height, and as shown by a two-dot chain line in FIG. Compared to the conventional case where hot air H is blown onto Y (see FIG. 6 or 7), the temperature rise is promoted. Further, the mounting component 6B having a low height and a small heat capacity receives less hot air H2 than the mounting component 6A having a high height, and the direction orthogonal to the substrate 5 is indicated by a dashed line in FIG. Compared with the conventional case where hot air H is blown onto Y (see FIG. 6 or FIG. 7), the temperature rise is suppressed. Therefore, the temperature difference T between the large mounting component 6A and the small mounting component 6B becomes small. Therefore, according to the present invention, the mounting components 6A and 6B mounted on the cream solder 7 of the substrate 5 are uniformly applied at a predetermined temperature without being affected by the size of the mounting components 6A and 6B, that is, the difference in heat capacity. It can be heated to raise the temperature.

  Means 3A, 3B, 3C, 3D are respectively connected above and below with means for supplying air or inert gas heated to a predetermined temperature as hot air H3 to supply the hot air H3. Openings 32 and 32 are formed. A partition wall 33 for forming a space communicating with the openings 32 and 32 is provided above and below the temperature equalizing portions 3A, 3B, 3C, and 3D. The space 33 and the temperature equalizing portion 3A are provided in the partition wall 33. A plurality of nozzles 30 communicating with the heating chambers in 3B, 3C, and 3D are provided. As shown in FIGS. 4 and 5, the nozzles 30 of the temperature equalizing units 3 </ b> A, 3 </ b> B, 3 </ b> C, and 3 </ b> D are disposed above the substrate 5 in the direction Y orthogonal to the surface of the substrate 5. The nozzles 30 are arranged at predetermined intervals so as to be staggered below. And between the nozzles 30 and 30 adjacent to each other (that is, a position facing the upper or lower nozzle 30 across the transport path of the substrate 5), an infrared radiator that emits infrared H4 by being heated. As 31, ceramic is disposed.

  In the soaking parts 3A, 3B, 3C, and 3D configured in this way, as shown in FIG. 5, the substrates 5 in a state where the mounting components 6A and 6B are mounted on the cream solder 7 are provided up and down. When not located between the nozzles 30, 30, the infrared radiator 31 stores heat by receiving and heating hot air H <b> 3 blown from the nozzle 30 provided so as to face the infrared radiator 31. Then, as shown in FIG. 4, when the substrate 5 on which the mounting components 6 </ b> A and 6 </ b> B are mounted on the cream solder 7 is conveyed by the conveyor 4 and positioned between the nozzle 30 and the infrared radiator 31, it is sprayed from the nozzle 30. The heated state is maintained not only by the hot air H3 but also by the infrared rays H4 emitted from the infrared radiator 31 by being heated. Therefore, the entire substrate 5 on which the mounting components 6A and 6B are mounted on the cream solder 7 is uniformly heated and held, and the cream solder 7 is surely melted uniformly to solder the mounting components 6A and 6B to the substrate 5. Can do. In addition, the infrared radiator 31 of the present invention does not need to supply power by connecting a wiring to an electric heater as in the prior art described above, and blows out from the nozzle 30 in a state where the substrate 5 is not positioned therebetween. Since the heated air H3 is used for heating, the production cost including the cost of equipment and energy is low, and there is no waste.

The present invention is not limited to the above-described embodiment. For example, the arrangement and the number of the temperature raising units 2A and 2B and the temperature equalizing units 3A, 3B, 3C, and 3D can be set as appropriate. Further, the reflow furnace 1 is not constituted by individual chambers constituting the temperature raising part and the temperature equalizing part, but is constituted by a single chamber, and the mounting components 6A and 6B are mounted on the cream solder 7 inside thereof. The nozzle 20 that blows the hot air H2 in a direction inclined toward the transport direction X of the substrate 5 in the state of being provided is provided, and / or the nozzle 30 that blows the hot air and the mounting components 6A and 6B are cream solder in the reflow furnace 1. And an infrared radiator 31 that is arranged to face the nozzle 30 across the conveyance path of the substrate 5 mounted on the substrate 7 and emits infrared rays H4 by receiving hot air H3 blown from the nozzles 30. Also good. Further, in the present invention, the nozzle 30 that blows hot air and the conveyance path of the substrate 5 in which the mounting components 6A and 6B are mounted on the cream solder 7 are sandwiched between one or all of the temperature raising units 2A and 2B. An infrared radiator 31 that is arranged opposite to the nozzle 30 and emits infrared rays H4 by receiving hot air H3 blown from the nozzle 30 may be provided, and mounted on the temperature equalizing units 3A, 3B, 3C, and 3D. You may provide the nozzle 20 which blows off the hot air H2 in the direction which inclines toward the conveyance direction X of the board | substrate 5 in the state in which components 6A and 6B were mounted on the cream solder 7. FIG. Furthermore, the present invention is not limited to reflow soldering of mounting parts having different heat capacities, and may be applied to reflow soldering of a plurality of mounting parts having a single or the same heat capacity to a substrate. Can do.

