JPS63177960A - Reflow soldering device - Google Patents
Reflow soldering deviceInfo
- Publication number
- JPS63177960A JPS63177960A JP62008965A JP896587A JPS63177960A JP S63177960 A JPS63177960 A JP S63177960A JP 62008965 A JP62008965 A JP 62008965A JP 896587 A JP896587 A JP 896587A JP S63177960 A JPS63177960 A JP S63177960A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- printed circuit
- circuit board
- reflow
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 238000005422 blasting Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、プリント基板の全体を均等に加熱してはん
だ付けできるようにしたリフローはんだ付け装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a reflow soldering apparatus that can evenly heat and solder the entire printed circuit board.
第３図は従来のリフローはんだ付け装置の一例を示す側
断面図である。この図において、１はプリント基板、２
はチップ部品、３ははんだペースト、４はリフローはん
だ付け装置の全体を示す。FIG. 3 is a side sectional view showing an example of a conventional reflow soldering apparatus. In this figure, 1 is a printed circuit board, 2
3 shows a chip component, 3 shows a solder paste, and 4 shows an entire reflow soldering device.
５は前記プリント基板１を搬送する手段としてのベルト
コンベアで、金属製の網目状のものが使用されている。Reference numeral 5 denotes a belt conveyor as a means for conveying the printed circuit board 1, and a mesh-like belt conveyor made of metal is used.
６は前記はんだペースト３の融解点未満の温度に加熱さ
れた空気によりプリント基板１を加熱する予備加熱室で
、プリント基板１の走行方向（矢印Ａ方向）の後方に設
けられている。Reference numeral 6 denotes a preheating chamber for heating the printed circuit board 1 with air heated to a temperature lower than the melting point of the solder paste 3, and is provided at the rear of the printed circuit board 1 in the running direction (arrow A direction).
７は前記はんだペースト３の融解点以上の温度に加熱さ
れた空気によりはんだペースト３を融解してプリント基
板１のはんだ付けを行うリフロ−室、８は冷却室、９は
前記予備加熱室６においてプリント基板１の搬入口６ａ
側に設けられた遠赤外線ヒータ、１０は前記リフロー室
７の内部に設けられはんだペースト３を融解する遠赤外
線ヒータ、９ａ、１０ａは前記遠赤外線ヒータ９，１゜
の反射板、１１．１２は前記予備加熱室６内の空気を加
熱するためのシーズヒータ、１３．１４は前記予備加熱
室６内の空気を下方に向けて送風するファン、１５は前
記リフロー室７内の空気を下方に向けて送風するファン
、１６は前記プリント基板１を冷却するためのファンで
ある。7 is a reflow chamber in which the printed circuit board 1 is soldered by melting the solder paste 3 with air heated to a temperature higher than the melting point of the solder paste 3; 8 is a cooling chamber; 9 is the preheating chamber 6; Loading port 6a for printed circuit board 1
10 is a far infrared heater provided inside the reflow chamber 7 for melting the solder paste 3; 9a and 10a are reflectors at 1° of the far infrared heater 9; 11.12 is a far infrared heater provided on the side; A sheathed heater for heating the air in the preheating chamber 6; 13 and 14 a fan for blowing the air in the preheating chamber 6 downward; and 15, a fan for blowing the air in the reflow chamber 7 downward. A fan 16 is a fan for cooling the printed circuit board 1.
従来のリフローはんだ付け装置は上記のように構成され
ており、ベルトコンベア５に載置されたプリント基板１
は矢印Ａ方向に搬送される。そして、プリント基板１は
、予備加熱室６内でシーズヒータ１１．１２により加熱
された空気により約１４０℃に加熱され、次いで、リフ
ロー室７に入り、遠赤外線ヒータ１０によりはんだペー
スト３が融解する温度２１５℃に加熱されはんだ付けさ
れる。次いで、冷却室８でファン１６により冷却されは
んだ付けを終了する。A conventional reflow soldering device is configured as described above, and has a printed circuit board 1 placed on a belt conveyor 5.
is transported in the direction of arrow A. Then, the printed circuit board 1 is heated to about 140° C. by the air heated by the sheathed heaters 11 and 12 in the preheating chamber 6, and then enters the reflow chamber 7, where the solder paste 3 is melted by the far infrared heater 10. It is heated to a temperature of 215°C and soldered. Next, the soldering is completed by cooling in the cooling chamber 8 by the fan 16.
