JPH0726052Y2 - Automatic soldering equipment - Google Patents

Description

[Detailed description of the device]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for automatically soldering a circuit board.

[Prior art]

2. Description of the Related Art Conventionally, in order to manufacture an electronic circuit, a circuit diagram whose design has been completed is printed on a raw material substrate by a photographic method, etching is performed, and then soldering is performed. The device used for this soldering has a brazing bath a and a blowing means therein, and the brazing bath a is provided with a pair of sliding rails b, and a lifting frame c is provided above the sliding rails. The elevating frame is moved up and down by the air cylinder d behind the wax bath (see FIG. 11), and the circuit board g is fixed by the hanger e and the fastener f above the elevating frame (twelfth). (See the figure), soldering is performed to prevent the circuit board from falling off during operation.

[Problems to be solved by the device]

However, since the above-mentioned steps of raising and lowering, fixing and removing the circuit board are all performed manually, there is a disadvantage that time is wasted in production. Therefore, an object of the present invention is to provide a soldering device capable of performing a pre-process completely automatically.

[Means for Solving the Problems]

In order to achieve the above object, an automatic soldering apparatus according to the present invention has a brazing bath, a conveying means, a holding means, an opening means, a rotating means, and an elevating mechanism, and the brazing bath is made of a heat-resistant material in a box shape. And a means for accommodating the wax melted by high heat, and spraying means for removing excess solder on the circuit board pulled up from the wax bath are provided before and after the vicinity of the opening of the upper surface. Arranged before and after the wax bath, the circuit board is intermittently conveyed at a fixed timing,
The front transport means transports the circuit board closer to the front portion of the upper opening of the wax bath, and the rear transport means transports the circuit board away from the rear portion of the upper opening, and the sandwiching means radially extends from the central axis. A plurality of pairs of openable and closable upper and lower clamps extending between the upper and lower clamps, which holds the circuit board by the urging force of a spring, and the opening means are provided in front and rear of the vicinity of the upper opening of the wax bath, respectively. The holding means opens the holding means against the biasing force of the spring when the holding means becomes horizontal near the opening of the upper surface, and the rotating means includes a pair of upper and lower clamps for holding the holding means. Is intermittently rotated by a predetermined angle corresponding to the number of, and the lifting mechanism is such that every time the holding means is rotated by the predetermined angle, the holding means holds the rotating plate submerged in the wax bath. Until Drop-off, and is characterized by increasing the clamping means in a state of sandwiching the circuit board to the rotatable position on the central axis.

[Action]

The front transportation means of the transportation means transports the circuit board, which has not been soldered yet, toward the front portion of the upper opening of the brazing bath. The holding means causes the conveyed circuit board to enter between the pair of upper and lower clamps. The opening means maintains the upper and lower clamps in an open state, and when the circuit board enters, the upper and lower clamps are closed to hold the circuit board. The elevating mechanism raises the circuit board holding means that holds the circuit board. The rotating means rotates the lifted holding means by a predetermined angle. The lifting mechanism lowers the holding means to sink the held circuit board into the wax bath. It rises again and is rotated by a predetermined angle by the rotating means, and in the horizontal state, the holding means is opened by the opening means, and the circuit board is conveyed rearward by the rear conveying means.

