CN104470245A - Wave soldering process for LED plug-in lamp panel - Google Patents
Wave soldering process for LED plug-in lamp panel Download PDFInfo
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- CN104470245A CN104470245A CN201410706408.0A CN201410706408A CN104470245A CN 104470245 A CN104470245 A CN 104470245A CN 201410706408 A CN201410706408 A CN 201410706408A CN 104470245 A CN104470245 A CN 104470245A
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- unit lamp
- plug
- temperature
- led plug
- led
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a wave soldering process for an LED plug-in lamp panel. The method includes the steps of firstly, heating a solder machine according to the same rising slope so as to raise the temperature of the solder machine to 95 DEG C to 105 DEG C, and keeping the temperature for 20 seconds to 30 seconds; secondly, controlling the soldering tin temperature to rise to 240 DEG C to 250 DEG C at a constant speed so that crests can be formed at a soldering tin nozzle; thirdly, controlling the LED plug-in lamp panel to pass through the crests at a constant speed, wherein 2 seconds to 4 seconds are spent when a plug-in lamp pin passes through the crests; fourthly, controlling an LED plug-in lamp to enter a cooling chamber at a constant speed after wave soldering is conducted, detecting the temperature of the welded LED plug-in lamp pin in real time, and moving the LED plug-in lamp panel out of the cooling chamber when the temperature of the welded LED plug-in lamp pin reaches 25 DEG C+/-2 DEG C. Preheating is conducted before the soldering tin is heated, the property of the soldering tin can be brought into full play, a welded LED lamp is more stable and firmer, and the ultra-large heat impact is reduced.
Description
Technical field
The invention belongs to electronics applications field, be specifically related to a kind of wave soldering processes of LED plug-in unit lamp plate.
Background technology
Wave-soldering refers to the solder (terne metal) of fusing, the solder wave of designing requirement is become through electrodynamic pump or electromagnetic pump jet flow, also by being formed to solder pot nitrogen injection, make the printed board that components and parts are housed in advance by solder wave, realize the room machine of components and parts welding end or pin and printed board pad and the solder of electrical connection.
Wave-soldering flow process: element to be inserted in corresponding component hole → pre-coated soldering flux → preheating → wave-soldering → cool → excise the pin → inspection of unnecessary plug-in unit.
Peak welds along with the enhancing of people to environmental protection consciousness has had new welding procedure.Employing in the past be leypewter, but lead is heavy metal has very large injury to human body.So there is lead-free process, adopt SAC and special scaling powder, and the preheat temperature that the requirement of welding temperature is higher.
In wave-soldering, the generation of scum silica frost is a stubborn problem, in welding process, all the time there is scum silica frost to exist in solder furnace, weld especially obvious in an atmosphere, because the solder surface be exposed in air is too large, and solder is oxidized, more scum silica frost can be produced, at present, the method that main employing pin scum silica frost is skimmed takes out scum silica frost, often carries out slash and cuts, scum silica frost can be caused to generate faster, the solder consumed can increase, and scum silica frost is too much, the scum silica frost of solder surface may enter in pump, block pumps.
Application number is 201410034378.3, the peak welding system of the applying date a kind of LED plug-in unit lamp plate that has been the disclosure of the invention of 2014.01.24, comprise transport module, temperature detecting module, tin oven module, refrigerating module, crest control module, system control module, described tin oven module also comprises except scruff device, oxidation, LED plug-in unit lamp plate checkout gear, and this system can the scruff of filtering flue inside automatically; Oxidation effectively can isolate the contact of scolding tin and air, avoids oxidation to produce scruff.The invention also discloses a kind of control method of peak welding system of LED plug-in unit lamp plate, by controlling scolding tin temperature, LED plug-in unit lamp plate is regulated to immerse the degree of depth of crest, plug-in unit lamp base on control LED plug-in unit lamp plate is through the time of crest, effectively improve welding efficiency and quality, save cost.