ところで、上記のような従来のリフローはんだ付け装置
４では、予備加熱室６内の空気はシーズヒータ１１．１
２により加熱されファン１３゜１４の回転により下方に
向けて送風されるが乱流状態になる。このため、プリン
ト基板１に対しては均等に加熱しない０で加熱むらが生
じ、特に、プリント基板１の搬送方向（矢印Ａ方向）と
直角方向、すなわちプリント基板１の幅方向に対して加
熱むらが発生しやすく、ことに、プリント基板１の中央
部と、幅方向における両端部では加熱温度の差が生ずる
という問題点があった。したがって、このようなプリン
ト基板１をリフロー室７へ搬送してはんだ付けを行うと
、はんだペースト３の融解が不揃いになるため、均等な
はんだ付けができないという問題点があった。By the way, in the conventional reflow soldering apparatus 4 as described above, the air in the preheating chamber 6 is supplied to the sheathed heater 11.1.
The air is heated by the fan 2 and blown downward by the rotation of the fans 13 and 14, creating a turbulent flow. For this reason, the printed circuit board 1 is not heated evenly and uneven heating occurs, especially in the direction perpendicular to the conveyance direction (direction of arrow A) of the printed circuit board 1, that is, in the width direction of the printed circuit board 1. In particular, there is a problem in that there is a difference in heating temperature between the central portion of the printed circuit board 1 and both ends in the width direction. Therefore, when such a printed circuit board 1 is transported to the reflow chamber 7 and soldered, there is a problem in that uniform soldering cannot be performed because the solder paste 3 melts unevenly.
この発明は、上記の問題点を解決するためになされたも
ので、プリント基板を予備加熱する時点において、プリ
ント基板全体を均等に予備加熱を行うことによりリフロ
ー室ではんだペーストの融解を均等に行うことができる
リフローはんだ付け装置を得ることを目的とする。This invention was made to solve the above problem, and when preheating the printed circuit board, the entire printed circuit board is preheated evenly, so that the solder paste is evenly melted in the reflow chamber. The purpose of the present invention is to obtain a reflow soldering device that is capable of reflow soldering.
〔問題点を解決するための手段）
この発明にかかるリフローはんだ付け装置は、予備加熱
室とリフロー室内の加熱された空気の流れを整流してプ
リント基板を均等に加熱するための整流板を予備加熱室
とリフロー室の内部にそれぞれ設け、さらに加熱された
空気をファンにより予備加熱室とリフロー室の内部でそ
れぞれ循環させるための吸入口と排出口とを形成した側
板を設けたものである。[Means for Solving the Problems] The reflow soldering apparatus according to the present invention is equipped with a rectifying plate for uniformly heating the printed circuit board by rectifying the flow of heated air in the preheating chamber and the reflow chamber. A side plate is provided inside the heating chamber and the reflow chamber, and has an inlet and an outlet for circulating heated air inside the preheating chamber and the reflow chamber, respectively, using a fan.
この発明においては、ファンが回転して加熱された空気
の流れが整流板を通過することにより層流となってプリ
ント基板の全体に均等に吹き付けるので、プリント基板
全体が均等に加熱され、かつはんだペーストもプリント
基板全体で均等に融解されるとともに、予備加熱室およ
びリフロー室の内部で加熱された空気が強制的に循環さ
れる。In this invention, the fan rotates and the heated air flows through the rectifying plate, forming a laminar flow and spraying it evenly over the entire printed circuit board, so that the entire printed circuit board is heated evenly and soldered. The paste is also melted evenly over the entire printed circuit board, and heated air is forced to circulate inside the preheating chamber and reflow chamber.
