JP2004346391A - Plating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make a carrier device arranged in an upper part of a plating tank have a configuration of not moving up and down; to automatically transfer articles to be treated one by one between pretreatment and posttreatment tanks of the plating tank; and when transferring them, to make the article enter a treatment liquid while maintaining the article in an appropriate condition even if the article has an angular curve. <P>SOLUTION: This plating apparatus comprises the plating tank, the pretreatment and posttreatment tanks, a carrier means and a hoisting means for the article to be treated, a moving means linked with the hoisting means, and a hanger for transferring the article between the carrier means and the hoisting means while supporting the article. The carrier means is arranged along the upper side of the plating tank. The hoisting means is arranged along a charging portion in the treatment tanks or the plating tank and/or the exporting portion of the plating tank. The moving means are each arranged at an ascending position and a descending position of the hoisting means in a position for transferring the article between the carrier means and the hoisting means. The hanger holds and transports the article in a hanging-down state. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides, for example, an object to be processed such as a printed circuit board, in particular, a thin plate that is automatically put into a plating tank and conveyed, and the object to be processed is thinly and uniformly electroplated, and a variety of types (sizes) are provided. The present invention relates to a plating apparatus which can be used.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as a plating apparatus for plating an object to be processed such as a printed circuit board, for example, a transport device provided in a processing tank for performing pre-treatment and / or post-treatment of plating, and a transport device provided in a plating tank Are provided, and there is a case in which these are integrally formed and a case in which these are formed separately. The integrally formed one raises and lowers the entire transfer device, and pre-processes and / or post-processes the object to be processed. It is configured to transfer between the plating tank.
[0003]
Further, in the transfer device formed separately, the transfer device provided in the plating tank is not moved up and down, and only the transfer device provided in the processing tank for performing the pre-processing and the post-processing is raised and lowered. The transfer device that can be moved up and down is composed of a rail track for the pre-processing section, a rail track for the post-processing section, and a pushing body, and the transfer apparatus provided in the plating tank is a rail track for the plating section. And a toothed belt for a plating section disposed endlessly.
[0004]
When the object to be processed is subjected to the electroplating process, the rail track for the pre-processing part and the rail track for the post-processing part are entirely suspended in a state where a plurality of the objects are individually suspended via jigs. Simultaneously ascending and descending, the jig is pushed by a constant stroke by the pushing body both at the ascending position and at the descending position, and at the descending position, the workpiece is moved from the rail track for the preprocessing section to the rail track for the plating section, Alternatively, transfer is performed by intermittently transferring one by one from the rail track for the plating section to the rail track for the post-processing section.
[0005]
Further, in the plating tank, the engaging claws attached to the jig are engaged with the engaging teeth of the toothed belt for the plating part, and the belt is suspended from the jig by the driving drive of the toothed belt for the plating part. The workpiece to be processed, that is, the sheet-shaped strip product, is transported in a laterally serial transport state along the plating section rail while maintaining a predetermined narrow gap width where current is not excessively concentrated. This is an electroplating processing system in which electroplating is performed (see Patent Document 1).
[0006]
Further, in this known technique, transfer rails are provided in front of the pre-processing section rail track and after the post-processing section rail track, respectively, and the transfer apparatus is provided in a direction orthogonal to these transfer rails. In addition, the present invention has a configuration in which the transfer rail and the rail track for the plating section, and the transfer rail for returning the jig and the rail track for the jig return section are arranged in the target state, respectively.
[0007]
[Patent Document 1]
JP-A-2000-54197 (page 2, FIG. 3)
[0008]
[Problems to be solved by the invention]
However, in the known technique of Patent Literature 1, the rail track for the pre-processing section and the rail track for the post-processing section simultaneously move up and down with respect to the rail track for the plating section provided at the top of the plating tank. Since a plurality of objects to be processed are suspended on the rail tracks for pre-processing and post-processing, each time one of the objects is intermittently changed, the entire object is simultaneously lifted and lowered. By doing so, the processing liquid is repeatedly put in and out of each tank containing the processing liquid at a certain speed, and in particular, in the case of a processing target made of a thin film film, the processing liquid If the lower end of the thin plate is slightly bent at an angle when it is inserted inside, it will enter obliquely, causing a phenomenon that uniform contact with the processing liquid will not be made, and uniform processing over the entire surface will occur. It has a problem to say that there is no.
