CN114258209A - Solder paste fusion glue dispensing, curing and welding method - Google Patents
Solder paste fusion glue dispensing, curing and welding method Download PDFInfo
- Publication number
- CN114258209A CN114258209A CN202111427901.5A CN202111427901A CN114258209A CN 114258209 A CN114258209 A CN 114258209A CN 202111427901 A CN202111427901 A CN 202111427901A CN 114258209 A CN114258209 A CN 114258209A
- Authority
- CN
- China
- Prior art keywords
- parts
- solder paste
- steel mesh
- welding
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 76
- 238000003466 welding Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000003292 glue Substances 0.000 title claims abstract description 12
- 230000004927 fusion Effects 0.000 title claims abstract description 7
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 62
- 239000010959 steel Substances 0.000 claims abstract description 62
- 238000005476 soldering Methods 0.000 claims abstract description 28
- 230000008569 process Effects 0.000 claims abstract description 21
- 239000002904 solvent Substances 0.000 claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 23
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 8
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 8
- 150000001735 carboxylic acids Chemical class 0.000 claims description 6
- 239000013008 thixotropic agent Substances 0.000 claims description 6
- 230000003213 activating effect Effects 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- -1 halide salts Chemical class 0.000 claims description 5
- 239000004359 castor oil Substances 0.000 claims description 4
- 235000019438 castor oil Nutrition 0.000 claims description 4
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000012190 activator Substances 0.000 claims 1
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000006071 cream Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000004043 dyeing Methods 0.000 description 6
- 230000002787 reinforcement Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a solder paste fusion glue dispensing, curing and welding method, which comprises the steps of printing through an SMT steel mesh, using modified solder paste containing solder material and epoxy resin, heating and curing through surface mounting and reflow soldering to melt the solder material and the epoxy solvent together, realizing the welding connection of an electronic component and a PCB pad through the solder material, and realizing the combination of two processes of SMT solder paste welding and dispensing curing, thereby reducing the production cost.
Description
Technical Field
The invention relates to a solder paste fusion glue dispensing, curing and welding method, and belongs to the field of SMT welding processes.
Background
SMT (Surface Mount Technology) is a circuit mounting Technology for mounting a leadless or short-lead Surface-mounted device on the Surface of a printed circuit board and soldering the device by reflow soldering or dip soldering, and is popular in the electronic assembly industry at present. The SMT technology starts in the 70 s, rapidly increases in the 80 s, and stably develops in the 90 s, and is gradually mature up to now.
At present, components such as shunts and the like use SMT soldering tin, solder paste is printed on a pad of a PCB substrate through a steel mesh, then the components are accurately attached to the pad coated with the solder paste, flux in the solder paste volatilizes through a reflow furnace, and the components are welded with the PCB substrate.
With the development of electronic products toward short, small, light and thin products, a large number of chip components such as 0201 and 01005 and fine-pitch devices such as SOIC, QFP, CSP, BGA and FC are used, which put higher demands on solder paste processes and equipment. Because the pad size of server PCB base plate is big, and action such as production process turnover, equipment, test are big to parts welding strength impact such as BGA, can produce the risk that welding strength reduces, and the current technology of solving this problem is that BGA underfill technology reinforcement, printing tin cream + chip mounter rubberizing piece + paste BGA + backflow solidification that the industry generally used usually to reach the effect of reinforceing welding strength. However, the method has four process steps, needs secondary dispensing and curing, may cause the problems of no glue penetration and too long curing time, needs too much solder paste and has higher cost. Patent No. CN201910181572.7 entitled SMT solder process and steel mesh for SMT solder process, which prevents molten solder paste 200 from flowing between the soldering surfaces 111, improves the solidification of solder paste 200 at the angle of uniform distribution of solder paste 200 on the soldering pads 110, and improves the soldering quality. The patent discloses an SMT welding process, which mainly comprises the following steps: forming a plurality of welding surfaces on a welding disc of the PCB substrate; printing solder paste on the welding surface by using a steel mesh; placing a soldering tin sheet on the solder paste, and placing a component on the soldering tin sheet to form a part to be welded; and sending the to-be-welded part into a welding furnace to fix the component on the PCB substrate. However, the operation steps are relatively complicated and complicated.
