CN113613404A - Hot melt adhesive package protection method and device for electronic component - Google Patents
Hot melt adhesive package protection method and device for electronic component Download PDFInfo
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- CN113613404A CN113613404A CN202110899770.4A CN202110899770A CN113613404A CN 113613404 A CN113613404 A CN 113613404A CN 202110899770 A CN202110899770 A CN 202110899770A CN 113613404 A CN113613404 A CN 113613404A
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- hot melt
- melt adhesive
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- electronic component
- electronic
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 132
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000007711 solidification Methods 0.000 claims abstract description 4
- 230000008023 solidification Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 230000007547 defect Effects 0.000 claims description 21
- 238000005507 spraying Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 230000002411 adverse Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a hot melt adhesive package protection method and a device for electronic components, wherein the method comprises the following steps: determining a target area corresponding to an electronic element to be wrapped on a circuit board; attaching a hot melt adhesive patch to the surface of the electronic element to be wrapped in the target area; carrying out backflow solidification on the electronic component to be wrapped with the hot melt adhesive patch attached to the surface, so that the hot melt adhesive patch is melted and wraps the electronic component to be wrapped; this application is guaranteeing to wrap up under the prerequisite that the protection process does not influence other electronic component of circuit board, has improved the production efficiency of circuit board.
Description
Technical Field
The invention relates to the technical field of protection of electronic elements on a circuit board, in particular to a hot melt adhesive package protection method and device for electronic elements.
Background
In the SMT (Surface mount Technology), in order to prevent electronic components on a circuit board from being bumped during a subsequent assembly process, the electronic components are protected by being wrapped. In the prior art, glue is generally sprayed to a specified glue dispensing area of a product by using a glue dispenser, and a glue film is formed after the glue is solidified. The method can cause the problem of glue dispersion in the process of dispensing, namely, the glue can be sputtered to other components on the circuit board, and the performance and the appearance of the circuit board are influenced. On the other hand, this method requires manual operation, which results in low production efficiency of the circuit board.
Disclosure of Invention
In view of this, the present invention provides a method and an apparatus for protecting a hot melt adhesive package of an electronic component, which improves the production efficiency of a circuit board on the premise of ensuring that the package protection process does not affect other components of the circuit board.
According to one aspect of the invention, a hot melt adhesive package protection method for electronic components is provided, which comprises the following steps:
s110, determining a target area corresponding to an electronic element to be wrapped on the circuit board;
s120, attaching a hot melt adhesive patch to the surface of the electronic element to be wrapped in the target area; and
s130, carrying out backflow solidification on the electronic component to be wrapped with the hot melt adhesive patch attached to the surface, so that the hot melt adhesive patch is melted and wraps the electronic component to be wrapped.
Optionally, between step S110 and step S120, the method further includes the steps of:
s111, coating an adhesive on the surface of the electronic component to be wrapped in the target area; or smearing an adhesive on the adhesive surface of the hot melt adhesive patch.
Optionally, between step S120 and step S130, the method further includes the steps of:
s140, detecting whether the appearance defect exists in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped;
if the appearance defect exists, executing the following steps: removing the original hot melt adhesive patch attached to the surface of the electronic element, and attaching a new hot melt adhesive patch to the surface of the electronic element to be wrapped in the target area again;
if there is no appearance defect, the step S130 is executed.
Optionally, the method further comprises the step of:
detecting whether the hot melt adhesive wrapping area has an electronic element exposure defect;
if yes, performing correction and maintenance operation;
and if not, collecting the circuit board where the electronic element is located.
Optionally, the shape of the hot melt adhesive patch matches the shape of the target area.
Optionally, the step S120 includes:
and attaching a hot melt adhesive patch to the surface of the electronic element to be wrapped in the target area by using a patch mounter.
Optionally, the step S130 includes:
and (4) carrying out reflow curing on the electronic element to be wrapped with the hot melt adhesive patch attached to the surface by using a reflow oven according to a preset temperature curve.
Optionally, the step S111 includes:
spraying an adhesive on the surface of the electronic element to be wrapped in the target area by using a dispenser; or spraying an adhesive on the adhesive surface of the hot melt adhesive patch by using a dispenser.
