CN115103528A - Flexible circuit board connector welding method and flexible circuit board - Google Patents
Flexible circuit board connector welding method and flexible circuit board Download PDFInfo
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- CN115103528A CN115103528A CN202210700065.1A CN202210700065A CN115103528A CN 115103528 A CN115103528 A CN 115103528A CN 202210700065 A CN202210700065 A CN 202210700065A CN 115103528 A CN115103528 A CN 115103528A
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- pad
- soldering
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- 238000003466 welding Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910000679 solder Inorganic materials 0.000 claims abstract description 50
- 238000005476 soldering Methods 0.000 claims abstract description 49
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 33
- 238000007639 printing Methods 0.000 claims abstract description 31
- 239000011241 protective layer Substances 0.000 claims abstract description 23
- 230000001681 protective effect Effects 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 20
- 239000010959 steel Substances 0.000 claims description 20
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 230000004907 flux Effects 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application is suitable for the technical field of flexible circuit boards, and provides a flexible circuit board connector welding method, which comprises the following steps: providing a flexible circuit board, wherein a connector welding disc is arranged on the flexible circuit board; printing solder paste on the surface of the flexible circuit board, wherein part of the solder paste covers the connector pad to be used as a tin protective layer; sticking a nickel sheet on the flexible circuit board; reflow soldering is carried out on the flexible circuit board, so that the nickel sheet is fixed on the flexible circuit board through solder paste; attaching a protective film on the surface of the flexible circuit board, and pressing and baking; and welding the connector on the connector pad. The application also provides a flexible circuit board. The welding method of the flexible circuit board connector can avoid the oxidation of the connector welding plate in the processing process, and the welding performance of the connector welding plate is good.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a flexible circuit board connector welding method and a flexible circuit board.
Background
With the popularization of new energy automobiles, the welding and protection technology of devices on flexible circuit boards used by new energy power batteries is one of the key factors for developing the technological progress of new energy automobiles. A nickel plate and a connector need to be welded on a flexible circuit board of the power battery pack, wherein a Polyimide (PI) protective film is attached to the nickel plate after the nickel plate is welded in order to enhance the welding strength of the nickel plate. Because the volume ratio of DIP connector is bigger, can't realize the pressfitting technology of PI protection film, consequently can not weld nickel piece and DIP connector simultaneously, can only weld the DIP connector after welding the nickel piece and laminating pressfitting PI protection film, however, this kind of process flow will lead to the connector pad to be heated many times to and expose in the air for a long time and cause the connector pad to oxidize, and then reduced welding performance.
Disclosure of Invention
The application provides a flexible circuit board connector welding method and a flexible circuit board, which aim to solve the problem that welding performance is reduced due to oxidation of a connector pad in machining.
A first aspect of the present application proposes a method of soldering a flexible circuit board connector, comprising:
providing a flexible circuit board, wherein a connector pad is arranged on the flexible circuit board;
printing solder paste on the surface of the flexible circuit board, wherein part of the solder paste covers the connector pad to be used as a tin protective layer;
sticking a nickel sheet on the flexible circuit board;
reflow soldering is carried out on the flexible circuit board, so that the nickel sheet is fixed on the flexible circuit board through solder paste;
attaching a protective film on the surface of the flexible circuit board, and pressing and baking;
and welding a connector on the connector pad.
In some embodiments, the connector pad is an annular pad and a plug hole is formed in the middle of the annular pad, and the tin protective layer covers the annular pad and avoids the plug hole.
In some embodiments, printing solder paste on a surface of the flexible circuit board includes:
providing a printing steel mesh, wherein a windowing part and a shielding part are arranged on the printing steel mesh, the shielding part corresponds to the plug hole, and the size of the shielding part is larger than or equal to that of the plug hole; the windowing part surrounds the periphery of the shielding part and corresponds to the annular bonding pad;
placing the printing steel mesh above the flexible circuit board;
and printing solder paste on the surface of the flexible circuit board through the printing steel mesh, wherein the solder paste covers the annular pad through the windowing part and forms the tin protective layer.
