JPH04300067A - Soldering device - Google Patents

Abstract

PURPOSE:To improve the reliability of a soldering part by making the whole soldering device small by combining the functions of a conventional receiving conveyor and an outlet feeder on and also, lengthening the cooling time of an object to be soldered after soldering. CONSTITUTION:On the withdrawing side of a main conveyor 6, a lift conveyor 13 being movable vertically is installed, and also, on the lift conveyor 13 concerned, a cooling system 15 is provided.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device which performs soldering by immersing a portion of an object to be soldered into molten solder.

0002

[Prior Art] For example, in a printed circuit board soldering device, a pair of main conveyors run over soldering processing equipment such as a fluxer, a preheater, a molten solder tank, and a cooling device. While holding the printed circuit board with a large number of claws, there are devices that apply flux with a fluxer, preheat with a preheater, apply solder in a molten solder bath, and cool down the printed circuit board after soldering with a cooling device. .

[0003] In the above-mentioned soldering apparatus, when the printed circuit board comes into contact with the molten solder in the molten solder bath and is separated from the molten solder, if the printed circuit board is slightly tilted upward in the direction of movement, the molten solder may The state of separation, that is, the "cutting" is improved, and soldering defects such as bridges and icicles can be reduced.

[0004] Therefore, in the above-mentioned soldering apparatus,
The main conveyor is slightly inclined upward from the entrance side to the exit side. The inclination of this main conveyor is called the conveyance angle, and is preferably 3 to 7 degrees.

[0005] Before the printed circuit board is soldered with the soldering device described above, electronic components are mounted on the electronic component mounting device, and after soldering, the printed circuit board is subjected to an inspection device that inspects the soldering condition.

[0006] These devices are placed before and after the soldering device, and are used in an in-line (in-line) system that continuously conveys printed circuit boards.
(in line), and the printed circuit boards are transferred to each conveyor.

Generally, the conveyor of a component mounting device and the conveyor of an inspection device are at the same height, but as mentioned above, the main conveyor of a soldering device is slightly inclined upward in the direction of travel, so Even if the height of the main conveyor is adjusted to match the height of the conveyor of the component loading device, the main conveyor becomes a little higher on the exit side and does not match the conveyor of the inspection device in the next process. Therefore, on the exit side of the main conveyor,
An outlet feeder must be installed that slopes downward in the direction of travel.

By the way, when a printed circuit board soldered with a soldering machine is carried out from a main conveyor that is inclined upward in the direction of travel, it must be placed on a receiving conveyor that is inclined at the same angle as the main conveyor before it can be delivered to the exit. Unable to transfer to feeder.

In other words, if the soldering device does not have a receiving conveyor, the printed circuit board after soldering will be carried out from the main conveyor at an angle, so that the final end of the printed circuit board held by the claws of the main conveyor will be Not only is there a risk that the final edge of the printed circuit board or the claws holding the final edge of the printed circuit board may be damaged, but the printed circuit board that is carried out in an upwardly slanted position may be placed at an exit with a drop. If it falls to the feeder, the shock may adversely affect the functionality of electronic components.

[0010] Therefore, in the above-mentioned soldering apparatus, a receiving conveyor is generally installed on the exit side of the main conveyor.

[0011]

[Problems to be Solved by the Invention] In the conventional soldering equipment as described above, a receiving conveyor is installed on the exit side of the main conveyor, which increases the overall size of the soldering equipment and requires a larger installation space within the factory. However, there were disadvantages such as the need for a large amount of structural material and the need for a large amount of structural material.

Furthermore, since the cooling device is installed below the main conveyor, the soldering device cannot be made larger due to constraints such as installation location and structural materials, so the cooling area of the cooling device is also long. I couldn't get it.

If the cooling range is short, the printed circuit board will not be cooled sufficiently after soldering, and the solder attached to the printed circuit board will be carried out in a semi-molten state or even if it solidifies, it will be carried out while it is still at a high temperature. Vibration during operation may cause accidents such as cracking of the solder or peeling of the soldered parts.

[0014] The object of the present invention is to make it possible to transfer soldered objects to the next process without damaging soldered attachments or the claws of the main conveyor after soldering, without having to install a receiving conveyor that would make the soldering equipment large. It is an object of the present invention to provide a soldering device which can perform soldering and also sufficiently cool objects to be soldered.

[0015]

[Means for Solving the Problems] The present inventors believe that if the functions of a receiving conveyor and an exit feeder can be combined into one device, the soldering device will not need to be made larger than necessary, and the cooling device will not be necessary. The present invention was completed based on the fact that if the solder attachment is moved in accordance with the movement of the solder attachment, the cooling time can be lengthened and the solder attachment can be sufficiently cooled.

The soldering apparatus of the present invention is a soldering apparatus in which soldering is carried out while conveying objects to be soldered by a main conveyor, in which a lift conveyor for transferring objects to be soldered to the next process is moved up and down on the exit side of the main conveyor. The lift conveyor is movably installed, and the lift conveyor is equipped with a cooling device for cooling the objects to be soldered.

