TW202308482A - Hot melt adhesive wrapping protection method and device for electronic component - Google Patents

Abstract

The invention provides a hot melt adhesive wrapping protection method and device for an electronic component. The method comprises the following steps: a target area corresponding to a to-be-wrapped electronic element on a circuit board is determined; a hot melt adhesive patch is attached to the surface of the to-be-wrapped electronic component in the target area; and the to-be-wrapped electronic component with the hot melt adhesive patch attached to the surface is subjected to backflow curing, so that the hot melt adhesive patch is melted and wraps the to-be-wrapped electronic component. The production efficiency of the circuit board is improved on the premise of ensuring that other electronic components of the circuit board are not affected in the wrapping protection process.

Description

Hot melt adhesive wrapping protection method and device for electronic components

The invention relates to the technical field of protecting electronic components on a circuit board, in particular to a method and device for wrapping and protecting electronic components with hot melt adhesive.

In SMT (Surface Mounted Technology, surface mount technology) technology, in order to prevent the electronic components on the circuit board from colliding during the subsequent assembly process, the electronic components will be wrapped and protected. In the prior art, a glue dispenser is usually used to spray glue onto the designated glue dispensing area of the product, and the glue is cured to form a glue film. This method will cause loose glue during the dispensing process, that is, it will cause glue to splash onto other components on the circuit board, affecting the performance and appearance of the circuit board. On the other hand, since this method needs to rely on manual work, the production efficiency of the circuit board is low.

In view of this, the present invention provides a hot melt adhesive wrapping protection method and device for electronic components, which improves the production efficiency of the circuit board on the premise of ensuring that the wrapping protection process does not affect other components of the circuit board.

According to one aspect of the present invention, there is provided a hot melt adhesive wrapping protection method for electronic components, comprising the following steps:

S110, determining a target area corresponding to the electronic component on the circuit board;

S120, attaching a hot melt adhesive patch to the surface of the electronic component to be wrapped in the target area; and

S130, performing reflow solidification on the electronic component to be wrapped with the hot-melt adhesive patch attached to the surface, melting the hot-melt adhesive patch and wrapping the electronic component to be wrapped.

Optionally, between step S110 and step S120, the method further includes the steps of:

S111, applying adhesive to the surface of the electronic component to be wrapped in the target area; or applying adhesive to the bonding surface of the hot melt adhesive patch.

Optionally, between step S120 and step S130, the method further includes the steps of:

S140, detecting whether there is an appearance defect in the hot-melt adhesive patch attached to the surface of the electronic component to be wrapped;

If there is an appearance defect, perform the steps of removing the original hot-melt adhesive patch attached to the surface of the electronic component, and re-attaching a new hot-melt adhesive patch to the surface of the electronic component to be wrapped in the target area ;

If there is no appearance defect, the step S130 is executed.

Optionally, the method also includes the steps of:

Detect whether there are exposed defects of electronic components in the hot melt adhesive package area;

If yes, perform corrective maintenance operations;

If not, the circuit board where the electronic component is located is closed.

Optionally, the shape of the hot melt adhesive patch matches the shape of the target area.

Optionally, the step S120 includes:

A hot-melt adhesive patch is pasted on the surface of the electronic component to be wrapped in the target area by using a placement machine.

Optionally, the step S130 includes:

Using a reflow oven according to the preset temperature curve, the electronic components to be wrapped with hot melt adhesive patches attached to the surface are reflow cured.

Optionally, the step S111 includes:

Spraying the adhesive on the surface of the electronic component to be wrapped in the target area by using a glue dispenser; or spraying the adhesive on the bonding surface of the hot melt adhesive patch by using a glue dispenser.

Optionally, the step S140 includes:

Use AOI equipment to detect whether there are appearance defects in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped.

