CN219561715U - Electromagnetic heating PCBA's selection welding stove - Google Patents
Electromagnetic heating PCBA's selection welding stove Download PDFInfo
- Publication number
- CN219561715U CN219561715U CN202320141891.7U CN202320141891U CN219561715U CN 219561715 U CN219561715 U CN 219561715U CN 202320141891 U CN202320141891 U CN 202320141891U CN 219561715 U CN219561715 U CN 219561715U
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- CN
- China
- Prior art keywords
- pcba
- furnace
- selective
- controller
- guide rail
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Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 31
- 238000003466 welding Methods 0.000 title claims abstract description 26
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title claims abstract 17
- 238000005476 soldering Methods 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000001931 thermography Methods 0.000 claims description 11
- 238000005485 electric heating Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model belongs to the technical field of PCBA processing technology, and particularly relates to a selective soldering furnace for electromagnetic heating PCBA. An electromagnetic heater and a conveying guide rail are arranged in the selective welding furnace, a PCBA is placed on the conveying guide rail, a controller and a furnace cover are arranged on the selective welding furnace, and the electromagnetic heater and the conveying guide rail are connected with the controller. According to the utility model, different parts of the PCBA are heated in a differential mode by electromagnetic wave heating, so that the copper foil part in the PCBA is heated sufficiently while parts are not damaged.
Description
Technical Field
The utility model belongs to the technical field of PCBA processing technology, and particularly relates to a selective soldering furnace for electromagnetic heating PCBA.
Background
The selective soldering is also called selective wave soldering, and the industrial application field is a through hole soldering device with advanced technology, and compared with the traditional wave soldering, the most obvious difference between the two is that the lower part of the PCB is completely immersed in liquid solder in the wave soldering, and only part of specific areas are contacted with solder wave in the selective soldering. The selective welding must also be pre-coated with flux prior to welding; in contrast to wave soldering, the flux is only applied to the lower part of the PCB where it is to be soldered, not the entire PCB. In addition, selective welding is only applicable to welding of the cartridge components. In recent industrial applications, there has been a growing trend toward through-hole soldering, and the application range is not limited to: and the multi-layer PCB through hole welding with high welding requirements and complex process such as military electronics, aerospace ship electronics, automobile electronics, digital cameras, printers and the like.
The components are preheated in the preheating zone of the welder during the transfer by the chain conveyor (the preheating of the components and the temperatures to which they are subjected are still controlled by a predetermined temperature profile). In actual welding, the preheating temperature of the component surface is also controlled, so that corresponding temperature detection devices (such as infrared detectors) are added to many devices. After preheating, the assembly is soldered by a single small nozzle solder wave. The small welding nozzle soldering wave contains molten liquid solder, and the bottom nozzle of the small welding nozzle soldering wave gushes out the molten soldering material to the wave crest with a fixed shape, so that the welding surface of the component is heated by the soldering wave when passing the wave, and the soldering area is wetted by the soldering wave and is spread and filled, and finally, the soldering process is realized.
The preheat zone provides sufficient temperature to achieve the desired tin level in the via and to form a good bond. The current method for heating the selected soldering furnace is an infrared heating pipe and a metal heating plate, and the heating method can lead the PCBA to be heated uniformly, but the defects are also obvious, namely, no difference heating is caused. Because most parts have strict temperature-resistant requirements, the temperature of the part body can reach the temperature-resistant requirements due to the non-differential heating, but copper foil on PCBA (printed circuit board assembly) does not reach ideal tin-coating temperature due to the problems of quick heat dissipation and the like, so that tin-coating in holes is insufficient, and the process adjustment encounters a bottleneck.
Disclosure of Invention
In order to overcome the defect of heating of the PCBA, the utility model realizes the differential heating of metals on the PCBA, thereby providing a selective soldering furnace for electromagnetic heating of the PCBA, wherein an electromagnetic heater and a conveying guide rail are arranged in the selective soldering furnace;
PCBA is placed on the conveying guide rail;
a controller and a furnace cover are arranged on the selective welding furnace;
the electromagnetic heater and the conveying guide rail are connected with the controller;
a temperature detector is arranged in the furnace cover;
the controller heats the PCBA through the electromagnetic heater, and obtains the temperature value of the copper foil on the PCBA through the temperature detector;
when the temperature value of the copper foil reaches a set value, the controller drives the conveying guide rail to convey the PCBA to the next process.