[0017]

[Operation] Therefore, according to the soldering device of the present invention, there is no need for a receiving conveyor that was required in conventional devices, so the soldering attachments can be transferred smoothly to the next process without increasing the size of the entire device. can be done. Also,
Since the objects to be soldered can be cooled while being transferred on the lift conveyor, the objects to be soldered can be sufficiently cooled.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the soldering apparatus of the present invention will be explained below according to the illustrated embodiments. In the illustrated embodiment, the present invention is applied to a soldering device for printed circuit boards.

In the figure, 1 is a soldering device, 2 is a box-shaped outer casing, and soldering processing equipment such as a fluxer 3, a preheater 4, a soldering bath 5, etc. are arranged in the outer casing 2. ing.

A main conveyor 6 is arranged above the soldering processing equipment 3, 4, 5 at an appropriate conveyance angle. The main conveyor 6 includes a pair of frames (only one is shown in the figure) 7, a chain 8 that is movably supported by the frame 7, and is moved by a drive unit (not shown), and a large number of frames supported by the chain 8. nail 9
, 9,...

An entrance feeder 10 is installed on the entrance side of the main conveyor 6. The inlet feeder 10 receives a printed circuit board 12 from a conveyor in a process before soldering, for example, a conveyor 11 of a component mounting device.

Furthermore, a lift conveyor 13 is installed on the exit side of the main conveyor 6. lift conveyor 13
is designed to move up and down (in the direction shown by arrow B) by a lifting device (not shown), and at the upper limit position is located at the same height as the claws 9, 9, ... of the main conveyor 6. It is inclined at approximately the same angle as the conveyance angle. When the lift conveyor 13 reaches the lower limit position (the position indicated by the dotted line), it is positioned at the same height as a conveyor in the next process, for example, a conveyor 14 of an inspection device, and is in a substantially horizontal position.

This lift conveyor 13 is configured to travel in the direction shown by arrow C using power (not shown).

A cooling device 15 using, for example, a blower fan is attached to the lift conveyor 13, and the cooling device 15 moves up and down as the lift conveyor 13 moves up and down.

Although this embodiment shows the cooling device 15 installed below the lift conveyor, the cooling device can also be installed above the lift conveyor or both above and below the lift conveyor.

Next, soldering of the printed circuit board 12 using the soldering apparatus 1 of the present invention having the above configuration will be described.

The printed circuit board 12 conveyed by the conveyor 11 in the previous process is received by the entrance feeder 10 and transferred to the main conveyor 6.

The printed circuit board 12 is held between the claws 9, 9, . . . and 9, 9, . Preheating is performed in the solder tank 5, and molten solder 16 is attached in the solder bath 5.Then, the conveyor is moved to the lift conveyor 13, which is waiting at the upper limit position while the conveyor is running. Since the lift conveyor 13 is inclined at the same angle as the conveyance angle of the main conveyor 6 at the upper limit position, the printed circuit board 12 and the claws 9 of the main conveyor 6, 9, . . .
The printed circuit board 12 can be received without causing any harm to the user.

The lift conveyor 13 that has received the printed circuit board stops running and is lowered to the lower limit position (the position shown by the dotted line) by a lifting device (not shown) with the printed circuit board on it. During this time, the printed circuit board 12 is cooled by a cooling device 15 attached to the lift conveyor 13.

When the lift conveyor 13 reaches the lower limit position, the lift conveyor 13 starts running again, and the printed circuit board 12 is transferred to the conveyor 14 for the next process outside the outer casing 2. When the printed circuit board 12 is transferred to the conveyor 14 for the next process, the lift conveyor 13 rises and returns to the upper limit position to receive the printed circuit board 12 that is then carried out by the main conveyor 6.

[0031]

Effects of the Invention The soldering device of the present invention is a soldering device that performs soldering while conveying objects to be soldered on a main conveyor, and a lift conveyor that transfers objects to be soldered to the next process on the exit side of the main conveyor. is installed so as to be movable up and down, and the lift conveyor is provided with a cooling device for cooling the objects to be soldered.

Therefore, in the soldering apparatus of the present invention, since the lift conveyor has the functions of a conventional receiving conveyor and an exit feeder, the soldering apparatus can be made smaller accordingly, reducing the installation area, structural materials, etc. Not only does it have an economical effect, but since it allows the soldered object to be cooled down for a long time after soldering, it also has an excellent effect in terms of reliability by preventing cracking or peeling of the soldered part. play.

[0033] The specific shapes and structures shown in the above embodiments are merely examples of embodiments of the present invention, and the technical scope of the present invention is not limited by these. It is not intended to be interpreted as such.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view showing an embodiment of a soldering apparatus according to the present invention.

[Explanation of symbols]

1 Soldering equipment 6 Main conveyor 12 Solderable accessories 13 Lift conveyor 15 Cooling device

Claims (1)

[Claims] [Claim 1] A soldering device that performs soldering while conveying objects to be soldered on a main conveyor,
Soldering characterized in that a lift conveyor for transferring objects to be soldered to the next process is movably installed on the exit side of the main conveyor, and a cooling device for cooling the objects to be soldered is provided on the lift conveyor. Device.