JPH03106260U - - Google Patents
Info
- Publication number
- JPH03106260U JPH03106260U JP1604990U JP1604990U JPH03106260U JP H03106260 U JPH03106260 U JP H03106260U JP 1604990 U JP1604990 U JP 1604990U JP 1604990 U JP1604990 U JP 1604990U JP H03106260 U JPH03106260 U JP H03106260U
- Authority
- JP
- Japan
- Prior art keywords
- preheating zone
- heating chamber
- reflow soldering
- soldering apparatus
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 239000006071 cream Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、リフローはんだ付け装置における本
考案に係る一実施例としての予備加熱ゾーンの概
略構成を示す側断面図、第２図は、第１図におけ
るＡ−Ａ線断面図である。
１……装置本体、２……予備加熱ゾーン、３…
…隔壁、４……隔室、５……仕切板、６……通気
口、７……加熱室、８……ヒータ部、９……電熱
ヒータ、１０……放熱プレート、１１……送風機
、１２……開口部、１３……増圧分岐路、１４…
…筒体、１５……循環用送気路、１６……天井部
、２１……本加熱ゾーン、２２……搬送手段、２
３……搬送基盤。
FIG. 1 is a side sectional view showing a schematic configuration of a preheating zone as an embodiment of the present invention in a reflow soldering apparatus, and FIG. 2 is a sectional view taken along the line A--A in FIG. 1. 1... Apparatus main body, 2... Preheating zone, 3...
... Partition wall, 4 ... Compartment, 5 ... Partition plate, 6 ... Vent, 7 ... Heating chamber, 8 ... Heater part, 9 ... Electric heater, 10 ... Heat radiation plate, 11 ... Air blower, 12...opening, 13...pressure boosting branch, 14...
... Cylindrical body, 15 ... Air supply path for circulation, 16 ... Ceiling part, 21 ... Main heating zone, 22 ... Conveying means, 2
3...Transportation base.
Claims (1)
基板の搬入側に配置される予備加熱ゾーンと、こ
の予備加熱ゾーンの後段に配置される本加熱ゾー
ンと、搬入側からこれらの加熱ゾーンを経て搬出
側へと搬送基板の送出を可能とした搬送手段とを
少なくとも備えてなるリフローはんだ付け装置に
おいて、 前記予備加熱ゾーンは、隔壁と仕切板とで区画
された加熱室と循環用送気路とを有する隔室から
なり、前記加熱室は、搬送基板の下方に配置され
るヒータ部と、搬送基板の上方にて下方への強制
送気を可能に配置される送風機と、この送風機と
前記搬送基板との間に介在され、かつ、垂直方向
に開口させた増圧分岐路とを有して形成され、前
記循環用送気路は、加熱室の下側に設けられた通
気口と、上側に設けられた開口部とを介して前記
加熱室と連通させたことを特徴とするリフローは
んだ付け装置における予備加熱ゾーン構造。[Claim for Utility Model Registration] A preheating zone located on the loading side of a board on which electronic components are mounted via cream solder, a main heating zone located after this preheating zone, and a main heating zone located from the loading side. In the reflow soldering apparatus, the preheating zone includes a heating chamber partitioned by a partition wall and a partition plate, and a reflow soldering apparatus that includes at least a transport means that allows the transport board to be delivered to the delivery side through these heating zones. The heating chamber includes a heater section disposed below the transfer substrate, and a blower disposed above the transfer substrate to be able to forcefully blow air downward. , the air circulation passage is interposed between the blower and the transfer board and has a pressure increasing branch passage opened in a vertical direction, and the circulation air supply passage is provided below the heating chamber. 1. A preheating zone structure in a reflow soldering apparatus, characterized in that the preheating zone is communicated with the heating chamber through a vent hole provided on the upper side and an opening provided on the upper side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1604990U JPH03106260U (en) | 1990-02-20 | 1990-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1604990U JPH03106260U (en) | 1990-02-20 | 1990-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106260U true JPH03106260U (en) | 1991-11-01 |
Family
ID=31519335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1604990U Pending JPH03106260U (en) | 1990-02-20 | 1990-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106260U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63177960A (en) * | 1987-01-20 | 1988-07-22 | Kenji Kondo | Reflow soldering device |
| JPS63180368A (en) * | 1987-01-21 | 1988-07-25 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
| JPS63278668A (en) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | Reflow soldering device |
| JPH01215462A (en) * | 1988-02-23 | 1989-08-29 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
-
1990
- 1990-02-20 JP JP1604990U patent/JPH03106260U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63177960A (en) * | 1987-01-20 | 1988-07-22 | Kenji Kondo | Reflow soldering device |
| JPS63180368A (en) * | 1987-01-21 | 1988-07-25 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
| JPS63278668A (en) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | Reflow soldering device |
| JPH01215462A (en) * | 1988-02-23 | 1989-08-29 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
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