JPH01112721A - Installation of lead wire to electronic component - Google Patents
Installation of lead wire to electronic componentInfo
- Publication number
- JPH01112721A JPH01112721A JP62270690A JP27069087A JPH01112721A JP H01112721 A JPH01112721 A JP H01112721A JP 62270690 A JP62270690 A JP 62270690A JP 27069087 A JP27069087 A JP 27069087A JP H01112721 A JPH01112721 A JP H01112721A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead wire
- metal film
- flux
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 238000009434 installation Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 230000004907 flux Effects 0.000 claims abstract description 13
- 238000002844 melting Methods 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 10
- 238000004140 cleaning Methods 0.000 abstract description 5
- 239000000155 melt Substances 0.000 abstract description 3
- 238000009835 boiling Methods 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract description 2
- 238000009736 wetting Methods 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract 2
- 238000007254 oxidation reaction Methods 0.000 abstract 2
- 230000035515 penetration Effects 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品のリード線の取付方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for attaching lead wires to electronic components.
従来の技術
従来の電子部品のリード線の取付は方法としては、第６
図に示すように、絶縁基板１に設けられた貫通穴よりリ
ード線２の先端部２１Ｌ’を突出させ、貫通穴の周囲の
銅等よりなる金属皮膜１ａとの間に外部より半田３を供
給して絶縁基板１とリード線２とを電気的に導通および
機械的に固定していた。なお、プリント基板等への半田
付けに際しては、半田付は工程の前にフラックス塗布、
半田付は後に７ラツクス洗浄を行う必要があった。Conventional technology The conventional method for attaching lead wires of electronic components is the sixth method.
As shown in the figure, the tip 21L' of the lead wire 2 protrudes from a through hole provided in the insulating substrate 1, and solder 3 is supplied from the outside between it and the metal film 1a made of copper or the like around the through hole. The insulating substrate 1 and the lead wires 2 were electrically connected and mechanically fixed. When soldering to a printed circuit board, etc., apply flux before the soldering process.
Soldering required 7 lux cleaning afterwards.
発明が解決しようとする問題点
しかしながら、上記のような方法によると、半田付作業
が煩雑であり、かつ半田付けする部分の面積も大きいと
いう問題があった。Problems to be Solved by the Invention However, the above method has problems in that the soldering work is complicated and the area to be soldered is large.
本発明はこのような問題を解決し、絶縁基板の金属皮膜
とリード線とを効率よりかつ必要な部分にだけ半田付け
することのできる電子部品のリード取付方法を提供する
こと全目的とする。It is an object of the present invention to solve these problems and provide a method for attaching leads to electronic components, which can efficiently solder the metal film of an insulating substrate and the lead wires only to the necessary parts.
問題点分解決するための手段
上記問題点を解決するため、本発明の電子部品のリード
線取付方法は、絶縁基板の適所に形成した半田付用の金
属皮膜に、表面に半田コーティングされたリード線を接
触させ、接触部にフラックスを塗布し、その後前記リー
ド線にコーティングされた半田の融点よりも高い温度に
加熱した不活性溶液中に浸漬した後、この不活性溶液中
から取出して前記金属皮膜とリード線間の半田を固化す
るものである。Means for Solving the Problems In order to solve the above-mentioned problems, the method for attaching lead wires for electronic components according to the present invention includes attaching leads whose surfaces are coated with solder to a metal film for soldering formed at appropriate locations on an insulating substrate. The wires are brought into contact, flux is applied to the contact area, and then immersed in an inert solution heated to a temperature higher than the melting point of the solder coated on the lead wire, and then taken out from the inert solution and soldered to the metal. This solidifies the solder between the film and the lead wire.