Disclosure of Invention
The invention overcomes the defects of the prior art and provides a solder paste fusion glue dispensing, curing and welding method, which adopts SMT steel mesh printing, uses modified solder paste containing solder and epoxy resin, and then carries out surface mounting and reflow soldering, heating and curing to melt the solder and the epoxy solvent together, so that the solder realizes the welding connection of electronic components and PCB bonding pads, and the two processes of SMT solder paste welding and glue dispensing and curing are combined into a whole, thereby reducing the production cost.
A solder paste fusion glue dispensing, curing and welding method comprises the following steps:
1) manufacturing a first SMT steel mesh, forming holes at the welding positions of the steel mesh where electronic components needing to be reinforced and welded are located, forming no holes at the welding positions of the other electronic components, and printing modified solder paste on the steel mesh;
2) preparing a second SMT steel mesh, wherein holes are formed at the welding positions of all electronic components normally, the steel mesh is printed with common solder paste, and 1 time of common solder paste is added at the positions where the electronic components need to be welded in an enhanced mode;
3) and carrying out reflow soldering to obtain the soldering pad for soldering the electronic component.
Further, the thickness of the opening of the steel mesh where the electronic component needing to be reinforced and welded is located in the step 1) is 0.1 m.
Further, the improved solder paste in the step 1) comprises the following components in parts by weight:
80-85 parts of tin powder, 1.5-3.5 parts of film forming material, 0.05-0.5 part of activating agent, 0.2-1.5 parts of thixotropic agent, 3-5 parts of solvent and 7-10 parts of epoxy resin.
Further, the common solder paste in the step 2) comprises the following components in parts by weight:
85-92 parts of tin powder, 2-5 parts of film forming substances, 0.05-0.5 part of activating agent, 0.2-2 parts of thixotropic agent and 3-7 parts of solvent.
Further, the film forming material component is rosin and derivatives thereof.
Further, the activating agent is one or more of dicarboxylic acid, special carboxylic acid and organic halide salt.
Further, the thixotropic agent is one or more of castor oil, hydrogenated castor oil, ethylene glycol monobutyl ether and carboxymethyl cellulose.
Further, the solvent is one or both of tripropylene glycol butyl ether and diethylene glycol butyl ether.
Has the advantages that:
put forward in this application and mix the solder material with epoxy solvent, reach the increase welding strength effect through printing + dress + reflow soldering technology, unite two into one reliability solder paste welding and some red glue or UV glue two independent detached workstations in original SMT production technology, reduce the secondary and glue solidification process flow, make welding strength increase, process flow reduces reduction, reduction in production cost.
Drawings
Fig. 1 experimental furnace temperature test results.
Fig. 2 shows a product manufactured by a conventional process.
Fig. 3 vibration drop test.
FIG. 4 slicing results.
FIG. 5 staining results.
Detailed Description
In order to make the technical solutions in the present application better understood, the present invention is further described below with reference to examples, which are only a part of examples of the present application, but not all examples, and the present invention is not limited by the following examples.
EXAMPLE 1 method of manufacturing a pad for soldering an electronic component
1) Get the needs reinforcement welding part that the customer required above the PCBA like BGA, a preparation SMT steel mesh, open a hole with the solder joint of BGA place steel mesh, the solder joint of other electronic components does not open a hole, steel mesh BGA trompil dimensional requirement will be less than normal trompil thickness and size, such as 1.0pitch BGA, normal trompil 0.6mm circle, steel sheet thickness 0.15mm, this steel mesh trompil 0.3mm circle, steel sheet thickness 0.1mm, the modified tin cream of printing (here printing mode is for line body and equipment Cost Down, select the tool that steel mesh and printing base are fixed on the steel mesh, personnel brush the tin cream manually), the modified tin cream include following component, according to the part by weight: 80-85 parts of tin powder, 1.5-3.5 parts of rosin and derivatives thereof, 0.05-0.5 part of dicarboxylic acid, 0.2-1.5 parts of ethylene glycol monobutyl ether, 3-5 parts of tripropylene glycol butyl ether and 7-10 parts of epoxy resin solvent. In the step, the thickness of the opening of the steel mesh where the electronic component needing to be reinforced and welded is located is 0.05mm less than that of the opening of the steel mesh being produced (the thickness of the opening of the steel mesh being produced is 0.15mm generally), and the thickness of the steel mesh where the electronic component needing to be reinforced and welded is located is 0.1mm, and the diameter of the opening is equal to the diameter of the opening of the 1/2 normal steel mesh. The method can meet the requirement that the position of the part to be reinforced and welded has both common solder paste and modified solder paste.
