CN215280246U - Whole course nitrogen-filled tin furnace - Google Patents
Whole course nitrogen-filled tin furnace Download PDFInfo
- Publication number
- CN215280246U CN215280246U CN202120843814.7U CN202120843814U CN215280246U CN 215280246 U CN215280246 U CN 215280246U CN 202120843814 U CN202120843814 U CN 202120843814U CN 215280246 U CN215280246 U CN 215280246U
- Authority
- CN
- China
- Prior art keywords
- pcb
- module
- soldering
- tin
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 26
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 title description 16
- 229910052757 nitrogen Inorganic materials 0.000 title description 8
- 238000005476 soldering Methods 0.000 claims abstract description 38
- 230000004907 flux Effects 0.000 claims abstract description 22
- 238000005507 spraying Methods 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- CMLMFNACXHHYRY-UHFFFAOYSA-N azanylidynetin Chemical compound [N].[Sn] CMLMFNACXHHYRY-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims abstract description 6
- 230000007246 mechanism Effects 0.000 claims abstract description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims 1
- 230000007723 transport mechanism Effects 0.000 claims 1
- 239000000843 powder Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a whole course fills nitrogen tin stove, it carries out the soldering operation to the PCB board, and this PCB board passes through a transmission device and runs in this whole course fills nitrogen tin stove, and this whole course fills nitrogen tin stove includes a first preheating module, a spraying module, a second preheating module, a soldering tin module and a cooling module in order; the first preheating module is used for heating the PCB on the transmission mechanism for the first time before soldering flux spraying, so that the electronic elements on the PCB absorb part of heat; the spraying module is used for spraying soldering flux on the PCB after the PCB is heated for the first time; the second preheating module is used for heating the PCB after the soldering flux is sprayed for the second time, so that the soldering flux on the PCB absorbs heat and electronic elements on the PCB absorb part of heat again; the soldering tin module is used for carrying out soldering tin operation on the PCB after the second heating; the cooling module is used for cooling the PCB after soldering operation.
Description
Technical Field
The utility model relates to a whole-course nitrogen-filled tin furnace.
Background
At present, the common tin furnace has the following limitations: because the common tin furnace is coated with the soldering flux firstly and then preheated, the following two troubles appear when the common tin furnace is used for dealing with elements with large heat capacity and elements with large grounding copper foil layers and large area: a. raising the preheat temperature or increasing the preheat time to achieve a sufficient temperature for the component to cause the applied flux to bake out and fail, thereby affecting the tin level on the component; b. in order to ensure that the soldering flux is not baked and the activity is kept, the temperature of the element with large heat capacity and the element with large area and more layers of grounding copper foil is not enough, and the tin coating height of the element is further influenced.
Therefore, how to provide the whole-course nitrogen-filled tin furnace for avoiding the influence on the tin-feeding height caused by poor preheating becomes a problem to be saved.
Disclosure of Invention
The utility model aims to solve the technical problem that a whole nitrogen tin furnace that fills is provided, it can avoid because preheat harmfully lead to influencing the tinning height
In order to solve the technical problem, the utility model provides a whole nitrogen-filled tin furnace, it carries out the soldering operation to the PCB board, and the PCB board passes through a transmission mechanism and runs in this whole nitrogen-filled tin furnace, and this whole nitrogen-filled tin furnace includes a first preheating module, a spraying module, a second preheating module, a soldering tin module and a cooling module in proper order;
the first preheating module is used for heating the PCB on the transmission mechanism for the first time before soldering flux spraying, so that the electronic elements on the PCB absorb part of heat;
the spraying module is used for spraying soldering flux on the PCB after the PCB is heated for the first time;
the second preheating module is used for heating the PCB after the soldering flux is sprayed for the second time, so that the soldering flux on the PCB absorbs heat and electronic elements on the PCB absorb part of heat again;
the soldering tin module is used for carrying out soldering tin operation on the PCB after the second heating;
the cooling module is used for cooling the PCB after soldering operation.
