JPH0739482Y2 - Reflow furnace - Google Patents
Reflow furnaceInfo
- Publication number
- JPH0739482Y2 JPH0739482Y2 JP1990022214U JP2221490U JPH0739482Y2 JP H0739482 Y2 JPH0739482 Y2 JP H0739482Y2 JP 1990022214 U JP1990022214 U JP 1990022214U JP 2221490 U JP2221490 U JP 2221490U JP H0739482 Y2 JPH0739482 Y2 JP H0739482Y2
- Authority
- JP
- Japan
- Prior art keywords
- hot air
- circuit board
- printed circuit
- air blowing
- reflow furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007664 blowing Methods 0.000 claims description 28
- 238000005476 soldering Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000742 single-metal deposition Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Tunnel Furnaces (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】 ［産業上の利用分野］ 本考案は、プリント基板を加熱してはんだ付けを行うリ
フロー炉、特にトンネル内の上下部に熱風吹き出し装置
を設置したリフロー炉に関する。[Detailed Description of the Invention] [Industrial application] The present invention relates to a reflow furnace for heating a printed circuit board for soldering, and more particularly to a reflow furnace in which hot air blowing devices are installed above and below a tunnel.
［従来の技術］ 近時の電子部品は、プリント基板に直接実装できる面実
装電子部品（Surface Mounting Device:以下SMDとい
う）となってきており、その実装は電子機器の小型化に
ともない高密度で、しかもプリント基板の表裏両面に行
われるようになってきた。[Prior Art] Recently, electronic components have become surface mounting devices (hereinafter referred to as SMDs) that can be directly mounted on a printed circuit board. Moreover, it has come to be performed on both front and back surfaces of a printed circuit board.
一般にSMDをプリント基板に実装するには、プリント基
板のはんだ付け部にクリームはんだを塗布し、その上に
SMDを載置してからリフロー炉ではんだ付けを行ってい
る。従来のリフロー炉は、トンネル内の上下部に赤外線
ヒータを設置したものであるが、このリフロー炉でSMD
を搭載したプリント基板を加熱すると、上方に突出した
SMDがプリント基板より高温となってしまい、SMDを熱損
傷させたり、SMDのリードだけにはんだが付着したりす
るという不都合を生じることがあった。Generally, to mount the SMD on the printed circuit board, apply cream solder to the soldering part of the printed circuit board and
After mounting the SMD, soldering is performed in the reflow furnace. The conventional reflow furnace has infrared heaters installed in the upper and lower parts of the tunnel.
When the printed circuit board equipped with is heated, it protrudes upward.
The SMD may become hotter than the printed circuit board, causing thermal damage to the SMD or causing inconvenience of solder sticking only to the SMD leads.
ところで、リフロー炉内でプリント基板に熱風を当てる
と、熱風が高密度に実装されたSMD間に侵入してSMDやプ
リント基板を均一に加熱できることが分かり、熱風を吹
き出す熱風式のリフロー炉が多数提案されている。この
熱風式リフロー炉には、熱風吹き出し装置がトンネルの
上部に設置されたもの（参照：特公昭61-38985号、特開
昭63-177960号、特開昭63-296295号、実公平1-23666
号）と、熱風吹き出し装置がトンネルの上下部に設置さ
れたもの（参照：特開昭63-180368号、特開昭63-278668
号、特開昭64-71571号、実開平1-177076号）がある。By the way, when hot air is blown to the printed circuit board in the reflow oven, it is found that the hot air enters between the SMDs mounted at high density and can uniformly heat the SMD and the printed circuit board. Proposed. In this hot air reflow furnace, a hot air blowing device is installed above the tunnel (see: Japanese Patent Publication No. 61-38985, Japanese Patent Publication No. 63-177960, Japanese Patent Publication No. 63-296295, Japanese Utility Model No. 1- 23666
No.) and hot air blowers installed at the top and bottom of the tunnel (see Japanese Patent Laid-Open Nos. 63-180368 and 63-278668.
No. 6,715,761 and JP-A No. 1-177076).