In some embodiments, the windowing portion includes a first half ring and a second half ring that are disposed opposite to each other and have the same radius, and two spaced first connecting portions are formed between the first half ring and the second half ring, and the two first connecting portions are respectively connected to two sides of the shielding portion.
In some embodiments, the windowing portion further comprises a third half ring and a fourth half ring which are opposite to each other, two spaced second connecting portions are formed between the third half ring and the fourth half ring, and the third half ring and the fourth half ring are arranged outside the first half ring and the second half ring; the two first connecting parts and the two second connecting parts are alternately and alternately arranged on the periphery of the shielding part.
In some embodiments, an end of the first half ring protrudes toward the direction close to the shielding portion; and/or the end part of the first half ring protrudes towards the direction departing from the shielding part.
In some embodiments, soldering a connector to the connector pad includes:
inserting pins of a connector into corresponding inserting holes of the connector bonding pads;
spraying soldering flux on the pins of the connector and the pads of the connector, and preheating;
and selectively wave-soldering the position of the connector pad to melt the tin protective layer and form a wave-shaped extension pin so as to fixedly solder the pin of the connector to the connector pad.
In some embodiments, before the pins of the connector are inserted into the plug holes of the corresponding connector pads, the flexible circuit board is placed on a welding carrier; and after the pins of the connector are inserted into the corresponding inserting holes of the connector welding discs, the connector is fixed by using the clamping block.
In some embodiments, when reflowing the flexible circuit board, the flexible circuit board is reflowed using a nitrogen reflow oven.
A second aspect of the present application provides a flexible circuit board manufactured by the flexible circuit board connector welding method according to the first aspect.
The welding method of the flexible circuit board connector comprises the steps of firstly printing solder paste on the surface of a flexible circuit board, covering a solder protection layer on a bonding pad of the connector, and then pasting a nickel sheet and performing reflow soldering; before the connector is welded, the tin protective layer can protect the connector pad, so that the method can avoid the poor welding performance caused by oxidation of the connector pad due to multiple times of heating and long-time exposure in the air, and effectively improve the welding quality of the connector. The flexible circuit board manufactured by the flexible circuit board connector welding method has better welding quality.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a flow chart of a method of soldering a flexible circuit board connector according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a structure of a connector pad in a flexible circuit board according to an embodiment of the present disclosure;
FIG. 3 is a partial schematic view of a flexible circuit board after a nickel sheet is attached and a protective film is attached according to an embodiment of the present disclosure;
FIG. 4 is a partial schematic view of a printing steel screen provided in an embodiment of the present application;
FIG. 5 is a schematic structural view of the open window and the shielding part in the printing steel net shown in FIG. 4;
FIG. 6 is a schematic structural diagram of a window opening part and a shielding part in a printing steel mesh according to another embodiment;
FIG. 7 is a schematic structural view of a window opening part and a shielding part in a printing steel mesh according to still another embodiment;
fig. 8 is a schematic diagram of a flexible circuit board provided by an embodiment of the present application during a selective wave soldering process.
The designations in the figures mean:
100. a flexible circuit board; 10. a connector pad; 101. inserting holes; 20. tin paste; 30. a nickel sheet; 40. a protective film; 50. a connector; 51. a pin; 200. printing a steel mesh; 210. a window opening part; 211. a first half ring; 212. a second half ring; 213. a third half ring; 214. a fourth half ring; 220. a shielding part; 230. a first connection portion; 240. a second connecting portion.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly attached to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless explicitly defined otherwise.
It should be noted that the same reference numerals are used to denote the same components or parts in the embodiments of the present application, and for the same parts in the embodiments of the present application, only one of the parts or parts may be given the reference numeral, and it should be understood that the reference numerals are also applicable to the other same parts or parts.
To illustrate the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.
A first aspect of the present application provides a flexible circuit board connector soldering method for soldering a nickel plate and a connector on a flexible circuit board. The flexible circuit board can be used in a sexual energy power battery or other products. Referring to fig. 1, the method for soldering a flexible circuit board connector includes:
step S110: and providing a flexible circuit board, wherein a connector welding disc is arranged on the flexible circuit board.
