CN113079651A - Method for realizing automatic welding on PCB and steel mesh for PCB printing - Google Patents
Method for realizing automatic welding on PCB and steel mesh for PCB printing Download PDFInfo
- Publication number
- CN113079651A CN113079651A CN202110262133.6A CN202110262133A CN113079651A CN 113079651 A CN113079651 A CN 113079651A CN 202110262133 A CN202110262133 A CN 202110262133A CN 113079651 A CN113079651 A CN 113079651A
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- pcb
- printing
- welding
- pad
- steel mesh
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- 238000007639 printing Methods 0.000 title claims abstract description 93
- 238000003466 welding Methods 0.000 title claims abstract description 88
- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 65
- 239000010959 steel Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 58
- 238000005476 soldering Methods 0.000 claims abstract description 41
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000010931 gold Substances 0.000 claims abstract description 17
- 229910052737 gold Inorganic materials 0.000 claims abstract description 17
- 238000007654 immersion Methods 0.000 claims description 16
- 239000006071 cream Substances 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract 2
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 238000007747 plating Methods 0.000 description 7
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 3
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application discloses a method for realizing automatic welding on a PCB and a steel mesh for printing the PCB, wherein the method for realizing automatic welding on the PCB comprises the following steps: forming printing holes corresponding to the positions of the insert welding pads on the PCB on the steel mesh; covering the steel mesh on a PCB (printed Circuit Board) to enable the printing holes to correspond to the plug-in welding pads one by one; printing solder paste on the insert welding pad on the PCB through the steel mesh, and removing the steel mesh after printing is finished; and performing reflow soldering so that the soldering tin is adhered to the surface of the plug soldering pad. Through offering the printing hole corresponding with PCB board grafting pad to current steel mesh for PCB board that the surface adopted heavy gold technology to handle is when printing, on tin cream can cover the pad, through after reflow soldering, realized carrying out tinned technology on the pad, so that realize the plug-in welding of components and parts, and improved the solderability and the welding efficiency of plug-in welding components and parts.
Description
Technical Field
The application relates to the technical field of electronic industry welding, in particular to a method for realizing automatic welding on a PCB and a steel mesh for printing the PCB.
Background
At present, in the technical field of welding of PCB boards, an automatic welding machine is used for welding plug-in welding components, so that the welding production efficiency can be improved. Because the plating layer thickness is uniform and the PCB surface gold immersion process is not easy to oxidize, the PCB in the industry generally adopts the gold immersion process to carry out surface treatment. However, in the production method of welding components and parts on the PCB by using the automatic welding machine, the plating layer on the surface of the PCB pad adopts the tin plating process, so that the plating layer on the surface of the PCB pad is easily combined with the soldering tin to form a welding spot, and the PCB board treated by the gold immersion process on the surface is not easily combined with the soldering tin to form a welding spot, so that the solderability of the PCB board treated by the gold immersion process on the surface is low, and the situations of poor welding and low welding efficiency of the welding spot are easily caused on the PCB board treated by the gold immersion process on the surface.
Disclosure of Invention
The main purpose of the present application is to provide a method for realizing automatic soldering on a PCB and a steel mesh for PCB printing, so as to solve at least one technical problem in the prior art.
In order to achieve the purpose, the technical scheme of the application is as follows:
the application provides a method for realizing automatic welding on a PCB, which comprises the following steps:
forming printing holes corresponding to the positions of the insert welding pads on the PCB on the steel mesh;
covering the PCB with a steel mesh, so that the printing holes correspond to the insert welding pads one by one;
printing solder paste on the insert welding pad on the PCB through a steel mesh, and removing the steel mesh after printing is finished;
and performing reflow soldering to enable the surface of the plug-in soldering pad to be adhered with soldering tin.
Optionally, before covering the steel mesh on the PCB and making the printing holes correspond to the socket pads one to one, the method includes:
and treating the surface of the PCB by adopting a gold immersion process.
Optionally, performing reflow soldering so that the solder is attached to the surface of the plug pad includes:
and welding a plug-in welding component on the plug-in welding pad of the PCB.
Optionally, an insertion hole is formed in the pad, a shielding structure corresponding to the insertion hole is further arranged on the steel mesh, the printing hole is annularly arranged on the periphery of the shielding structure, and the outer diameter of the shielding structure is larger than that of the insertion hole and smaller than that of the pad.
