JPS62203669A - Reflow device for printed circuit board loading chip parts - Google Patents
Reflow device for printed circuit board loading chip partsInfo
- Publication number
- JPS62203669A JPS62203669A JP4541786A JP4541786A JPS62203669A JP S62203669 A JPS62203669 A JP S62203669A JP 4541786 A JP4541786 A JP 4541786A JP 4541786 A JP4541786 A JP 4541786A JP S62203669 A JPS62203669 A JP S62203669A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- soldering
- solder paste
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 230000004907 flux Effects 0.000 claims abstract description 14
- 238000005476 soldering Methods 0.000 claims abstract description 12
- 239000000155 melt Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 9
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 229910052736 halogen Inorganic materials 0.000 abstract description 3
- 150000002367 halogens Chemical class 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 235000011962 puddings Nutrition 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント基板に半田ペーストを用いてチップ
部品を半田付けするに際し、半１ｕペーストを加熱・溶
融するリフロー装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a reflow apparatus that heats and melts semi-1U paste when soldering chip components to a printed circuit board using solder paste.
（従来の技術）
従来のこの種の装置は、例えば第２図に示したように構
成されていた。第２図において、１はベルトコンベアで
あり、チップ部品を搭載するプリント基板２を移送する
。Ａは予備加熱部であり、紫外線を照射するＵＶランプ
３、遠赤外線を照射するヒータ４からなっている。Ｂは
本加熱部であり、近赤外線を照射するハロゲンランプ５
からなっている。またＣは冷却部であり、ファン６を備
えている。７は各部を仕切るケーシングである。(Prior Art) A conventional device of this type has been configured as shown in FIG. 2, for example. In FIG. 2, 1 is a belt conveyor, which transports a printed circuit board 2 on which chip components are mounted. A is a preheating section, which includes a UV lamp 3 that irradiates ultraviolet rays and a heater 4 that irradiates far infrared rays. B is the main heating section, which includes a halogen lamp 5 that irradiates near-infrared rays.
It consists of Further, C is a cooling section, which is equipped with a fan 6. 7 is a casing that partitions each part.
上記構成において、半田ペーストを塗布し、所定の位置
にチップ部品を載置したプリント基板２をベルトコンベ
ア１に載せると、プリント基板２は移送と共に予備加熱
部Ａで昇温され、本加熱部Ｂで加熱されて半田ペースト
が溶融し、冷却部Ｃで冷却されて、チップ部品の半田付
けが終了する。In the above configuration, when the printed circuit board 2 coated with solder paste and with chip components mounted at predetermined positions is placed on the belt conveyor 1, the temperature of the printed circuit board 2 is raised in the preheating section A as it is transferred, and then the temperature is raised in the main heating section B. The solder paste is heated in the cooling section C to melt it, and is cooled in the cooling section C to complete soldering of the chip components.
（発明が解決しようとする問題点）
しかしながら、上記従来装置では、半Ｆｉｌペーストを
溶融させるための加熱において、プリン１〜基板の裏面
等に形成されている銅箔パターンの表面が酸化し、他の
部品の半田付は処理（主として半田デツプ処理）の際に
半＋ｎ付は性が非常に悪くなるという問題があった。(Problems to be Solved by the Invention) However, in the conventional apparatus described above, during heating to melt the semi-Fil paste, the surface of the copper foil pattern formed on the back surface of the pudding 1 to the substrate etc. is oxidized, and other There is a problem in that during soldering of parts (mainly solder depth processing), half+n soldering becomes very poor.
本発明は、上記問題点を解消するもので、加熱時に生成
した酸化・膜を、基板の冷却と同時に除去し、次の半田
付は処理に支障を来さないようにしたプリント基板用リ
フロー装置を提供するものである。The present invention solves the above problems, and is a reflow device for printed circuit boards that removes oxides and films generated during heating at the same time as the board is cooled, so that the next soldering process will not be hindered. It provides:
（問題点を解決するための手段）
本加熱部で加熱して半田ペーストを溶融した後、まだ温
度が低下しないうちに、基板にフラックスを塗布するフ
ラックス塗布手段を設けるものである。(Means for Solving the Problems) After the solder paste is melted by heating in the main heating section, a flux application means is provided for applying flux to the substrate before the temperature drops.