Referring to fig. 2, fig. 2 illustrates a structure of a set of connector pads 10 in an embodiment, a plurality of connector pads 10 are arranged in an array, and each connector pad 10 is used for soldering a pin of a connector 50.
Step S120: solder paste is printed on the surface of the flexible circuit board, wherein a portion of the solder paste is covered on the connector pad 10 to serve as a tin protective layer.
Specifically, a printed steel mesh may be used to print solder paste on the surface of the flexible circuit board, so that the solder paste covers the position where soldering is required, wherein the solder paste is also printed on the connector pad 10, and the solder paste covered by the connector pad 10 serves as a solder protection layer of the connector pad 10. Therefore, the connector pad 10 can be subjected to the preliminary tin treatment by this step.
Step S130: and (4) sticking a nickel sheet on the flexible circuit board.
Referring to fig. 3, optionally, a plurality of nickel sheets 30 are attached to the flexible circuit board 100, and the nickel sheets 30 may perform an anti-corrosion function. The nickel plate 30 is fixed on the flexible circuit board 100 by the solder paste 20. In this step, an NTC chip or other components may also be attached to the flexible circuit board 100 at the same time.
Step S140: the flexible circuit board 100 is subjected to reflow soldering.
Specifically, the flexible circuit board 100 is passed through a reflow oven, the solder paste 20 is melted, and the nickel plate 30 is soldered on the flexible circuit board 100 by the solder paste 20. Meanwhile, the NTC chip and other components attached to the solder paste 20 are also soldered and fixed. The prepeg tin on the connector pad 10 melts on the pad to form a tin protective layer.
Optionally, the reflow oven may be an infrared reflow oven.
In one embodiment, to ensure the tin-climbing effect at the connector pads 10, the flexible circuit board 100 may be reflowed using a nitrogen reflow oven.
Step S150: the surface of the flexible circuit board 100 is bonded with the protective film 40, and then pressed and baked.
Specifically, the protective film 40 may be a PI film. In order to enhance the peel strength of the nickel sheet 30, the protective films 40 are attached to the upper surface and the lower surface of the flexible circuit board 100 and the nickel sheet 30, and high-temperature pressing and high-temperature baking are performed, so that the peel strength meets the product requirements, and optionally, the glass strength of the nickel sheet 30 can reach more than 100N.
The protective film 40 is attached to the surface of the flexible circuit board 100, so that the welding strength of the nickel sheet 30 can be enhanced, and the soldering tin below the nickel sheet 30 can be protected; the protective film 40 can cover most of the surface of the flexible circuit board 100 and expose the area where the components to be soldered are needed, without affecting the functions of other devices and the soldering performance of the soldering pad.
Step S160: the connector is soldered to the connector pad 10.
Referring to fig. 2 and 8, during soldering, the tin protective layer on the connector pad 10 is melted to fixedly solder the connector 50 on the connector pad 10. In this embodiment, the connector 50 may be a DIP connector, the connector 50 has a plurality of pins 51, and each pin 51 is soldered to a corresponding connector pad 10. Optionally, after step S160, post-process processing may be performed, including adhering FR4 for reinforcement, dispensing, functional testing, and the like.
The method for soldering the flexible circuit board connector comprises the steps of firstly printing solder paste 20 on the surface of a flexible circuit board 100 to enable a connector pad 10 to be covered with a tin protective layer, then carrying out nickel sheet 30 pasting and reflow soldering; before the connector 50 is soldered, the tin protective layer can protect the connector pad 10, so that the method can avoid the poor soldering performance caused by oxidation of the connector pad 10 due to multiple heating and long-time exposure in air, and effectively improve the soldering quality of the connector 50.
Referring to fig. 2, in an embodiment, the connector pad 10 is an annular pad, the middle of the annular pad is provided with a plug hole 101, and the tin protective layer covers the annular pad and avoids the plug hole 101.
The insertion holes 101 are used for inserting pins of the connector 50; the tin protective layer covers the annular pad and avoids the plug hole 101, so that the connector pad 10 can be covered and protected by the tin paste 20, copper exposure is avoided, and meanwhile, the pin insertion is prevented from being influenced by the fact that the tin paste 20 flows into the plug hole 101.
Referring to fig. 1 to 4, in an embodiment, the step S120 of printing the solder paste 20 on the surface of the flexible circuit board 100 includes the following steps.
Firstly, providing a printing steel mesh 200, wherein a window opening part 210 and a shielding part 220 are arranged on the printing steel mesh 200, the shielding part 220 corresponds to the plugging hole 101, and the size of the shielding part 220 is larger than or equal to that of the plugging hole 101; the window portion 210 surrounds the shielding portion 220 and corresponds to the annular pad, the window portion 210 is used for the solder paste 20 to pass through, and the shielding portion 220 is used for shielding the solder paste 20.
Next, the printing steel net 200 is placed on the flexible circuit board 100, so that the window portion 210 corresponds to the annular pad, and the shielding portion 220 corresponds to the insertion hole 101.
Then, the solder paste 20 is printed on the surface of the flexible circuit board 100 by the printing steel net 200, and the solder paste 20 covers the annular pad via the opening 210 to form a solder resist.
By adopting the technical scheme, the annular tin protective layer can be formed on the connector pad 10 by the method, the tin protective layer covers the annular pad and avoids the plugging hole 101, the connector pad 10 cannot be exposed, and tin can be prevented from entering the plugging hole 101 of the connector pad 10.
Optionally, the flexible circuit board 100 is positioned in a carrier slot before the solder paste 20 is printed.
In an embodiment, the window portion 210 includes a first half ring 211 and a second half ring 212 that are disposed opposite to each other and have the same radius, two spaced first connection portions are formed between the first half ring 211 and the second half ring 212, and the two first connection portions 230 are respectively connected to two sides of the shielding portion 220. It should be noted that the radian of the first half ring 211 and the second half ring 212 may be 160-180 degrees, but is not limited thereto, for example, the radian of the first half ring 211 is greater than 180 degrees and the radian of the second half ring 212 is less than 180 degrees, as long as the window 210 formed by the two halves can solder the connector pad and ensure the soldering.
The first coupling part 230 functions as a coupling rib on the printing steel net 200 so that the shielding part 220 can be coupled with the rest of the printing steel net 200; the first half ring 211 and the second half ring 212 are spaced apart from each other, and since the solder paste 20 has fluidity, the solder paste 20 leaked from the first half ring 211 and the second half ring 212 may flow to a position corresponding to the first connection portion 230 during printing, so that the solder resist continuously covers the connector pad 10.
Further, the window opening part 210 further includes a third half ring 213 and a fourth half ring 214 opposite to each other, two spaced second connecting parts 240 are formed between the third half ring 213 and the fourth half ring 214, and the third half ring 213 and the fourth half ring 214 are disposed outside the first half ring 211 and the second half ring 212; the two first connection portions 230 and the two second connection portions 240 are alternately and alternately disposed on the outer circumference of the shielding portion 220. Thus, the printing quality of the solder paste 20 can be improved, so that the solder protection layer completely covers the connector pad 10, thereby preventing copper exposure.
As shown in fig. 4 and 5, the window opening portion 210 has a double-ring structure, and the inner ring and the outer ring are arranged in a staggered manner, that is, the ring where the first half ring 211 and the second half ring 212 are located is arranged inside the ring where the third half ring 213 and the fourth half ring 214 are located; the included angle between the circle centers of the first connecting portion 230 and the second connecting portion 240 adjacent to each other and the window opening portion 210 may be 90 degrees, so that the thickness of the tin protective layer is relatively uniform.
Referring to fig. 6 and 7, optionally, the window opening portion 210 may have a single ring structure, and includes a first half ring 211 and a second half ring 212 that are opposite to each other, and two spaced first connecting portions 230 are formed between the first half ring 211 and the second half ring 212; wherein, the end of the first half ring 211 protrudes toward the shielding part 220; and/or, the end of the first half ring 211 protrudes toward a direction away from the shielding part 220. Thus, the opening sizes of the ends of the first half ring 211 and the second half ring 212 can be increased, and the problem that the solder paste 20 at the gap bridge is insufficient and cannot cover the connector pad 10 can be avoided.
Referring to fig. 2 and 8, in an embodiment, soldering the connector 50 on the connector pad 10 includes:
first, the pins of the connector 50 are inserted into the insertion holes 101 of the corresponding connector pads 10.
Next, flux is sprayed to the pins of the connector 50 and the connector pads 10, and pre-heated, wherein a heating tube or a heating plate may be used to pre-heat the flexible circuit board 100.
Then, selective wave soldering is performed on the position of the connector pad 10, so that the tin protective layer is melted and formed into a wave-shaped extended pin, so as to fixedly solder the pin of the connector 50 to the connector pad 10. Wherein, the nozzle in the tin furnace forms the wave shape of the molten tin cream 20 and connects with the pin of the connector 50, and the tin cream 20 is melted by the soldering flux to expand and fill, finally achieving the purpose of complete welding.
The method adopts selective wave soldering to solder the connector 50, can realize the local soldering of the position of the connector 50, can not influence the nickel sheet 30 and the tin paste 20 at the NTC soldering position when the connector 50 is soldered, and can prevent the nickel sheet 30 and the NTC soldering position from secondary tin melting caused by high temperature; by adopting a selective wave soldering processing technology, high-temperature tin melting is only carried out on the soldering position of the connector 50, and other positions are in a normal temperature state, so that the soldering positions of the nickel sheet 30 and the NTC cannot be influenced by high temperature, and the soldering of the connector pad 10 is fully ensured.
Optionally, before the pins of the connector 50 are inserted into the insertion holes 101 of the corresponding connector pads 10, the flexible circuit board 100 is placed on the soldering carrier; after the pins of the connector 50 are inserted into the insertion holes 101 of the corresponding connector pads 10, the connector 50 is fixed using the retainer block. Therefore, the problem that the welding precision is influenced by the looseness of the pins of the connector 50 during welding can be avoided.
In one embodiment, when the flexible circuit board 100 is reflowed, the flexible circuit board 100 is reflowed using a nitrogen reflow oven. Thus, the solder paste 20 can ensure the solder-climbing effect at the pin position.
The second aspect of the present application provides a flexible circuit board 100, which is manufactured by using the soldering method of the connector 50 of the flexible circuit board 100 of the first aspect.
The flexible circuit board 100 may be a new energy battery flexible circuit board, and the soldered connector 50 may be a DIP connector, but is not limited thereto.
Above-mentioned flexible circuit board 100 can print tin cream 20 earlier, weld nickel piece 30, laminating protection film 40, then welds connector 50, on the one hand, can avoid welding nickel piece 30 and connector 50 simultaneously and influence the laminating of protection film 40, and on the other hand is equipped with the tin protective layer on connector pad 10 when welding nickel piece 30, and the tin protective layer can play the guard action to connector pad 10, avoids connector pad 10 oxidation and reduces welding performance. Therefore, the flexible circuit board 100 has a better connector soldering effect and better quality.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. A method of soldering a flexible circuit board connector, comprising:
providing a flexible circuit board, wherein a connector pad is arranged on the flexible circuit board;
printing solder paste on the surface of the flexible circuit board, wherein part of the solder paste covers the connector pad to be used as a tin protective layer;
sticking a nickel sheet on the flexible circuit board;
reflow soldering is carried out on the flexible circuit board, so that the nickel sheet is fixed on the flexible circuit board through solder paste;
adhering a protective film on the surface of the flexible circuit board, and performing pressing and baking;
and welding a connector on the connector pad.
2. The method of claim 1, wherein the connector pad is an annular pad and a plug hole is formed in a middle portion of the annular pad, and the tin protective layer covers the annular pad and avoids the plug hole.
3. The method of soldering a flexible circuit board connector according to claim 2, wherein the printing of solder paste on the surface of the flexible circuit board includes:
providing a printing steel mesh, wherein a window opening part and a shielding part are arranged on the printing steel mesh, the shielding part corresponds to the plug hole, and the size of the shielding part is larger than or equal to that of the plug hole; the windowing part surrounds the periphery of the shielding part and corresponds to the annular bonding pad;
placing the printing steel mesh above the flexible circuit board;
and printing solder paste on the surface of the flexible circuit board through the printing steel mesh, wherein the solder paste covers the annular pad through the windowing part and forms the tin protective layer.
4. The method of claim 3, wherein the opening portion comprises a first half ring and a second half ring that are opposite to each other and have the same radius, and two first connection portions are formed between the first half ring and the second half ring and are spaced apart from each other, and the two first connection portions are connected to two sides of the shielding portion respectively.
5. The method of claim 4, wherein the fenestration further comprises opposing third and fourth halves, wherein two spaced second connections are formed between the third and fourth halves, and wherein the third and fourth halves are disposed outside of the first and second halves; the two first connecting parts and the two second connecting parts are alternately and alternately arranged on the periphery of the shielding part.
6. The method of claim 4, wherein the end of the first half ring is convex toward the shielding portion; and/or the end part of the first half ring protrudes towards the direction departing from the shielding part.
7. The method of soldering a flexible circuit board connector according to claim 2, wherein soldering a connector to the connector pads comprises:
inserting pins of a connector into corresponding inserting holes of the connector bonding pads;
spraying soldering flux on the pins of the connector and the pads of the connector, and preheating;
and selectively wave-soldering the position of the connector pad to melt the tin protective layer and form a wave-shaped extension pin so as to fixedly solder the pin of the connector to the connector pad.
8. The method of claim 7, wherein the flexible circuit board is placed on a solder carrier before the pins of the connector are inserted into the corresponding sockets of the connector pads; and after the pins of the connector are inserted into the corresponding inserting holes of the connector welding discs, the connector is fixed by using the clamping block.
9. A method of soldering a flexible circuit board connector as claimed in any one of claims 1 to 8, wherein when the flexible circuit board is subjected to reflow soldering, the flexible circuit board is subjected to reflow soldering using a nitrogen reflow oven.
10. A flexible circuit board manufactured by the flexible circuit board connector soldering method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210700065.1A CN115103528A (en) | 2022-06-20 | 2022-06-20 | Flexible circuit board connector welding method and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210700065.1A CN115103528A (en) | 2022-06-20 | 2022-06-20 | Flexible circuit board connector welding method and flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN115103528A true CN115103528A (en) | 2022-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210700065.1A Pending CN115103528A (en) | 2022-06-20 | 2022-06-20 | Flexible circuit board connector welding method and flexible circuit board |
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| CN (1) | CN115103528A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008166310A (en) * | 2006-12-26 | 2008-07-17 | Toshiba Corp | Solder print mask, printed wiring board, and method for manufacturing circuit board |
| CN106793522A (en) * | 2017-01-07 | 2017-05-31 | 江西凯强实业有限公司 | A kind of preparation method of new energy on-vehicle battery plate |
| CN213126634U (en) * | 2020-09-18 | 2021-05-04 | 深圳市一博科技股份有限公司 | Steel mesh structure for improving through hole reflow soldering yield |
| CN113079651A (en) * | 2021-03-10 | 2021-07-06 | 京信网络系统股份有限公司 | Method for realizing automatic welding on PCB and steel mesh for PCB printing |
-
2022
- 2022-06-20 CN CN202210700065.1A patent/CN115103528A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008166310A (en) * | 2006-12-26 | 2008-07-17 | Toshiba Corp | Solder print mask, printed wiring board, and method for manufacturing circuit board |
| CN106793522A (en) * | 2017-01-07 | 2017-05-31 | 江西凯强实业有限公司 | A kind of preparation method of new energy on-vehicle battery plate |
| CN213126634U (en) * | 2020-09-18 | 2021-05-04 | 深圳市一博科技股份有限公司 | Steel mesh structure for improving through hole reflow soldering yield |
| CN113079651A (en) * | 2021-03-10 | 2021-07-06 | 京信网络系统股份有限公司 | Method for realizing automatic welding on PCB and steel mesh for PCB printing |
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