[0009]
Further, when one workpiece is changed, the rail track for the pre-processing section and the rail track for the post-processing section simultaneously move up and down, respectively, so that a plurality of workpieces repeatedly enter and exit the processing liquid. By doing so, the angular bending is promoted, and when the ascent is raised, all the pushing bodies operate at the same time, but when the ascent is lowered, only the pushing body located at the end must be operated. In addition, since it is unknown how the pushing body is driven, it is possible only by manual operation, and there is a problem that the transfer is not automatically performed.
[0010]
Further, since the object to be processed is attached to a jig provided with an engagement claw, the engagement claw of the jig is conveyed by engaging the engagement claw of the endless belt with a toothed belt for a plating section. There is a relatively large number of members for conveyance, which inevitably increases the amount of dust and the like generated from each belt and each rail track, and the dust and the like are removed from the plating tank, the pretreatment tank, and the There is a problem that it is mixed into the inside of the processing tank.
[0011]
Accordingly, in the conventional plating apparatus, the transfer device disposed above the plating tank is not moved up and down, and the transfer of the workpiece in the pre-processing and post-processing of the plating tank is automatically performed one by one. It is necessary to solve the problem so that it can be smoothly performed, and even if there is an angular bend at the time of transfer, it is possible to maintain the proper state of the object to be processed into the processing liquid and to enter the processing solution. Have issues that must be met.
[0012]
[Means for Solving the Problems]
As a specific means for solving the above-mentioned problems of the conventional example, the present invention is directed to a plating tank in which a plating solution is stored and an anode plate is disposed, and a pre- and post-treatment in which a processing solution for pre-processing and post-processing is stored. A tank, a means for transporting the object to be processed, a means for elevating and lowering the object to be processed, a moving means associated with the means for elevating and lowering, and a transfer between the transporting means and the elevating means supporting the object to be processed. A transfer hanger is provided along the upper side surface of the plating tank and at a predetermined interval, and the elevating means is provided with an input portion of the processing tank or the plating tank and / or the plating tank. The moving means is disposed at a transfer position between the transporting means and the elevating means, and at an ascending position and a descending position of the elevating means, respectively. And the hanger is It has an arm having a horizontal portion with a length and a hanging portion, and a clamp for a cathode is provided at the hanging portion of the arm, and the clamp holds the object to be processed in a hanging state from the pretreatment tank. It is an object of the present invention to provide a plating apparatus characterized in that a plating apparatus is automatically transferred to a plating tank and a post-treatment tank sequentially via an elevating unit, a moving unit, and a conveying unit, and then transferred and plated.
[0013]
In the present invention, a substantially V-shaped ejection pipe or oblique descending flow plate is provided at least in an input portion of the object to be processed in the plating tank and / or the processing tank; A movable shielding plate which is divided into predetermined lengths and moves up and down respectively is disposed in parallel with the transport direction of the workpiece; in the plating tank, the movable shield plate is parallel to the transport direction of the workpiece and A plurality of transport guide members inclined upward or downward along the transport direction of the workpiece are arranged in a plurality of rows; the transport guide members are divided into a plurality of pieces with a predetermined length, and the divided transport guide members are divided. A part of which overlaps; providing a suction pipe connected to a circulation pump at the lower side of the jet pipe or the inclined downflow plate to circulate a plating solution or a processing solution; It is included as a requirement.
[0014]
The plating apparatus according to the present invention is characterized in that the moving means is disposed at a transfer position between the transporting means and the elevating means and at the ascending position and the descending position of the elevating means, respectively. In addition, the change of the workpiece in the post-processing can be automatically and smoothly performed one by one.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, the present invention will be described in detail based on specific embodiments.
The plating apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a plan view schematically showing the apparatus, and FIG. 2 is a schematic view taken along line AA of FIG. 3 and 4 are a schematic enlarged cross-sectional view and a side view, respectively, of the transport unit.
[0016]
In these figures, a plating apparatus 1 includes a treatment tank 2 for performing a pre-processing and a post-treatment in a plating process, and a plating tank 3 for storing a plating solution and performing a plating process. And a post-treatment tank 2b containing a processing solution for post-treatment. The processing tank 2 may be either the pre-processing tank 2a or the post-processing tank 2b.