【Example】

Next, an embodiment of the present invention will be described with reference to the drawings. The apparatus of the embodiment has a wax bath 1, an opening means 2, a conveying means 3a3b, a holding means 4, a lifting mechanism 5, and a rotating means 7 as main components. The brazing bath 1 comprises a brazing groove 11, a spraying means 12, and an angle material.
It consists of 13. The brazing groove 11 is formed by forming the brazing bath 1 into a box shape, and the outer shell of the brazing container is made of a material that can withstand high heat to accommodate the brazing (Su-Pb alloy) melted at high temperature. can do. Double spraying means 12 are provided on both front and rear sides of the upper end opening of the brazing melt groove. The spraying means 12 is used to promptly blow off the excess brazing material on the circuit board 6 when the circuit board 6 has been soldered and pulled out from the brazing groove 11. Angle members 13 are attached to the outside of the front and rear sides of the opening of the brazing and melting groove 11 in order to attach the opening means 2. The case 21 of the opening means has the brazing groove 11 on the angle material 13.
It is mounted so as to extend in parallel with the longitudinal direction of the, and in the case 21 of the opening means, as shown in FIGS. 3A and 3B, a sideways air cylinder 22, a descending air cylinder 23, and an ascending air cylinder 24. have. The descending air cylinder 23 has a groove 230 in the head of the rod. The horizontal air cylinder 22 is connected to a sliding member 25, and several sets of descending air cylinders 23 are attached to the upper side of the sliding member 25 so that the descending air cylinders can move left and right synchronously. Has been done. As the conveying means 3a, 3b, a belt conveyor or any other suitable means for conveying the circuit board 6 is used, of which the front conveying means 3a
The circuit board 6 which has not been soldered yet is brought close to the upper surface opening of the brazing groove 11 of the brazing bath 1 in a horizontal state and conveyed. The rear transport means 3b is used to transport the circuit board 6'after soldering away from the vicinity of the upper opening of the brazing groove. The holding means 4 includes a main shaft 41, a support arm 40, and a lower clamp 4
3. It consists of the upper clamp 44. The main shaft 41 is formed in the shape of a square rod, and both ends in the longitudinal direction thereof are formed in the shape of a circular rod, and penetrate the support column 51 of the elevating mechanism and the rotating means 7. The main shaft 41 has short support arms 42 protruding in four directions at several positions in the longitudinal direction. Each support arm 42
Has a protrusion 421 projecting to both upper and lower sides in the middle portion, and has a pin insertion hole 422 at the tip side of the protrusion with respect to the protrusion. The pin insertion hole is used for riveting the fixing pin 423. The lower clamp 43 is formed in a substantially trapezoidal plate shape, and has a recess 431 into which the protrusion 421 of the support arm 42 is fitted. When the protrusion 421 is fitted in the recess 431, the lower clamp 43 can swing about the protrusion 421 as a fulcrum. The lower lamp 43 also has a screw rod 432 projecting upward at a position close to the support arm 42, and a positioning pin near the tip, and a projection projecting laterally near the pin 433. It has 434 and is fitted into the groove 230 of the descending air cylinder 23 from the projection 434. Similarly to the lower clamp 43, the upper clamp 44 is also formed in a plate shape of a trapezoid, and has a recess 441 into which the protrusion 421 of the support arm 42 is fitted on the base side, for penetrating the screw rod 432 of the lower clamp 43. It has a circular hole 442. The threaded rod 432 penetrates the circular hole 442 and then penetrates the coil spring 445, and the nut 446 is screwed together to sandwich the upper and lower clamps 43 and 44 and to support the main shaft 41.
The tip of the upper clamp 44 is the positioning pin of the lower clamp 43.
Positioning 443 is provided at a position corresponding to 433 so as to penetrate it. The upper clamp 44 also has a protrusion 444 protruding laterally near the positioning hole 443. This protrusion is used for lifting air cylinder 24
Corresponds to the top of. The lifting mechanism 5 has left and right columns 51 and 52 and a transmission means 53. The left support column 51 is erected upward from the left side of the brazing groove 11, has a vertical hole 511 on its side surface, and has two sliding rails 512 on the inner surface of the left support column 51. A chain connector 410 of is installed in place. Post 51
A sliding guide 513 is provided on the outer side of the front and rear of the movable motor frame 514 to which a movable motor frame 514 is slidably fixed in a fixed direction, and a movable motor 515 is attached to the upper side of the movable motor frame 514. The drive shaft of the movable motor 515 is the rotary shaft 4.
Is connected to the main shaft 41 of the rotating means 7. A fixed motor 417 is attached to the upper part of the left column 51.
The right strut 52 also has two similar sliding rails 520 to which the right chain connector 410 is attached. The transmission means is provided on the upper end of the left support column 51, and the fixed motor
A gear shaft 531 extends from 517 to the upper end of the left column 52, upper gears 532 are provided on both sides of the gear shaft 531, and lower gears 533 are also provided on the lower ends of the left and right columns 51, 52.
A chain is installed between the upper and lower gears 532 and 533 on the left and right sides.
The transmission means is configured by winding 534, and the chain coupler 410 pulls the rotating shaft 4 to move it up and down. Next, the operation of the above configuration will be described with reference to FIGS. 7 to 9. FIG. 7 is a first operation diagram. In this state, the lateral air cylinder 22 of the opening means 2 is activated, and the descending air cylinder 22 is activated.
The protrusion 434 of the lower 7 lamp 43 is fitted into the groove 230 of 23, and the air cylinder 22 is activated to firmly push the lifting cylinder 24 upward and the upper clamp 44 upward.
At the same time, the descending air cylinder 23 pulls the lower clamp 43 downward. Therefore, the upper and lower clamps 44 and 43 are opened, and the circuit board 6 which has not been soldered yet is conveyed between the upper and lower clamps by the conveyance of the front conveying means 3a, and is fixed and fixed by the positioning pin 433. After that, the rods that move the upper ends of both cylinders 23 and 24 are loosened, and the upper and lower clamps 43 and 44 are strongly approached by the restoring force of the spring 445 to securely hold the circuit board 6. Furthermore, the fixed motor 517 is started, the rotation shaft 40 and the circuit board 6 are raised at the same time as the left and right gears 532, the transmission of the chain 534, and the combined action of the chain coupling 410 and the slide rails 512 and 520 of the support pillar, Start the spraying means 12,
When the excess wax above the circuit board is wiped out cleanly, and the movable motor 515 also rises along the sliding guide 520 in synchronization with the rotating shaft 4 and the holding means 4 is raised to the normal position, the rotating means 7 is removed. After starting, the rotary shaft body is rotated 90 degrees so that the circuit board that has not been soldered faces downward and the circuit board that has been soldered faces the upper unload position. As shown in FIG. 8 and further as shown in FIG.
The soldering process proceeds with 41 directed downward, and after the soldering process is raised, it is rotated by a predetermined angle as shown in FIG. 10 and returns to the state shown in FIG. ,
The circuit board 6'after soldering is placed on the rear transport means 3b. After that, the same steps are cyclically performed, and the circuit board is automatically transported, soldered, excess solder is removed, and unloading is performed. Therefore, the production efficiency is remarkably improved. Further, according to the present invention, by the holding action of the holding means 4, a combination of the transmission of the fixed motor 517 and the rotation of the movable motor 515 makes it possible to completely automate the transportation, the soldering, the elimination of the excess brazing, the unloading and the like. It is possible to prevent waste of labor.