2) Preparing a second SMT steel mesh, wherein all electronic component welding parts are normally perforated, after the first manual operation printing, the printing machine is used for printing common solder paste, 1 time of common solder paste is added at the position where the electronic components need to be reinforced and welded, and 1 time of common solder paste is added at the position where the electronic components need to be reinforced and welded after the printing, wherein the common solder paste comprises the following components in parts by weight: 85-92 parts of tin powder, 2-5 parts of rosin and derivatives thereof, 0.05-0.5 part of dicarboxylic acid, 0.2-2 parts of ethylene glycol monobutyl ether and 3-5 parts of tripropylene glycol butyl ether.
3) Reflow soldering, wherein the temperature parameter setting of the reflow soldering furnace is according to the temperature recommended by a normal solder paste manufacturer:
reflow oven temperature curve process standard: a temperature rise slope: 0-3 ℃/s, b temperature is 150-200 ℃ for the following time: 60-120, c temperature is above 217 ℃ for a period of time: 70-120 s, d peak temperature of welding spots of elements, e peak temperature of PCB surface is less than or equal to 25 ℃, f slope temperature slope is-3-0 ℃/s, g temperature zone temperature deviation: +/-5 ℃, and h is less than or equal to 150 ℃ before taking the PCB out of the furnace.
And (5) determining an experimental furnace temperature test result pass as shown in figure 1, confirming that furnace temperature parameters meet the requirements of the welding process, and confirming that the solder paste and the epoxy resin are cured completely after welding. PCBA carries out the experiment in the aspect of the reliability after accomplishing verification SMT welding: shaking drop, ATC, dyeing and slicing experiments, and the experimental result meets the requirements of customers, namely the process of the scheme is successful.
1) Get the needs reinforcement welding part that the customer required above the PCBA like BGA, a preparation SMT steel mesh, open a hole with the solder joint of BGA place steel mesh, the solder joint of other electronic components does not open a hole, steel mesh BGA trompil dimensional requirement will be less than normal trompil thickness and size, such as 1.0pitch BGA, normal trompil 0.6mm circle, steel sheet thickness 0.15mm, this steel mesh trompil 0.3mm circle, steel sheet thickness 0.1mm, the modified tin cream of printing (here printing mode is for line body and equipment Cost Down, select the tool that steel mesh and printing base are fixed on the steel mesh, personnel brush the tin cream manually), the modified tin cream include following component, according to the part by weight: 80-85 parts of tin powder, 1.5-3.5 parts of rosin and derivatives thereof, 0.05-0.5 part of special carboxylic acid, 0.2-1.5 parts of ethylene glycol monobutyl ether, 3-5 parts of tripropylene glycol butyl ether and 7-10 parts of epoxy resin solvent. In the step, the thickness of the opening of the steel mesh where the electronic component needing to be reinforced and welded is located is 0.05mm less than that of the opening of the steel mesh being produced (the thickness of the opening of the steel mesh being produced is 0.15mm generally), and the thickness of the steel mesh where the electronic component needing to be reinforced and welded is located is 0.1mm, and the diameter of the opening is equal to the diameter of the opening of the 1/2 normal steel mesh. The method can meet the requirement that the position of the part to be reinforced and welded has both common solder paste and modified solder paste.
2) Preparing a second SMT steel mesh, wherein all electronic component welding parts are normally perforated, after the first manual operation printing, the printing machine is used for printing common solder paste, 1 time of common solder paste is added at the position where the electronic components need to be reinforced and welded, and 1 time of common solder paste is added at the position where the electronic components need to be reinforced and welded after the printing, wherein the common solder paste comprises the following components in parts by weight: 85-92 parts of tin powder, 2-5 parts of rosin and derivatives thereof, 0.05-0.5 part of special carboxylic acid, 0.2-2 parts of ethylene glycol monobutyl ether and 3-7 parts of tripropylene glycol butyl ether.