［考案が解決しようとする課題］ 熱風吹き出し装置がトンネルの上部に設置されたリフロ
ー炉は、プリント基板の表面は均一に加熱できるが、裏
面は熱風が当たらないため均一加熱とならず、表裏にSM
Dを搭載したプリント基板では裏面にはんだ付け不良を
起こすことがあった。[Problems to be solved by the invention] In a reflow oven in which a hot air blowing device is installed in the upper part of a tunnel, the front surface of the printed circuit board can be heated uniformly, but the back surface is not heated uniformly, so that the front and back surfaces are not heated uniformly. SM
In the printed circuit board with D, soldering failure could occur on the back side.
また熱風吹き出し装置がトンネル内の上下部に設置され
たリフロー炉は、プリント基板の両面に熱風が当たるた
め、両面実装基板に対しては両面とも同程度に加熱がで
きる。しかしながら、上下熱風吹き出し式のリフロー炉
でプリント基板の温度変化（温度プロファイル）を描い
てみると、走行するプリント基板がリフロー炉の或ると
ころにさしかかったときに温度が下がってしまい、不均
一加熱となってしまうことがあった。Further, in the reflow furnace in which the hot air blowing devices are installed in the upper and lower parts of the tunnel, both sides of the printed circuit board are exposed to the hot air. However, when drawing the temperature change (temperature profile) of the printed circuit board in the reflow furnace of the upper and lower hot air blowing type, the temperature drops when the traveling printed circuit board reaches a certain part of the reflow furnace, and the uneven heating occurs. There were times when it became.
［課題を解決するための手段］ 本考案者がトンネルの上下部に熱風吹き出し装置を設置
したリフロー炉における温度降下の原因を検討してみた
ところ第４、５図に示すように、熱風の流出口８が走行
するプリント基板Ｃの直下、または直上、即ちプリント
基板進行方向に対して直角方向に横切っているため、こ
こで熱風が吸い込まれてしまうからであることが分かっ
た。つまり、従来の上下熱風吹き出し式のリフロー炉で
は、熱風流出口のところで熱風が真っすぐに吹き出さな
い域（Ａ）ができるため、この域では熱風が被加熱物に
対して加熱ができず、プリント基板は温度が下がってし
まうものである。[Means for Solving the Problem] When the present inventor examined the cause of the temperature drop in a reflow furnace in which hot air blowing devices were installed above and below the tunnel, as shown in FIGS. It has been found that the hot air is sucked in here because the outlet 8 crosses directly below or directly above the printed circuit board C on which it travels, that is, in a direction perpendicular to the direction of travel of the printed circuit board. That is, in the conventional reflow furnace of the upper and lower hot air blowing type, there is an area (A) where the hot air does not blow out straight at the hot air outlet, so the hot air cannot heat the object to be heated in this area, The temperature of the substrate is lowered.
そこで本考案者は、熱風の流出口がプリント基板の走行
路を横切っていなければ、プリント基板は流出する熱風
に影響されないことに着目して本考案を完成させた。Therefore, the present inventor completed the present invention by paying attention to the fact that the printed circuit board is not affected by the hot air flowing out unless the hot air outlet crosses the traveling path of the printed circuit board.
本考案は、トンネルの上下部に熱風吹き出し装置を設置
したリフロー炉において、熱風吹き出し装置から吹き出
された熱風を熱風吹き出し装置に還流させる流出口がト
ンネルの下部または上下部にある熱風吹き出し装置の両
側に設けられているとともに、該流出口は熱風吹き出し
装置の熱風吹き出し口と同一面となっていることを特徴
とするリフロー炉である。The present invention is a reflow furnace in which hot air blowing devices are installed in the upper and lower parts of a tunnel, and the outlets for returning the hot air blown from the hot air blowing device to the hot air blowing device are located at the bottom or top and bottom of the tunnel on both sides of the hot air blowing device. And the outlet is flush with the hot air outlet of the hot air outlet.
［実施例］ 以下図面に基づいて本考案を説明する。第１図は本考案
のリフロー炉の側面断面図、第２図は他の実施例の側面
断面図、第３図は第１図のＸ−Ｘ線断面図である。[Embodiment] The present invention will be described below with reference to the drawings. 1 is a side sectional view of a reflow furnace of the present invention, FIG. 2 is a side sectional view of another embodiment, and FIG. 3 is a sectional view taken along line XX of FIG.