Optionally, the printing hole is a circular ring, and a connecting rib radially connected with the shielding structure is arranged on the printing hole.
Optionally, a plurality of connecting ribs are distributed on the printing holes, and the intervals between the connecting ribs are equal.
Optionally, the outer diameter of the printing hole is larger than the outer diameter of the pad.
Optionally, the width of the tie bars is greater than 0.09 mm.
This application still provides a steel mesh for PCB board printing for form the plug-in welding pad that adheres to soldering tin on the PCB board, be provided with the spliced eye on the pad, the steel mesh includes: the shielding structure is arranged corresponding to the inserting hole, the periphery of the shielding structure is annularly arranged on the printing hole corresponding to the PCB pad, and the outer diameter of the shielding structure is larger than that of the inserting hole and smaller than that of the pad.
Optionally, the printing hole is a circular ring, and a connecting rib radially connected with the shielding structure is arranged on the printing hole.
Optionally, a plurality of the connecting ribs are distributed on the printing hole, and the intervals between the connecting ribs are equal.
Optionally, an outer diameter of the printing hole is larger than an outer diameter of the pad.
Optionally, the width of the connecting rib is greater than 0.09 mm.
Compared with the prior art, the technical scheme provided by the application has the following beneficial effects:
the application provides a method for realizing automatic welding on a PCB and a steel mesh for printing the PCB, wherein a printing hole corresponding to a PCB inserting and connecting pad is formed in the existing steel mesh, so that tin paste can cover the pad during printing, and a tinning process is realized on the pad after reflow soldering. The surface of the PCB is treated by the gold immersion process, so that the plug-in welding of components is realized, and the weldability of the plug-in welding components is improved. Because the printing hole of seting up on the steel mesh corresponds with the pad one-to-one, when printing through the steel mesh, every pad can both cover the tin cream on the PCB, has further promoted to use automatic weld machine welding to connect to insert to weld components and parts efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart diagram illustrating one embodiment of a method for performing automated soldering on a PCB of the present application;
FIG. 2 is a schematic structural view of a bonding pad and a plugging hole on a PCB in the steel mesh for PCB printing according to the present invention;
fig. 3 is a schematic structural view of a printing hole, a shielding structure and a connecting rib on a steel mesh in the steel mesh for PCB printing according to the present invention.
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that all the directional indications (such as up, down, left, right, front, and rear … …) in the embodiment of the present application are only used to explain the relative position relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indication is changed accordingly.
In addition, descriptions in this application as to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "multiband" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In addition, technical solutions between the various embodiments of the present application may be combined with each other, but it must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should be considered to be absent and not within the protection scope of the present application.
Fig. 1 shows an exemplary flowchart of a method for implementing automatic soldering on a PCB according to an embodiment of the present application, and as shown in fig. 1, the present application provides a method for implementing automatic soldering on a PCB, including: s110, S120, S130, S140.
S110: and printing holes corresponding to the positions of the insertion welding pads on the PCB are formed in the steel mesh.
The method for realizing automatic welding on the PCB and the steel mesh for PCB printing provided by the embodiment of the application are mainly applied to the PCB with the surface processed by the gold immersion process and the condition that components are required to be welded on the PCB processed by the gold immersion process through the splicing welding disc. In order to improve the efficiency of the plug-in welding of the components and the welding yield. In the embodiment provided by the present application, as shown in fig. 2 and 3, a printing hole 21 corresponding to the plug-in pad 11 on the PCB 1 is formed on the existing steel mesh 2, so that during the printing process of the SMT solder paste printer on the steel mesh 2, the solder paste can cover the pad 11 through the printing hole 21, so that the solder paste can be attached to the plug-in pad after the reflow soldering process.
In the embodiment provided by the present application, as shown in fig. 2 and 3, a plug hole 12 is disposed on the plug pad 11, and the plug hole 12 is disposed in the middle of the pad 11. The steel mesh 2 is further provided with a shielding structure 22 corresponding to the plugging hole 12, so that during the printing process, the printing solder paste cannot flow into the plugging hole 12, and the plugging hole is prevented from being blocked. Correspondingly, the printing hole 21 is arranged around the shielding structure 22, the outer diameter of the shielding structure 22 is larger than that of the plugging hole 12, and the outer diameter of the shielding structure 22 is smaller than that of the bonding pad 11, so that the printing hole 21 can cover the bonding pad 11, and the printing solder paste cannot flow into the plugging hole 12.
In an embodiment provided by the present application, as shown in fig. 2 and 3, since the insertion hole 12 is circular, in order to make the solder paste uniformly contact with the insertion component and improve the soldering yield, the pad 11 is annularly disposed on the periphery of the insertion hole 12. In order to adapt to the shape of the bonding pad 11, the bonding pad 11 can be uniformly covered with solder paste, and the solder paste is prevented from flowing into the insertion holes or other positions on the PCB board 1, the printing holes 21 are circular and correspond to the bonding pad 11. In order to improve the printing efficiency, when the steel mesh 2 covers the PCB 1, a plurality of pads on the PCB 1 can be covered at one time, and when the steel mesh is taken away, the shielding structure can be taken out together, and the connecting rib 23 radially connected with the shielding structure 22 is arranged on the printing hole 21. In order to avoid the steel mesh 2 to take out the in-process, shield the structure 22 all directions ability even atress for shield the structure 22 and can follow and take out fast on PCB board 1, and can not pop out the tin cream on the pad, it has a plurality of splice bars 23 to distribute on printing hole 21, and the interval between the splice bar 23 equals. Optionally, 4 connecting ribs 23 are disposed on the printing hole 21, and a central angle corresponding to an arc line between two adjacent connecting ribs 23 is 90 °.
In the embodiment provided by the present application, as shown in fig. 2 and 3, the outer diameter of the printing hole 21 is larger than the outer diameter of the pad 11 to ensure that more solder paste can be covered on the pad 11, the inner diameter of the printing hole 21 is 0.8mm, the outer diameter is 1.6mm, and the inner diameter of the pad 11 is 0.7mm, and the outer diameter is 1.3 mm. The width of splice bar 23 is greater than 0.09mm, the width along printing hole 21 circumference of splice bar 23 is greater than 0.09mm promptly, optionally, the width along printing hole 21 circumference of splice bar 23 is greater than or equal to 0.1mm, in order to guarantee to shield the joint strength between structure 22 and the whole steel mesh 2 structure, avoid printing the in-process or taking out the steel mesh in-process, the splice bar fracture leads to shielding the structure and remains on the spliced eye 12 of PCB board 1, thereby lead to spliced eye 12 can not be connected with grafting components and parts. Or the connecting rib is bent, so that the shielding structure cannot completely shield the plug hole, and solder paste flows into and blocks the plug hole.
S120: and covering the PCB with a steel mesh to enable the printing holes to correspond to the insertion welding pads one by one.
Optionally, before covering the steel mesh on the PCB and making the printing holes correspond to the socket pads one to one, the method includes:
and treating the surface of the PCB by adopting a gold immersion process.
In the embodiment provided by the application, in order to guarantee welding efficiency and form heavy tin on the pad of PCB board, cover the steel mesh on the PCB board, and each printing hole and each insert welding pad one-to-one, and then in the printing process, can once only print the tin cream to the pad of a plurality of spliced holes, and all can cover the tin cream uniformly on every pad, improved PCB board welding efficiency.
As described above, the method for implementing automatic soldering on a PCB provided in the embodiments of the present application is mainly applied to a process of performing surface treatment on a PCB by using a gold immersion process, so that the surface of the PCB is subjected to the gold immersion process before a steel mesh is covered on the PCB, so that a plating layer on the surface of the PCB is uniform in thickness and is not easily oxidized.
S130: and printing solder paste on the plug-in welding pad on the PCB through the steel mesh, and removing the steel mesh after printing.
After the steel mesh covers on the PCB board and the steel mesh is fixed, and then through steel mesh to the plug-in welding pad printing tin cream on the PCB board, realize once only the printing to a plurality of plug-in welding pad tin creams on the PCB board, SMT tin cream printing machine is adopted in this application for tin cream uniformity on every pad is better, is difficult for appearing bad solder joint simultaneously, takes out the steel mesh after the printing is accomplished, so that carry out SMT's backward flow welding to the PCB board.
S140: and performing reflow soldering to enable the surface of the plug-in soldering pad to be adhered with soldering tin.
Optionally, performing reflow soldering so that the solder is attached to the surface of the plug pad includes:
and welding a plug-in welding component on the plug-in welding pad of the PCB.
After the steel mesh is taken out, reflow soldering is carried out on the PCB, so that solder paste printed on the surface of the pad can be stably attached to the plug-in soldering pad, the tin deposition process on the plug-in soldering pad is realized, in the plug-in soldering process of subsequent components, soldering is adopted, welding spots are easily formed, and the welding yield of the welding spots is high due to the fact that the welding material is consistent with the material attached to the pad, meanwhile, the welding is easy, and the welding efficiency is improved. After reflow soldering is completed, the plug-in components can be welded in the plug-in holes of the PCB, so that solder paste of the bonding pad can easily form a welding spot with the welding paste, and the welding spot is surrounded on the periphery of the components, and the welding yield of the welding spot is guaranteed.
In the embodiment that this application provided, the trompil size in steel mesh printing hole is confirmed according to connector PCB pad area for in SMT solder paste printing process, can spread one deck solder paste on connector PCB pad, the soldering tin on the PCB pad can be spread the pad surface and can not flow into the welding hole that needs the plug-in welding simultaneously after reflow soldering, in order to avoid blockking up the plug-in welding hole. Through the embodiment provided by the application, the original PCB pad adopting the gold immersion process is equal to the local PCB connector pad after reflow soldering, so that the tin plating process is realized, the weldability of the plug-in soldering component is improved, and the efficiency of using an automatic welding machine to weld the plug-in soldering component is improved. Furthermore, compared with the existing process conditions, in the embodiment provided by the application, the surface treatment process of the PCB still adopts a gold immersion process, so that the manufacturing cost of the PCB is not increased; meanwhile, the existing steel mesh is perforated with printing holes, so that the operation is simply realized without additionally adding equipment and tool clamp for assistance, and the operation is simple and easy to operate.
In summary, the method for realizing automatic welding on the PCB and the steel mesh for PCB printing provided by the embodiment of the present application have the following beneficial effects:
in the embodiment of the method for realizing automatic welding on the PCB and the steel mesh for PCB printing, the printing holes corresponding to the PCB splicing pads are formed in the existing steel mesh, so that tin paste can cover the pads during printing, and after reflow soldering, a tin plating process is realized on the pads. The surface of the PCB is treated by the gold immersion process, so that the plug-in welding of components is realized, and the weldability of the plug-in welding components is improved. Because the printing hole of seting up on the steel mesh corresponds with the pad one-to-one, when printing through the steel mesh, every pad can both cover the tin cream on the PCB, has further promoted to use automatic weld machine welding to connect to insert to weld components and parts efficiency.
The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all modifications and equivalents of the subject matter of the present application, which is intended to be covered by the claims and their equivalents, or which are directly or indirectly applicable to other related arts are intended to be included within the scope of the present application.
Claims (13)
1. A method for realizing automatic welding on a PCB is characterized by comprising the following steps:
forming printing holes corresponding to the positions of the insert welding pads on the PCB on the steel mesh;
covering the steel mesh on a PCB (printed Circuit Board) to enable the printing holes to correspond to the plug-in welding pads one by one;
printing solder paste on the insert welding pad on the PCB through the steel mesh, and removing the steel mesh after printing is finished;
and performing reflow soldering so that the soldering tin is adhered to the surface of the plug soldering pad.
2. The method for realizing automatic welding on the PCB board as recited in claim 1, wherein before the step of covering the steel mesh on the PCB board to enable the printing holes to correspond to the plug-in welding pads one by one, the method comprises the following steps:
and treating the surface of the PCB by adopting a gold immersion process.
3. The method for realizing automatic soldering on a PCB board as recited in claim 1, wherein the step of performing reflow soldering so that the surface of the plug pad is attached with solder comprises the following steps:
and welding a plug-in welding component on the plug-in welding pad of the PCB.
4. The method for realizing automatic welding on the PCB as recited in claim 1, wherein the bonding pad is provided with a plug hole, the steel mesh is further provided with a shielding structure corresponding to the plug hole, the printing hole is annularly arranged on the periphery of the shielding structure, and the outer diameter of the shielding structure is larger than that of the plug hole and smaller than that of the bonding pad.
5. The method for realizing automatic welding on the PCB board as claimed in claim 4, wherein the printing hole is circular ring shaped, and the printing hole is provided with a connecting rib radially connected with the shielding structure.
6. The method for realizing automatic welding on the PCB of claim 5, wherein a plurality of connecting ribs are distributed on the printing hole, and the intervals between the connecting ribs are equal.
7. The method for realizing automatic welding on the PCB board as recited in claim 1, wherein the outer diameter of the printing hole is larger than the outer diameter of the welding pad.
8. The method for realizing automatic welding on the PCB board as recited in claim 5, wherein the width of the connecting rib is more than 0.09 mm.
9. The utility model provides a steel mesh for PCB board printing which characterized in that for form the plug-in welding pad that adheres to soldering tin on the PCB board, be provided with the spliced eye on the pad, the steel mesh includes: the shielding structure is arranged corresponding to the inserting hole, the printing hole is annularly arranged on the periphery of the shielding structure and corresponds to the PCB pad, and the outer diameter of the shielding structure is larger than that of the inserting hole and smaller than that of the pad.
10. The steel mesh for PCB printing according to claim 9, wherein the printing holes are circular ring type, and the printing holes are provided with connection ribs radially connected with the shielding structure.
11. The steel net for PCB printing according to claim 10, wherein a plurality of the connection ribs are distributed on the printing holes, and the intervals between the connection ribs are equal.
12. The steel net for PCB printing according to claim 9, wherein an outer diameter of the printing hole is larger than an outer diameter of the pad.
13. A steel net for PCB printing according to claim 10, wherein the width of the connecting rib is more than 0.09 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110262133.6A CN113079651A (en) | 2021-03-10 | 2021-03-10 | Method for realizing automatic welding on PCB and steel mesh for PCB printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110262133.6A CN113079651A (en) | 2021-03-10 | 2021-03-10 | Method for realizing automatic welding on PCB and steel mesh for PCB printing |
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| Publication Number | Publication Date |
|---|---|
| CN113079651A true CN113079651A (en) | 2021-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110262133.6A Pending CN113079651A (en) | 2021-03-10 | 2021-03-10 | Method for realizing automatic welding on PCB and steel mesh for PCB printing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113687211A (en) * | 2021-07-21 | 2021-11-23 | 桂林研创半导体科技有限责任公司 | Printed circuit board pad drawing method |
| CN115103528A (en) * | 2022-06-20 | 2022-09-23 | 珠海景旺柔性电路有限公司 | Flexible circuit board connector welding method and flexible circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2920648Y (en) * | 2006-05-30 | 2007-07-11 | 华为技术有限公司 | Circuit board printing device and steel net thereof |
| WO2014040423A1 (en) * | 2012-09-11 | 2014-03-20 | 厦门锐迅达电子有限公司 | Surface mounting process of dies |
| WO2018018847A1 (en) * | 2016-07-29 | 2018-02-01 | 广东美的制冷设备有限公司 | Intelligent power module and method for manufacturing same |
| CN210670835U (en) * | 2019-10-12 | 2020-06-02 | 芜湖启迪半导体有限公司 | Steel mesh for solder paste printing process |
-
2021
- 2021-03-10 CN CN202110262133.6A patent/CN113079651A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2920648Y (en) * | 2006-05-30 | 2007-07-11 | 华为技术有限公司 | Circuit board printing device and steel net thereof |
| WO2014040423A1 (en) * | 2012-09-11 | 2014-03-20 | 厦门锐迅达电子有限公司 | Surface mounting process of dies |
| WO2018018847A1 (en) * | 2016-07-29 | 2018-02-01 | 广东美的制冷设备有限公司 | Intelligent power module and method for manufacturing same |
| CN210670835U (en) * | 2019-10-12 | 2020-06-02 | 芜湖启迪半导体有限公司 | Steel mesh for solder paste printing process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113687211A (en) * | 2021-07-21 | 2021-11-23 | 桂林研创半导体科技有限责任公司 | Printed circuit board pad drawing method |
| CN115103528A (en) * | 2022-06-20 | 2022-09-23 | 珠海景旺柔性电路有限公司 | Flexible circuit board connector welding method and flexible circuit board |
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Application publication date: 20210706 |