CN105276534A - LED circuit board - Google Patents
LED circuit board Download PDFInfo
- Publication number
- CN105276534A CN105276534A CN201510629202.7A CN201510629202A CN105276534A CN 105276534 A CN105276534 A CN 105276534A CN 201510629202 A CN201510629202 A CN 201510629202A CN 105276534 A CN105276534 A CN 105276534A
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- China
- Prior art keywords
- wire
- thermoelectric
- circuit board
- led circuit
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002787 reinforcement Effects 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 230000003014 reinforcing effect Effects 0.000 abstract 5
- 238000001816 cooling Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention disclosed an LED circuit board which comprises a power line, a first thermoelectric wire and a second thermoelectric wire and further comprises a plurality of reinforcing ribs. The power line, the first thermoelectric wire and the second thermoelectric wire are sequentially arranged in parallel. The reinforcing ribs are arranged perpendicular to the parallel direction and connected with the power line, the first thermoelectric wire and the second thermoelectric wire. The portions, between two reinforcing ribs close to the first thermoelectric wire and the second thermoelectric wire, of the first thermoelectric wire and the second thermoelectric wire are provided with a cooling area and a light-emitting area. The portions, used for connecting the power line, the first thermoelectric wire and the second thermoelectric wire, of the reinforcing ribs and the portions, between two reinforcing ribs close to the first thermoelectric wire and the second thermoelectric wire, of the first thermoelectric wire and the second thermoelectric wire are disconnected at specific positions. The LED circuit board is a metal plate disposable LED circuit board. By means of the LED circuit board, LED circuits can be connected in series and then connected in parallel, and the LED circuits can be connected in parallel and then connected in series as well.
Description
Technical field
The present invention relates to LED wiring board art, particularly relate to a kind of LED circuit board.
Background technology
LED (LightEmittingDiode), light emitting diode, be a kind of solid-state semiconductor devices, it directly can be converted into light electricity.The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a support, and one end is negative pole, and the other end connects the positive pole of power supply, makes whole wafer by epoxy encapsulation.Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and inside it, occupy an leading position in hole, and the other end is N-type semiconductor, at this side mainly electronics.But time these two kinds of semiconductors couple together, between them, just form one " P-N junction ".When electric current acts on this wafer by wire time, electronics will be pushed to P district, and in P district, electronics is with hole-recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is.And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.
Practical and the commercialization of high performance lED, makes lighting engineering face a new revolution.The pixel lamp be made up of red, blue, the green three-color LED of multiple super brightness not only can send the continuously adjustable various coloured light of wavelength, but also the white light that brightness can reach tens to one hundred candle light can be sent become lighting source, for incandescent lamp and the LED solid lighting lamp of identical luminosity, the power consumption of the latter only accounts for the former 10%-20%.
The white light LEDs major part of current production is made by covering the faint yellow fluorescent coating of one deck on blue-ray LED, and this yellow phosphor is normally made by being blended in a kind of dense adhesive after the yag crystal mixing cerium is clayed into power.When LED chip sends blue light, some blue light just can be converted to the wider light being mainly yellow of a spectrum by this crystal very efficiently, because gold-tinted can stimulate ruddiness in naked eyes and green glow acceptor, then mix the blue light of LED itself, make it seem just as white light.
Existing LED is generally be directly installed on installing plate, installing plate is generally laminated structure, comprise three layers: the line layer being used for connecting up under the heat dissipating layer being used for dispelling the heat, the insulating barrier being used under heat dissipating layer insulating, insulating barrier, wherein heat dissipating layer is generally aluminium foil or aluminum alloy sheet; Line layer is generally Copper Foil and makes, and is used for doing configuration.LED is arranged on heat dissipating layer, welds with line layer.The installing plate heat dispersion of the LED of this type depends on the thermal conductance index of insulating barrier to a great extent, and the thermal conductance index of insulating barrier is often not high, causes the heat dispersion of whole LED installation strip not good.
A kind of LED circuit board is proposed in " a kind of LED circuit board " (application number 2015103208701) application of the submit of the applicant, comprise the many substrate bands be arranged in parallel, every bar substrate band comprises the first wire, the second wire and thermal wire, wherein said first wire, the second wire and thermal wire be arranged in parallel, substrate band longitudinal direction compartment of terrain is provided with luminous zone and radiating area, in luminous zone, the first wire is symmetrically arranged inverted "L" shaped, and the thermal wire of radiating area has the arc protruded downwards; Described luminous zone is provided with LED seat, and LED seat top is provided with LED lamp cup, and described first wire, the second wire and thermal conductive wire through described LED seat, and are positioned at the bottom of described Lamp cup.The first wherein said wire and the second wire are used for powering to LED, and thermal wire is for exporting to fin by heat.
Above-mentioned application is in parallel after can only realizing the first series connection of LED, and can not realize first rear series connection in parallel; Meanwhile, namely the material of described thermal wire is identical with the material of the second wire with described first wire is all metal, may be used for conduction completely and participates in forming LED circuit board.The existing heat conduction function of above-mentioned thermal wire, also have conduction thus the function of formation wiring board, we are called thermoelectric (al) wire.
Summary of the invention
For overcoming the deficiencies in the prior art, simultaneously as the improvement of above-mentioned application, the invention provides a kind of LED circuit board, comprise the power line be arranged in parallel successively, first thermoelectric (al) wire, second thermoelectric (al) wire, also comprise multiple reinforcements of the vertical direction being arranged on described parallel direction, described reinforcement connects described power line, first thermoelectric (al) wire, second thermoelectric (al) wire, described first thermoelectric (al) wire and the part of the second thermoelectric (al) wire between two reinforcements closed on are provided with radiating area and luminous zone, reinforcement is for connecting described power line, first thermoelectric (al) wire, the part of the second thermoelectric (al) wire and described first thermoelectric (al) wire, the part of the second thermoelectric (al) wire between two reinforcements closed on disconnects at ad-hoc location.
As the improvement of such scheme, described second thermoelectric (al) wire is other is also provided with an independent current source line abreast, and described independent current source line is connected with described second thermoelectric (al) wire by described reinforcement.
As the improvement of such scheme, the second thermoelectric (al) wire in described luminous zone is symmetrically arranged inverted "L" shaped.
As the improvement of such scheme, the first thermoelectric (al) wire in described luminous zone is symmetrically arranged inverted "L" shaped.
As the improvement of such scheme, the first thermoelectric (al) wire of described radiating area has the arc protruded downwards.
As the improvement of such scheme, the second thermoelectric (al) wire of described radiating area has the arc protruded downwards.
As the improvement of such scheme, the curved bottom shape of described downward protrusion is flat.
Compared with prior art, LED circuit board disclosed by the invention is the disposable LED circuit board of metallic plate, and this wiring board is in parallel after not only realizing the first series connection of LED circuit, also can realize the rear series connection first in parallel of LED circuit, also incorporate conduction and heat conduction function simultaneously; LED can straight forming in the circuit board; Heat can directly distribute by the radiating area of thermoelectric (al) wire, is also connected to other by modes such as welding and has on the parts of heat sinking function, makes the heat dispersion of wiring board better.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiments of the invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only one embodiment of the present of invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a specific embodiment of the present invention;
Fig. 2 is the structural representation before ad-hoc location disconnects in the specific embodiment in Fig. 1;
In figure: 1-power line; 2-first thermoelectric (al) wire; 3-second thermoelectric (al) wire; 4-independent current source line; 5-reinforcement; 6-luminous zone; 7-radiating area.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
See Fig. 1, a kind of LED circuit board of the present invention, comprise the power line 1 be arranged in parallel successively, first thermoelectric (al) wire 2, second thermoelectric (al) wire 3, also comprise multiple reinforcements 5 of the vertical direction being arranged on described parallel direction, described reinforcement 5 connects described power line 1, first thermoelectric (al) wire 2, second thermoelectric (al) wire 3, described first thermoelectric (al) wire 2 and the part of the second thermoelectric (al) wire 3 between two reinforcements 5 closed on are provided with radiating area 7 and luminous zone 6, reinforcement 5 is for connecting described power line 1, first thermoelectric (al) wire 2, the part of the second thermoelectric (al) wire 3 and described first thermoelectric (al) wire 2, the part of the second thermoelectric (al) wire 3 between two reinforcements 5 closed on disconnects at ad-hoc location.
Described luminous zone 6 is used for mounted LED lamp.Can to weld or fit between first thermoelectric (al) wire 2 of the bottom of described LED lamp cup 9 and the 3rd thermoelectric (al) wire 3 LED chip, then injection fluorescent material and mould top glue mixture are shaped to LED lens, and the mixture of LED chip, fluorescent material and mould top glue constitutes LED lamp bead.Power line 1, first thermoelectric (al) wire 2 and the 3rd thermoelectric (al) wire 3 and reinforcement 5 constitute LED circuit board, by controlling described power line 1, first thermoelectric (al) wire 2 and the 3rd thermoelectric (al) wire 3 and the break-make of reinforcement 5 in some position, the circuit of series connection after in parallel or first in parallel after can forming the first series connection of required multiple LED.
In order to better the present invention is described, the state of LED circuit board shown in Fig. 1 before ad-hoc location does not disconnect as shown in Figure 2.What show in FIG is after two LED parallel connections, then the situation of connecting with two LED of parallel connection below.Those skilled in the art also can not need to pay performing creative labour, the circuit of connecting with multiple LED of parallel connection below again after can obtaining multiple LED parallel connection, equally also can to obtain after the series connection of multiple LED again with the circuit of multiple LED parallel connections of connecting below.
In one embodiment of the invention, described second thermoelectric (al) wire 3 is other is also provided with an independent current source line 4 abreast, and described independent current source line 4 is connected with described second thermoelectric (al) wire 3 by described reinforcement 5.When being powered to described LED circuit board by a power-supply controller of electric, if single-ended power, then only the both positive and negative polarity of power-supply controller of electric need be connected to power line 1 and the first thermoelectric (al) wire 2 or the second thermoelectric (al) wire 3; If both end power supplying, then need the electric current of the other end to be caused the one end with power-supply controller of electric by independent current source line 4.
The structure of described power line 1, first thermoelectric (al) wire 2, second thermoelectric (al) wire 3, independent current source line 4 and reinforcement 5 is metallic plate integral one-step molding, and the mode of processing can be punching press, also can be wheel hub roll-in.The material of metallic plate is metal or its alloy of conduction arbitrarily.
The second thermoelectric (al) wire in described luminous zone and the first thermoelectric (al) wire be arranged in parallel, usual interval is therebetween larger, LED chip can be installed in the future between second thermoelectric (al) wire and the first thermoelectric (al) wire of described luminous zone, and LED chip is usually smaller, in order to weld/fitting LED chip better, usually the second thermoelectric (al) wire 3 in described luminous zone 6 is set to symmetrically arranged inverted "L" shaped, namely protrudes a part with closer to the first thermoelectric (al) wire 2.Also can be simultaneously the first thermoelectric (al) wire 2 in described luminous zone 6 for symmetrically arranged inverted "L" shaped, or the first thermoelectric (al) wire 2 in luminous zone 6 and the second thermoelectric (al) wire 3 are symmetrically arranged inverted "L" shaped simultaneously.
First thermoelectric (al) wire 2 of described radiating area 7 and the second thermoelectric (al) wire 3 are used for dispelling the heat, and LED can produce a large amount of heats in the process of luminescence, and heat is distributed by the first thermoelectric (al) wire 2 and the part of the second thermoelectric (al) wire 3 in radiating area 7.And distribute heat in air only by radiating area 7 or inadequate often in other medium of being in contact with it, sometimes need radiating area 7 to be connected on other thermal component, with distribute heat quickly.At this moment, the first thermoelectric (al) wire 2 in radiating area 7 and/or the second thermoelectric (al) wire 3 can be provided with the arc having and protrude downwards, to fit on other described thermal component.Meanwhile, because the material of the first thermoelectric (al) wire 2 and the second thermoelectric (al) wire 3 is metal, its heat conductivility is better, and can be welded direct on other thermal component, and does not need to be fitted on other thermal component by insulating barrier.
In another preferred embodiment of the present invention, the curved bottom shape of the first thermoelectric (al) wire 2 in above-mentioned radiating area 7 and/or the downward protrusion of the second thermoelectric (al) wire 3 is set to flat.When being set to the curved weld of the downward protrusion of the first thermoelectric (al) wire 2 in the radiating area 7 of flat and/or the second thermoelectric (al) wire 3 or fitting on other thermal component, its contact area is larger, heat-conducting effect is better, can not only be dispelled the heat by other thermal component simultaneously, itself also can directly distribute heat in air or in other medium of being in contact with it.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (7)
1. a LED circuit board, comprise the power line be arranged in parallel successively, first thermoelectric (al) wire, second thermoelectric (al) wire, also comprise multiple reinforcements of the vertical direction being arranged on described parallel direction, described reinforcement connects described power line, first thermoelectric (al) wire, second thermoelectric (al) wire, described first thermoelectric (al) wire and the part of the second thermoelectric (al) wire between two reinforcements closed on are provided with radiating area and luminous zone, it is characterized in that, reinforcement is for connecting described power line, first thermoelectric (al) wire, the part of the second thermoelectric (al) wire and described first thermoelectric (al) wire, the part of the second thermoelectric (al) wire between two reinforcements closed on disconnects at ad-hoc location.
2. LED circuit board according to claim 1, is characterized in that, described second thermoelectric (al) wire is other is also provided with an independent current source line abreast, and described independent current source line is connected with described second thermoelectric (al) wire by described reinforcement.
3. LED circuit board according to claim 1, is characterized in that, the second thermoelectric (al) wire in described luminous zone is symmetrically arranged inverted "L" shaped.
4. the LED circuit board according to claim 1 or 3, is characterized in that, the first thermoelectric (al) wire in described luminous zone is symmetrically arranged inverted "L" shaped.
5. LED circuit board according to claim 1, is characterized in that, the first thermoelectric (al) wire of described radiating area has the arc protruded downwards.
6. LED circuit board according to claim 5, is characterized in that, the second thermoelectric (al) wire of described radiating area has the arc protruded downwards.
7. the LED circuit board according to claim 5 or 6, is characterized in that, the curved bottom shape of described downward protrusion is flat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510629202.7A CN105276534A (en) | 2015-09-25 | 2015-09-25 | LED circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510629202.7A CN105276534A (en) | 2015-09-25 | 2015-09-25 | LED circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105276534A true CN105276534A (en) | 2016-01-27 |
Family
ID=55146026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510629202.7A Pending CN105276534A (en) | 2015-09-25 | 2015-09-25 | LED circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105276534A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1529914A (en) * | 2001-04-26 | 2004-09-15 | 森山产业株式会社 | Light source coupler, illuninant device, patterned conductor and method for manufacturing light source coupler |
| CN102200235A (en) * | 2010-03-26 | 2011-09-28 | 上海东熠光电有限公司 | Light-emitting diode (LED) light-emitting bar |
| CN102364713A (en) * | 2011-11-08 | 2012-02-29 | 吕能兵 | Light emitting diode (LED) bracket and crystallizing method |
| CN103994359A (en) * | 2014-06-10 | 2014-08-20 | 吴锦星 | Modularized LED lamp strip and processing method thereof |
| CN104930476A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | Metallic LED (light emitting diode) lamp support |
| CN104930388A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light emitting diode) substrate stripe |
| CN205050875U (en) * | 2015-09-25 | 2016-02-24 | 吴少健 | LED circuit board |
-
2015
- 2015-09-25 CN CN201510629202.7A patent/CN105276534A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1529914A (en) * | 2001-04-26 | 2004-09-15 | 森山产业株式会社 | Light source coupler, illuninant device, patterned conductor and method for manufacturing light source coupler |
| CN102200235A (en) * | 2010-03-26 | 2011-09-28 | 上海东熠光电有限公司 | Light-emitting diode (LED) light-emitting bar |
| CN102364713A (en) * | 2011-11-08 | 2012-02-29 | 吕能兵 | Light emitting diode (LED) bracket and crystallizing method |
| CN103994359A (en) * | 2014-06-10 | 2014-08-20 | 吴锦星 | Modularized LED lamp strip and processing method thereof |
| CN104930476A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | Metallic LED (light emitting diode) lamp support |
| CN104930388A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light emitting diode) substrate stripe |
| CN205050875U (en) * | 2015-09-25 | 2016-02-24 | 吴少健 | LED circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20161021 Address after: 311300, Zhejiang Province, Hangzhou City, Ling'an Qingshan Lake Street Chuen mouth village Applicant after: Linan New Sanlian Lighting Electric Co., Ltd. Address before: 528421, No. thirteen, Lane 5, dragon First Street, Cao two town, Guzhen Town, Guangdong, Zhongshan Applicant before: Wu Shaojian |