Preferably, an electric heating pipe is also arranged in the selective welding furnace;
the controller is connected with the electric heating pipe and is used for preheating the soldering flux on the PCBA.
Preferably, a display screen is arranged outside the furnace cover;
the temperature detector adopts a thermal imaging camera;
the controller is connected with the display screen, and the thermal imaging information of the PCBA is displayed through the display screen.
Preferably, a heat preservation layer is arranged in the selective welding furnace.
Preferably, two sides of the selective welding furnace are provided with material openings for conveying the guide rails to pass through.
Preferably, the controller adopts an AT89C51 singlechip or an STC10 series singlechip.
From the above technical scheme, the utility model has the following advantages:
the utility model sets the electromagnetic heater, and the alternating magnetic field is generated by the component parts of the electronic circuit board to heat the PCBA magnetic metal piece, so that the PCBA magnetic metal piece reaches a proper tin coating temperature, other non-magnetic parts are ensured not to be heated, and further differential heating of the parts on the PCBA is realized. According to the utility model, the PCBA is preheated through the electric heating pipe, so that the rapid heating up to the set tin-plating temperature can be ensured in the later electromagnetic induction heating. According to the utility model, the thermal imaging information of the PCBA is obtained through the thermal imaging camera, and whether the temperature of the part to be tin-plated on the PCBA reaches a set value is observed through the display screen. The utility model carries out differential heating on different parts of the PCBA, ensures that the copper foil part in the PCBA is sufficiently heated while the parts are not damaged, and ensures that electromagnetic heating is applied and popularized in the field of selective soldering furnaces.
Drawings
In order to more clearly illustrate the technical solutions of the present utility model, the drawings that are needed in the description will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the interior of a selective soldering furnace.
FIG. 2 is a schematic view of a select welder.
FIG. 3 is a schematic diagram of a select welder control.
In the figure: 1-a selective welding furnace, 2-an electromagnetic heater, 3-an electric heating pipe, 4-a controller, 5-a temperature detector, 6-a display screen, 7-a material port, 8-a furnace cover and 9-a conveying guide rail.
Detailed Description
In order to make the objects, features and advantages of the present utility model more obvious and understandable, the technical solutions of the present utility model will be clearly and completely described below with reference to the drawings in this specific embodiment, and it is apparent that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, based on the embodiments in this patent, which would be within the purview of one of ordinary skill in the art without the particular effort to make the utility model are intended to be within the scope of the patent protection.
The utility model provides a selective soldering furnace 1 for electromagnetic heating PCBA, as shown in figures 1 to 3, comprising: an electromagnetic heater 2 and a conveyor rail 9. The PCBA is placed on the conveyor rail 9. The selective welding furnace 1 is provided with a controller 4 and a furnace cover 8. The controller 4 adopts an AT89C51 singlechip, an industrial PLC or STC10 series singlechip. The furnace cover 8 is internally provided with a temperature detector 5, the controller 4 heats the PCBA through the electromagnetic heater 2, and the temperature value of the copper foil on the PCBA is obtained through the temperature detector 5. When the temperature value of the copper foil reaches a set value, the controller 4 drives the transfer rail 9 to transfer the PCBA to the next process.
It is further explained that the temperature detector 5 employs a thermal imaging camera. The controller 4 obtains the thermal imaging information of the PCBA through the thermal imaging camera and displays the thermal imaging information through the display screen 6, so that staff can timely obtain the temperature of each part of the PCBA, and when the temperature reaches the corresponding temperature, the temperature is timely transmitted to the next procedure through the transmission guide rail 9.