It is a conceptual diagram which shows the whole reflow soldering apparatus of this invention. The conceptual diagram shown in order to explain the state in which the mounting component heats the board mounted on the cream solder by the nozzle provided to blow the hot air in the direction inclined toward the conveying direction in the temperature raising part of the reflow furnace It is. It is the graph which showed the temperature change with time of the small and large mounting components heated by the nozzle shown in FIG. The mounting component transports the substrate mounted on the cream solder between the nozzle and the infrared radiator provided to face the temperature equalizing part of the reflow furnace, and is radiated from the hot air blown from the nozzle and the infrared radiator. It is the conceptual diagram shown in order to demonstrate the state heated with infrared rays. Infrared radiation is arranged so that the mounting component is unloaded from the solder paste between the nozzle and infrared radiator, which is provided to face the temperature equalizing section of the reflow furnace, and is opposed to the nozzle. It is the conceptual diagram shown in order to demonstrate the state heated by blowing a hot air on a body. It is the conceptual diagram shown in order to demonstrate the prior art which blows and heats hot air from both the up-and-down direction in the direction substantially orthogonal to the conveyance direction of the board | substrate with which small and large mounting components were mounted on the cream solder. It is the conceptual diagram shown in order to demonstrate the prior art which blows and heats hot air from an upper direction one side in the direction substantially orthogonal to the conveyance direction of the board | substrate with which the small and large mounting components were mounted on the cream solder. It is the graph which showed the temperature profile for demonstrating that the temperature difference in a board | substrate produced when it heated by the prior art shown in FIG. 6 or FIG.

Explanation of symbols

1: Reflow furnace, 2A, 2B: Temperature raising part, 3A, 3B, 3C, 3D: Temperature equalizing part, 5: Substrate, 6A, 6B: Mounted part, 7: Cream solder, 20: Nozzle, 30: Nozzle, 31 : Infrared radiator, H2, H3: Hot air, H4: Infrared

Claims (4)

A reflow soldering apparatus for soldering a mounting component to a substrate by heating the substrate to which the mounting component is mounted on the cream solder while heating the substrate to a predetermined temperature,
A reflow soldering apparatus comprising a nozzle that blows hot air in a direction inclined toward a conveying direction of a substrate on which the mounting component is mounted on the cream solder. A reflow soldering apparatus for soldering a mounting component to a substrate by heating the substrate to which the mounting component is mounted on the cream solder while heating the substrate to a predetermined temperature,
A nozzle that blows hot air at a predetermined temperature, and an infrared ray that radiates infrared rays by receiving hot air blown from the nozzle that is disposed facing the nozzle across the conveyance path of the substrate on which the mounting component is mounted on the cream solder A reflow soldering apparatus comprising: a radiator; A reflow soldering method of mounting a mounting component on a cream solder applied to a substrate, transporting the inside of the reflow furnace, and soldering the mounting component to the substrate,
A reflow soldering method, wherein hot air of a predetermined temperature is blown in a direction in which the mounting component inclines toward a conveying direction of a substrate mounted on cream solder. A reflow soldering method of mounting a mounting component on a cream solder applied to a substrate, transporting the inside of the reflow furnace, and soldering the mounting component to the substrate,
A nozzle that blows hot air at a predetermined temperature and an infrared radiator that emits infrared rays by receiving hot air blown from the nozzle are opposed to each other across the transport path of the substrate on which the mounting component is mounted on the cream solder. Arranged so that
When the substrate on which the mounting component is mounted on the cream solder is not positioned between the nozzle and the infrared radiator, the infrared radiator receives the hot air blown from the nozzle, and the mounting component is placed on the cream solder. Reflow solder characterized by heating and holding at a predetermined temperature by hot air blown from the nozzle and infrared rays emitted from the infrared radiator when the mounted substrate is conveyed between the nozzle and the infrared radiator. Attaching method.

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