According to another aspect of the present invention, there is provided a hot-melt adhesive wrapping protection device for electronic components, which is used to realize the hot-melt adhesive wrapping protection method for any of the above-mentioned electronic components, and the device includes a placement machine, AOI equipment and a reflow oven The placement machine is used to attach the hot melt adhesive patch to the surface of the electronic component to be wrapped in the target area; the AOI equipment is used to detect whether the hot melt adhesive patch attached to the surface of the electronic component to be wrapped is There are appearance defects; the reflow oven is used to reflow and solidify the electronic components to be wrapped with hot-melt adhesive patches attached to the surface, so that the hot-melt adhesive patches can melt and wrap the electronic components to be wrapped.

Optionally, the hot melt adhesive package protection device for electronic components also includes a glue dispenser, which is used to determine the target area corresponding to the electronic components to be wrapped on the circuit board, and apply the adhesive to the The surface of the electronic component to be wrapped in the target area or the adhesive is sprayed on the adhesive surface of the above-mentioned hot melt adhesive patch.

Optionally, the AOI equipment is also used to detect whether there is an exposed defect of electronic components in the area wrapped by the hot melt adhesive after the step of reflow curing is completed.

The beneficial effect of the present invention compared with prior art is:

1. The hot-melt adhesive wrapping protection method and device for electronic components provided by the present invention use hot-melt adhesive patches to replace the traditional dispensing machine dispensing. The shape of the area determines the shape of the hot-melt adhesive patch, without spending a lot of time dispensing glue, which can ensure that the wrapping area of electronic components does not exceed the target area, reducing accuracy requirements and shortening operation time;

2. The hot-melt adhesive wrapping protection method and device for electronic components provided by the present invention realize the wrapping protection of the electronic components to be wrapped by using hot-melt adhesive patching and melting, which can avoid adverse effects on other components of the circuit board during the wrapping process, Solved the problem of high scrap rate of circuit boards and effectively reduced scrap boards;

3. The hot-melt adhesive wrapping protection method and device for electronic components provided by the present invention can be completed automatically by using machines, which improves the production efficiency of circuit boards.

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, one skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or that other methods, materials, devices, etc. may be employed. In other instances, prior art solutions have not been shown or described in detail to avoid obscuring aspects of the present disclosure. The same drawing symbols in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

Some passive components on the circuit board, such as 01005 or 0201 components, need to be wrapped for protection during assembly to avoid collisions.

As shown in Figure 1, an embodiment of the present invention discloses a hot melt adhesive wrapping protection method for electronic components, including the following steps:

S110, determining a target area corresponding to the electronic component to be packaged on the circuit board. Specifically, at least one area formed by gathering a plurality of electronic components to be packaged on the circuit board is obtained first, and all the areas constitute the above-mentioned target area. Each area is covered with hot melt adhesive in subsequent steps, and the shape of each area facilitates determining the shape of the hot melt adhesive patch corresponding to the area in subsequent steps. This step can be realized by using a placement machine. During specific implementation, the above-mentioned target area can be used as a preset parameter and input into the placement machine, so that the placement machine can continue to perform subsequent steps.

S120, attaching a hot melt adhesive patch on the surface of the electronic component to be wrapped in the above target area. Specifically, in this step, a placement machine can be used to attach hot-melt adhesive patches to the surface of the electronic components to be wrapped in the above-mentioned target area; this can realize automatic production and is beneficial to improve the production efficiency of circuit boards.

The shape of the above-mentioned hot melt adhesive patch matches the shape of the target area. That is, the shape of each hot-melt adhesive patch is the same as that of one area in the target area. For example, when an area in the target area is rectangular, the hot-melt adhesive patch attached to the area is rectangular. When another area in the target area is circular, the hot melt adhesive patch attached to this area is circular. This helps to reduce the area of the hot-melt adhesive patch used, improve the effective utilization rate of the hot-melt adhesive patch, and reduce the impact on other components of the circuit board.