（作 用）
加熱により一旦銅箔パターンの表面には酸化膜が生成す
るが、熱せられた状態でフラックスが塗布されると、酸
化膜が除去され、しかもフラックスで基板表面が覆われ
るのでその後の酸化も防止され、次の半田付は処理が確
実に行なわれる。(Function) Once heated, an oxide film is formed on the surface of the copper foil pattern, but when flux is applied in a heated state, the oxide film is removed and the surface of the board is covered with flux, so that subsequent Oxidation is also prevented, and the next soldering process is performed reliably.
（実施例） 以下図面を参照して実施例を詳細に説明する。(Example) Embodiments will be described in detail below with reference to the drawings.
第１図は、本発明の一実施例のリフロー装置を示したも
ので、第２図と同一符号のものは同一のものを示し、ま
たＤは冷却部である。冷却部りはフラクサー８を備えて
いる。FIG. 1 shows a reflow apparatus according to an embodiment of the present invention, in which the same reference numerals as in FIG. 2 indicate the same parts, and D is a cooling section. The cooling section is equipped with a fluxer 8.
次に、本実施例の動作を説明する。半田ペーストを塗布
し、所定の位置にチップ部品を載置したプリント基板２
をベル１〜コンベア１に載せると、プリン１〜基板２は
移送され、まず予備加熱部Ａで昇温され、本加熱部Ｂで
加熱されて半田ペーストが溶融し、チップ部品が半田付
けされる。プリント基板２はさらに移送されて、冷却部
りでフラクサー８により表裏両面にフラックスが塗布さ
れる。Next, the operation of this embodiment will be explained. Printed circuit board 2 with solder paste applied and chip components mounted in predetermined positions
When placed on bell 1 to conveyor 1, pudding 1 to board 2 are transferred, first heated in preheating section A, then heated in main heating section B to melt the solder paste and solder the chip components. . The printed circuit board 2 is further transported, and flux is applied to both the front and back surfaces by a fluxer 8 in a cooling section.
フラックスの塗布方法は、シャワー、浸漬１発泡等の公
知の方法が適用できる。このフラックス塗布によりプリ
ント基板は冷却され、リフロー装置の外へ出る。As the flux application method, known methods such as showering, dipping and foaming can be applied. The printed circuit board is cooled by this flux application and exits the reflow apparatus.
以上のように構成された本実施例では、予備加熱部Ａと
本加熱部Ｂにおける加熱によってプリント基板の裏面等
に形成されている銅箔パターン表面が一旦酸化されるが
、本加熱部Ｂで熱せられた直後のフラックス塗布により
、酸化膜が直ちに除去される。さらに、プリント基板全
体がフラックスでコーティングされるので、その後の空
気による酸化を防ぐこともできる。In this embodiment configured as described above, the surface of the copper foil pattern formed on the back surface of the printed circuit board is temporarily oxidized by heating in the preheating section A and the main heating section B, but the surface of the copper foil pattern formed on the back surface of the printed circuit board is oxidized once. The oxide film is immediately removed by applying flux immediately after heating. Furthermore, since the entire printed circuit board is coated with flux, subsequent oxidation by air can be prevented.