第１図はこの発明の一実施例を示す側断面図、第２図は
、第１図のＩ−Ｉ線による断面図である。これらの図に
おいて、第３図と同一符号は同一部分を示し、２１はこ
の発明のリフローはんだ付け装置の全体を示す。２２．
２３は前記リフローはんだ付け装置２１の１次子備加熱
室と２次子備加熱室で、プリント基板１の走行方向（矢
印Ａ方向）の後方と前方に設けられ、第３図に示す従来
の予備加熱室６を仕切板２４により２室に形成したもの
である。２５は前記予備加熱室２２゜２３およびリフロ
ー室７に設けられた整一゛流板で、その長手方向がプリ
ント基板１の搬送方向（矢印Ａ方向）に対して直角方向
になるように配列したものである。２６は前記整流板２
５を支承する側板で、各予備加熱室２２．２３．リフロ
ー室７の内部に設けられ、各ファン１３．１４．１５に
より加熱された空気を強制的に循環作用を生ぜしめるた
めのものである。２７は前記側板２６の上部に形成され
、加熱された空気を各側板２６間内に吸入する吸入口、
２８は前記側板２６の下部に形成され、加熱された空気
を各側板２６の間から外側へ排出する排出口である。こ
のため、側板２６に形成した吸入口２７．排出口２８に
より各側板２６内の空気が各側板２６間の内側から外側
に向けて循環作用が行われる。FIG. 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along line I--I in FIG. 1. In these figures, the same reference numerals as in FIG. 3 indicate the same parts, and 21 indicates the entire reflow soldering apparatus of the present invention. 22.
Reference numerals 23 denote a primary heating chamber and a secondary heating chamber of the reflow soldering apparatus 21, which are provided at the rear and front of the printed circuit board 1 in the running direction (direction of arrow A), and are similar to those shown in FIG. The preheating chamber 6 is formed into two chambers by a partition plate 24. Reference numeral 25 denotes alignment flow plates provided in the preheating chambers 22 and 23 and the reflow chamber 7, which are arranged so that their longitudinal direction is perpendicular to the direction of conveyance of the printed circuit board 1 (direction of arrow A). It is something. 26 is the rectifying plate 2
5, each preheating chamber 22.23. It is provided inside the reflow chamber 7 to forcefully circulate the air heated by the respective fans 13, 14, and 15. 27 is an inlet formed at the upper part of the side plate 26 for sucking heated air into between each side plate 26;
Reference numeral 28 denotes an exhaust port formed at the lower part of the side plates 26 for discharging heated air from between the side plates 26 to the outside. For this reason, the suction port 27 formed in the side plate 26. The air in each side plate 26 is circulated from the inside to the outside between each side plate 26 by the exhaust port 28 .
上記のように形成されたリフローはんだ付け装置２１に
おいて、各予備加熱室２２．２３の空気は各シーズヒー
タ１１．１２によりそれぞれ別個に加熱される。すなわ
ち、１次子偏加熱室２２においては空気の温度を約１６
０℃に加熱して、プリント基板１の温度上昇率を大きく
してプリント基板１の温度を急速に１４０℃に近づくよ
うに上昇させる。次いで、２次子備加熱室２３では空気
の温度を１次子偏加熱室２２よりも低くして１４０℃に
加熱し、プリント基板１の温度上昇率を小さくしてプリ
ント基板１が１４０℃で安定するようにする。次いで、
プリント基板１はさらに搬送され、リフロー室７に入り
、従来と同様にはんだ付けが行われる。In the reflow soldering apparatus 21 formed as described above, the air in each preheating chamber 22.23 is heated separately by each sheathed heater 11.12. That is, in the primary heating chamber 22, the temperature of the air is approximately 16
The printed circuit board 1 is heated to 0° C., and the temperature increase rate of the printed circuit board 1 is increased to rapidly raise the temperature of the printed circuit board 1 to approach 140° C. Next, in the secondary heating chamber 23, the temperature of the air is lowered than that in the primary uneven heating chamber 22 and heated to 140°C, and the rate of temperature rise of the printed circuit board 1 is reduced so that the printed circuit board 1 reaches 140°C. Make it stable. Then,
The printed circuit board 1 is further transported and enters the reflow chamber 7, where soldering is performed in the same manner as in the past.
また、各予備加熱室２２．２３およびリフロー室７にお
いて側板２６間内の加熱された空気はファン１３．１４
および１５の駆動により第２図の矢印Ｂ方向に流れる。In addition, the heated air between the side plates 26 in each preheating chamber 22, 23 and reflow chamber 7 is supplied to the fan 13, 13.
and 15, the current flows in the direction of arrow B in FIG.
すなわち、シーズヒータ１１．１２または遠赤外線ヒー
タ１０により加熱された空気は排出口２８から側板２６
間から外側に出て上昇し、側板２６の上部の吸入口２７
から吸入することにより循環作用が生ずる。ところで、
加熱された空気はファン１３．１４．１５の回転により
送風されるが、整流板２５を通過することにより整流さ
れ層流となってプリント基板１に均等に吹き付けられる
ので、プリント基板１の幅方向に対して均等に加熱され
る。That is, the air heated by the sheathed heaters 11 and 12 or the far infrared heater 10 flows from the outlet 28 to the side plate 26.