3) Reflow soldering, wherein the temperature parameter setting of the reflow soldering furnace is according to the temperature recommended by a normal solder paste manufacturer:
reflow oven temperature curve process standard: a temperature rise slope: 0-3 ℃/s, b temperature is 150-200 ℃ for the following time: 60-120, c temperature is above 217 ℃ for a period of time: 70-120 s, d peak temperature of welding spots of elements, e peak temperature of PCB surface is less than or equal to 25 ℃, f slope temperature slope is-3-0 ℃/s, g temperature zone temperature deviation: +/-5 ℃, and h is less than or equal to 150 ℃ before taking the PCB out of the furnace.
And (5) determining an experimental furnace temperature test result pass as shown in figure 1, confirming that furnace temperature parameters meet the requirements of the welding process, and confirming that the solder paste and the epoxy resin are cured completely after welding. PCBA carries out the experiment in the aspect of the reliability after accomplishing verification SMT welding: shaking drop, ATC, dyeing and slicing experiments, and the experimental result meets the requirements of customers, namely the process of the scheme is successful.
Example 3
1) Get the needs reinforcement welding part that the customer required above the PCBA like BGA, a preparation SMT steel mesh, open a hole with the solder joint of BGA place steel mesh, the solder joint of other electronic components does not open a hole, steel mesh BGA trompil dimensional requirement will be less than normal trompil thickness and size, such as 1.0pitch BGA, normal trompil 0.6mm circle, steel sheet thickness 0.15mm, this steel mesh trompil 0.3mm circle, steel sheet thickness 0.1mm, the modified tin cream of printing (here printing mode is for line body and equipment Cost Down, select the tool that steel mesh and printing base are fixed on the steel mesh, personnel brush the tin cream manually), the modified tin cream include following component, according to the part by weight: 80-85 parts of tin powder, 1.5-3.5 parts of rosin and derivatives thereof, 0.05-0.5 part of special carboxylic acid, 0.2-1.5 parts of ethylene glycol monobutyl ether, 3-5 parts of tripropylene glycol butyl ether and 7-10 parts of epoxy resin solvent. In the step, the thickness of the opening of the steel mesh where the electronic component needing to be reinforced and welded is located is 0.05mm less than that of the opening of the steel mesh being produced (the thickness of the opening of the steel mesh being produced is 0.15mm generally), and the thickness of the steel mesh where the electronic component needing to be reinforced and welded is located is 0.1mm, and the diameter of the opening is equal to the diameter of the opening of the 1/2 normal steel mesh. The method can meet the requirement that the position of the part to be reinforced and welded has both common solder paste and modified solder paste.
2) Preparing a second SMT steel mesh, wherein all electronic component welding parts are normally perforated, after the first manual operation printing, the printing machine is used for printing common solder paste, 1 time of common solder paste is added at the position where the electronic components need to be reinforced and welded, and 1 time of common solder paste is added at the position where the electronic components need to be reinforced and welded after the printing, wherein the common solder paste comprises the following components in parts by weight: 85-92 parts of tin powder, 2-5 parts of rosin and derivatives thereof, 0.05-0.5 part of special carboxylic acid, 0.2-2 parts of ethylene glycol monobutyl ether and 3-7 parts of tripropylene glycol butyl ether.
3) Reflow soldering, wherein the temperature parameter setting of the reflow soldering furnace is according to the temperature recommended by a normal solder paste manufacturer:
reflow oven temperature curve process standard: a temperature rise slope: 0-3 ℃/s, b temperature is 150-200 ℃ for the following time: 60-120, c temperature is above 217 ℃ for a period of time: 70-120 s, d peak temperature of welding spots of elements, e peak temperature of PCB surface is less than or equal to 25 ℃, f slope temperature slope is-3-0 ℃/s, g temperature zone temperature deviation: +/-5 ℃, and h is less than or equal to 150 ℃ before taking the PCB out of the furnace.
And (5) determining an experimental furnace temperature test result pass as shown in figure 1, confirming that furnace temperature parameters meet the requirements of the welding process, and confirming that the solder paste and the epoxy resin are cured completely after welding. PCBA carries out the experiment in the aspect of the reliability after accomplishing verification SMT welding: shaking drop, ATC, dyeing and slicing experiments, and the experimental result meets the requirements of customers, namely the process of the scheme is successful.