Preferably, the flux is rosin.
Compared with the prior art, the utility model discloses a whole journey fills nitrogen tin stove can carry out the first time heating before treating welded PCB board and carry out the spraying scaling powder to let the component on the PCB board, especially the big component of thermal capacity and the ground connection copper foil number of piles is many, the big component of area heats in advance, heats once more after the spraying scaling powder after that, thereby guarantees that component temperature and scaling powder on the PCB circuit board reach the best temperature before the welding simultaneously, improves the last tin height of component, promotes the product quality.
[ description of the drawings ]
FIG. 1 is a block schematic diagram of the whole course nitrogen-filled tin furnace of the present invention.
[ detailed description ] embodiments
Please refer to fig. 1, the utility model provides a whole nitrogen tin furnace 1 that fills, it carries out the soldering operation to the PCB board, and this PCB board is in through a transmission mechanism the utility model discloses a whole nitrogen tin furnace 1 that fills moves, the utility model discloses a whole nitrogen tin furnace 1 that fills includes that a first preheating module 10, a spraying module 11, a second preheat module 12, a soldering tin module 13, a cooling module 14 in proper order.
The first preheating module 10 is configured to heat the PCB located on the conveying mechanism for the first time before flux spraying, so that the electronic components on the PCB absorb a part of the heat.
The spraying module 11 is used for spraying a soldering flux on the PCB after the first heating, wherein the soldering flux may be rosin or the like.
The second preheating module 12 heats the PCB after the soldering flux is sprayed for the second time, so that the soldering flux on the PCB absorbs heat and simultaneously allows the electronic components on the PCB to absorb a part of heat again.
And a soldering module 13 for performing a soldering operation on the PCB after the second heating.
And a cooling module 14 for cooling the PCB after the soldering operation.
Through the utility model discloses a whole journey fills nitrogen tin stove 1, can carry out the first time heating before treating welded PCB board and carry out the spraying scaling powder to let the component on the PCB board, especially the big component of thermal capacity and the ground connection copper foil number of piles is many, the big component of area heats in advance, heats once more after the spraying scaling powder after that, thereby guarantees that component temperature and scaling powder on the PCB circuit board reach the best temperature before the welding simultaneously, improves the tinning height of component, promotes the product quality.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (2)
1. A whole course fills the nitrogen tin stove, it carries on the tin soldering operation to the PCB board, this PCB board passes a transport mechanism and fills the nitrogen tin stove to run in this whole course, characterized by that, should fill the nitrogen tin stove and include a first preheating module, a spray module, a second preheating module, a soldering tin module and a cooling module sequentially in this whole course;
the first preheating module is used for heating the PCB on the transmission mechanism for the first time before soldering flux spraying, so that the electronic elements on the PCB absorb part of heat;
the spraying module is used for spraying soldering flux on the PCB after the PCB is heated for the first time;
the second preheating module is used for heating the PCB after the soldering flux is sprayed for the second time, so that the soldering flux on the PCB absorbs heat and electronic elements on the PCB absorb part of heat again;
the soldering tin module is used for carrying out soldering tin operation on the PCB after the second heating;
the cooling module is used for cooling the PCB after soldering operation.
2. The tin furnace according to claim 1, wherein the flux is rosin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120843814.7U CN215280246U (en) | 2021-04-22 | 2021-04-22 | Whole course nitrogen-filled tin furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120843814.7U CN215280246U (en) | 2021-04-22 | 2021-04-22 | Whole course nitrogen-filled tin furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215280246U true CN215280246U (en) | 2021-12-24 |
Family
ID=79537667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120843814.7U Expired - Fee Related CN215280246U (en) | 2021-04-22 | 2021-04-22 | Whole course nitrogen-filled tin furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215280246U (en) |
-
2021
- 2021-04-22 CN CN202120843814.7U patent/CN215280246U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211224 |