（発明の効果）
以上説明したように、本発明によれば、両面実装用のプ
リント基板の片面にチップ部品を半田ペーストを用いて
半田付けするりフロ一工程において、リフローのための
加熱で他面の銅箔パターン表面が酸化しても、熱せられ
た状態でのフラックスの塗布によりその酸化膜を直ちに
除去することができ、しかもフラックスのコーティング
により基板面を空気から遮断し、以後の酸化も防止する
ことができるので、後工程における他の部品の半田１付
は実装が容易になるという利点がある。(Effects of the Invention) As described above, according to the present invention, during the reflow process in which chip components are soldered to one side of a printed circuit board for double-sided mounting using solder paste, the heating for reflow is used to solder the chip components onto one side of a printed circuit board for double-sided mounting. Even if the surface of the copper foil pattern on the board oxidizes, the oxide film can be removed immediately by applying flux in a heated state.Furthermore, the flux coating isolates the board surface from the air, preventing further oxidation. Since this can be prevented, there is an advantage that mounting of other components with solder in a subsequent process becomes easier.
第１図は、本発明の一実施例の構成図、第２図は、従来
例の構成図である６
１ ・・・ベル１−コンベア、 ２ ・・・プリント
基板、３ ・・・ Ｕ■ランプ、 ４ ・・・ ヒー
タ、 ５ ・・・ハロゲンランプ、 ８ ・・・ フ
ラクサー、Ａ・・・予備加熱部、 Ｂ・・・本加熱部。
Ｃ・・・冷却部。Fig. 1 is a block diagram of an embodiment of the present invention, and Fig. 2 is a block diagram of a conventional example. Lamp, 4... Heater, 5... Halogen lamp, 8... Fluxer, A... Preheating section, B... Main heating section. C...Cooling section.
Claims (1)
チップ部品を半田付けするに際し、基板を加熱して半田
ペーストを溶融するリフロー装置において、半田ペース
トを塗布し、所定の位置にチップ部品を載置したプリン
ト基板を移送する手段と、前記プリント基板を加熱して
半田ペーストをリフローする加熱部と、リフロー後の熱
せられた状態の基板にフラックスを塗布する手段とを備
えたことを特徴とするチップ部品を搭載するプリント基
板用リフロー装置。When soldering chip components to one side of a double-sided printed circuit board using solder paste, a reflow machine that heats the board and melts the solder paste applies the solder paste and places the chip component in a predetermined position. A chip characterized by comprising means for transferring a heated printed circuit board, a heating section for heating the printed circuit board and reflowing solder paste, and means for applying flux to the heated circuit board after reflow. Reflow equipment for printed circuit boards that mounts components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4541786A JPS62203669A (en) | 1986-03-04 | 1986-03-04 | Reflow device for printed circuit board loading chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4541786A JPS62203669A (en) | 1986-03-04 | 1986-03-04 | Reflow device for printed circuit board loading chip parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62203669A true JPS62203669A (en) | 1987-09-08 |
Family
ID=12718686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4541786A Pending JPS62203669A (en) | 1986-03-04 | 1986-03-04 | Reflow device for printed circuit board loading chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62203669A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5607609A (en) * | 1993-10-25 | 1997-03-04 | Fujitsu Ltd. | Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering |
| US7172106B2 (en) * | 2002-12-30 | 2007-02-06 | Samsung Electronics Co., Ltd. | Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board |
| CN109332837A (en) * | 2018-11-21 | 2019-02-15 | 中国航发沈阳黎明航空发动机有限责任公司 | A kind of vacuum brazing method with thin-wall part structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5013879A (en) * | 1973-06-11 | 1975-02-13 |
-
1986
- 1986-03-04 JP JP4541786A patent/JPS62203669A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5013879A (en) * | 1973-06-11 | 1975-02-13 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5607609A (en) * | 1993-10-25 | 1997-03-04 | Fujitsu Ltd. | Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering |
| US5770835A (en) * | 1993-10-25 | 1998-06-23 | Fujitsu Limited | Process and apparatus and panel heater for soldering electronic components to printed circuit board |
| US7172106B2 (en) * | 2002-12-30 | 2007-02-06 | Samsung Electronics Co., Ltd. | Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board |
| CN109332837A (en) * | 2018-11-21 | 2019-02-15 | 中国航发沈阳黎明航空发动机有限责任公司 | A kind of vacuum brazing method with thin-wall part structure |
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