[0017]
Further, the plating apparatus 1 includes a transporting unit 4 for passing an object to be processed through the plating tank 3 for plating, an elevating unit 5 for transferring between the processing tank 2 and the plating tank 3, A hanger 6 that supports the object to be processed in a suspended state and is transported by the transporting means 4 and can be changed while holding the object to be processed by a lifting / lowering means 5; A roller 6a is attached to the side, and an arm 7 having a base side integrally fixed thereto is provided.
[0018]
The treatment by the pre-treatment tank 2a in the plating step includes, for example, degreasing, water washing and pickling, and the treatment by the post-treatment tank 2b in the plating step includes, for example, water washing with a shower and rust prevention treatment. is there.
[0019]
As shown in FIGS. 3 and 4, for example, the transporting means 4 has a pair of chains 4 a and 4 b arranged in parallel and endlessly with a common shaft 4 c in a length range substantially corresponding to the length of the plating tank 3. In addition, a work rail 8a is provided so as to be suspended and driven by a plurality of gear driving wheels 4d, and further provided with a work rail 8a in parallel with the driving means 4, and the work rail 8a is provided on the upper outer side surface of the plating tank 3. It is arranged along. A work rail 8b is also provided on the pretreatment tank 2a side.
[0020]
An elevating guide 9 is disposed on the elevating means 5 so as to be able to move up and down freely. The elevating guide 9 is moved up and down by an appropriate driving source, for example, a motor M installed at an upper part. Is driven while being hooked and held. Also, the hanger 6 held by the elevating guide 9 is provided with moving means 5a for moving the hanger 6 in the lateral direction near the ascending end position of the elevating guide 9 in a substantially parallel manner.
[0021]
As shown in FIG. 5, this moving means 5a is a so-called horizontally arranged bar-shaped or rail-shaped member, and is provided with a slide member 5b which reciprocates along the bar-shaped or rail-shaped member. The slide member 5b is formed with a claw portion 5c that works in only one direction. Then, the slide member 5b reciprocates via a cord-like tension member 5e suspended on both sides of the reel 5d driven by an appropriate drive source, and the claw portion 5c is placed above the hanger 6 held by the lifting guide 9. It acts and moves in the lateral direction.
[0022]
In addition, the transfer of the hanger 6 to the transporting means 4 by lowering the elevating guide 9 is, in effect, to move the hanger 6 in the lateral direction, so that the one having substantially the same structure as the moving means 5a is used. Therefore, since the description is duplicated, the details of the respective components are omitted, but as shown in FIG. 4, the components are attached so that the claws 5c face upward adjacent to the end of the transporting means 4. And the claw part 5c acts on the lower part of the hanger 6 and moves in the horizontal direction.
[0023]
The hanger 6 is provided with a locking projection 6b for transmitting power on the side opposite to the arm 7, and the arm 7 is formed with a horizontal portion 7a and a hanging portion 7b on a free end side. A clamp 10 for the cathode is attached to an end of the hanging portion 7b, and the object to be processed 11 is held by the clamp 10 for the cathode to maintain the hanging state. As the object 11 to be processed, for example, a relatively thin film-like or thin-plate-like printed board can be used.
[0024]
When the hanger 6 is located on the transporting means 4 side, the roller 6a abuts on the work rail 8a, and the locking projection 6b is locked on the shaft 4c between the pair of chains 4a, 4b. Then, the roller 6a rolls and can move horizontally by driving the chain. When the hanger 6 is located on the processing tank 2 side, the roller 6a comes into contact with the work rail 8b provided together with the lifting / lowering means 5 to roll and move horizontally.
[0025]
Next, the operation will be described with reference to FIGS. 6 to 8. FIG. 6 shows a pre-treatment tank 2 a, a post-treatment tank 2 b, and a plating tank 3 of the plating apparatus 1. FIG. 7 is a cross-sectional view schematically illustrating the plating tank 3 and the post-treatment tank 2b. FIG. 8 is a schematic side view of a main part for explaining a transfer state of the hanger 6.
