JPH04197576A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPH04197576A
JPH04197576A JP32714390A JP32714390A JPH04197576A JP H04197576 A JPH04197576 A JP H04197576A JP 32714390 A JP32714390 A JP 32714390A JP 32714390 A JP32714390 A JP 32714390A JP H04197576 A JPH04197576 A JP H04197576A
Authority
JP
Japan
Prior art keywords
flux
soldering
solder
soldered
immersed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32714390A
Other languages
Japanese (ja)
Inventor
Naoshi Kani
直士 可児
Koichi Ishida
浩一 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP32714390A priority Critical patent/JPH04197576A/en
Publication of JPH04197576A publication Critical patent/JPH04197576A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To execute the soldering work with high characteristics by preheating soldering part, dipping into a flux vessel and dipping into a soldering vessel in successively plural times. CONSTITUTION:The soldering part in a product having a substrate 1, soldering lands 1a and terminals 4 is dipped into solder 10 in the soldering vessel 9. Then, the soldering part is preheated at the prescribed temp. After preheating, this soldering part 1, 1a, 4 is dipped into flux 8 in the flux vessel 7 in successively two times. After dipping into flux, the soldering part 1, 1a, 4 is dipped into the solder 10 in the soldering vessel 9 in successively two times. By this method, activation of flux is sufficiently executed.

Description

【発明の詳細な説明】 〔産業上の利用分野) 本発明は、製品の半田付部を半田槽に浸漬して半田付を
行う半田付方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a soldering method in which a soldered portion of a product is immersed in a solder bath to perform soldering.

〔従来の技術〕[Conventional technology]

従来、浸漬半田付けを行う場合は、良好な半田付特性を
得るために製品の半田付部を半田槽に浸漬させる前に、
該半田付部をフラックス槽に浸漬してフラックス層を形
成し、この後、該半田付部を、例えば100℃程度で加
熱して該フラックス層を活性化させることが行われてい
る。
Conventionally, when performing immersion soldering, in order to obtain good soldering characteristics, before immersing the soldered part of the product in a soldering bath,
The soldered portion is immersed in a flux bath to form a flux layer, and then the soldered portion is heated, for example, at about 100° C. to activate the flux layer.

(発明が解決しようとする課題) 上記従来の半田付方法では、製品の半田付部にフラック
ス層を形成させた後、該フラックス層を活性化させるべ
く半田付部を予熱しているので。
(Problems to be Solved by the Invention) In the conventional soldering method described above, after forming a flux layer on the soldered part of the product, the soldered part is preheated to activate the flux layer.

予熱時にフラックスが飛散し、製品を搬送するコンベア
等の設備に粘着して設備周辺を汚損することある。この
フラックスによる汚損を放置しておくと、設備の動作機
構にも支障をきたすこととなるので、できるだけフラッ
クスが飛散しないようにすることが望ましい。
Flux may scatter during preheating and stick to equipment such as conveyors that transport products, staining the area around the equipment. If the stain caused by this flux is left untreated, it will cause problems in the operating mechanism of the equipment, so it is desirable to prevent the flux from scattering as much as possible.

上記問題を解決するため、例えば製品の半田付部を予熱
した後、フラックス槽に浸漬して活性化したフラックス
層を形成させる方法も考えられるが、この方法ではフラ
ックス槽に浸漬する際に半田付部のIIIが低下してフ
ラックスの活性化を十分に行うことができない欠点があ
る。
In order to solve the above problem, for example, it is possible to preheat the soldered part of the product and then immerse it in a flux bath to form an activated flux layer. There is a drawback that part III is lowered and the flux cannot be activated sufficiently.

本発明は、上記課題に鑑みてなされたものであり、フラ
ックスを飛散させることなく該フラックスの活性化を行
い、半田付けを良好に行うことのできる半田付方法を提
供することを目的とする。
The present invention has been made in view of the above problems, and it is an object of the present invention to provide a soldering method that can activate flux without scattering the flux and perform soldering well.

〔課題を解決するための手段〕[Means to solve the problem]

上記課題を解決するために、本発明は、半田槽に製品の
半田付部を浸漬して半田付けを行う半田付方法において
、前記半田付部を予め所定温度で加熱する予熱工程と、
予熱後に前記半田付部をフラックス槽に浸漬するフラッ
クス浸漬工程と、フラックス浸漬後に前記半田付部を半
田槽に連続して2回浸漬する半田浸漬工程とからなるも
のである。
In order to solve the above problems, the present invention provides a soldering method in which a soldered part of a product is immersed in a soldering bath for soldering, including a preheating step of heating the soldered part to a predetermined temperature in advance;
The method consists of a flux immersion step in which the soldered portion is immersed in a flux bath after preheating, and a solder immersion step in which the soldered portion is immersed in the solder bath twice in succession after being immersed in flux.

〔作用〕[Effect]

本発明に係る方法によれば、製品の半田付部を予熱した
後、該半田付部をフラックス層に浸漬することよりフラ
ックスが飛散することなく半田付部に塗布される。また
、フラックス層が形成された半田付部を半田層へ浸漬し
、−旦、空気中に引き上げると、半田槽への浸漬による
加熱によりフラックスの活性化が進行するとともに、分
解ガスが十分に抜け、フラックスの活性化が十分に行わ
れる。これにより半田付部を再度半田槽に浸漬すること
により、好適に半田付けが行われる。
According to the method of the present invention, after preheating the soldered part of a product, the soldered part is immersed in a flux layer, so that flux is applied to the soldered part without scattering. In addition, when the soldered part on which a flux layer has been formed is immersed into the solder layer and then lifted into the air, the activation of the flux progresses due to the heating caused by immersion in the solder bath, and the decomposed gas is sufficiently released. , the flux is sufficiently activated. By immersing the soldered portion in the solder bath again, soldering can be performed appropriately.

〔実施例〕〔Example〕

本発明に係る半田付方法についてハイブリッドICの端
子半田付を例に説明する。
The soldering method according to the present invention will be explained using terminal soldering of a hybrid IC as an example.

第1図は、ハイブリッドICに入出力端子が半田付され
るときの構成を示す図である。同図において、1はハイ
ブリッドICの基板であって、両面又は片面に電子部品
(不図示)が半田付されている。基板1の一方の長辺部
には端子4が半田付される半田付ランドla(半田付部
)が所定間隔で設けられている。また、2はガイド板3
に多数の端子4が所定間隔で形成されたフープ材で、こ
の端子4の先端部は二股に分岐した挟持部(不図示)が
形成されている。基板1は、半田付ランド1aの位置に
端子4の先端挟持部を挟持させてフープ材2に取り付け
られてい−る。このフープ材2には所定間隔で複数の基
板1が取り付けられる。
FIG. 1 is a diagram showing a configuration when input/output terminals of a hybrid IC are soldered. In the figure, reference numeral 1 denotes a board of a hybrid IC, and electronic components (not shown) are soldered to both sides or one side. Soldering lands la (soldering portions) to which terminals 4 are soldered are provided at predetermined intervals on one long side of the board 1. Also, 2 is the guide plate 3
The terminal 4 is made of a hoop material in which a large number of terminals 4 are formed at predetermined intervals, and the tip of the terminal 4 is formed with a bifurcated clamping part (not shown). The board 1 is attached to the hoop material 2 with the end clamping portion of the terminal 4 being clamped at the position of the soldering land 1a. A plurality of substrates 1 are attached to this hoop material 2 at predetermined intervals.

なお、基板1に取り付けられない端子4は間引かれてい
る。5は、基板1を支持して搬送及び昇降可能にされる
支持帯であって、後述するようにフープ材2及び基板1
の半田付ランド1aの部分をフラックス層や半田層に浸
漬する場合に該基板1を支持するものである。
Note that the terminals 4 that are not attached to the substrate 1 are thinned out. Reference numeral 5 denotes a support belt that supports the substrate 1 and is capable of transporting and raising and lowering the hoop material 2 and the substrate 1 as described later.
It supports the substrate 1 when the soldering land 1a portion is immersed in a flux layer or a solder layer.

上記構成のハイブリッドICの端子半田付の手順を第2
図、第3図(a)、(b)を用いて説明する。
The second procedure for soldering the terminals of the hybrid IC with the above configuration is as follows.
This will be explained using FIGS. 3(a) and 3(b).

第2図は第1図に示すハイブリッドL Cの基板の半田
浸漬部をフラックス槽に浸漬するフラックス浸漬工程を
示す一部正面図、第3図(a)は同ハイブリッドICの
基板の半田浸漬部を半田槽に浸漬する半田槽浸漬工程を
示す一部正面図、第3図は(b)は同ハイブリッドIC
の半田浸漬部を半田槽から引き上げた状態を示す図であ
る。
Figure 2 is a partial front view showing the flux immersion process in which the solder-dipped part of the hybrid LC board shown in Figure 1 is dipped into a flux bath, and Figure 3 (a) is the solder-dipped part of the hybrid IC board. Figure 3 (b) is a partial front view showing the solder bath immersion process in which the hybrid IC is immersed in the solder bath.
FIG. 3 is a diagram showing a state in which the solder-immersed part of the solder is pulled up from the solder bath.

なお、ここでは説明の便宜上、所定の数の基板1をフー
プ材2に取り付け(以下、セットにした基板1をセット
基板Aという)、そのセットを単位として端子半田付け
を行う場合について説明する。
For convenience of explanation, a case will be described here in which a predetermined number of boards 1 are attached to the hoop material 2 (hereinafter, a set of boards 1 is referred to as a set board A), and terminal soldering is performed for each set.

まず、セット基板Aは、およそ100℃の温度槽に入れ
るか或いは熱盤上に載置して予熱が行われる。
First, the set substrate A is preheated by placing it in a temperature bath of approximately 100° C. or placing it on a heating plate.

次に、第2図に示すようにセット基板Aのフープ材2及
び半田付ランド1aの部分(以下、半田浸漬部6という
)だけフラックス槽7に浸漬して半田浸漬部6にフラッ
クス8が塗布される。この場合、フラックス8が飛散す
ることはあっても、フラックス槽7内であるため、その
外部周辺が汚損されることはない。
Next, as shown in FIG. 2, only the hoop material 2 and the soldering land 1a of the set board A (hereinafter referred to as the solder immersed area 6) are immersed in a flux bath 7, and the flux 8 is applied to the solder immersed area 6. be done. In this case, even though the flux 8 may be scattered, since the flux 8 is inside the flux tank 7, the outer periphery thereof will not be contaminated.

次に、セット基板Aの半田浸漬部6は所要時間だけ半田
槽9に浸漬され(第3図(a))、−旦、空気中に引き
上げられる(第3図(b))。この浸漬時間は主として
半田浸漬部6のフラックス8を活性化させるために加熱
するもので、半田槽9の設定温度により適宜の時間が設
定される。半田浸漬部6のフラックス8は、この加熱に
より活性化され、発生した分解ガスは、空気中に引き上
げたときに、空気中に放出される。、 次に、再度半田浸漬部6は所定時間だけ半田槽9に浸漬
された後(第3図(a))、空気中に引き上げられて(
第3図(b))、半田浸漬部6の溶融した半田10が冷
却、固化される。半田浸漬部6のフラックス8は十分に
活性化しているので、溶融した半田10は端子4及び半
田付ランド1aに馴染んで好適な合金層が形成され、冷
部固化により良好の半田付特性を有する半田付けが行わ
れる。
Next, the solder immersion portion 6 of the set board A is immersed in the solder bath 9 for a required time (FIG. 3(a)), and then lifted into the air (FIG. 3(b)). This immersion time is mainly for heating to activate the flux 8 in the solder immersion portion 6, and is set to an appropriate time depending on the set temperature of the solder bath 9. The flux 8 in the solder immersion section 6 is activated by this heating, and the generated decomposed gas is released into the air when it is pulled up into the air. Next, the solder immersion part 6 is immersed in the solder bath 9 again for a predetermined time (FIG. 3(a)), and then lifted into the air (
As shown in FIG. 3(b), the molten solder 10 in the solder immersion portion 6 is cooled and solidified. Since the flux 8 in the solder immersion part 6 is sufficiently activated, the molten solder 10 blends into the terminal 4 and the soldering land 1a to form a suitable alloy layer, and has good soldering characteristics due to cold solidification. Soldering is performed.

なお、上記実施例では、所定数の基板1がセットで構成
されたものをセット単位で半田付けする場合について説
明したが、多数の基板1がフープ材2に連設されたもの
を連続的に各工程に流しながら基板1の端子半田付けを
することもできる。
In the above embodiment, a case where a set of a predetermined number of boards 1 is soldered is explained. It is also possible to solder the terminals of the board 1 while performing each process.

また、本発明は、ハイブリッドICに限らず、その他各
種の回路基板の半田付作業についても適用することがで
きる。
Furthermore, the present invention is applicable not only to hybrid ICs but also to soldering work for various other circuit boards.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、製品の半田付部を
予熱した後、該半田付部をフラックス槽に浸漬するよう
にしたので、フラックスが飛散して設備周辺を汚損する
ようなことがなくなる。
As explained above, according to the present invention, after preheating the soldered part of the product, the soldered part is immersed in the flux bath, so that the flux does not scatter and contaminate the surroundings of the equipment. It disappears.

しかも、フラックス塗布後に半田付部を2回半田槽に浸
漬するようにしたので、1回目の半田槽浸漬によりフラ
ックスの活性化が十分に行われ。
Moreover, since the soldered portion is dipped twice in the solder bath after applying the flux, the flux is sufficiently activated by the first immersion in the solder bath.

半田付特性の良好な半田付作業を行うことができる。Soldering work with good soldering characteristics can be performed.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はハイブリッドICの基板に入出力端子が半田付
けされるときの構成を示す一部正面図、第2図は前記ハ
イブリッドIC基板の半田浸漬部をフラックス層に浸漬
するフラックス浸漬工程を示す一部正面図、第3図(a
)は前記ハイブリッドICの基板の半田浸漬部を半田層
に浸漬する半田浸漬工程を示す一部正面図、第3図(b
)は前記ハイブリッドIC基板の半田浸漬部を半田槽か
ら引き上げた状態を示す図である。 1・・・基板、1a・・・半田付ランド、2・・・フー
プ材。 3・・・ガイド板、4・・・端子、5・・・支持帯、6
・・・半田浸漬部、7・・・フラックス槽、8・・・フ
ラックス、9・・・半田槽、10・・・半田、A・・・
セット基板。 第  1  図 第  2  図
Fig. 1 is a partial front view showing the configuration when the input/output terminals are soldered to the hybrid IC board, and Fig. 2 shows a flux dipping step in which the solder dipped portion of the hybrid IC board is dipped into the flux layer. Partial front view, Figure 3 (a
) is a partial front view showing the solder dipping step of dipping the solder dipping part of the hybrid IC board into the solder layer, and FIG.
) is a diagram showing a state in which the solder-immersed part of the hybrid IC board is pulled up from the solder bath. 1... Board, 1a... Soldering land, 2... Hoop material. 3... Guide plate, 4... Terminal, 5... Support band, 6
...Solder immersion part, 7...Flux tank, 8...Flux, 9...Solder tank, 10...Solder, A...
set board. Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] 1.半田槽に製品の半田付部を浸漬して半田付けを行う
半田付方法において、前記半田付部を予め所定温度で加
熱する予熱工程と、予熱後に前記半田付部をフラックス
槽に浸漬するフラックス浸漬工程と、フラックス浸漬後
に前記半田付部を半田槽に連続して2回浸漬する半田浸
漬工程とからなることを特徴とする半田付方法。
1. A soldering method in which a soldered part of a product is immersed in a soldering bath for soldering, includes a preheating step of heating the soldered part in advance to a predetermined temperature, and a flux immersion step of immersing the soldered part in a flux bath after preheating. and a solder immersion step of immersing the soldered portion in a solder tank twice in succession after being immersed in flux.
JP32714390A 1990-11-27 1990-11-27 Soldering method Pending JPH04197576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32714390A JPH04197576A (en) 1990-11-27 1990-11-27 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32714390A JPH04197576A (en) 1990-11-27 1990-11-27 Soldering method

Publications (1)

Publication Number Publication Date
JPH04197576A true JPH04197576A (en) 1992-07-17

Family

ID=18195797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32714390A Pending JPH04197576A (en) 1990-11-27 1990-11-27 Soldering method

Country Status (1)

Country Link
JP (1) JPH04197576A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018111122A (en) * 2017-01-13 2018-07-19 コーセル株式会社 Soldering device and soldering method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018111122A (en) * 2017-01-13 2018-07-19 コーセル株式会社 Soldering device and soldering method

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