The program also discloses a kind of control method of peak welding system of LED plug-in unit lamp plate, comprises the steps:
(1) system control module control heater, by scolding tin heating temperatures to 230 ~ 250 degree, and keeps this temperature;
(2) control scolding tin and form crest at tin stove nozzle;
(3) LED plug-in unit lamp plate is at the uniform velocity transferred through crest by controls transfer module, the plug-in unit lamp base on regulate LED plug-in unit lamp plate to immerse 30% ~ 60%, control LED plug-in unit lamp plate that the crest degree of depth is LED plug-in unit lamp plate thickness through peak time be 3 ~ 5 seconds;
(4) control LED plug-in unit lamp plate enters refrigerating module and is cooled to normal temperature.
The temperature of tin stove is directly increased to 230 degree by above-mentioned patent, and the temperature shock that the method for this direct Fast Heating can cause scolding tin is excessive, effectively can not play the character of scolding tin, easily produce scum silica frost.
Summary of the invention
Technical problem to be solved by this invention is: the wave soldering processes providing a kind of LED plug-in unit lamp plate, solves tin stove in prior art and heats the problem causing temperature shock excessive too soon.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
A wave soldering processes for LED plug-in unit lamp plate, comprises the steps:
Step 1, the temperature of tin stove is heated to 95 DEG C ~ 105 DEG C by the identical rate of rise, keeps this temperature 20 ~ 30 seconds;
Step 2, control scolding tin temperature at the uniform velocity rise to 240 DEG C ~ 250 DEG C, form crest at tin stove nozzle;
Step 3, control LED plug-in unit lamp plate are at the uniform velocity through crest, and plug-in unit lamp base is 2 ~ 4 seconds through the time of crest;
LED plug-in unit lamp after step 4, control wave soldering at the uniform velocity enters cooling chamber;
The temperature of the LED plug-in unit lamp base after step 5, detection welding in real time, when the LED plug-in unit lamp base temperature after welding reaches 25 ± 2 DEG C, shifts out cooling chamber by LED plug-in unit lamp plate.
Control tin furnace temperature 100 DEG C in described step 1, keep 30 seconds.
In described step 2, scolding tin temperature is 245 degree.
In described step 3, LED plug-in unit lamp plate immerses the crest degree of depth is 30% ~ 60% of LED plug-in unit lamp plate thickness.
It is 50% that described LED plug-in unit lamp plate immerses the crest degree of depth.
In described step 3, plug-in unit lamp base is 3 seconds through the time of crest.
Compared with prior art, the present invention has following beneficial effect:
1, heat scolding tin temperature, first carry out preheating, the character of scolding tin can be given full play to, the LED of welding is stablized firmly more, decreases excessive heat and impact.
2, control temperature steadily rises or declines, and avoids non-uniform temperature to cause scolding tin character to change, and avoids temperature fluctuation to damage LED.
3, the process entering cooling chamber is wanted steadily, avoids vibration to cause damage to the LED lamp panel welded, effectively improves the total quality of LED lamp panel.
Embodiment
Below structure of the present invention and the course of work are described further.
A wave soldering processes for LED plug-in unit lamp plate, comprises the steps:
Step 1, the temperature of tin stove is heated to 95 DEG C ~ 105 DEG C by the identical rate of rise, keeps this temperature 20 ~ 30 seconds;
Step 2, control scolding tin temperature at the uniform velocity rise to 240 DEG C ~ 250 DEG C, form crest at tin stove nozzle;
Step 3, control LED plug-in unit lamp plate are at the uniform velocity through crest, and plug-in unit lamp base is 2 ~ 4 seconds through the time of crest;
LED plug-in unit lamp after step 4, control wave soldering at the uniform velocity enters cooling chamber;
The temperature of the LED plug-in unit lamp base after step 5, detection welding in real time, when the LED plug-in unit lamp base temperature after welding reaches 25 ± 2 DEG C, shifts out cooling chamber by LED plug-in unit lamp plate.
Heating scolding tin temperature, first carries out preheating, can give full play to the character of scolding tin, the LED of welding is stablized firmly more, decreases excessive heat and impact.
Control temperature steadily rises or declines, and avoids non-uniform temperature to cause scolding tin character to change, and avoids temperature fluctuation to damage LED.
The process entering cooling chamber is wanted steadily, avoids vibration to cause damage to the LED lamp panel welded, effectively improves the total quality of LED lamp panel.
Control tin furnace temperature 100 DEG C in described step 1, keep 30 seconds.
In described step 2, scolding tin temperature is 245 degree.
In described step 3, LED plug-in unit lamp plate immerses the crest degree of depth is 30% ~ 60% of LED plug-in unit lamp plate thickness.
It is 50% that described LED plug-in unit lamp plate immerses the crest degree of depth.
In described step 3, plug-in unit lamp base is 3 seconds through the time of crest.
Specific embodiment one,
A wave soldering processes for LED plug-in unit lamp plate, comprises the steps:
Step 1, the temperature of tin stove is heated to 100 DEG C by the identical rate of rise, keeps this temperature 25 seconds;
Step 2, control scolding tin temperature at the uniform velocity rise to 245 DEG C, form crest at tin stove nozzle;
Step 3, control LED plug-in unit lamp plate are at the uniform velocity through crest, and plug-in unit lamp base is 3 seconds through the time of crest; Keeping LED plug-in unit lamp plate to immerse the crest degree of depth is 50% of LED plug-in unit lamp plate thickness;
LED plug-in unit lamp after step 4, control wave soldering at the uniform velocity enters cooling chamber;
The temperature of the LED plug-in unit lamp base after step 5, detection welding in real time, when the LED plug-in unit lamp base temperature after welding reaches 25, shifts out cooling chamber by LED plug-in unit lamp plate.
Specific embodiment two,
A wave soldering processes for LED plug-in unit lamp plate, comprises the steps:
Step 1, the temperature of tin stove is heated to 95 DEG C by the identical rate of rise, keeps this temperature 30 seconds;
Step 2, control scolding tin temperature at the uniform velocity rise to 240 DEG C, form crest at tin stove nozzle;
Step 3, control LED plug-in unit lamp plate are at the uniform velocity through crest, and plug-in unit lamp base is 4 seconds through the time of crest; Keeping LED plug-in unit lamp plate to immerse the crest degree of depth is 60% of LED plug-in unit lamp plate thickness;
LED plug-in unit lamp after step 4, control wave soldering at the uniform velocity enters cooling chamber;
The temperature of the LED plug-in unit lamp base after step 5, detection welding in real time, when the LED plug-in unit lamp base temperature after welding reaches 23 DEG C, shifts out cooling chamber by LED plug-in unit lamp plate.
Specific embodiment three,
A wave soldering processes for LED plug-in unit lamp plate, comprises the steps:
Step 1, the temperature of tin stove is heated to 105 DEG C by the identical rate of rise, keeps this temperature 20 seconds;
Step 2, control scolding tin temperature at the uniform velocity rise to 250 DEG C, form crest at tin stove nozzle;
Step 3, control LED plug-in unit lamp plate are at the uniform velocity through crest, and plug-in unit lamp base is 2 seconds through the time of crest; Keeping LED plug-in unit lamp plate to immerse the crest degree of depth is 40% of LED plug-in unit lamp plate thickness;
LED plug-in unit lamp after step 4, control wave soldering at the uniform velocity enters cooling chamber;
The temperature of the LED plug-in unit lamp base after step 5, detection welding in real time, when the LED plug-in unit lamp base temperature after welding reaches 27 DEG C, shifts out cooling chamber by LED plug-in unit lamp plate.
Specific embodiment four,
A wave soldering processes for LED plug-in unit lamp plate, comprises the steps:
Step 1, the temperature of tin stove is heated to 98 DEG C by the identical rate of rise, keeps this temperature 28 seconds;
Step 2, control scolding tin temperature at the uniform velocity rise to 243 DEG C, form crest at tin stove nozzle;
Step 3, control LED plug-in unit lamp plate are at the uniform velocity through crest, and plug-in unit lamp base is 3 seconds through the time of crest; Keeping LED plug-in unit lamp plate to immerse the crest degree of depth is 30% of LED plug-in unit lamp plate thickness;
LED plug-in unit lamp after step 4, control wave soldering at the uniform velocity enters cooling chamber;
The temperature of the LED plug-in unit lamp base after step 5, detection welding in real time, when the LED plug-in unit lamp base temperature after welding reaches 26 DEG C, shifts out cooling chamber by LED plug-in unit lamp plate.
Claims (6)
1. a wave soldering processes for LED plug-in unit lamp plate, is characterized in that: comprise the steps:
Step 1, the temperature of tin stove is heated to 95 DEG C ~ 105 DEG C by the identical rate of rise, keeps this temperature 20 ~ 30 seconds;
Step 2, control scolding tin temperature at the uniform velocity rise to 240 DEG C ~ 250 DEG C, form crest at tin stove nozzle;
Step 3, control LED plug-in unit lamp plate are at the uniform velocity through crest, and plug-in unit lamp base is 2 ~ 4 seconds through the time of crest;
LED plug-in unit lamp after step 4, control wave soldering at the uniform velocity enters cooling chamber;
The temperature of the LED plug-in unit lamp base after step 5, detection welding in real time, when the LED plug-in unit lamp base temperature after welding reaches 25 ± 2 DEG C, shifts out cooling chamber by LED plug-in unit lamp plate.
2. the wave soldering processes of LED plug-in unit lamp plate according to claim 1, is characterized in that: control tin furnace temperature 100 DEG C in described step 1, keeps 30 seconds.
3. the wave soldering processes of LED plug-in unit lamp plate according to claim 1, is characterized in that: in described step 2, scolding tin temperature is 245 degree.
4. the wave soldering processes of LED plug-in unit lamp plate according to claim 1, is characterized in that: in described step 3, LED plug-in unit lamp plate immerses the crest degree of depth is 30% ~ 60% of LED plug-in unit lamp plate thickness.
5. the wave soldering processes of LED plug-in unit lamp plate according to claim 4, is characterized in that: it is 50% that described LED plug-in unit lamp plate immerses the crest degree of depth.
6. the wave soldering processes of LED plug-in unit lamp plate according to claim 1, is characterized in that: in described step 3, plug-in unit lamp base is 3 seconds through the time of crest.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410706408.0A CN104470245A (en) | 2014-12-01 | 2014-12-01 | Wave soldering process for LED plug-in lamp panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410706408.0A CN104470245A (en) | 2014-12-01 | 2014-12-01 | Wave soldering process for LED plug-in lamp panel |
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| CN104470245A true CN104470245A (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410706408.0A Pending CN104470245A (en) | 2014-12-01 | 2014-12-01 | Wave soldering process for LED plug-in lamp panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604566A (en) * | 2017-01-13 | 2017-04-26 | 昆山福烨电子有限公司 | Wave soldering method for printed circuit board |
| CN107135614A (en) * | 2017-05-25 | 2017-09-05 | 杭州晶志康电子科技有限公司 | Printed circuit board (PCB) paster processing technology |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781290A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Wave soldering system for LED plug-in lamp panel and control method thereof |
-
2014
- 2014-12-01 CN CN201410706408.0A patent/CN104470245A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781290A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Wave soldering system for LED plug-in lamp panel and control method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 马洪涛: "基于PID的波峰焊温度控制研究", 《热加工工艺》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604566A (en) * | 2017-01-13 | 2017-04-26 | 昆山福烨电子有限公司 | Wave soldering method for printed circuit board |
| CN107135614A (en) * | 2017-05-25 | 2017-09-05 | 杭州晶志康电子科技有限公司 | Printed circuit board (PCB) paster processing technology |
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Application publication date: 20150325 |
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