JPS6427794A - Heating equipment - Google Patents

Heating equipment

Info

Publication number
JPS6427794A
JPS6427794A JP18400087A JP18400087A JPS6427794A JP S6427794 A JPS6427794 A JP S6427794A JP 18400087 A JP18400087 A JP 18400087A JP 18400087 A JP18400087 A JP 18400087A JP S6427794 A JPS6427794 A JP S6427794A
Authority
JP
Japan
Prior art keywords
mask
temperature regulation
printed wiring
heating equipment
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18400087A
Other languages
Japanese (ja)
Inventor
Osamu Noguchi
Atsunobu Iwamoto
Nobuo Kimura
Yoshifumi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18400087A priority Critical patent/JPS6427794A/en
Publication of JPS6427794A publication Critical patent/JPS6427794A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Abstract

PURPOSE:To uniformize a temperature distribution on printed wiring by mounting electronic circuit parts on a printed wiring board on which paste is applied and arranging a temperature regulation mask to regulate the quantity of radiation with the size of small holes between said wiring board and heating equipment such as infrared rays. CONSTITUTION:The printed wiring board 8 is fixed by a mask holder 13 and mounted on the temperature regulation mask 11 on which a gap is provided by a spacer 12. The mask holder 13 is transferred in the heating equipment by a belt conveyer 6 and during this time, the printed wiring plate 8 is heated by an infrared heater 5 via the temperature regulation mask 11. The quantity of radiation of the infrared rays is regulated according to the thermal capacity, etc., of the electronic circuit parts by the size of the small holes of the temperature regulation mask 11 and the variation of the distance of the spacer 12 and the presence or absence of a projecting part 15. Even if the mounting parts, a mounting pattern, etc., are changed by the change of kinds of machines, it can be dealt with the changed only by changing a constituent pattern of the temperature regulation mask without changing the temperature setting of the heating equipment and the mixed production can be carried out.
JP18400087A 1987-07-23 1987-07-23 Heating equipment Pending JPS6427794A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18400087A JPS6427794A (en) 1987-07-23 1987-07-23 Heating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18400087A JPS6427794A (en) 1987-07-23 1987-07-23 Heating equipment

Publications (1)

Publication Number Publication Date
JPS6427794A true JPS6427794A (en) 1989-01-30

Family

ID=16145567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18400087A Pending JPS6427794A (en) 1987-07-23 1987-07-23 Heating equipment

Country Status (1)

Country Link
JP (1) JPS6427794A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04109695A (en) * 1990-07-25 1992-04-10 Kenji Kondo Reflow soldering method of printed board and device thereof
JP2002346736A (en) * 2001-05-30 2002-12-04 Toyota Motor Corp Solder reflow device and assembling equipment using the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010208A (en) * 1973-06-04 1975-02-01
JPS6181697A (en) * 1984-09-28 1986-04-25 石井　銀弥 Soldering of printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010208A (en) * 1973-06-04 1975-02-01
JPS6181697A (en) * 1984-09-28 1986-04-25 石井　銀弥 Soldering of printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04109695A (en) * 1990-07-25 1992-04-10 Kenji Kondo Reflow soldering method of printed board and device thereof
JP2002346736A (en) * 2001-05-30 2002-12-04 Toyota Motor Corp Solder reflow device and assembling equipment using the same

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