[Effect of device]

As described above, according to the device of the present invention, the soldering to the circuit board can be performed automatically and efficiently.

[Brief description of drawings]

1 to 10 show one embodiment of the device of the present invention. FIG. 1 is a perspective view of the entire device, FIG. 2 is a perspective view of the holding means, and FIG. 3 is the holding means. 4 is an exploded perspective view of FIG.
FIG. 5 is an external perspective view of the opening means, FIG. 5 is a longitudinal sectional view of the opening means, FIG. 6 is a lateral sectional view of the same, FIG. 7 is an inside side view of a part of the lifting mechanism, and FIG. FIG. 9 is a sectional view showing a state in a step, FIG. 9 is a sectional view showing a state in the next operation step, and FIG. 10 is a sectional view showing a state in a further operation step. FIG. 11 is a partially cutaway perspective view showing a conventional device, and FIG. 12 is an enlarged view of a circuit board supporting means in the same device. 1 ... Wax bath, 2 ... Opening means, 23 ... Descent clamp, 24 ... Ascent clamp, 3a, 3b ... Conveying means, 4 ...
... Clamping means, 43 ... lower clamp, 44 ... upper clamp, 445 ... spring, 5 ... elevating mechanism, 6,6 '... circuit board.

Claims (1)

[Scope of utility model registration request] (A) A brazing bath, a carrying means, a holding means, an opening means, a rotating means, and an elevating mechanism. (B) The brazing bath is made of a heat-resistant material in the form of a box and melts at high heat. And a spraying means for removing excess braze on the circuit board pulled up from the brazing bath before and after the vicinity of the upper opening, and (c) the carrying means is the brazing bath. Are arranged before and after the circuit board to intermittently convey the circuit board at a fixed timing, the front conveying means conveys the circuit board closer to the front of the upper opening of the wax bath, and the rear conveying means conveys the upper surface. (D) The holding means is composed of a plurality of pairs of upper and lower openable and downwardly extending clamps extending in the radial direction from the central axis, and holds the circuit board by the urging force of a spring. (E) The opening means is Provided before and after the upper opening of the wax bath, and when the holding means is in a horizontal state near the upper opening, the holding means is opened against the biasing force of the spring. (F) The rotating means intermittently rotates the circuit board holding means by a predetermined angle corresponding to the number of pairs of upper and lower clamps. (G) In the elevating mechanism, the holding means uses the predetermined holding means. Each time it is rotated by an angle, the holding means is lowered until the circuit board held by the holding means is submerged in the wax bath, and the holding means in the state of holding the circuit board is rotatable about the central axis. Automatic soldering device that raises to the position.