Optionally, the step S140 includes:
and detecting whether the appearance defect exists in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped by utilizing AOI equipment.
According to another aspect of the present invention, there is provided a hot melt adhesive package protection apparatus for electronic components, for implementing the hot melt adhesive package protection method for any one of the above electronic components, the apparatus includes a chip mounter, an AOI device, and a reflow oven; the chip mounter is used for attaching the hot melt adhesive chip to the surface of the electronic component to be wrapped in the target area; the AOI equipment is used for detecting whether appearance defects exist in the hot melt adhesive patches attached to the surfaces of the electronic components to be packaged; and the reflow soldering furnace is used for performing reflow curing on the electronic element to be wrapped with the hot melt adhesive patch attached to the surface, so that the hot melt adhesive patch is melted and wraps the electronic element to be wrapped.
Optionally, the hot melt adhesive package protection device for the electronic component further includes a dispenser, where the dispenser is configured to determine a target area corresponding to the electronic component to be packaged on the circuit board, and paint an adhesive on a surface of the electronic component to be packaged in the target area or spray the adhesive on an adhesive surface of the hot melt adhesive patch.
Optionally, the AOI device is further configured to detect whether an exposed defect of the electronic component exists in the hot melt adhesive coated area after the step of reflow curing is completed.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the method and the device for protecting the electronic element by wrapping the hot melt adhesive, the hot melt adhesive patch replaces the traditional dispensing of a dispenser, the hot melt adhesive patch is prepared in advance, the shape of the hot melt adhesive patch can be determined according to the shape of a target area during the patch mounting, a large amount of time is not needed for dispensing, the wrapping area of the electronic element can be ensured not to exceed the target area, the precision requirement is reduced, and the operation time is shortened;
2. according to the hot melt adhesive package protection method and device for the electronic element, provided by the invention, the package protection of the electronic element to be packaged is realized by sticking and melting the hot melt adhesive, so that the adverse effect on other elements of the circuit board in the packaging process can be avoided, the problem of high rejection rate of the circuit board is solved, and the waste boards are effectively reduced;
3. the hot melt adhesive package protection method and the device for the electronic element can be automatically completed by utilizing the full process of a machine, and the production efficiency of the circuit board is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic flow chart illustrating a method for protecting a hot-melt adhesive package of an electronic component according to an embodiment of the present invention;
fig. 2 is a schematic flow chart illustrating a hot-melt adhesive package protection method for electronic components according to another embodiment of the present invention;
fig. 3 is a schematic flow chart illustrating a hot-melt adhesive package protection method for electronic components according to another embodiment of the present invention;
fig. 4 is a schematic flow chart illustrating a hot-melt adhesive package protection method for electronic components according to another embodiment of the present invention.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, materials, devices, etc. In other instances, well-known technical solutions have not been shown or described in detail to avoid obscuring aspects of the present disclosure. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Some passive components on the circuit board, such as 01005 or 0201 components, need to be wrapped during assembly to avoid bumping.
As shown in fig. 1, an embodiment of the present invention discloses a method for protecting a hot melt adhesive package of an electronic component, which comprises the following steps:
and S110, determining a target area corresponding to the electronic element to be wrapped on the circuit board. Specifically, at least one area formed by gathering a plurality of electronic components to be packaged on the circuit board is obtained, and all the areas constitute the target area. Each area is covered with hot melt adhesive in the subsequent step, and the shape of each area is convenient for determining the shape of the hot melt adhesive patch corresponding to the area in the subsequent step. This step may be implemented using a placement machine. In specific implementation, the target area may be used as a preset parameter and input to the chip mounter, so that the chip mounter continues to perform subsequent steps.
And S120, attaching the hot melt adhesive patch to the surface of the electronic element to be wrapped in the target area. Specifically, in the step, a chip mounter can be used for attaching the hot melt adhesive chip to the surface of the electronic component to be wrapped in the target area; therefore, automatic production can be realized, and the production efficiency of the circuit board is improved.
The shape of the hot melt adhesive patch is matched with that of the target area. That is, the shape of each hot melt adhesive patch is the same as the shape of one of the target areas. For example, when one of the target areas is rectangular, the hot melt adhesive patch attached to that one area will be rectangular. When another area in the target area is circular, the hot melt adhesive patch attached to the area is circular. The area of the hot melt adhesive patch used is reduced, the effective utilization rate of the hot melt adhesive patch is improved, and the influence on other elements of the circuit board is reduced.
And S130, carrying out backflow solidification on the electronic component to be wrapped with the hot melt adhesive patch attached to the surface, so that the hot melt adhesive patch is melted and wraps the electronic component to be wrapped. In the step, the circuit board including the electronic component to be packaged is loaded in the carrier, and then the circuit board and the carrier are sent into a reflow soldering furnace together, and the reflow soldering furnace automatically reflows and solidifies the hot melt adhesive patch attached to the surface of the electronic component to be packaged according to a preset temperature curve. In this step, the preset temperature profile includes four temperature zones: respectively a heating area, a constant temperature area, a reflux area and a cooling area.
In the temperature raising region, the temperature of the circuit board, the temperature of the components on the circuit board, and the temperature of the carrier are raised from room temperature to a first preset temperature. The constant temperature area is used for keeping the temperature of the circuit board, the temperature of components on the circuit board and the temperature of the carrier at a first preset temperature within a first preset time period; and the temperature of the components in each area on the circuit board is the same, so that the relative temperature difference of the components is reduced. In the constant temperature zone, the hot melt adhesive is in a state of being melted but not melted.
In the reflow region, the temperature of the circuit board, that is, the temperature of the reflow oven, is first raised to the melting point temperature of the hot melt adhesive, then raised to a second preset temperature, and then lowered to the melting point temperature of the hot melt adhesive and kept for a second preset time; so that the hot melt adhesive is melted and forms connection with the surface of the circuit board after being melted. The purpose in the cooling zone is to lower the temperature of the circuit board from the melting point temperature of the hot melt adhesive to a third preset temperature, so that the hot melt adhesive is cooled to form a solid state in combination with the electronic component to be wrapped and the circuit board.
Wherein the second preset temperature is higher than the first preset temperature, and the second preset temperature is higher than the melting point temperature of the hot melt adhesive. The first preset temperature is lower than the melting point temperature of the hot melt adhesive and higher than the third preset temperature. For example, the first preset time period may be 60 seconds, and the second preset time period may be 20 seconds. The first preset temperature may be 120 ℃. The second preset temperature may be 200 ℃. The third preset temperature may be 60 ℃. This is not limited by the present application.
As shown in fig. 2, another embodiment of the present invention discloses a method for protecting a hot-melt adhesive package of an electronic component, which, based on the above embodiment, further includes the following steps between step S110 and step S120:
s111, coating the adhesive on the surface of the electronic element to be wrapped in the target area; or smearing the adhesive on the adhesive surface of the hot melt adhesive patch. The adhesive is used for bonding the electronic element to be wrapped and the hot melt adhesive patch, so that the bonding strength is improved, the hot melt adhesive is fixed, and the hot melt adhesive is prevented from displacing after the patch is attached; and the adhesive plays a role in flattening the surface of the electronic element, so that the influence of the unevenness on the surface of the electronic element on the surface of the patch is avoided. In other embodiments, the adhesive may further comprise an auxiliary agent, for example, a small amount of catalyst is contained to catalyze the melting of the hot melt adhesive, so as to achieve the purpose of melting the hot melt adhesive more fully.
In a specific implementation, the adhesive may be sprayed on the surface of the electronic component to be wrapped in the target area by using a dispenser. The binder may be rosin, which is not limited in this application.
As shown in fig. 3, another embodiment of the present application discloses a method for protecting a hot melt adhesive package of an electronic component, and on the basis of any of the above embodiments, the method further includes, between step S120 and step S130, the steps of:
s140, detecting whether the appearance defect exists in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped.
If there is an appearance defect, execute step S180: and removing the original hot melt adhesive patch with the appearance defect, and attaching a new hot melt adhesive patch on the surface of the electronic element to be wrapped in the target area again.
If there is no appearance defect, step S130 is executed. In specific implementation, the step may use an Automatic Optical Inspection (AOI) device to detect whether the hot melt adhesive patch attached to the surface of the electronic component to be packaged has an appearance defect.
As shown in fig. 4, another embodiment of the present application discloses a method for protecting a hot melt adhesive package of an electronic component, and on the basis of any one of the above embodiments, the method in this embodiment further includes, after step S130, the steps of:
s150, detecting whether the hot melt adhesive wrapping area has the defect of exposed electronic elements.
If yes, go to step S160: and correcting and maintaining the circuit board on which the electronic element is positioned.
If not, executing step S170: and collecting the circuit board on which the electronic element is positioned.
Similarly, the implementation of step S150 may be accomplished using an AOI device.
In another embodiment, the step S150 may further include: and measuring height data of each position in the area where the hot melt adhesive is located, and judging whether the height data meet preset conditions. If yes, the circuit board is collected; and if not, performing maintenance operation. Illustratively, the preset condition may be that an error between the measured value and the preset value does not exceed 10%. This is not limited by the present application.
An embodiment of the application discloses electronic component's hot melt adhesive parcel protection device, and the device includes chip mounter and reflow oven. The chip mounter is used for attaching the hot melt adhesive chip to the surface of the electronic component to be wrapped in the target area. The reflow soldering furnace is used for performing reflow curing on the electronic element to be wrapped with the hot melt adhesive patch attached to the surface, so that the hot melt adhesive patch is melted and wraps the electronic element to be wrapped.
The application further discloses a hot melt adhesive package protection device for the electronic element, and the device further comprises a glue dispenser on the basis of the embodiment. The glue dispenser is used for spraying the adhesive on the surface of the electronic element to be wrapped in the target area; or spraying the adhesive on the adhesive surface of the hot melt adhesive patch by using a dispenser. The chip mounter is used for attaching the hot melt adhesive chip to the surface of the adhesive. The application further discloses a hot melt adhesive package protection device for the electronic component, which is based on the above embodiment, and the device further comprises an AOI device. The AOI equipment is used for detecting whether appearance defects exist in a hot melt adhesive patch attached to the surface of an electronic component to be packaged before reflow curing; and/or detecting whether the electronic element exposure defect exists in the hot melt adhesive wrapping area after the reflow curing step is completed.
It is understood that the hot melt adhesive wrapped protection device for electronic components of the present invention also includes other existing functional modules that support the operation of the hot melt adhesive wrapped protection device for electronic components. The hot-melt adhesive wrapped protection device for electronic components disclosed in the above embodiments is only an example, and should not bring any limitations to the function and scope of the embodiments of the present invention.
In this embodiment, the hot melt adhesive wrapping protection device for an electronic component is used to implement the above method for protecting a hot melt adhesive wrapping of an electronic component, so as to refer to the above description of the method for protecting a hot melt adhesive wrapping of an electronic component for the specific implementation steps of the hot melt adhesive wrapping protection device for an electronic component, which is not described herein again.
It should be noted that all the above embodiments disclosed in the present application can be freely combined, and the technical solutions obtained by combining them are also within the scope of the present application.
In summary, the hot melt adhesive package protection method and device for electronic components of the present invention have at least the following advantages:
1. according to the method and the device for protecting the electronic element by wrapping the hot melt adhesive, the hot melt adhesive patch replaces the traditional dispensing of a dispenser, the hot melt adhesive patch is prepared in advance, the shape of the hot melt adhesive patch can be determined according to the shape of a target area during the patch mounting, a large amount of time is not needed for dispensing, the wrapping area of the electronic element can be ensured not to exceed the target area, the precision requirement is reduced, and the operation time is shortened;
2. according to the hot melt adhesive package protection method and device for the electronic element, provided by the invention, the package protection of the electronic element to be packaged is realized by sticking and melting the hot melt adhesive, so that the adverse effect on other elements of the circuit board in the packaging process can be avoided, the problem of high rejection rate of the circuit board is solved, and the waste boards are effectively reduced;
3. the hot melt adhesive package protection method and the device for the electronic element can be automatically completed by utilizing the full process of a machine, and the production efficiency of the circuit board is improved.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A hot melt adhesive package protection method for electronic components is characterized by comprising the following steps:
s110, determining a target area corresponding to an electronic element to be wrapped on the circuit board;
s120, attaching a hot melt adhesive patch to the surface of the electronic element to be wrapped in the target area; and
s130, carrying out backflow solidification on the electronic component to be wrapped with the hot melt adhesive patch attached to the surface, so that the hot melt adhesive patch is melted and wraps the electronic component to be wrapped.
2. The method for protecting hot melt adhesive packages of electronic components of claim 1, wherein between step S110 and step S120, said method further comprises the steps of:
s111, coating an adhesive on the surface of the electronic component to be wrapped in the target area; or smearing an adhesive on the adhesive surface of the hot melt adhesive patch.
3. The method for protecting a hot melt adhesive package of electronic components of claim 1, wherein between step S120 and step S130, said method further comprises the steps of:
s140, detecting whether the appearance defect exists in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped;
if the appearance defect exists, executing the following steps: removing the original hot melt adhesive patch attached to the surface of the electronic element, and attaching a new hot melt adhesive patch to the surface of the electronic element to be wrapped in the target area again;
if there is no appearance defect, the step S130 is executed.
4. A method of hot melt adhesive wrap protection for electronic components as in claim 1, further comprising the steps of:
detecting whether the hot melt adhesive wrapping area has an electronic element exposure defect;
if yes, performing correction and maintenance operation;
and if not, collecting the circuit board where the electronic element is located.
5. A method for hot melt adhesive wrap protection of electronic components as in claim 1, wherein said hot melt adhesive patch has a shape which matches the shape of the target area.
6. The method for protecting a hot melt adhesive package of an electronic component according to claim 1, wherein said step S120 comprises:
and attaching a hot melt adhesive patch to the surface of the electronic element to be wrapped in the target area by using a patch mounter.
7. The method for protecting a hot melt adhesive package of an electronic component according to claim 1, wherein said step S130 comprises:
and (4) carrying out reflow curing on the electronic element to be wrapped with the hot melt adhesive patch attached to the surface by using a reflow oven according to a preset temperature curve.
8. The method for protecting a hot melt adhesive package of an electronic component according to claim 2, wherein said step S111 comprises:
spraying an adhesive on the surface of the electronic element to be wrapped in the target area by using a dispenser; or spraying an adhesive on the adhesive surface of the hot melt adhesive patch by using a dispenser.
9. The method for protecting a hot melt adhesive package of an electronic component according to claim 3, wherein said step S140 comprises:
and detecting whether the appearance defect exists in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped by utilizing AOI equipment.
10. A hot melt adhesive parcel protection device of electronic components, for realizing the hot melt adhesive parcel protection method of electronic components of claim 1, characterized by that, the said device includes the chip mounter, AOI apparatus and reflow oven; the chip mounter is used for attaching the hot melt adhesive chip to the surface of the electronic component to be wrapped in the target area; the AOI equipment is used for detecting whether appearance defects exist in the hot melt adhesive patches attached to the surfaces of the electronic components to be packaged; and the reflow soldering furnace is used for performing reflow curing on the electronic element to be wrapped with the hot melt adhesive patch attached to the surface, so that the hot melt adhesive patch is melted and wraps the electronic element to be wrapped.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110899770.4A CN113613404A (en) | 2021-08-06 | 2021-08-06 | Hot melt adhesive package protection method and device for electronic component |
| TW110136513A TWI785822B (en) | 2021-08-06 | 2021-09-30 | Hot melt adhesive wrapping protection method and device for electronic components |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110899770.4A CN113613404A (en) | 2021-08-06 | 2021-08-06 | Hot melt adhesive package protection method and device for electronic component |
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| CN113613404A true CN113613404A (en) | 2021-11-05 |
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| CN202110899770.4A Pending CN113613404A (en) | 2021-08-06 | 2021-08-06 | Hot melt adhesive package protection method and device for electronic component |
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| US5414928A (en) * | 1991-12-11 | 1995-05-16 | International Business Machines Corporation | Method of making an electronic package assembly with protective encapsulant material |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI785822B (en) | 2022-12-01 |
| TW202308482A (en) | 2023-02-16 |
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Application publication date: 20211105 |