トンネル１内にはプリント基板Ｃを搬送するコンベア２
が走行しており、トンネルの上下部には複数の熱風吹き
出し装置３…がプリント基板の進行方向に配列されてい
る。熱風吹き出し装置３は気体流入口４を有する箱体５
である。箱体５には熱風吹き出し口である多孔板６と、
該多孔板を加熱する電熱ヒータ７が設置されている。多
孔板６は電熱ヒータ７で加熱されると遠赤外線を放射す
るようになっている。A conveyor 2 that conveys a printed circuit board C in the tunnel 1.
Are running, and a plurality of hot air blowing devices 3 ... Are arranged in the traveling direction of the printed circuit board at the upper and lower portions of the tunnel. The hot air blowing device 3 is a box body 5 having a gas inlet 4
Is. In the box body 5, a perforated plate 6 which is a hot air outlet,
An electric heater 7 for heating the perforated plate is installed. When the porous plate 6 is heated by the electric heater 7, it emits far infrared rays.
熱風吹き出し装置３の両側、即ちプリント基板進行方向
に平行した両側には熱風の流出口８、８が設けられてい
る。該流出口は第１、２図に示すように熱風吹き出し口
である多孔板６と同一面に開口している。Hot air outlets 8 are provided on both sides of the hot air blowing device 3, that is, on both sides parallel to the traveling direction of the printed circuit board. As shown in FIGS. 1 and 2, the outlet is open on the same plane as the porous plate 6 which is a hot air outlet.
第１図に示すリフロー炉は、下部の熱風吹き出し装置の
両側だけに流出口８、８が設けられており、第２図に示
すリフロー炉は上下部の熱風吹き出し装置の両側に流出
口８…が設けられている。The reflow furnace shown in FIG. 1 is provided with outlets 8, 8 only on both sides of the lower hot air blowing device, and the reflow furnace shown in FIG. 2 is the outlets 8 on both sides of the upper and lower hot air blowing devices. Is provided.
流出口８にはダクト９が接続されており、該ダクトはポ
ンプ10と接続されている。そしてポンプ10はダクト９で
前述熱風吹き出し装置３の気体流入口４と接続されてい
る。従って、熱風吹き出し装置３から吹き出された熱風
は矢印で示すごとく、トンネル１内を通過後、流出口８
からダクト９を通ってポンプ10に至り、ポンプで再度熱
風吹き出し装置３へ還流していくという循環を行うよう
になる。A duct 9 is connected to the outlet 8 and the duct is connected to a pump 10. The pump 10 is connected to the gas inlet 4 of the hot air blowing device 3 by the duct 9. Therefore, the hot air blown out from the hot air blowing device 3 passes through the tunnel 1 and then reaches the outlet 8 as shown by the arrow.
Then, the circulation is performed from the duct 9 through the duct 9 to the pump 10, and the pump recirculates to the hot air blowing device 3 again.
次に本考案のリフロー炉でのプリント基板の加熱状態に
ついて説明する。Next, the heating state of the printed circuit board in the reflow furnace of the present invention will be described.
熱風吹き出し装置３ではポンプ10から送られた気体が電
熱ヒータ７と高温となった多孔板６で加熱されて熱風と
なり、トンネル１内を走行するプリント基板Ｃに当たっ
てプリント基板を加熱するようになる。また、熱風吹き
出し装置３の多孔板６は熱せられると遠赤外線を放射す
る材質であるため、プリント基板を遠赤外線でも加熱す
ることになる。熱風吹き出し装置３から吹き出された熱
風はトンネル１内に流出し、プリント基板Ｃに直接当た
ってから流出口８に流入していくが、流出口８が熱風吹
き出し装置３の両側に、しかも流出口８と同一面に設け
られているため、熱風は乱れることなく連続した状態で
プリント基板に当たる。従って、プリント基板は常に熱
風に当てられており、均一加熱されることになる。In the hot air blowing device 3, the gas sent from the pump 10 is heated by the electric heater 7 and the porous plate 6 having a high temperature to become hot air, and hits the printed circuit board C running in the tunnel 1 to heat the printed circuit board. Further, since the perforated plate 6 of the hot air blowing device 3 is a material that emits far infrared rays when heated, the printed circuit board is also heated by the far infrared rays. The hot air blown out from the hot air blowing device 3 flows out into the tunnel 1, directly hits the printed circuit board C, and then flows into the outflow port 8. The outflow ports 8 are provided on both sides of the hot air blowing device 3 and at the outflow port. Since it is provided on the same surface as 8, the hot air hits the printed circuit board in a continuous state without being disturbed. Therefore, the printed circuit board is constantly exposed to hot air and is heated uniformly.