[0026]
Therefore, the elevating guide 9 provided in the elevating means 5 so as to be able to ascend and descend can be moved along the pretreatment tank 2a to the loading part 3a of the plating tank 3 and the unloading part 3b of the plating tank 3 to the post-treatment tank 2b. The moving means 5a are also provided at the upper part of the elevating means 5 and at both ends of the transport means 4, respectively.
[0027]
The elevating guide 9 provided in the elevating means 5 transfers the object 11 between the processing tanks provided in the pre-processing tank 2a and the post-processing tank 2b and between the pre-processing tank 2a and the plating tank 3. When moving between the plating tank 3 and the post-treatment tank 2b, the lifting means 5 moves up and down in the vertical direction, and when the lifting guide 9 reaches the ascending position and the descending position, the movement is detected. 5a operates to move the hanger 6 in the horizontal direction.
[0028]
The hanger 6, which is raised and lowered and horizontally conveyed by the lifting guide 9, and the arm 7 attached to the hanger 6 are appropriately raised and lowered in each processing tank, and are moved to the upper position as shown in the locus 7c of the arm in FIG. Or it is conveyed horizontally at the lower position.
[0029]
First, in the pretreatment tank 2a, the hanger 6 is hooked to the elevating guide 9, and the object to be processed 11 is sandwiched and supplied to the clip 10 of the arm 7 in a suspended state. The pre-treatment is performed by immersion in the treatment liquid stored in 2a. In this pre-processing step, there are a plurality of processing tanks, and the pre-processing is performed while sequentially feeding from the end processing tank. The hangers 6 are sequentially fed one by one to the position corresponding to each processing tank by 5a.
[0030]
The object 11 processed in the pretreatment tank 2a is then moved to the plating tank 3, and the movement is not at the same pitch as in the forward feeding in the pretreatment tank 2a, but in substantially the same manner. When the elevating guide 9 moves up, the moving means 5a acts on the hanger 6 suspending the workpiece 11 for which the pretreatment process has been completed, and the plating is performed. The tank 3 is moved laterally to a position corresponding to the input section 3a.
[0031]
At this moved position, the workpiece 11 is loaded into the loading section 3 a of the plating tank 3 by lowering the lifting guide 9. The moving means 5a disposed on the lower side at the lowering point of the elevating guide 9 is driven at the lowering point of the elevating guide 9 to move the hanger 6 suspended from the elevating guide 9 in the lateral direction. 8a, and the engaging projection 6b of the hanger 6 is engaged with the shaft 4c between the pair of chains 4a, 4b as the transport means 4, whereby the hanger 6 moves along the work rail 8a, The object to be processed 11 sandwiched by the cathode clamp 10 attached to the end of the arm 7 is immersed in the plating solution stored in the plating tank 3 and transported to the unloading section 3b.
[0032]
In the plating tank 3, a plating solution is stored, and an anode plate 12 is provided along both wall surfaces. Since the anode plate 12 is located in parallel with the workpiece 11, the plating tank 3 While moving in the inside, both surfaces of the object 11 to be processed held between the cathode clamps 10 can be uniformly plated.
[0033]
Further, in the plating tank 3, as shown in FIG. 2, a plurality of ejection pipes 13 are arranged on both sides of the processing target 11 in parallel along the transport direction of the processing target 11, Since a plurality of ejection nozzles 13 a provided in the ejection pipe 13 continuously eject the plating solution to both surfaces of the object 11, a new plating solution always comes into contact with the object 11, and a high plating solution is applied. The plating process can be performed efficiently and stably, and the difference in plating thickness due to the density of the plating solution can be reduced, and the plating process can be performed uniformly.
[0034]
As shown in FIGS. 7 and 8, the processed object 11 after the plating process is carried out of the plating tank 3 and transferred to the post-processing tank 2b. At the rear end side, the elevating guide 9 descends, and when the lowering point is reached, the moving means 5a disposed on the lower side is driven, and the claw portion 5c of the slide member 5b is conveyed by the conveying means 4 to the plating process. The processed object 11 acts on the lower part of the suspended hanger 6 to move in the lateral direction, and the hanger 6 is smoothly transferred to the lifting guide 9.
