JPH0249498A - Lead attached electronic component packaging device - Google Patents

Lead attached electronic component packaging device

Info

Publication number
JPH0249498A
JPH0249498A JP63200610A JP20061088A JPH0249498A JP H0249498 A JPH0249498 A JP H0249498A JP 63200610 A JP63200610 A JP 63200610A JP 20061088 A JP20061088 A JP 20061088A JP H0249498 A JPH0249498 A JP H0249498A
Authority
JP
Japan
Prior art keywords
component
lead
printed board
soldering
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63200610A
Other languages
Japanese (ja)
Inventor
Toshio Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63200610A priority Critical patent/JPH0249498A/en
Publication of JPH0249498A publication Critical patent/JPH0249498A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To shorten operating time and to enable the reduction of manpower by a method wherein a surface packaging process of electronic components provided with leads, which includes such processes as component feed, the formation of component leads, the positioning and the packaging of components onto a printed board, and the soldering of components, is automated.
CONSTITUTION: An X-Y table 9 is made to ascend higher than the level of conveyers 10 and 11 through a program so as to obtain a horizontal free movement. A soldering head 5 is made to move linearly as being guided by a horizontal beam 8 basing on a program and to stop at a position coincident with a fitted pattern of a printed board. A component chuck 6 is made to descend to position the tip of a lead 2a of an electronic component 2 on a pattern 12 of the printed board. The component 2 is kept as being held by the component chuck 6 of the head 5, a heating chip 7 descends on the lead 2a and executes reflow soldering as pressing against the lead 2a while a current is supplied to the heating chip 7. By this setup, the reduction of an operating time and manpower can be realized.
COPYRIGHT: (C)1990,JPO&Japio
JP63200610A 1988-08-11 1988-08-11 Lead attached electronic component packaging device Pending JPH0249498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63200610A JPH0249498A (en) 1988-08-11 1988-08-11 Lead attached electronic component packaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63200610A JPH0249498A (en) 1988-08-11 1988-08-11 Lead attached electronic component packaging device

Publications (1)

Publication Number Publication Date
JPH0249498A true JPH0249498A (en) 1990-02-19

Family

ID=16427229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63200610A Pending JPH0249498A (en) 1988-08-11 1988-08-11 Lead attached electronic component packaging device

Country Status (1)

Country Link
JP (1) JPH0249498A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014500631A (en) * 2010-12-23 2014-01-09 サンパワー コーポレイション Connecting solar cells
WO2014045370A1 (en) * 2012-09-20 2014-03-27 富士機械製造株式会社 Work machine for printed circuit boards and mounting method
CN105540217A (en) * 2016-01-22 2016-05-04 东莞市誉铭新精密技术股份有限公司 Component front positioning device of CCD checking machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014500631A (en) * 2010-12-23 2014-01-09 サンパワー コーポレイション Connecting solar cells
WO2014045370A1 (en) * 2012-09-20 2014-03-27 富士機械製造株式会社 Work machine for printed circuit boards and mounting method
CN105540217A (en) * 2016-01-22 2016-05-04 东莞市誉铭新精密技术股份有限公司 Component front positioning device of CCD checking machine
CN105540217B (en) * 2016-01-22 2018-03-20 东莞市誉铭新精密技术股份有限公司 The component front positioner of CCD detection machines

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