［考案の効果］ 本考案のリフロー炉は、熱風の流出口がプリント基板の
走行路より外れたところにあるため、熱風が途切れるこ
となくプリント基板を加熱してプリント基板全体を均一
加熱するものであり、また本考案のリフロー炉は熱風が
乱流を起こさずプリント基板に直接当たるため、熱風が
高密度実装されたSMDの隙間まで容易に侵入してはんだ
付け不良や電子部品の熱損傷等を全く起こさせないとい
う信頼性のあるはんだ付けが行えるものである。[Advantages of the Invention] The reflow oven of the present invention has a hot air outlet located outside the traveling path of the printed circuit board, so that the printed circuit board is heated without interruption and the entire printed circuit board is heated uniformly. In the reflow oven of the present invention, the hot air does not cause turbulence and directly hits the printed circuit board, so the hot air easily penetrates into the gaps of the SMD where high density mounting is performed, resulting in poor soldering and thermal damage to electronic components. Reliable soldering that does not occur at all can be performed.
第１図は本考案のリフロー炉の側面断面図、第２図は他
の実施例の側面断面図、第３図は第１図のＸ−Ｘ線断面
図、第４図は従来の熱風式リフロー炉の平面断面図、第
５図は同正面断面図である。 １……トンネル、２……コンベア、３……熱風吹き出し
装置、６……多孔板 ８……流出口、10……ポンプ、Ｃ……プリント基板FIG. 1 is a side sectional view of a reflow furnace of the present invention, FIG. 2 is a side sectional view of another embodiment, FIG. 3 is a sectional view taken along line XX of FIG. 1, and FIG. 4 is a conventional hot-air type. FIG. 5 is a front sectional view of the reflow furnace, and FIG. 1 ... Tunnel, 2 ... Conveyor, 3 ... Hot air blowing device, 6 ... Perforated plate 8 ... Outflow port, 10 ... Pump, C ... Printed circuit board
Claims (1)
置したリフロー炉において、熱風吹き出し装置から吹き
出された熱風を熱風吹き出し装置に還流させる流出口が
トンネルの下部または上下部にある熱風吹き出し装置の
両側に設けられているとともに、該流出口は熱風吹き出
し装置の熱風吹き出し口と同一面となっていることを特
徴とするリフロー炉。1. A reflow furnace having hot air blowing devices installed in the upper and lower parts of a tunnel, wherein the hot air blowing device is provided with an outlet for returning the hot air blown from the hot air blowing device to the hot air blowing device at the bottom or upper and lower parts of the tunnel. A reflow furnace, which is provided on both sides, and the outlet is flush with the hot air outlet of the hot air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990022214U JPH0739482Y2 (en) | 1990-03-07 | 1990-03-07 | Reflow furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990022214U JPH0739482Y2 (en) | 1990-03-07 | 1990-03-07 | Reflow furnace |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03116257U JPH03116257U (en) | 1991-12-02 |
| JPH0739482Y2 true JPH0739482Y2 (en) | 1995-09-13 |
Family
ID=31525232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990022214U Expired - Lifetime JPH0739482Y2 (en) | 1990-03-07 | 1990-03-07 | Reflow furnace |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739482Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101281548B1 (en) * | 2010-09-09 | 2013-07-03 | 주식회사 티에스엠 | Nozzle Unit for Reflow Soldering Machine |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4348122B2 (en) * | 2003-06-18 | 2009-10-21 | エスペック株式会社 | Heating device |
| JP2010261835A (en) * | 2009-05-08 | 2010-11-18 | Shimadzu Corp | X-ray inspection apparatus and heating apparatus for X-ray inspection apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02187260A (en) * | 1989-01-16 | 1990-07-23 | Nippon Haiburitsudo Kk | Reflow furnace utilizing hot blast |
-
1990
- 1990-03-07 JP JP1990022214U patent/JPH0739482Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101281548B1 (en) * | 2010-09-09 | 2013-07-03 | 주식회사 티에스엠 | Nozzle Unit for Reflow Soldering Machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03116257U (en) | 1991-12-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |