CN102686046A - Method for reducing off rate of light-emitting diode (LED) lamp beads caused by crest soldering heating - Google Patents
Method for reducing off rate of light-emitting diode (LED) lamp beads caused by crest soldering heating Download PDFInfo
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- CN102686046A CN102686046A CN201210173729XA CN201210173729A CN102686046A CN 102686046 A CN102686046 A CN 102686046A CN 201210173729X A CN201210173729X A CN 201210173729XA CN 201210173729 A CN201210173729 A CN 201210173729A CN 102686046 A CN102686046 A CN 102686046A
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- led lamp
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- lamp beads
- circuit board
- soldering
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Abstract
The invention discloses a method for reducing the off rate of light-emitting diode (LED) lamp beads caused by crest soldering heating, which comprises the following steps that: fine LED lamp beam pins are selected; pipelines are sleeved on the pins; elements and devices are inserted onto a printed circuit board; the circuit board is checked and cleared, and crest soldering is carried out on the circuit board; and the circuit board after crest soldering is cooled, wires are cut and a test is taken. According to the method for reducing the off rate of LED lamp beads caused by crest soldering heating, distances from solder contacts to the internal metal leads of the LED lamp beads during a crest soldering process are increased, the temperature conduction time is prolonged, so that the off rate of the LED lamp beads is reduced; and in addition, the contact area between the pins of the LED lamp beads and the solder during the crest soldering process is reduced by reducing the cross sectional area of the pins of the LED lamp beads, so that less heat of a tin pool is conducted to the internal metal leads of the LED lamp beads, and the off rate of the LED lamp beads is reduced.
Description
Technical field
The present invention relates to the crest welding field, relate in particular to a kind of be heated method of the LED lamp desperate lamp rate that causes of wave-soldering that reduces.
Background technology
The wave-soldering connection technology is mainly used in the packaging technology of conventional via plug-in mounting printed circuit board (PCB), and surface-assembled and through-hole mounting components and parts load in mixture technology.The wave-soldering connection technology is to be come by early stage hot dipping solder technology development; Hot dipping welding is to get into printed circuit board (PCB) and scolder face that monoblock is inserted good electronic devices and components abreast in the fusion welding, makes one of mobile welding method that components and parts pin, circuit board Copper Foil weld.Wave-soldering is mechanical type or the electromagnetic type centrifugal pump that utilizes in the solder bath, and the scolder of fusion is pressed to nozzle, forms the solder wave that one is upwards steadily gushed, and from nozzle, overflows continuously.The printed circuit board (PCB) that components and parts are housed passes through solder wave with speed straight line plane motion stably.On solder side, form the infiltration solder joint and accomplish welding.
Because in welding process, the fusion welding of high temperature can directly contact with the lead-in wire of components and parts, and heat will conduct to components and parts inside, and high temperature can let components and parts generation physical change, and for example LED lamp pearl interior metal silk thread may fuse because of high temperature.
Summary of the invention
For solving problem and the defective that exists in above-mentioned, the invention provides a kind of practicality, reduce wave-soldering simply, reliably and be heated and cause the method for LED lamp desperate lamp rate.This method is encapsulating structure and the components and parts insertion method through the LED lamp pearl of improving the Lamp-LED encapsulating structure, prolongs the time of tin pond heat transferred to LED lamp pearl interior metal lead-in wire, reduces the LED lamp desperate lamp rate of being heated and causing because of wave-soldering.Said technical scheme is following:
A kind of wave-soldering that reduces is heated and causes the method for LED lamp desperate lamp rate, comprising:
Choose thin LED lamp pearl pin;
Be nested with pipeline in Pin locations;
Placing components is on printed circuit board (PCB);
Check, clear up circuit board, and circuit board is carried out wave-soldering;
Circuit board to behind the wave-soldering cools off, and trimming and detection.
The beneficial effect of technical scheme provided by the invention is:
The present invention has increased the distance of scolder contact point to LED lamp pearl interior metal lead-in wire in the wave-soldering process, has prolonged the time of temperature conduction, reduces LED lamp desperate lamp rate; In addition, the cross-sectional area of the pin through reducing LED lamp pearl reduces the pin and the contact area of scolder of LED lamp pearl in the wave-soldering process, and the heat that reduces Xi Chi is transmitted to LED lamp pearl interior metal lead-in wire, thus the dead lamp rate of reduction LED lamp pearl.
Description of drawings
Fig. 1 reduces wave-soldering to be heated and to cause the method for LED lamp desperate lamp rate;
Fig. 2 is a LED lamp bead seal assembling structure sketch map.
Embodiment
For making the object of the invention, technical scheme and advantage clearer, will combine accompanying drawing that embodiment of the present invention is done to describe in detail further below:
Present embodiment provides a kind of wave-soldering that reduces to be heated and to cause the method for LED lamp desperate lamp rate, wherein,
Referring to Fig. 1, the reduction wave-soldering is heated and causes the method for LED lamp desperate lamp rate, and this method may further comprise the steps:
The diameter of above-mentioned LED lamp pearl pin 12 is 0.6 millimeter.
Above-mentioned pipeline is an epoxy resin pipeline 11; This epoxy resin pipeline is installed in pin and junction, LED lamp pearl colloid bottom; The length of epoxy resin pipeline is 3～5 millimeters; Solder joint and the distance that LED lamp pearl interior metal goes between when increasing wave-soldering have prolonged temperature conduction time of Xi Chi, have reduced the dead lamp rate (as shown in Figure 2) of LED lamp pearl.
In crest welder, can pass through the scaling powder coating unit of certain form, here scaling powder utilizes the method for crest, foaming or injection to be coated on the wiring board.Scaling powder the time must reach and keep an activation temperature to guarantee the infiltration fully of solder joint in welding, so wiring board was wanted earlier through a preheating zone before getting into the crest groove.After printed circuit board (PCB) is preheating to preset temperature, will send into the groove the inside of wave-soldering, here the components and parts pin of plug-in mounting can directly contact with the scolder of fusion on the circuit board.After solder joint soaked into fully, printed circuit board (PCB) left the crest groove, is admitted to cooling chamber.
Circuit board behind the step 50 pair wave-soldering cools off, and trimming and detection.
As shown in Figure 2; Showed LED lamp bead seal assembling structure; Comprise: led chip 3, wedge shape support 5, metal lead wire 1 and colloid 2, said colloid is encapsulated in the outside of said led chip, wedge shape support and metal lead wire, and colloid 6 length of said LED lamp pearl are 9 millimeters～11 millimeters.
Be perfused with transparent epoxy resin in the above-mentioned colloid, form the transparent epoxy resin colloid.
LED lamp pearl interior metal go between LED lamp pearl colloid bottom distance 9 be 7 millimeters～9 millimeters, LED lamp pearl diameter 10 is 3～5 millimeters.
Above-mentioned LED lamp bead seal assembling structure also comprises tore of reflection 4, and this tore of reflection is arranged on the top of said wedge shape support.
Above-mentioned wedge shape support is connected with cathode rod 7 and anode rod 8.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. one kind is reduced wave-soldering and is heated and causes the method for LED lamp desperate lamp rate, it is characterized in that said method comprises:
Choose thin LED lamp pearl pin;
Be nested with pipeline in Pin locations;
Placing components is on printed circuit board (PCB);
Check, clear up circuit board, and circuit board is carried out wave-soldering;
Circuit board to behind the wave-soldering cools off, and trimming and detection.
2. reduction wave-soldering according to claim 1 is heated and causes the method for LED lamp desperate lamp rate, it is characterized in that, said LED lamp pearl leg diameter is 0.6 millimeter.
3. reduction wave-soldering according to claim 1 is heated and causes the method for LED lamp desperate lamp rate, it is characterized in that said pipeline is the epoxy resin pipeline, and this epoxy resin pipeline is installed in pin and junction, LED lamp pearl colloid bottom.
4. reduction wave-soldering according to claim 3 is heated and causes the method for LED lamp desperate lamp rate, it is characterized in that the length of said epoxy resin pipeline is 3～5 millimeters, the distance of solder joint and LED lamp pearl interior metal lead-in wire when increasing wave-soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210173729.XA CN102686046B (en) | 2012-05-31 | 2012-05-31 | Method for reducing off rate of light-emitting diode (LED) lamp beads caused by crest soldering heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210173729.XA CN102686046B (en) | 2012-05-31 | 2012-05-31 | Method for reducing off rate of light-emitting diode (LED) lamp beads caused by crest soldering heating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102686046A true CN102686046A (en) | 2012-09-19 |
| CN102686046B CN102686046B (en) | 2015-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210173729.XA Expired - Fee Related CN102686046B (en) | 2012-05-31 | 2012-05-31 | Method for reducing off rate of light-emitting diode (LED) lamp beads caused by crest soldering heating |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781290A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Wave soldering system for LED plug-in lamp panel and control method thereof |
| CN106604566A (en) * | 2017-01-13 | 2017-04-26 | 昆山福烨电子有限公司 | Wave soldering method for printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03141498A (en) * | 1989-10-27 | 1991-06-17 | Nohmi Bosai Ltd | Semiconductor fire sensor |
| TW201110431A (en) * | 2009-09-15 | 2011-03-16 | Maintek Comp Suzhou Co Ltd | Light emitting diode |
| CN102291947A (en) * | 2011-07-29 | 2011-12-21 | 杭州华三通信技术有限公司 | Method for manufacturing through hole pad on step structure of printed circuit board (PCB) and PCB |
-
2012
- 2012-05-31 CN CN201210173729.XA patent/CN102686046B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03141498A (en) * | 1989-10-27 | 1991-06-17 | Nohmi Bosai Ltd | Semiconductor fire sensor |
| TW201110431A (en) * | 2009-09-15 | 2011-03-16 | Maintek Comp Suzhou Co Ltd | Light emitting diode |
| CN102291947A (en) * | 2011-07-29 | 2011-12-21 | 杭州华三通信技术有限公司 | Method for manufacturing through hole pad on step structure of printed circuit board (PCB) and PCB |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781290A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Wave soldering system for LED plug-in lamp panel and control method thereof |
| CN103781290B (en) * | 2014-01-24 | 2016-11-23 | 南通苏禾车灯配件有限公司 | The peak welding system of a kind of LED plug-in unit lamp plate and control method thereof |
| CN106604566A (en) * | 2017-01-13 | 2017-04-26 | 昆山福烨电子有限公司 | Wave soldering method for printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN102686046B (en) | 2015-02-11 |
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Address after: 523657, Guangdong City, Dongguan Province town of Victoria Lai village management area factory building Patentee after: Dongguan Jiehe Au Optronics Co Address before: 523657, Guangdong City, Dongguan Province town of Victoria Lai village management area factory building Patentee before: Dongguan JAHURD Optoelectronic Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20150211 Termination date: 20180531 |