[0035]
The hanger 6 changed in this way is pulled out of the plating tank 3 with the elevation of the elevating guide 9 together with the object 11 to be processed, and when the elevating guide 9 reaches the ascent point, the hanger 6 is disposed at the top. The means 5a is driven, and the claw portion 5c of the slide member 5b acts on the upper part of the hanger 6 to move in the horizontal direction, and to the position corresponding to the post-processing tank 2b. In this position, when the elevating guide 9 is lowered again, on the one hand, the plated hanger 6 is received from the plating tank 3, and on the other hand, the plated hanger 6 is transferred to the post-processing tank 2b. It is post-processed.
[0036]
In any case, the front and rear processing tanks 2 and plating tanks 3, and the transporting means 4, the elevating means 5 and the moving means 5a are provided so as to connect the processing units with predetermined intervals, respectively. The workpiece 11 held by the cathode clamp 10 attached to the arm 7 of the hanger 6 which is moved or conveyed by the means 4 and the lifting / lowering means 5 is automatically transferred between the processing units. As a result, work efficiency is significantly improved.
[0037]
Further, a second embodiment according to the present invention will be described with reference to FIGS. Note that the basic configuration is the same as that of the first embodiment, so that a specific overall illustration of this embodiment is omitted and a new configuration is added to FIG. I do.
[0038]
FIG. 9 is a side view schematically showing the inside of the plating tank 3, and FIG. 10 is a schematic sectional view thereof. On the lower side in the plating tank 3, a movable shielding plate divided into a predetermined length in parallel with the transport direction (arrow a) on both sides of the workpiece 11 inside the anode plate 12 and the ejection pipe 13. A cover plate 17 for protecting the movable shielding plate 16 is provided near the outside of the movable shielding plate 16.
[0039]
9A to 9C show a state in which the object 11 is conveyed with the passage of time in the conveying direction, and FIG. 10A shows the depth of the object 11. FIG. 10B shows a state in which the movable shield plate 16 is housed at the same level as the cover plate 17 when the length in the direction is long. In FIG. Is short, and the state in which the movable shielding plate 16 has slid upward from the cover plate 17 is shown.
[0040]
When the length of the processing target 11 in the depth direction is long, the movable shielding plate 16 is located below the same level as the cover plate 17 and the length of the processing target 11 in the depth direction is small. If it is short, it is slid upward from the cover plate 17 to block a part (lower side) of the current 18 from the anode plate 12 and to keep the current transmitted to the object 11 constant. In addition, the plating of the object 11 is made uniform.
[0041]
As described above, by disposing the movable shielding plate 16 that moves up and down in accordance with the size (length in the vertical direction) of the processing target 11, the processing target 11 can be uniformly plated. By dividing the movable shielding plate 16 into a predetermined length, for example, by using only one dummy plate 11a, it is possible to correspond to the workpiece 11 having a different length. It can be adapted. That is, the vertical movement of the movable shielding plate 16 may be controlled by suspending the dummy plate 11a on the hanger 6 and detecting the passage of the hanger 6 with the dummy plate 11a.
[0042]
Further, FIG. 11 schematically shows a state in which the transport guide member 19 is mounted inside the plating tank 3. That is, inside the plating tank 3, a flat plate or a rod-like member that is parallel to the transport direction of the workpiece 11 (arrow a) and is inclined downward along the transport direction of the workpiece 11 inside the ejection pipe 13. The transport guide members 19 are arranged in a plurality of rows. Note that the transport guide member 19 may be inclined upward along the transport direction of the workpiece 11.
[0043]
The transport guide member 19 is divided into a plurality of portions having a predetermined length, and a part (front and rear end portions) of the divided transport guide members 19 is overlapped with each other to convey the workpiece 11 in an orderly manner and to carry out a plating solution. , That is, stirring is performed so that the flow of the plating solution is not in a certain direction, so that it is possible to prevent a stripe pattern from being generated on the object 11 due to the plating process.
[0044]
FIGS. 12 and 13 show a plating apparatus according to a third embodiment of the present invention. Also in this embodiment, the basic configuration is the same as that of the first embodiment, and therefore, a detailed description of the embodiment will be omitted.