S130, performing reflow solidification on the to-be-wrapped electronic component with the above-mentioned hot-melt adhesive patch attached to the surface, melting the above-mentioned hot-melt adhesive patch and wrapping the above-mentioned to-be-wrapped electronic component. During specific implementation, in this step, the circuit board containing the above-mentioned electronic components to be wrapped can be loaded in the carrier, and then the circuit board and the carrier are sent together into the reflow oven. Automatic reflow curing of hot-melt adhesive patches attached to the surface of electronic components. In this step, the preset temperature curve includes four temperature zones: heating zone, constant temperature zone, reflow zone and cooling zone.

In the above heating zone, the purpose is to increase the temperature of the circuit board, the temperature of the components on the circuit board and the temperature of the carrier from room temperature to a first preset temperature. The purpose of the constant temperature zone is to keep the temperature of the circuit board, the temperature of the components on the circuit board and the temperature of the carrier at the first preset temperature within the first preset time; and make the temperature of the components in each area on the circuit board the same, reducing their relative temperature difference. In the constant temperature zone, the hot melt adhesive is in a state of being melted but not melted.

In the above-mentioned reflow zone, the purpose is to make the temperature of the circuit board, that is, the temperature of the reflow oven, first increase to the melting point temperature of the hot melt adhesive, then increase to the second preset temperature, and then reduce to the melting point temperature of the hot melt adhesive and maintain The second preset duration; thus, the hot melt adhesive is melted, and the hot melt adhesive forms a connection with the surface of the circuit board after melting. The purpose in the cooling zone is to reduce the temperature of the circuit board from the melting point of the hot melt adhesive to the third preset temperature, so that the hot melt adhesive, the above-mentioned electronic components to be wrapped and the circuit board are combined and cooled to form a solid state.

Wherein, the second preset temperature is higher than the first preset temperature, and the second preset temperature is higher than the melting point of the hot melt adhesive. The first preset temperature is lower than the melting point temperature of the hot melt adhesive and higher than the third preset temperature. Exemplarily, the first preset duration may be 60 seconds, and the second preset duration may be 20 seconds. The first preset temperature may be 120°C. The second preset temperature may be 200°C. The third preset temperature may be 60°C. This application is not limited to this.

As shown in Figure 2, another embodiment of the present invention discloses a hot melt adhesive wrapping protection method for electronic components. On the basis of the above embodiment, between step S110 and step S120, further steps are included:

S111, applying an adhesive to the surface of the electronic component to be wrapped in the above target area; or applying an adhesive to the bonding surface of the above hot melt adhesive patch. The above-mentioned adhesive is used to bond between the electronic components to be wrapped and the hot-melt adhesive patch, improve the bonding strength, realize the fixing of the hot-melt adhesive, and prevent the hot-melt adhesive from being displaced after the patch; and the adhesive It plays the role of leveling the surface of electronic components, avoiding the uneven surface of electronic components and affecting the placement effect. In other embodiments, the above-mentioned adhesive may also contain additives, such as a small amount of catalyst to catalyze the melting of the hot-melt adhesive, so as to achieve the purpose of making the hot-melt adhesive melt more fully.

During specific implementation, a glue dispenser can be used to spray the adhesive on the surface of the electronic component to be wrapped in the above target area. Wherein, the above-mentioned binder may be rosin, which is not limited in the present application.

As shown in Figure 3, another embodiment of the present application discloses a hot melt adhesive wrapping protection method for electronic components. On the basis of any of the above embodiments, steps between step S120 and step S130 are further included:

S140, detecting whether there is an appearance defect in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped.

If there is an appearance defect, perform step S180: remove the original hot-melt adhesive patch with appearance defect, and reattach a new hot-melt adhesive patch to the surface of the electronic component to be wrapped in the above-mentioned target area.

If there is no appearance defect, execute step S130. During specific implementation, this step can use AOI (Automatic Optical Inspection, automatic optical inspection machine) equipment to detect whether there is an appearance defect in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped.

As shown in Figure 4, another embodiment of the present application discloses a hot melt adhesive wrapping protection method for electronic components. On the basis of any of the above embodiments, in this embodiment, after step S130, further steps are included:

S150, detecting whether there is an exposed defect of an electronic component in the area wrapped by the hot melt adhesive.

If yes, perform step S160: perform correction and maintenance operations on the circuit board where the above-mentioned electronic components are located.

If not, execute step S170: collect the circuit board where the above-mentioned electronic components are located.

Similarly, the implementation of step S150 can be accomplished using AOI equipment.

In another embodiment, the above step S150 may further include: measuring the height data of each position in the area where the hot melt adhesive is located, and judging whether the height data satisfies a preset condition. If it is satisfied, the circuit board will be collected; if not, it will be repaired. Exemplarily, the preset condition may be that the error between the measured value and the preset value does not exceed 10%. This application is not limited to this.

An embodiment of the present application discloses a device for encapsulating and protecting electronic components with hot melt adhesive, and the device includes a placement machine and a reflow oven. The above-mentioned placement machine is used to attach the hot-melt adhesive patch to the surface of the electronic component to be wrapped in the target area. The above-mentioned reflow oven is used to reflow and solidify the electronic components to be wrapped with the hot-melt adhesive patch attached to the surface, so that the hot-melt adhesive patch melts and wraps the electronic components to be wrapped.

Another embodiment of the present application also discloses a device for wrapping and protecting electronic components with hot melt adhesive. This embodiment is based on the above embodiment, and the above device further includes a glue dispenser. The above-mentioned glue dispenser is used to spray the adhesive on the surface of the electronic component to be wrapped in the target area; or use the glue dispenser to spray the adhesive on the adhesive surface of the above-mentioned hot melt adhesive patch. The placement machine is used to attach the hot melt adhesive patch to the surface of the above adhesive. Another embodiment of the present application also discloses a hot-melt adhesive wrapping protection device for electronic components. This embodiment is based on the above-mentioned embodiment, and the above-mentioned device also includes AOI equipment. The AOI equipment is used to detect whether there are appearance defects in the hot melt adhesive patch attached to the surface before the reflow curing of the electronic components to be wrapped; and/or to detect whether there are exposed electronic components in the hot melt adhesive package area after the reflow curing step is completed defect.

It can be understood that the hot-melt adhesive package protection device for electronic components of the present invention also includes other existing functional modules that support the operation of the hot-melt adhesive package protection device for electronic components. The hot melt adhesive wrapping protection device for electronic components disclosed in the above embodiments is only an example, and should not limit the functions and application scope of the embodiments of the present invention.

The hot-melt adhesive wrapping protection device for electronic components in this embodiment is used to realize the above-mentioned hot-melt adhesive wrapping protection method for electronic components, so the specific implementation steps for the hot-melt adhesive wrapping protection device for electronic components can refer to the above-mentioned electronic components. The description of the method of hot melt adhesive wrapping and protecting the components will not be repeated here.

It should be noted that all the above-mentioned embodiments disclosed in this application can be combined freely, and the technical solutions obtained after combination are also within the protection scope of this application.

To sum up, the hot melt adhesive wrapping protection method and device for electronic components of the present invention have at least the following advantages:

1. The hot-melt adhesive wrapping protection method and device for electronic components provided by the present invention use hot-melt adhesive patches to replace the traditional dispensing machine dispensing. The shape of the area determines the shape of the hot-melt adhesive patch, without spending a lot of time dispensing glue, which can ensure that the wrapping area of electronic components does not exceed the target area, reducing accuracy requirements and shortening operation time;

2. The hot-melt adhesive wrapping protection method and device for electronic components provided by the present invention realize the wrapping protection of the electronic components to be wrapped by using hot-melt adhesive patching and melting, which can avoid adverse effects on other components of the circuit board during the wrapping process, Solved the problem of high scrap rate of circuit boards and effectively reduced scrap boards;

3. The hot-melt adhesive wrapping protection method and device for electronic components provided by the present invention can be completed automatically by using machines, which improves the production efficiency of circuit boards.

The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be assumed that the specific implementation of the present invention is limited to these descriptions. For those of ordinary skill in the technical field of the present invention, without departing from the concept of the present invention, some simple deduction or replacement can be made, which should be regarded as belonging to the protection scope of the present invention.

S110, S111, S120, S130, S140, S150, S160, S170, S180: steps

The drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description serve to explain the principles of the invention. Obviously, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to these drawings without progressive efforts.

Fig. 1 is a schematic flow chart of a hot melt adhesive wrapping protection method for electronic components disclosed in an embodiment of the present invention; Fig. 2 is a schematic flow chart of a hot melt adhesive wrapping protection method for electronic components disclosed in another embodiment of the present invention; Fig. 3 is a schematic flow chart of a hot melt adhesive wrapping protection method for electronic components disclosed in another embodiment of the present invention; FIG. 4 is a schematic flowchart of a method for encapsulating and protecting electronic components with hot melt adhesive disclosed in another embodiment of the present invention.

S110, S120, S130: steps

Claims (10)

A hot melt adhesive wrapping protection method for electronic components, characterized in that it comprises the following steps: S110, determining a target area corresponding to an electronic component to be packaged on a circuit board; S120, attaching a hot melt adhesive patch on the surface of the electronic component to be wrapped in the target area; and S130, performing reflow solidification on the electronic component to be wrapped with the hot melt adhesive patch on its surface, melting the hot melt adhesive patch and wrapping the electronic component to be wrapped. The hot melt adhesive wrapping protection method for electronic components as described in claim 1, wherein, between step S110 and step S120, the method further includes the steps of: S111, apply adhesive to the surface of the electronic component to be wrapped in the target area; or apply adhesive to an adhesive surface of the hot melt adhesive patch. The hot-melt adhesive wrapping protection method for electronic components as described in claim 1, wherein, between step S120 and step S130, the method further includes the steps of: S140, detecting whether there is an appearance defect in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped; If there is an appearance defect, perform the step of removing the original hot-melt adhesive patch attached to the surface of the electronic component to be wrapped, and re-attach a new hot-melt adhesive patch to the target area The surface of the electronic component to be wrapped as described in; If there is no appearance defect, the step S130 is executed. The hot melt adhesive package protection method for electronic components as described in claim 1, wherein the method further includes the steps of: Detect whether there are exposed defects of electronic components in the area wrapped by hot melt adhesive; If yes, perform corrective maintenance operations; If not, closing the circuit board where the electronic component is located. The hot-melt adhesive encapsulation and protection method for electronic components according to claim 1, wherein the shape of the hot-melt adhesive patch matches the shape of the target area. The method for encapsulating and protecting electronic components with hot melt adhesive according to claim 1, wherein the step S120 includes: Using a placement machine to stick the hot melt adhesive patch on the surface of the electronic component to be wrapped in the target area. The method for encapsulating and protecting electronic components with hot melt adhesive according to claim 1, wherein the step S130 includes: Using a reflow oven according to a preset temperature curve, the electronic components to be packaged with the hot melt adhesive patches attached to the surface are reflow cured. The method for encapsulating and protecting electronic components with hot melt adhesive according to claim 2, wherein the step S111 includes: Spraying the adhesive on the surface of the electronic component to be wrapped in the target area by using a glue dispenser; or spraying the adhesive on the bonding surface of the hot-melt adhesive patch by using the glue dispenser. The method for encapsulating and protecting electronic components with hot melt adhesive according to claim 3, wherein the step S140 includes: An AOI device is used to detect whether there is an appearance defect in the hot melt adhesive patch attached to the surface of the electronic component to be wrapped. A hot-melt adhesive package protection device for electronic components, used to realize the hot-melt adhesive package protection method for electronic components as described in claim 1, characterized in that the device includes a placement machine, an AOI equipment and a reflow Welding furnace; the placement machine is used to attach the hot melt adhesive patch to the surface of the electronic component to be wrapped in the target area; the AOI equipment is used to detect the surface of the electronic component to be wrapped Whether there is an appearance defect in the attached hot melt adhesive patch; The patch melts and wraps the electronic component to be wrapped.

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