CN103994359A - Modularized LED lamp strip and processing method thereof - Google Patents
Modularized LED lamp strip and processing method thereof Download PDFInfo
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- CN103994359A CN103994359A CN201410255859.7A CN201410255859A CN103994359A CN 103994359 A CN103994359 A CN 103994359A CN 201410255859 A CN201410255859 A CN 201410255859A CN 103994359 A CN103994359 A CN 103994359A
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Abstract
The invention discloses a modularized LED lamp strip and a manufacturing method thereof. The LED lamp strip comprises a positive pole metal wire and a negative pole metal wire, wherein the positive pole metal wire and the negative pole metal wire are connected with the input end of a rectifier. The LED lamp strip further comprises a positive pole metal base line and a negative pole metal base line, wherein the positive pole metal base line and the negative pole metal base line are connected with an LED chip and the output end of the rectifier, the positive pole metal wire, the negative pole metal wire, the positive pole metal base line and the negative pole metal base line are distributed in parallel, multiple plastic bases transversely wrapping the positive pole metal wire, the negative pole metal wire, the positive pole metal base line and the negative pole metal base line are arranged, the upper portions of the plastic bases are provided with a containing groove used for containing the LED chip, the bottom of the containing groove is exposed so that the positive pole metal base line and the negative pole metal base line of an electrode of the LED chip can be welded, and a light-pervious layer is further encapsulated on the surface, in the containing groove, of the LED chip. By means of the technical scheme, the height of an LED lamp can be effectively reduced, processing is easier, processing efficiency is higher, production cost is effectively lowered, troubles of externally connecting a power supply line are omitted, and application approximates to perfectness.
Description
Technical field
The present invention relates to LED encapsulation technology field, refer to paster LED, particularly a kind of modular bonded LED lamp bar structure.
Background technology
Existing paster LED mainly adopts to stick to be realized luminous in PCB PCB surface, be applicable to SMT processing, can Reflow Soldering, the adopting surface mounted LED of this mode has well solved brightness, visual angle, flatness, reliability, conforming problem, with respect to the LED packaging of other form, it has the advantages such as vibration resistance is strong, welding point defect is low, high frequency characteristics is good, and can realize and on very little area, encapsulate multiple LED chips.LED after employing PCB PCB surface paster type encapsulation by contrast, can make electronic product volume-diminished, weight saving, finally makes application more perfect.But this PCB wiring board adopting surface mounted LED also exists processing technology complexity to cause that difficulty of processing is large, efficiency is low, not only increase the thickness of LED owing to need to being applied to PCB wiring board, also increase production cost, the circumscripted power line that connects in addition rectifier input will pass through whole lamp support realizes the supply of power supply, particularly the LED fluorescent lamp of strip, has strengthened difficulty of processing undoubtedly.
Summary of the invention
Need to be applied to PCB wiring board and not only increased the thickness of LED in order to overcome existing paster LED, production cost and difficulty of processing are also increased, main purpose of the present invention is to provide a kind of modularity paster LED, the constraint that this modularity paster LED is simple in structure, broken away from PCB wiring board, effectively reduce the height of LED, make processing more simple and easy, cost.
Above-mentioned purpose is achieved by the following technical solution:
According to an aspect of the present invention, the invention provides a kind of modularity paster LED lamp bar, comprise: the cathode metal wire and the negative pole plain conductor that connect rectifier input, also comprise the cathode metal baseline and the negative pole metal base that connect LED chip and rectifier output end, by cathode metal wire, negative pole plain conductor, cathode metal baseline, the micro-interval of negative pole metal base is parallel arrangement, and on these wires, be arranged at intervals with multiple by its horizontal completely coated plastic cement pedestal, this plastic cement pedestal top has a storage tank for accommodating LED chip and packaging plastic, this storage tank bottom is exposed in order to connect the part of cathode metal baseline and negative pole metal base of LED chip electrode, in storage tank, on LED chip face, be also packaged with a photic zone.
Realize luminous deficiency owing to adopting the modularity paster LED of above technical scheme to break away from LED will to be sticked in PCB PCB surface, cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base are to parallel arrangement, effectively reduce the height of LED, make that processing is more simple and easy, working (machining) efficiency is higher, effectively reduce production cost, finally make application more perfect.
Above technical scheme can be further improved by following measures:
In some embodiments, cathode metal wire, negative pole plain conductor are laid in respectively to the both sides of cathode metal baseline and negative pole metal base.These two line one end are welded on respectively on rectifier input, and this has just solved the connection rectifier input of pulling strings in addition and has passed through the trouble that whole lamp support brings.
In some embodiments, in order to improve as much as possible light efficiency, reduce the diffuse scattering of LED light source, be provided with an optically focused groove in exposed cathode metal baseline end, storage tank bottom.
In some embodiments, for the workpiece operation of injection machine, add the efficiency of the note of hurrying up, according to design need to be by equidistant plastic cement pedestal spaced apart and be wrapped on cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base.
In some embodiments, PPA plastics have advantages of high temperature resistant and fire-retardant and intensity is high and resistance to deformation, and therefore the material of plastic cement pedestal adopts PPA plastics and completes by injection machine injection moulding.
In some embodiments, convenient for plastic cement pedestal is arranged, the one side design of negative pole metal base is had to the extension relative with cathode metal baseline end.
In some embodiments, for the ease of the processing of mould, ensure that LED module has frivolous characteristic, cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base adopt the metal wire rods such as thin iron, copper, aluminium.In order to ensure that these thin metal wire rods have good electric conductivity and are not corroded, be provided with an electrodeposited coating at these metal wire material surfaces.
Based on a processing molding method for above-mentioned modularity paster LED lamp bar, comprise following step:
A. foil is pressed into multiple anyhow connected hollow out bodies through Presser Dashing, this hollow out body comprises: cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base, the end punching press of cathode metal baseline wherein forms optically focused groove, negative pole metal base in hollow out body is L-shaped, its terminal part corresponding with cathode metal baseline end optically focused groove and disconnect;
B. the foil with engraved structure step a being completed does electroplating surface processing;
C. the plastic cement that insulate is selected thermosetting resin, by injection machine, thermosetting resin is also laterally wrapped in centered by each optically focused groove to the middle part of cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base, and on foil, be formed with multiple plastic cement pedestals with pattern, on described plastic cement pedestal, have a storage tank for accommodating LED chip, the exposed optically focused groove in bottom of this storage tank and negative pole metal base part are in order to weld LED chip electrode pin.
D. LED chip is fixed in the storage tank of plastic cement pedestal, uses bonding wire board by LED chip electrode pin and optically focused groove and the welding of negative pole metal base part conducting.
E. after applying layer of fluorescent powder on LED chip face, encapsulate again a photic zone.
F. put into baking box baking sizing.
The modularity paster LED lamp bar of multiple LED lamps washed many of rear formation open and has by the tie point punch press of each cathode metal wire of g. finally the foil after baking sizing being connected anyhow, negative pole plain conductor, cathode metal baseline, negative pole metal base
Brief description of the drawings
Fig. 1 is the wiring floor map of modularity paster LED of the present invention.
Fig. 2 is the planar structure schematic diagram of invention modularity paster LED.
Fig. 3 is the hollow out body plane structural representation that foil of the present invention forms through punching press.
Fig. 4 is the structure for amplifying schematic diagram of Fig. 3 A portion.
Fig. 5 is the planar structure schematic diagram of foil hollow out body injection moulding plastic pedestal of the present invention.
Fig. 6 is the structure for amplifying schematic diagram of Fig. 5 B portion.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Referring to figs. 1 to Fig. 6; The invention provides a kind of modularity paster LED lamp bar, the corresponding rectifier input that connects of cathode metal wire 3, negative pole plain conductor 4 adopting, cathode metal baseline 1, negative pole metal base 2 one end connect the electrode of LED chip, and the other end connects rectifier output end electrode.Cathode metal baseline 1, negative pole metal base 2, cathode metal wire 3, negative pole plain conductor 4 are the metallic flat thin wires such as thin iron, copper, aluminium, in order to ensure that these thin metal wire rods have good electric conductivity and are not corroded, these iron, copper, the thin metal wire material surface of aluminium are electroplated to one deck anti-corrosion conductive layer.In addition, one side of negative pole metal base 2 is designed with the extension 21 of a bending, in order to improve as much as possible light efficiency, reduce the diffuse scattering of LED light source, be provided with an optically focused groove 11 in the end of cathode metal baseline 1, optically focused groove 11 intervals of the extension 21 of negative pole metal base 2 and cathode metal baseline 1 are relative and form the positive and negative connecting portion of a lamp, according to needs, several so positive and negative connecting portions can be set on these lines more, just formed many lamps modular structure on line.According to the width design requirement of module LED lamp, by spaced apart these 4 thin metallic flat thin wires and be parallel arrangement and place, and cathode metal wire 3, negative pole plain conductor 4 are laid in respectively to the both sides of cathode metal baseline 1 and negative pole metal base 2.Injection machine by plastic injection-moulded PPA at cathode metal wire 3, negative pole plain conductor 4, cathode metal baseline 1, on negative pole metal base 2, laterally be coated above-mentioned wire rod completely and form plastic cement pedestal 5, these plastic cement pedestal 5 tops are provided with a storage tank 51 for accommodating LED chip and packaging plastic, the bottom of this storage tank 51 is exposed in order to connect the end of the optically focused groove 11 of cathode metal baseline 1 and the extension 21 of negative pole metal base 2 of LED chip electrode, positive pole at the storage tank 51 interior LED chips of plastic cement pedestal 5 is welded on the optically focused groove 11 of cathode metal baseline 1, the negative pole correspondence of LED chip is welded on the end of extension 21 of exposed negative pole metal base 2, and be also packaged with a photic zone on the interior LED chip face of storage tank 51.Because the modularity paster LED that adopts above technical scheme has been broken away from and LED will have been sticked in PCB PCB surface and realizes luminous deficiency, cathode metal wire 3, negative pole plain conductor 4, cathode metal baseline 1, negative pole metal base 2 are to parallel arrangement, effectively reduce the height of LED, make processing more simple and easy, working (machining) efficiency is higher, effectively reduce production cost, also saved the trouble of circumscripted power line, finally made application more perfect.
Above-mentioned modularity paster LED adopts following steps to complete: a. foil 10 is pressed into multiple hollow out bodies through Presser Dashing, this hollow out body comprises: cathode metal wire 3, negative pole plain conductor 4, cathode metal baseline 1, negative pole metal base 2 and phase mutual tie point are connected, the end punching press of cathode metal baseline 1 wherein forms optically focused groove 11, negative pole metal base 2 in hollow out body is L-shaped, its terminal part corresponding with cathode metal baseline 1 end optically focused groove 11 and disconnect; B. the foil with engraved structure 10 step a being completed does electroplating surface processing; C. the plastic cement that insulate is selected thermosetting resin, by injection machine by thermosetting resin centered by each optically focused groove 11, directly laterally be wrapped in the middle part of cathode metal wire 3, negative pole plain conductor 4, cathode metal baseline 1, negative pole metal base 2 completely to reserved line 50, and on foil 10, be formed with multiple plastic cement pedestals 5 with pattern, on described plastic cement pedestal 5, have a storage tank 51 for accommodating LED chip, the exposed optically focused groove 11 in bottom of this storage tank 51 and the extension 21 of negative pole metal base 2 parts are in order to weld LED chip electrode pin.D. LED chip is fixed in the storage tank 51 of plastic cement pedestal 5, the extension 21 of LED chip electrode pin and optically focused groove 11 and negative pole metal base 2 parts is welded and conducting with bonding wire board.E. after applying layer of fluorescent powder on LED chip face, encapsulate again a photic zone.F. put into baking box baking sizing.The modularity paster LED lamp bar of multiple LED lamps washed many of rear formation open and has by the tie point punch press of each cathode metal wire 3 of g. finally the foil 10 after baking sizing being connected anyhow, negative pole plain conductor 4, cathode metal baseline 1, negative pole metal base 2.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, without departing from the concept of the premise of the invention, can also make multiple distortion and improvement, these all belong to protection scope of the present invention.
Claims (8)
1. a Modular LED lamp bar, comprise the cathode metal wire and the negative pole plain conductor that connect rectifier input, also comprise the cathode metal baseline and the negative pole metal base that connect LED chip and rectifier output end, it is characterized in that: described cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base is parallel arrangement, and be provided with multiple by cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base is coated plastic cement pedestal laterally, described plastic cement pedestal top has a storage tank for accommodating LED chip, the bottom of this storage tank is exposed in order to weld the part of cathode metal baseline and negative pole metal base of LED chip electrode, in storage tank, on LED chip face, be also packaged with a photic zone.
2. Modular LED lamp bar according to claim 1, is characterized in that: described cathode metal wire, the both sides that negative pole plain conductor is laid in respectively cathode metal baseline and negative pole metal base.
3. Modular LED lamp bar according to claim 1 and 2, is characterized in that: exposed cathode metal baseline end, described storage tank bottom has an optically focused groove.
4. Modular LED lamp bar according to claim 3, is characterized in that: what described plastic cement pedestal was equidistant is wrapped on cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base.
5. Modular LED lamp bar according to claim 1, is characterized in that: described plastic cement pedestal is PPA plastics and completes by injection machine injection moulding.
6. Modular LED lamp bar according to claim 1, is characterized in that: described negative pole metal base one side has the extension relative with cathode metal baseline end.
7. Modular LED lamp bar according to claim 1, is characterized in that: described cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base are iron or copper or aluminium wire, and its surface has electrodeposited coating.
8. the processing molding method based on Modular LED lamp bar described in claim 1, is characterized in that, comprises following step:
A, foil are pressed into multiple connected hollow out bodies anyhow through Presser Dashing, this hollow out body comprises: cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base, the end punching press of cathode metal baseline wherein forms optically focused groove, negative pole metal base in hollow out body is L-shaped, its terminal part corresponding with cathode metal baseline end optically focused groove and disconnect;
B, the foil with engraved structure that step a is completed do electroplating surface processing;
C, insulation plastic cement are selected thermosetting resin, by injection machine, thermosetting resin is also laterally wrapped in centered by each optically focused groove to the middle part of cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base, foil is formed with the plastic cement pedestal of multiple same pattern, on described plastic cement pedestal, have a storage tank for accommodating LED chip, the part of this storage tank exposed optically focused groove in bottom and negative pole metal base is in order to weld LED chip electrode pin;
D, LED chip is fixed in the storage tank of plastic cement pedestal, with bonding wire board by the also conducting of part welding of LED chip electrode pin and optically focused groove and negative pole metal base;
E, encapsulate again a photic zone apply layer of fluorescent powder on LED chip face after;
F, put into baking box baking sizing;
G, finally the modularity paster LED lamp bar of multiple LED lamps washed many of rear formation open and has by the tie point punch press of each cathode metal wire, negative pole plain conductor, cathode metal baseline, negative pole metal base that the foil after baking sizing is connected anyhow.
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| CN201410255859.7A CN103994359B (en) | 2014-06-10 | 2014-06-10 | A kind of processing method of Modular LED lamp bar |
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| CN201410255859.7A CN103994359B (en) | 2014-06-10 | 2014-06-10 | A kind of processing method of Modular LED lamp bar |
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| CN103994359B CN103994359B (en) | 2016-04-27 |
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| CN104930372A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light-emitting diode) bulb with arched lens |
| CN105276534A (en) * | 2015-09-25 | 2016-01-27 | 吴少健 | LED circuit board |
| CN105390454A (en) * | 2015-10-22 | 2016-03-09 | 深圳市敏杰电子科技有限公司 | Waterproof wired component, production equipment and method thereof |
| CN105508916A (en) * | 2016-02-22 | 2016-04-20 | 深圳市敏杰电子科技有限公司 | Waterproof LED lamp strip and equipment and method for producing waterproof LED lamp strip |
| WO2016197961A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light packaging frame |
| CN107023809A (en) * | 2016-01-30 | 2017-08-08 | 深圳市环基实业有限公司 | A kind of LED board manufacturing method |
| CN107477377A (en) * | 2017-08-24 | 2017-12-15 | 深圳市圣心照明科技有限公司 | A kind of LED light source board, LED tube light and manufacture method |
| CN108278517A (en) * | 2018-02-28 | 2018-07-13 | 杭州小太阳农业科技有限公司 | A kind of double, multiple rows of LED light strip |
| CN108278515A (en) * | 2018-02-28 | 2018-07-13 | 杭州小太阳农业科技有限公司 | A kind of double, multiple rows of LED light base band |
| CN108302354A (en) * | 2018-02-28 | 2018-07-20 | 杭州小太阳农业科技有限公司 | A kind of single LED light strip |
| CN108361574A (en) * | 2018-02-28 | 2018-08-03 | 杭州小太阳农业科技有限公司 | A kind of production method of LED light strip |
| CN108361573A (en) * | 2018-02-28 | 2018-08-03 | 杭州小太阳农业科技有限公司 | A kind of production method of light bar |
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| CN108278517A (en) * | 2018-02-28 | 2018-07-13 | 杭州小太阳农业科技有限公司 | A kind of double, multiple rows of LED light strip |
| CN109742215A (en) * | 2019-01-10 | 2019-05-10 | 广东品美电子科技有限公司 | A kind of LED support preparation process |
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