CN106604566A - Wave soldering method for printed circuit board - Google Patents
Wave soldering method for printed circuit board Download PDFInfo
- Publication number
- CN106604566A CN106604566A CN201710023476.0A CN201710023476A CN106604566A CN 106604566 A CN106604566 A CN 106604566A CN 201710023476 A CN201710023476 A CN 201710023476A CN 106604566 A CN106604566 A CN 106604566A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- wave
- soldering
- printed circuit
- soldering method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a wave soldering method for a printed circuit board. The method comprises the steps of (1) sending a circuit board with the installation of components to an interface automatic controller, (2) evenly coating the circuit board with soldering flux, (3) preheating the circuit board with the preheating temperature of 70 DEG C to 75 DEG C and the preheating time of 20s to 30s, (4) cleaning solder splash in a wave soldering trough, (5) sending the circuit board into the wave soldering trough through a conveyor belt to carry out soldering, wherein the wave soldering temperature is 240 DEG C to 245 DEG C, the soldering time is 2s to 4s, and the angle between the circuit board and a solder wave is 5degrees to 6 degrees, and the depth of pressing the circuit board into the wave is 0.5 to 0.6 time of the thickness of the circuit board, (6) cooling the circuit board, and (7) taking down the circuit board. The soldering effect is improved, and soldering defects are reduced.
Description
Technical field
The present invention relates to a kind of wave-soldering method of printed circuit board.
Background technology
Printed circuit board（PCB）It is important electronic unit also known as printed substrate, is the supporter of electronic devices and components,
It is the carrier of electronic devices and components electrical connection.
Wave-soldering is to allow the solder side of card directly to contact with high-temperature liquid state tin and reach welding purpose, with efficiency high,
The advantages of quality is good, but existing wave-soldering method, because state modulator is not accurate enough, cause welding effect not ideal enough, have
Treat further raising.
The content of the invention
For the problems referred to above, the present invention provides a kind of wave-soldering method of printed circuit board, improves welding effect, reduces weldering
Connect defect.
To realize above-mentioned technical purpose, above-mentioned technique effect is reached, the present invention is achieved through the following technical solutions：
A kind of wave-soldering method of printed circuit board, comprises the steps：
Step 1, the circuit board for having inserted components and parts is sent on interface automatic controller；
Step 2, solder flux is uniformly coated on circuit boards；
Step 3, circuit board is preheated, the temperature of preheating is 70-75 DEG C, and preheating time is 20-30s；
Step 4, the scruff removed in wave-soldering hopper；
Step 5, by conveyer belt will circuit board send into wave-soldering hopper in be welded, wherein, wave-soldering temperature be 240-245
DEG C, weld interval is 2-4s, and the inclination angle between circuit board and solder wave is 5-6 °, and the depth of circuit board press-in crest is circuit
0.5-0.6 times of plate thickness；
Step 6, circuit board is cooled down；
Step 7, remove circuit board.
It is preferred that, also include pruning pin step between step 5 and 6 so that component down-lead stretches out the length in solder joint tin face
Less than 2mm.
It is preferred that, in step 5, wave-soldering temperature is 243 DEG C.
It is preferred that, in step 3, the temperature of preheating is 75 DEG C, and preheating time is 25s.
It is preferred that, cleaning step is also included between step 6 and 7, remove the solder flux of circuit board surface residual.
It is preferred that, the solder flux of circuit board surface residual is removed using gas phase ablution.
The invention has the beneficial effects as follows：
Solder wave process is the process of a complexity, it is ensured that the quality of welding, it is necessary to each ginseng in strict control welding
Number, such as, welding temperature, weld interval etc., the present invention improves the considered critical to parameter, improves welding effect.
Specific embodiment
Technical solution of the present invention is described in further detail with reference to specific embodiment, so that the skill of this area
Art personnel can be better understood from the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
A kind of wave-soldering method of printed circuit board, comprises the steps：
Step 1, the circuit board for having inserted components and parts is sent on interface automatic controller；
Step 2, solder flux is uniformly coated on circuit boards；
Step 3, circuit board is preheated, the temperature of preheating is 70-75 DEG C, and preheating time is 20-30s；
Step 4, the scruff removed in wave-soldering hopper, can regularly be cleared up；
Step 5, by conveyer belt will circuit board send into wave-soldering hopper in be welded, wherein, wave-soldering temperature be 240-245
DEG C, weld interval is 2-4s, and the inclination angle between circuit board and solder wave is 5-6 °, and the depth of circuit board press-in crest is circuit
0.5-0.6 times of plate thickness；
Step 6, circuit board is cooled down, typically using air-cooled, it is to avoid damage components and parts；
Step 7, remove circuit board.
It is preferred that, also include pruning pin step between step 5 and 6 so that component down-lead stretches out the length in solder joint tin face
Less than 2mm.
It is preferred that, in step 5, wave-soldering temperature is 243 DEG C.
It is preferred that, in step 3, the temperature of preheating is 75 DEG C, and preheating time is 25s.Preheating can improve the activation energy of solder flux
Power, reduces thermal shock during welding circuit board, improves welding quality.
It is preferred that, cleaning step is also included between step 6 and 7, remove the solder flux of circuit board surface residual.
It is preferred that, the solder flux of circuit board surface residual is removed using gas phase ablution, such as using gas phase cleaning machine.
Solder wave process is the process of a complexity, it is ensured that the quality of welding, it is necessary to each in strict control welding
Individual parameter, such as, welding temperature, weld interval etc., the present invention improves the considered critical to parameter, improves welding effect.
The preferred embodiments of the present invention are these are only, the scope of the claims of the present invention is not thereby limited, it is every using this
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technologies
Field, is included within the scope of the present invention.
Claims (6)
1. a kind of wave-soldering method of printed circuit board, it is characterised in that comprise the steps：
Step 1, the circuit board for having inserted components and parts is sent on interface automatic controller；
Step 2, solder flux is uniformly coated on circuit boards；
Step 3, circuit board is preheated, the temperature of preheating is 70-75 DEG C, and preheating time is 20-30s；
Step 4, the scruff removed in wave-soldering hopper；
Step 5, by conveyer belt will circuit board send into wave-soldering hopper in be welded, wherein, wave-soldering temperature be 240-245
DEG C, weld interval is 2-4s, and the inclination angle between circuit board and solder wave is 5-6 °, and the depth of circuit board press-in crest is circuit
0.5-0.6 times of plate thickness；
Step 6, circuit board is cooled down；
Step 7, remove circuit board.
2. the wave-soldering method of a kind of printed circuit board according to claim 1, it is characterised in that between step 5 and 6 also
Including pruning pin step so that component down-lead stretches out the length in solder joint tin face and is less than 2mm.
3. the wave-soldering method of a kind of printed circuit board according to claim 1, it is characterised in that in step 5, wave-soldering
Temperature is 243 DEG C.
4. the wave-soldering method of a kind of printed circuit board according to claim 3, it is characterised in that in step 3, preheating
Temperature is 75 DEG C, and preheating time is 25s.
5. the wave-soldering method of a kind of printed circuit board according to claim 4, it is characterised in that between step 6 and 7 also
Including cleaning step, the solder flux of circuit board surface residual is removed.
6. the wave-soldering method of a kind of printed circuit board according to claim 5, it is characterised in that using gas phase ablution
Remove the solder flux of circuit board surface residual.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710023476.0A CN106604566A (en) | 2017-01-13 | 2017-01-13 | Wave soldering method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710023476.0A CN106604566A (en) | 2017-01-13 | 2017-01-13 | Wave soldering method for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106604566A true CN106604566A (en) | 2017-04-26 |
Family
ID=58584798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710023476.0A Pending CN106604566A (en) | 2017-01-13 | 2017-01-13 | Wave soldering method for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106604566A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109623069A (en) * | 2019-01-22 | 2019-04-16 | 湖南机电职业技术学院 | A kind of robot welding system Internet-based and welding procedure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686046A (en) * | 2012-05-31 | 2012-09-19 | 东莞市捷和光电有限公司 | Method for reducing off rate of light-emitting diode (LED) lamp beads caused by crest soldering heating |
| CN103781290A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Wave soldering system for LED plug-in lamp panel and control method thereof |
| CN104470245A (en) * | 2014-12-01 | 2015-03-25 | 苏州立瓷电子技术有限公司 | Wave soldering process for LED plug-in lamp panel |
| CN104722873A (en) * | 2014-10-10 | 2015-06-24 | 淮安信息职业技术学院 | Welding technological process for restraining discharge of welding spot without point |
| CN205519979U (en) * | 2016-04-12 | 2016-08-31 | 昆山升菖电子有限公司 | Tin stove is crossed to energy -concerving and environment -protective type wave -soldering |
-
2017
- 2017-01-13 CN CN201710023476.0A patent/CN106604566A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686046A (en) * | 2012-05-31 | 2012-09-19 | 东莞市捷和光电有限公司 | Method for reducing off rate of light-emitting diode (LED) lamp beads caused by crest soldering heating |
| CN103781290A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Wave soldering system for LED plug-in lamp panel and control method thereof |
| CN104722873A (en) * | 2014-10-10 | 2015-06-24 | 淮安信息职业技术学院 | Welding technological process for restraining discharge of welding spot without point |
| CN104470245A (en) * | 2014-12-01 | 2015-03-25 | 苏州立瓷电子技术有限公司 | Wave soldering process for LED plug-in lamp panel |
| CN205519979U (en) * | 2016-04-12 | 2016-08-31 | 昆山升菖电子有限公司 | Tin stove is crossed to energy -concerving and environment -protective type wave -soldering |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109623069A (en) * | 2019-01-22 | 2019-04-16 | 湖南机电职业技术学院 | A kind of robot welding system Internet-based and welding procedure |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170426 |
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| RJ01 | Rejection of invention patent application after publication |