The suction port 27 at the top of the side plate 26 rises outward from the gap.
Circulatory effects occur when inhaled from the body. by the way,
The heated air is blown by the rotation of the fans 13, 14, and 15, but when it passes through the rectifying plate 25, it is rectified and becomes a laminar flow, which is evenly blown onto the printed circuit board 1. is heated evenly.
このため、プリント基板１は各予備加熱室２２．２３に
おいては幅方向に対して均等に加熱され、かつリフロー
室７においても均等に加熱されるので、はんだペースト
３の融解が均等に行われ、はんだ付けにむらのない良質
のプリント基板１が得られる。Therefore, the printed circuit board 1 is heated evenly in the width direction in each of the preheating chambers 22 and 23, and is also heated evenly in the reflow chamber 7, so that the solder paste 3 is evenly melted. A high-quality printed circuit board 1 with even soldering can be obtained.
なお、実施例において、プリント基板１を搬送する手段
としてはベルトコンベア５の代わりに、プリント基板１
を保持する保持爪を備えた搬送チェーンであってもよい
。In the embodiment, the printed circuit board 1 is used instead of the belt conveyor 5 as a means for conveying the printed circuit board 1.
It may also be a conveyor chain equipped with holding claws that hold the.
（発明の効果）
以上説明したように、この発明は、予備加熱室とリフロ
ー室内の加熱された空気の流れを整流してプリント基板
を均等に加熱するための整流板を予備加熱室とリフロー
室の内部にそれぞれ設け、さらに加熱された空気をファ
ンにより予備加熱室とリフロー室の内部でそれぞれ循環
させるための吸入口と排出口とを形成した側板を設けた
ので、予備加熱室でプリント基板全体が均等に加熱され
ることによりリフロー室でのはんだペーストが均等に融
解するためはんだ付けのむらがなくなり、品質の良いプ
リント基板が得られる利点を有する。(Effects of the Invention) As described above, the present invention provides a rectifier plate for uniformly heating printed circuit boards by rectifying the flow of heated air in the preheating chamber and reflow chamber. In addition, a side plate was provided with an inlet and an outlet for circulating heated air inside the preheating chamber and the reflow chamber, respectively, so that the entire printed circuit board could be heated in the preheating chamber. Since the solder paste is evenly heated in the reflow chamber and melted uniformly, uneven soldering is eliminated and a high-quality printed circuit board can be obtained.
第１図はこの発明の一実施例を示す側断面図、第２図は
、第１図のＩ−Ｉ線による断面図、第３図は従来のリフ
ローはんだ付け装置の一例を示す側断面図である。
図中、１はプリント基板、２はチップ部品、３ははんだ
ペースト、５はベルトコンベア、７はリフロー室、９，
１ｏは遠赤外線ヒータ、１３゜１４．１５はファン、２
１はリフローはんだ付け装置、２２は１次子備加熱室、
２３は２次子備加熱室、２４は仕切板、２５は整流板、
２６は側板、２７は吸入口、２８は排出口である。FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view taken along line I-I in FIG. 1, and FIG. 3 is a side sectional view showing an example of a conventional reflow soldering device. It is. In the figure, 1 is a printed circuit board, 2 is a chip component, 3 is a solder paste, 5 is a belt conveyor, 7 is a reflow chamber, 9,
1o is far infrared heater, 13゜14.15 is fan, 2
1 is a reflow soldering device, 22 is a primary heating chamber,
23 is a secondary heating chamber, 24 is a partition plate, 25 is a rectifier plate,
26 is a side plate, 27 is an inlet, and 28 is an outlet.