A preheating zone and a thermal compensation zone are arranged in the selective welding furnace 1, an electric heating pipe 3 is arranged in the preheating zone, and an electromagnetic heater 2 is arranged in the thermal compensation zone. The two sides of the selective welding furnace 1 are provided with a material opening 7 for the transmission guide rail 9 to pass through, and the preheating zone and the thermal compensation zone are communicated by the transmission guide rail 9. The controller 4 is connected with the electric heating pipe 3, and the controller 4 preheats the soldering flux on the PCBA through the electric heating pipe 3. Meanwhile, the heat-insulating layers are arranged at the preheating zone and the thermal compensation zone.
Based on the above arrangement, the present utility model will be further described with reference to a specific embodiment of the work flow of the selective soldering furnace 1 of the present utility model.
After the PCBA is sprayed with the soldering flux, the soldering flux is heated by the electric heating pipe 3, after the corresponding heating time is reached at the set temperature, the controller 4 moves the PCBA to a thermal compensation area through the conveying guide rail 9, and the electromagnetic heater 2 is used for electromagnetic heating of the PCBA magnetic metal parts. The principle of electromagnetic heating is that an alternating magnetic field is generated by the component parts of an electronic circuit board, when an iron-containing container is placed on the container, alternating magnetic force lines are cut on the surface of the container, alternating current (namely vortex) is generated at the metal part at the bottom of the container, and the vortex enables carriers at the bottom of the container to move randomly at a high speed, and the carriers collide with atoms and rub with each other, so that heat energy is generated. Thereby having an effect of heating the article. The iron container generates heat, so the heat conversion rate is particularly high and can reach 95%, and the iron container is a direct heating mode.
The staff obtains each part temperature information of PCBA through thermal imaging camera or infrared detector, obtains sufficient heating at PCBA copper foil part after, and controller 4 moves PCBA to next process through conveying guide rail 9 and carries out the tin-plating.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. A selective soldering furnace for electromagnetic heating PCBA is characterized in that an electromagnetic heater and a conveying guide rail are arranged in the selective soldering furnace;
PCBA is placed on the conveying guide rail;
a controller and a furnace cover are arranged on the selective welding furnace;
the electromagnetic heater and the conveying guide rail are connected with the controller;
a temperature detector is arranged in the furnace cover;
the controller heats the PCBA through the electromagnetic heater, and obtains the temperature value of the copper foil on the PCBA through the temperature detector;
when the temperature value of the copper foil reaches a set value, the controller drives the conveying guide rail to convey the PCBA to the next process;
a display screen is arranged outside the furnace cover;
the temperature detector adopts a thermal imaging camera;
the controller is connected with the display screen, and the thermal imaging information of the PCBA is displayed through the display screen.
2. The selective soldering furnace for electromagnetic heating of PCBA according to claim 1, wherein,
an electric heating pipe is also arranged in the selective welding furnace;
the controller is connected with the electric heating pipe and is used for preheating the soldering flux on the PCBA.
3. The selective soldering furnace for electromagnetic heating of PCBA according to claim 1, wherein,
an insulating layer is arranged in the selective welding furnace.
4. The selective soldering furnace for electromagnetic heating of PCBA according to claim 1, wherein,
two sides of the selective welding furnace are provided with material openings for conveying the guide rails to pass through.
5. The selective soldering furnace for electromagnetic heating of PCBA according to claim 1, wherein,
the controller adopts an AT89C51 singlechip or STC10 series singlechip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320141891.7U CN219561715U (en) | 2023-01-30 | 2023-01-30 | Electromagnetic heating PCBA's selection welding stove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320141891.7U CN219561715U (en) | 2023-01-30 | 2023-01-30 | Electromagnetic heating PCBA's selection welding stove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219561715U true CN219561715U (en) | 2023-08-22 |
Family
ID=87657031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320141891.7U Active CN219561715U (en) | 2023-01-30 | 2023-01-30 | Electromagnetic heating PCBA's selection welding stove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219561715U (en) |
-
2023
- 2023-01-30 CN CN202320141891.7U patent/CN219561715U/en active Active
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