JPS62101665U - - Google Patents
Info
- Publication number
- JPS62101665U JPS62101665U JP19060185U JP19060185U JPS62101665U JP S62101665 U JPS62101665 U JP S62101665U JP 19060185 U JP19060185 U JP 19060185U JP 19060185 U JP19060185 U JP 19060185U JP S62101665 U JPS62101665 U JP S62101665U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- parts
- inlet
- furnace
- partition wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Tunnel Furnaces (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例を示す一部切欠側面図
、第２図は同じく一部切欠正面図、第３図は第１
図のＡ―Ａ矢視図である。
１：炉体、２：搬送路、３：入口、４：出口、
５：加熱部、５ａ：側方加熱部、５ｂ：中間加熱
部、６：赤外線加熱面、６ａ：赤外線輻射ヒータ
、７：空気噴射口、８：空気供給装置、９：入口
側隔壁、１０：出口側隔壁、１１：入口側の予備
加熱ゾーン、１２：第２の予備加熱ゾーン、１３
：出口側の高温加熱ゾーン、１４：隔壁。
Fig. 1 is a partially cutaway side view showing an embodiment of the present invention, Fig. 2 is a partially cutaway front view, and Fig. 3 is a partially cutaway side view showing an embodiment of the present invention.
It is an AA arrow view of the figure. 1: furnace body, 2: conveyance path, 3: inlet, 4: outlet,
5: heating section, 5a: side heating section, 5b: intermediate heating section, 6: infrared heating surface, 6a: infrared radiation heater, 7: air injection port, 8: air supply device, 9: entrance side partition, 10: Outlet side bulkhead, 11: Inlet side preheating zone, 12: Second preheating zone, 13
: High temperature heating zone on the exit side, 14: Partition wall.
Claims (1)
した被加熱物を入口から出口に向け移送する搬送
路２を設けた炉体１内の上方部と下方部に、赤外
線輻射ヒータ６ａの多数個を縦横に配列した赤外
線加熱面６と空気噴射口７が多数個配設された加
熱助長用の空気供給装置８とよりなる加熱部５を
それぞれ設け、各加熱部５は炉側壁に沿つた両側
の側方加熱５ａ，５ａと該側方加熱部５ａ，５ａ
間にあつてこれらと等温に保持される中間加熱部
５ｂにより形成されるとともに炉側壁間に張設さ
れた入口側隔壁９と出口側隔壁１０とをもつて入
口側の予備加熱ゾーン１１の第２の予備加熱ゾー
ン１２と出口側の高温加熱ゾーン１３とに区画さ
れていることを特徴とする電子部品類製造用はん
だ付け炉。 A large number of infrared radiant heaters 6a are installed vertically and horizontally in the upper and lower parts of the furnace body 1, which is provided with a conveyance path 2 for transporting the heated object with parts mounted on the base via preliminary solder from the inlet to the outlet. A heating section 5 is provided, each consisting of an infrared heating surface 6 arranged in a row and an air supply device 8 for promoting heating in which a large number of air injection ports 7 are arranged. Side heating parts 5a, 5a and side heating parts 5a, 5a
The preheating zone 11 on the inlet side is formed by an intermediate heating section 5b located in between and held at the same temperature as these, and has an inlet side partition wall 9 and an outlet side partition wall 10 stretched between the furnace side walls. A soldering furnace for manufacturing electronic parts, characterized in that it is divided into two preheating zones 12 and a high temperature heating zone 13 on the exit side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985190601U JPH0230137Y2 (en) | 1985-12-11 | 1985-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985190601U JPH0230137Y2 (en) | 1985-12-11 | 1985-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62101665U true JPS62101665U (en) | 1987-06-29 |
| JPH0230137Y2 JPH0230137Y2 (en) | 1990-08-14 |
Family
ID=31143971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985190601U Expired JPH0230137Y2 (en) | 1985-12-11 | 1985-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230137Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50131330U (en) * | 1974-04-17 | 1975-10-28 | ||
| JPS6057637A (en) * | 1983-09-09 | 1985-04-03 | Hitachi Ltd | Soldering device for semiconductor element |
-
1985
- 1985-12-11 JP JP1985190601U patent/JPH0230137Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50131330U (en) * | 1974-04-17 | 1975-10-28 | ||
| JPS6057637A (en) * | 1983-09-09 | 1985-04-03 | Hitachi Ltd | Soldering device for semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230137Y2 (en) | 1990-08-14 |
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