Claims (1)
配設したプリント基板を搬送する搬送手段を設け、加熱
された空気により前記プリント基板を加熱する予備加熱
室を設け、加熱された空気により前記はんだペーストを
融解してはんだ付けを行うリフロー室を設け、前記加熱
された空気を下方に向けて送風するため前記予備加熱室
と前記リフロー室の上部にそれぞれファンを設けたリフ
ローはんだ付け装置において、前記予備加熱室と前記リ
フロー室内の前記加熱された空気の流れを整流して前記
プリント基板を均等に加熱するための整流板を前記予備
加熱室と前記リフロー室の内部にそれぞれ設け、さらに
前記加熱された空気を前記ファンにより前記予備加熱室
と前記リフロー室の内部でそれぞれ循環させるための吸
入口と排出口とを形成した側板を設けたことを特徴とす
るリフローはんだ付け装置。A conveyance means is provided for conveying a printed circuit board on which chip components are arranged on solder paste applied in advance, a preheating chamber is provided for heating the printed circuit board with heated air, and the solder paste is melted by the heated air. In the reflow soldering apparatus, the reflow soldering apparatus is provided with a reflow chamber in which soldering is performed, and a fan is provided in the upper part of the preheating chamber and the reflow chamber to blow the heated air downward, respectively. and rectifying plates for rectifying the flow of the heated air in the reflow chamber to uniformly heat the printed circuit board are provided inside the preheating chamber and the reflow chamber, respectively, and further, the heated air is A reflow soldering apparatus, characterized in that a side plate is provided with an inlet and an outlet for circulation by the fan inside the preheating chamber and the reflow chamber, respectively.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62008965A JPS63177960A (en) | 1987-01-20 | 1987-01-20 | Reflow soldering device |
| KR1019880008802A KR900002671A (en) | 1987-01-20 | 1988-07-15 | Reflow Soldering Equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62008965A JPS63177960A (en) | 1987-01-20 | 1987-01-20 | Reflow soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63177960A true JPS63177960A (en) | 1988-07-22 |
| JPH055581B2 JPH055581B2 (en) | 1993-01-22 |
Family
ID=11707388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62008965A Granted JPS63177960A (en) | 1987-01-20 | 1987-01-20 | Reflow soldering device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS63177960A (en) |
| KR (1) | KR900002671A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02284764A (en) * | 1989-04-25 | 1990-11-22 | Osaka Asahi Kagaku Kk | Soldering device for packaging both faces of printed circuit board |
| JPH03106260U (en) * | 1990-02-20 | 1991-11-01 | ||
| US5154338A (en) * | 1990-06-06 | 1992-10-13 | Senju Metal Industry Co., Ltd. | Solder reflow furnace |
| JPH04300066A (en) * | 1991-03-26 | 1992-10-23 | Hitachi Techno Eng Co Ltd | Method and device for reflow soldering |
| EP0598367A1 (en) * | 1992-11-17 | 1994-05-25 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
| JPH08250852A (en) * | 1995-03-10 | 1996-09-27 | Senju Metal Ind Co Ltd | Reflow method, reflow furnace and hot air heater for the furnace |
| CN109425107A (en) * | 2017-08-25 | 2019-03-05 | 张跃 | A kind of hot-blast stove of high-voltage operation |
-
1987
- 1987-01-20 JP JP62008965A patent/JPS63177960A/en active Granted
-
1988
- 1988-07-15 KR KR1019880008802A patent/KR900002671A/en not_active Application Discontinuation
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02284764A (en) * | 1989-04-25 | 1990-11-22 | Osaka Asahi Kagaku Kk | Soldering device for packaging both faces of printed circuit board |
| JPH03106260U (en) * | 1990-02-20 | 1991-11-01 | ||
| US5154338A (en) * | 1990-06-06 | 1992-10-13 | Senju Metal Industry Co., Ltd. | Solder reflow furnace |
| JPH04300066A (en) * | 1991-03-26 | 1992-10-23 | Hitachi Techno Eng Co Ltd | Method and device for reflow soldering |
| US5203487A (en) * | 1991-03-26 | 1993-04-20 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering method and system therefor |
| EP0598367A1 (en) * | 1992-11-17 | 1994-05-25 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
| US5524812A (en) * | 1992-11-17 | 1996-06-11 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
| US5715990A (en) * | 1992-11-17 | 1998-02-10 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
| JPH08250852A (en) * | 1995-03-10 | 1996-09-27 | Senju Metal Ind Co Ltd | Reflow method, reflow furnace and hot air heater for the furnace |
| CN109425107A (en) * | 2017-08-25 | 2019-03-05 | 张跃 | A kind of hot-blast stove of high-voltage operation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH055581B2 (en) | 1993-01-22 |
| KR900002671A (en) | 1990-02-28 |
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