作用
すなわち、このような方法によると、フラックスの表面
清浄作用により金属皮膜の酸化膜等が除去され、次に高
温に保たれた不活性溶液中に浸漬することにより、リー
ド線にコーティングされた半田が溶融後固化して必要な
部分にのみ半田付けされることになる。In other words, according to this method, the oxide film of the metal coating is removed by the surface cleaning action of the flux, and then the solder coated on the lead wire is removed by immersion in an inert solution kept at a high temperature. After being melted, it solidifies and can be soldered only to the necessary parts.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
第１図において５は絶縁基板で、貫通穴５ｂおよび貫通
穴５ｂの周囲に金属皮膜５ａが設けられている。６はリ
ード線で、絶縁基板５の貫通穴５ｂに挿入される先端部
６Ｌ’ と絶縁基板５のうら面に当たる貫通穴６ｂより
も大きなソバ部６ｂが設けられている。またリード線６
の表面はメツキ処理等の方法によシ半田コーティング（
図示せず）がなされている。リード線６の先端部６ａ’
は貫通穴６ｂの深さよシも長く、貫通穴５ｂに挿入され
た状態で先端部６ａ′の最先端部を押しつぶすことによ
り、貫通穴６ｂよりも大きなツバ部６１ができる。以上
のようにして出来上っているリード線６の取付けられた
絶縁基板６の金属皮膜６ａとリード線６のソバ部６ａの
部分にフラックスを塗布し、フラックスの表面清浄作用
にて金属皮膜６ａの酸化膜等が除去される。次に前記リ
ード線６の半田コーティングに使用されている半田の融
点よりも高い沸点を持つ不活性溶液の中に浸漬する。こ
の場合、槽内の不活性溶液はリード線６にコーティング
された半田の融点よりも高く温めておく。そうすると、
半田コーティングされている半田が溶融して第２図に示
すように、金属皮膜５ａに半田ぬれが起こる。そこで、
これを不活性溶液槽より出すと溶融している半田が固体
化し、リード線６のツバ部６ａと金属皮膜６ａが半田付
けされることになる。なお、６０は溶融後に固体化した
半田である。In FIG. 1, 5 is an insulating substrate, and a through hole 5b and a metal coating 5a are provided around the through hole 5b. Reference numeral 6 denotes a lead wire, which has a tip end 6L' inserted into the through hole 5b of the insulating substrate 5, and a buckle portion 6b that is larger than the through hole 6b and corresponds to the back surface of the insulating substrate 5. Also, lead wire 6
The surface is coated with solder (by plating or other methods).
(not shown). Tip part 6a' of lead wire 6
is longer than the depth of the through hole 6b, and by crushing the most distal end of the tip 6a' while inserted into the through hole 5b, a collar 61 larger than the through hole 6b is formed. Flux is applied to the metal coating 6a of the insulating substrate 6 to which the lead wire 6 is attached, which has been completed as described above, and the buckle portion 6a of the lead wire 6, and the surface cleaning action of the flux causes the metal coating 6a to be coated. oxide film etc. are removed. Next, the lead wire 6 is immersed in an inert solution having a boiling point higher than the melting point of the solder used for the solder coating. In this case, the inert solution in the tank is heated to a temperature higher than the melting point of the solder coated on the lead wires 6. Then,
The solder in the solder coating melts, and as shown in FIG. 2, solder wetting occurs on the metal film 5a. Therefore,
When this is removed from the inert solution bath, the molten solder solidifies, and the collar 6a of the lead wire 6 and the metal coating 6a are soldered. Note that 60 is solder that is solidified after being melted.
このように本実施例によれば、リード線６に半田コーテ
ィングされている半田の融点よりも高く加熱された不活
性溶液中に、絶縁基板５の金属皮膜５ａとリード線６と
を接触させた状態で浸漬することにより、半田付けを行
うものであり、半田付けの必要な部分にのみ半田付けす
ることが可能となり、半田付けする部分の面積が少なく
ても安定した半田付けが可能となる。また、組立設備の
簡素化もできることとなる。According to this embodiment, the metal coating 5a of the insulating substrate 5 and the lead wire 6 are brought into contact with each other in an inert solution heated to a temperature higher than the melting point of the solder with which the lead wire 6 is coated with solder. Soldering is performed by immersing the solder in the soldering condition, and it is possible to solder only the parts that require soldering, and even if the area of the part to be soldered is small, stable soldering is possible. Furthermore, assembly equipment can be simplified.
なお、本実施例のように、半田付けの面積を大きくした
シ絶縁基板５の表面上にリード線６の先端部６ａ’を突
出させられない時は、第３図に示すように貫通穴６ｂの
内壁にも金属皮膜５ａを施して本実施例と同じように半
田付を行っても良い。Note that, as in this embodiment, when the tip portion 6a' of the lead wire 6 cannot be made to protrude onto the surface of the insulating substrate 5 with a large soldering area, the through hole 6b is used as shown in FIG. It is also possible to apply a metal film 5a to the inner wall and perform soldering in the same manner as in this embodiment.
また、第４図に示すように、金属皮膜側６ａのみにリー
ド線６のソバ部６ａを形成し、半田付けを行っても良い
。また、本実施例では不活性溶液とは別の装置にて７ラ
ツクスを塗布しているが、第５図のように不活性溶液８
の層の上に（下でも中間でも良い。）フラックス層７を
設けておき、リード線６の取付けられた絶縁基板６を不
活性溶液８の中に、半田が溶けるまで保持する過程にお
いてフラックス層７を通過するようにしておいても良い
。なお１ｏは加熱ヒータである。Alternatively, as shown in FIG. 4, the buckle portion 6a of the lead wire 6 may be formed only on the metal film side 6a and soldered. In addition, in this example, 7 lux was applied using a separate device from the inert solution, but as shown in Figure 5, the inert solution 8
A flux layer 7 is provided on the layer (below or in the middle), and in the process of holding the insulating substrate 6 to which the lead wires 6 are attached in an inert solution 8 until the solder melts, the flux layer 7 is formed. 7 may be passed through. Note that 1o is a heater.
発明の効果
以上のように本発明は金属皮膜の表面ｔ−清浄しリード
線にコーティングさｎた半田を溶融させて半田付けする
方法であり、絶縁基板の金属皮膜とリード線とを効率よ
くかつ必要な部分にだけ半田付けすることができる。し
たがって、その効果は電子部品の小型化が要求される中
にあってきわめて大きい。Effects of the Invention As described above, the present invention is a method of cleaning the surface of a metal film and melting and soldering the solder coated on a lead wire, which efficiently and efficiently connects the metal film of an insulating substrate and the lead wire. You can solder only the necessary parts. Therefore, the effect is extremely large in view of the demand for miniaturization of electronic components.
第１図〜第４図は本発明の一実施例を示し、第１図は工
程図、第２図は要部断面図、第３図、第４図はそれぞれ
他の実施例における要部断面図、第６図は２層式の加熱
槽の断面図である。第６図は従来方法の工程図である。
５・・・・・・絶縁基板、６ａ・・・・・・金属皮膜、
６・・・・・・リード線、６Ｃ・・・・・・固化した半
田、７・・・・・・フラックス槽、８・・・・・・不活
性溶液層、９・・・・・・熱媒体、１０・・・・・・加
熱ヒータ。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名４−
リート塊
（Ｑ） ＜ｂノ
（Ｃ）第３図 嬉４図1 to 4 show one embodiment of the present invention, FIG. 1 is a process diagram, FIG. 2 is a sectional view of a main part, and FIGS. 3 and 4 are a sectional view of a main part in other embodiments. FIG. 6 is a sectional view of a two-layer heating tank. FIG. 6 is a process diagram of the conventional method. 5...Insulating substrate, 6a...Metal film,
6... Lead wire, 6C... Solidified solder, 7... Flux tank, 8... Inert solution layer, 9... Heat medium, 10... Heater. Name of agent: Patent attorney Toshio Nakao and 1 other person 4-
Leet lump (Q) <bノ
(C) Figure 3 Happy Figure 4
Claims (2)
、表面に半田コーティングされたリード線を接触させ、
前記金属皮膜と前記リード線との接触部にフラックスを
塗布し、前記リード線にコーティングされた半田の融点
よりも高い温度に加熱した不活性液体中に浸漬した後、
この不活性液体中から取出して前記金属皮膜とリード線
間の半田を固化する電子部品のリード線取付方法。(1) Contact a lead wire whose surface is coated with solder to a metal film for soldering formed at an appropriate location on an insulating substrate,
Applying flux to the contact area between the metal film and the lead wire, and immersing the wire in an inert liquid heated to a temperature higher than the melting point of the solder coated on the lead wire,
A method for attaching lead wires to electronic components, in which the solder between the metal film and the lead wires is solidified by taking it out of the inert liquid.
層式にした特許請求の範囲第１項に記載の電子部品のリ
ード線取付方法。(2) Put the flux in the same container as the inert liquid,
A method for attaching lead wires for electronic components according to claim 1, which is a layered method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62270690A JPH01112721A (en) | 1987-10-27 | 1987-10-27 | Installation of lead wire to electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62270690A JPH01112721A (en) | 1987-10-27 | 1987-10-27 | Installation of lead wire to electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01112721A true JPH01112721A (en) | 1989-05-01 |
Family
ID=17489595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62270690A Pending JPH01112721A (en) | 1987-10-27 | 1987-10-27 | Installation of lead wire to electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01112721A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6971571B2 (en) | 2000-12-21 | 2005-12-06 | Fujitsu Limited | Reflow soldering apparatus and reflow soldering method |
-
1987
- 1987-10-27 JP JP62270690A patent/JPH01112721A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6971571B2 (en) | 2000-12-21 | 2005-12-06 | Fujitsu Limited | Reflow soldering apparatus and reflow soldering method |
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