[0045]
FIG. 12 is a side view schematically showing the inside of the plating tank, and FIG. 13 is a sectional view thereof. In the third embodiment, the movable shield plate 16 of the second embodiment is a float type, and the other configuration is the same as that of the second embodiment. Therefore, the same portions are denoted by the same reference numerals and described, and detailed description thereof will be omitted.
[0046]
In the third embodiment, the movable shielding plate 16 and the float 21 are connected via the support shaft 20. The float 21 raises and lowers the movable shielding plate 16 by being pressed by an appropriate pressing plate 22. In this case, the push plate 22 moves up and down by appropriate means, for example, air or the like, and is driven by passing through the dummy plate 11a.
[0047]
Although not shown, for example, a push plate formed by bending the tip upward with a gentle curved surface at a predetermined length can also be used, and the mounting position is set at the length of the workpiece 11 with the dummy plate 11a as a boundary. By setting correspondingly, for example, by attaching to the hanger 6 or the like and moving it along with the transfer of the processing object 11, the float 21 is sequentially moved up and down to move the movable shielding plate 16 up and down. Also, the plating of the object to be processed 11 is made uniform.
[0048]
FIG. 14 shows a main part of a plating apparatus according to a fourth embodiment of the present invention. Also in this embodiment, since the basic configuration is the same as that of the first embodiment, a specific overall illustration of the embodiment is omitted, and only main parts are shown. explain.
[0049]
In this embodiment, the configuration of the ejection pipe 13 according to the first embodiment is improved, and the arrangement position and the like in the plating tank 3 are exactly the same.
The improved ejection pipe 23 is a pair of ejection pipes 23a and 23b, each of which is formed by bending its upper part outward and forming the pair of upper parts in a substantially V-shape.
[0050]
The pair of substantially V-shaped ejection pipes 23a and 23b are disposed at least at the portion of the plating tank 3 where the workpiece 11 is charged. May be provided. The plating liquid is also ejected from a substantially V-shaped upper side in a direction substantially perpendicular to the transport direction a of the workpiece 11.
[0051]
In this way, by disposing the ejection pipes 23a and 23b having the upper portions formed in a substantially V shape at least at the portion of the plating tank 3 where the article 11 is charged, the article 11 to be treated is particularly thin. Also, even if the input angle or the lower end angle of the object 11 is shifted, the object 11 can be immediately guided to the center of the ejection pipes 23a and 23b by the ejected plating solution. The workpiece 11 can be smoothly and stably put into the plating tank 3 in a stable state without requiring a holding jig and a pinching mechanism for the workpiece 11, thereby reducing costs.
[0052]
15 and 16 show a main part of a plating apparatus according to a fifth embodiment of the present invention. Also in this embodiment, since the basic configuration is the same as that of the first embodiment, a specific overall illustration of the embodiment is omitted, and only main parts are shown. explain.
[0053]
In this embodiment, a part of the plating tank 3 into which the workpiece 11 is charged is mainly improved. FIG. 15 is a perspective view showing only a main part, and a side view of the plating tank 3 at the charging part is schematically shown. FIG.
[0054]
In the drawing, a kind of rectifying member 31 is disposed inside a plating tank 3 in a plating apparatus, particularly, at a charging portion of a workpiece 11, and the rectifying member 31 is a pair of oblique descending flow plates. 31a and 31b. The other configuration is the same as that of the first embodiment, so that illustration and description are omitted.
[0055]
The pair of obliquely descending flow plates 31a and 31b constituting the rectifying member 31 has an upper side formed in a substantially V-shape, and the obliquely descending flow plates 31a and 31b are moved in the conveying direction of the workpiece 11. a, and a jet pipe 32 is provided along the vicinity of the upper end of the obliquely descending flow plates 31a, 31b. A liquid pipe 33 is provided, and an appropriate circulation pump is interposed between the ejection pipe 32 and the liquid suction pipe 33, and the plating solution sucked through the liquid suction pipe 33 is ejected from the ejection pipe 32 to descend obliquely. And circulate.
[0056]
As described above, by disposing the substantially V-shaped obliquely descending flow plates 31a and 31b in the plating tank 3, even if the object to be processed 11 is a thin film, Even if the input angle of 11 or the angle on the lower end side is shifted, the object to be processed 11 can be quickly guided to the center of the obliquely descending flow plates 31a and 31b by the obliquely descending plating solution that has been circulated and ejected. The workpiece 11 can be stably put into the plating tank 3 without the need for the holding jig / sandwich mechanism 11, and the cost can be reduced.
[0057]
Further, the ejection pipes 23a and 23b according to the fourth embodiment and the oblique descending flow plates 31a and 31b according to the fifth embodiment may be disposed in the front and rear processing tanks 2. Incidentally, in order to clarify what the state added to the pretreatment tank 2a is, as an example, a state in which the rectifying member 31 is attached is shown in FIG. 2 according to the first embodiment. is there.
[0058]
In any case, in the processing tank 2 and the plating tank 3 before and after the partitioning, the moving means 5a and the transporting means 4 are made independent and driven in relation to each other, so that the object 11 is moved forward and backward. The transfer between the plating tank 2 and the plating tank 3 can be performed automatically and smoothly, and even if the sizes of the objects to be processed 11 are different, the operation of the apparatus is not stopped and the apparatus can be continuously operated. The treatment can be performed uniformly. Further, in both the treatment tank 2 and the plating tank 3, a so-called rectifying member is provided at a portion where the object to be treated 11 is charged, so that an angular bend is caused at the time of transfer. Even if it does, the object to be processed can enter and stay in the processing liquid while maintaining an appropriate state.
[0059]
In addition, since the moving unit 5a and the conveying unit 4 are made independent, the moving unit 5a can be adjusted in accordance with the speed of the conveying unit 4, so that the immersion time of the object 11 in the processing liquid can be freely controlled. Since the transporting means 4 is disposed at a predetermined interval on the upper side surface of the processing tank 2 and the plating tank 3 instead of at the upper central part, dust generated by driving or sliding of the transporting means 4 is removed. It is not mixed into the processing tank 2 and the plating tank 3.
[0060]
【The invention's effect】
As described above, the plating apparatus according to the present invention includes a plating tank in which a plating solution is stored and an anode plate is disposed, and a pre- and post-treatment tank in which a processing solution for pre-processing and post-processing is stored. An object conveying means, an object elevating means, a moving means associated with the elevating means, and a hanger which supports the object and can be switched between the conveying means and the elevating means. Wherein the transporting means is disposed at a predetermined interval along the upper side surface of the plating tank, and the elevating means is configured to carry out the treatment tank or the charging section of the plating tank and / or carry out the plating tank. The moving means is provided at a transfer position between the transport means and the elevating means, and at an ascending position and a descending position of the elevating means, respectively. , The hanger has a required length It has an arm having a flat part and a hanging part, a clamp for a cathode is provided on the hanging part of the arm, and the clamp holds the object to be processed in a hanging state. By sequentially transferring to the post-treatment tank via the lifting / lowering means, the moving means, and the transfer means, and carrying and plating, the transfer of the workpiece in the pre-treatment and post-treatment of the plating treatment tank can be performed. This is an excellent effect that the plating operation can be performed efficiently and automatically one by one.
[0061]
Further, in the present invention, in the plating tank and / or the processing tank, an ejection pipe or an oblique descending flow plate formed in a substantially V-shape is provided at least at a charging portion of the object to be processed. Even if the input angle or the lower end angle of the processing object is deviated, it can be said that the processing object can be promptly penetrated into the processing solution in the center of the plating tank or the processing tank while maintaining an appropriate state. It has excellent effects.
[Brief description of the drawings]
FIG. 1 is a plan view schematically showing a plating apparatus according to a first embodiment of the present invention.
FIG. 2 is a sectional view taken along line AA of FIG.
FIG. 3 is a sectional view schematically showing only a main part of the plating apparatus.
FIG. 4 is a schematic side view of a main part showing a relationship between a conveying means and a moving means in the plating apparatus.
FIG. 5 is a schematic side view of a main part showing a relationship between a lifting unit and a moving unit in the plating apparatus.
FIG. 6 is a cross-sectional view schematically showing a pretreatment tank, a post-treatment tank, and a plating tank arranged linearly in order to easily explain the plating apparatus.
FIG. 7 is a cross-sectional view schematically showing, in an enlarged manner, a part of a plating tank and a post-treatment tank in order to explain a situation in which an object to be processed is changed in the plating apparatus.
FIG. 8 is a side view showing, in an enlarged manner, a main portion of the plating apparatus at a transfer position of a workpiece.
FIG. 9 is a plating apparatus according to a second embodiment of the present invention, in which a basic configuration of a plating tank is shown in a block diagram, and (a) to (c) are side views showing an operation state thereof. It is.
FIGS. 10A and 10B are cross-sectional views schematically showing operation states of a movable shielding plate in a plating tank of the plating apparatus.
FIG. 11 is a cross-sectional view schematically showing another main part in the plating tank of the plating apparatus.
FIG. 12 is a side view schematically showing a basic configuration of a plating tank in a plating apparatus according to a third embodiment of the present invention.
FIGS. 13A and 13B are cross-sectional views schematically showing operation states of a movable shielding plate in a plating tank of the plating apparatus.
FIG. 14 is a perspective view schematically showing a jet pipe used by being attached to the inside of a plating tank in a plating apparatus according to a fourth embodiment of the present invention.
FIG. 15 is a perspective view schematically showing an oblique descending flow plate used by being attached to the inside of a plating tank in a plating apparatus according to a fifth embodiment of the present invention.
FIG. 16 is a side view schematically showing the inside of the plating tank in the plating tank of the plating apparatus.
[Explanation of symbols]
1 Plating equipment
2 Processing tank
2a Pretreatment tank for plating
2b Post-treatment bath for plating
3 Plating tank
4 Transport means
4a, 4b chain
4c axis
4d gear drive wheels
5 lifting means
5a Transportation means
5b slide member
5c claw
5d reel
5e tension material
6 Hangers
6a roller
6b Locking projection
7 Arm
7a Horizontal part of arm
7b Hanging arm
8a, 8b Work rail
9 Lifting guide
10. Cathode clamp
11 Workpiece
11a Dummy plate
12 Anode plate
13, 32 Ejector tube
13a Spout nozzle
16 Movable shielding plate
17 Cover plate
18 current
19 Transport guide plate
20 Support shaft
21 float
22 Push plate
23, 23a, 23b ejection pipe
31 Rectifying member
31a, 31b Inclined descending flow plate
33 suction tube

Claims (6)

A plating bath in which a plating solution is stored and an anode plate is disposed; a pre- and post-treatment bath in which processing solutions for pre-processing and post-processing are stored; conveying means for the object to be processed; and elevating means for the object to be processed And a moving means associated with the elevating means, and a hanger capable of supporting the object to be processed and switching between the transport means and the elevating means.
The transfer means is disposed along the upper side surface of the plating tank and at a predetermined interval,
The elevating means is disposed along the processing tank or the charging section of the plating tank and / or a carry-out section of the plating tank and at a predetermined interval from a side surface,
The moving means is disposed at a transfer position between the transport means and the elevating means, and at an ascending position and a descending position of the elevating means, respectively.
The hanger has an arm having a horizontal portion and a hanging portion of a required length,
A clamp for a cathode is provided in a hanging portion of the arm,
The workpiece is sandwiched in a hanging state by the clamp, and is automatically transferred from the pre-treatment tank to the plating tank and the post-treatment tank via the elevating unit, the moving unit, and the conveying unit, and is transferred and transferred. A plating apparatus. In the plating tank and / or the processing tank,
2. The plating apparatus according to claim 1, wherein an ejection pipe or an obliquely downward flow plate formed in a substantially V-shape is disposed at least in a charging portion of the workpiece. In the plating tank,
The plating apparatus according to claim 1, wherein a movable shielding plate that is divided into predetermined lengths and moves up and down is disposed in parallel with the transport direction of the workpiece. In the plating tank,
4. The transfer guide member according to claim 1, wherein a plurality of transfer guide members are arranged in parallel with the transfer direction of the processing object and inclined upward or downward along the transfer direction of the processing object. The plating apparatus as described. The transport guide member,
The plating apparatus according to claim 4, wherein the plating apparatus is divided into a plurality of pieces having a predetermined length, and a part of the divided transport guide members is overlapped. 3. The plating apparatus according to claim 2, wherein a liquid suction pipe connected to a circulation pump is provided below the jet pipe or the obliquely descending flow plate to circulate a plating liquid or a processing liquid.

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