Example 4
The pad for welding the electronic component prepared by the application is subjected to ATC and vibration drop-back dyeing and slicing experiments.
TABLE 1 ATC test parameter requirements
The acceptability criteria are as follows:
the functionality of the PCBA sample should be intact.
Problems of electroless corrosion and migration of the tested PCBA sample
Appearance: without violating the requirements of related IPC-610-F
Vibration & Drop Vibration Drop test
As shown in fig. 3
| Board card |
6 faces were vibrated for 30 minutes each |
And (5) carrying out slicing and dyeing experiment confirmation after ATC and vibration falling are finished.
Slicing results: as shown in FIG. 4, the BGA solder joints tested had voids (less than 30%), and no abnormal phenomena such as cracking and the like
And (3) dyeing results: as shown in FIG. 5, the staining phenomenon indicates that there was no abnormality in the weld strength.
Comparative example prior art solution
The steel mesh is manufactured, the steel mesh opening is executed according to normal process standards, electronic components are normally pasted after solder paste is printed, a machine board is pasted before components such as BGA needing to be reinforced in welding strength, an undercut film (sub-film) film is pasted around a corresponding area, then the electronic components are pasted above the film, a reflow furnace is passed, high-temperature heating is carried out, the film is melted into a liquid state by solder paste firstly, the bottom of the component is infiltrated, and after the solder paste is melted and welded, the steel mesh opening and the electronic components are combined to complete the improvement of the welding strength.
The prior art scheme is as follows, wherein A in FIG. 2 is a tape and B in FIG. 2 is a BGA tape.
Claims (8)
1. A solder paste fusion glue dispensing, curing and welding method is characterized by comprising the following steps:
1) manufacturing a first SMT steel mesh, forming holes at the welding positions of the steel mesh where electronic components needing to be reinforced and welded are located, forming no holes at the welding positions of the other electronic components, and printing modified solder paste on the steel mesh;
2) preparing a second SMT steel mesh, wherein holes are formed at the welding positions of all electronic components normally, the steel mesh is printed with common solder paste, and 1 time of common solder paste is added at the positions where the electronic components need to be welded in an enhanced mode;
3) and carrying out reflow soldering to obtain the soldering pad for soldering the electronic component.
2. The soldering method according to claim 1, wherein the thickness of the opening of the steel mesh of the electronic component to be solder enhancement in step 1) is 0.1 m.
3. The soldering method according to claim 1, wherein the improved solder paste of step 1) comprises the following components in parts by weight:
80-85 parts of tin powder, 1.5-3.5 parts of film forming material, 0.05-0.5 part of activating agent, 0.2-1.5 parts of thixotropic agent, 3-5 parts of solvent and 7-10 parts of epoxy resin.
4. The soldering method according to claim 1, wherein the general solder paste in the step 2) comprises the following components in parts by weight:
85-92 parts of tin powder, 2-5 parts of film forming substances, 0.05-0.5 part of activating agent, 0.2-2 parts of thixotropic agent and 3-7 parts of solvent.
5. A welding method according to any one of claims 3 or 4 wherein said film forming material component is rosin and derivatives thereof.
6. A welding method as claimed in any one of claims 3 or 4, wherein said activator is one or more of dicarboxylic acids, carboxylic acids and organic halide salts.
7. A welding method as claimed in any one of claims 3 or 4, wherein said thixotropic agent is one or more of castor oil, hydrogenated castor oil, ethylene glycol monobutyl ether, and carboxymethyl cellulose.
8. A welding process as claimed in any one of claims 3 or 4 wherein said solvent is one or both of tripropylene glycol butyl ether and diethylene glycol butyl ether.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111427901.5A CN114258209B (en) | 2021-11-26 | 2021-11-26 | Solder paste fusion glue dispensing solidification welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111427901.5A CN114258209B (en) | 2021-11-26 | 2021-11-26 | Solder paste fusion glue dispensing solidification welding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114258209A true CN114258209A (en) | 2022-03-29 |
| CN114258209B CN114258209B (en) | 2023-07-18 |
Family
ID=80791301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111427901.5A Active CN114258209B (en) | 2021-11-26 | 2021-11-26 | Solder paste fusion glue dispensing solidification welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114258209B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997007542A1 (en) * | 1995-08-11 | 1997-02-27 | Kirsten Kenneth J | Epoxy resin based solder paste |
| JPH11135930A (en) * | 1997-10-31 | 1999-05-21 | Nippon Avionics Co Ltd | Soldering method of mixed component mounting board by solder paste printing |
| JP2004014947A (en) * | 2002-06-10 | 2004-01-15 | Mitsubishi Electric Corp | Manufacture of electronic circuit board |
| CN1579698A (en) * | 2003-08-08 | 2005-02-16 | 株式会社东芝 | Thermal-setting welding-assistant, welding paste and welding method |
| JP2005158892A (en) * | 2003-11-21 | 2005-06-16 | Kyocera Corp | Process for producing wiring board |
| CN108500501A (en) * | 2018-04-09 | 2018-09-07 | 苏州科技大学 | A kind of epoxy tin cream |
-
2021
- 2021-11-26 CN CN202111427901.5A patent/CN114258209B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997007542A1 (en) * | 1995-08-11 | 1997-02-27 | Kirsten Kenneth J | Epoxy resin based solder paste |
| JPH11135930A (en) * | 1997-10-31 | 1999-05-21 | Nippon Avionics Co Ltd | Soldering method of mixed component mounting board by solder paste printing |
| JP2004014947A (en) * | 2002-06-10 | 2004-01-15 | Mitsubishi Electric Corp | Manufacture of electronic circuit board |
| CN1579698A (en) * | 2003-08-08 | 2005-02-16 | 株式会社东芝 | Thermal-setting welding-assistant, welding paste and welding method |
| JP2005158892A (en) * | 2003-11-21 | 2005-06-16 | Kyocera Corp | Process for producing wiring board |
| CN108500501A (en) * | 2018-04-09 | 2018-09-07 | 苏州科技大学 | A kind of epoxy tin cream |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114258209B (en) | 2023-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6137183A (en) | Flip chip mounting method and semiconductor apparatus manufactured by the method | |
| US5111991A (en) | Method of soldering components to printed circuit boards | |
| US20060043597A1 (en) | Solder composition, connecting process with soldering, and connection structure with soldering | |
| US7017795B2 (en) | Solder pastes for providing high elasticity, low rigidity solder joints | |
| CN108337821A (en) | A kind of welding method of circuit board | |
| CN107570911B (en) | Lead-free high-temperature soldering paste for mobile phone and computer mainboard and preparation method thereof | |
| CN109530957A (en) | Grafting material | |
| Chen et al. | Mechanical shock and drop reliability evaluation of the BGA solder joint stack-ups formed by reflow soldering SAC solder balls BGAs with BiSnAg and resin reinforced BiSn-based solder pastes | |
| CN112247300B (en) | Electronic component welding method and surface-mounted electronic component welding method | |
| CN111901984A (en) | Reinforcing and desoldering method for MAPF-PGA packaging device of spacecraft electronic product | |
| CN108925062B (en) | Installation method for CQFP (CQFP) device of spacecraft electronic product | |
| CN114258209A (en) | Solder paste fusion glue dispensing, curing and welding method | |
| CN108391374A (en) | A kind of technique that Surface Mount component welding is carried out using pinboard | |
| CN108356374A (en) | A kind of soldering of printed boards method containing unleaded BGA device | |
| CN112888188A (en) | PCBA (printed circuit board assembly) paster processing technology | |
| CN112820652B (en) | Method for removing Jin Tang tin from L-shaped welding terminal of QFN packaging device | |
| CN107295759B (en) | Welding shielding mold manufacturing method, welding shielding mold and welding structure | |
| JP2001345549A (en) | Method of manufacturing mounting board, method of mounting part, and apparatus for manufacturing the mounting board | |
| Sun | Solder joint reliability of Sn-Ag-Cu BGA and Sn-Pb solder paste | |
| US6390355B1 (en) | Method for forming a metallic contact on an electronic printed circuit board and a product therefrom | |
| CN104754881A (en) | Injection welding method | |
| CN219660041U (en) | Printing steel mesh | |
| US20240136322A1 (en) | Semiconductor package and manufacturing method therefor | |
| CN114248045A (en) | Soldering flux paste with gluing effect after welding and preparation method thereof | |
| Kuttiyil Thomas et al. | Soldering Defects |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |