CN111417269A - Printed circuit board paster processing technology - Google Patents
Printed circuit board paster processing technology Download PDFInfo
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- CN111417269A CN111417269A CN202010270788.3A CN202010270788A CN111417269A CN 111417269 A CN111417269 A CN 111417269A CN 202010270788 A CN202010270788 A CN 202010270788A CN 111417269 A CN111417269 A CN 111417269A
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- circuit board
- printed circuit
- solder paste
- treatment
- tinning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Abstract
The invention discloses a printed circuit board paster processing technology, which belongs to the technical field of printed circuit board processing and comprises a tinning treatment, a paster treatment, a reflow soldering treatment, a segmentation treatment and a waterproof treatment, wherein the tinning treatment is divided into a primary tinning treatment and a secondary tinning treatment, and the secondary tinning treatment is used for supplementing tin to an area with insufficient tin paste amount after the primary tinning treatment. In the printed circuit board paster processing technology, before the printed circuit board paster is processed, the circuit board needs to be subjected to tinning treatment, the tinning treatment comprises primary tinning treatment and secondary tinning treatment, and the secondary tinning treatment is used for supplementing tin to an area with insufficient tin paste amount after the primary tinning treatment, so that the tin paste amount of a welding area on the printed circuit board meets the welding requirement, and then the paster and reflow soldering treatment is carried out, so that the problems of insufficient soldering, short circuit and the like are avoided, and the reliability of the welding and paster processing of the printed circuit board is improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a printed circuit board paster processing technology.
Background
The circuit board is named as a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a PCB, an ultrathin circuit board, a printed copper etching technology circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
With the development of science and technology, components applied to printed circuit boards in various electronic products are smaller and smaller, and besides small-sized precise components, the printed circuit board also has components with larger sizes such as shielding frames, card seats and the like. The existing printed circuit board surface mounting process is mostly only used for one-time tin applying treatment, and because components of different sizes have different requirements on the amount of tin paste during welding, in order to achieve one-time synchronous reflow welding completion of the components of different sizes, a ladder steel mesh (different parts of the ladder steel mesh have different thicknesses) is usually used for tin applying, and different components on the printed circuit board correspond to different amounts of tin paste. However, because the size difference of each component is large, and the thickness of the ladder steel mesh has certain limitation, the ladder steel mesh cannot completely meet the welding requirements of the components with various sizes, and the problems of short circuit, insufficient soldering and the like can occur, so that the reliability of the welding of the printed circuit board is not strong.
Disclosure of Invention
1. Technical problem to be solved
In the printed circuit board paster processing technology, before the printed circuit board paster is processed, the circuit board needs to be subjected to tinning treatment, the tinning treatment comprises primary tinning treatment and secondary tinning treatment, and the secondary tinning treatment is used for supplementing tin to an area with insufficient tin paste amount after the primary tinning treatment, so that the tin paste amount of a welding area on the printed circuit board meets the welding requirement, and then the paster and reflow soldering treatment are carried out, so that the problems of insufficient soldering, short circuit and the like are avoided, and the reliability of the welding and paster processing of the printed circuit board is improved.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A printed circuit board patch processing technology comprises the following steps:
s1, performing tinning treatment on the area to be welded of the printed circuit board;
s2, carrying out surface mounting processing on each component to be welded of the printed circuit board;
s3, carrying out reflow soldering treatment on the printed circuit board after being pasted with the sheet;
s4, carrying out segmentation processing on the printed circuit board after the reflow soldering processing is finished;
and S5, performing waterproof treatment on the printed circuit board after the segmentation treatment is completed, and completing the whole processing technology.
Further, in S1, the tinning process is divided into a primary tinning process and a secondary tinning process, and the secondary tinning process is used to supplement the tin in the area where the amount of the tin paste is insufficient after the primary tinning process.
Further, the one-time tin coating treatment process comprises the following steps: taking a steel mesh and solder paste, adding the solder paste onto the steel mesh, installing the steel mesh added with the solder paste onto a solder paste printer, placing a printed circuit board to be printed with the solder paste into an upper plate machine, starting the solder paste printer, and printing the solder paste on the printed circuit board; wherein, the covering length of the solder paste on the steel mesh does not exceed the length of the scraper, but exceeds the length of the printed circuit board, and the thickness of the solder paste on the steel mesh is 15-25 mm.
Further, before the one-time tinning treatment, the method further comprises a solder paste pretreatment, wherein the solder paste pretreatment comprises the following steps: and taking out the solder paste from the refrigerated cabinet, returning the temperature of the solder paste to 4-6h at normal temperature, and stirring the solder paste by using a stirrer or a manual stirring mode until the solder paste is drawn to 8-10 cm.
Further, the secondary tinning treatment process comprises the following steps: the solder paste is applied to the soldering area of the printed circuit board with insufficient solder paste amount by hot melt application, wherein the volume of the solder paste is matched with the volume of the solder paste amount required to be supplemented, and the composition of the solder paste is the same as that of the solder paste used in one-time soldering treatment.
Further, in S3, the reflow soldering process specifically includes the following steps:
s31, selecting a corresponding welding method according to the type of the solder paste used in the tinning treatment;
s32, setting a furnace temperature curve of the reflow soldering furnace;
s33, adjusting the width of the track of the reflow soldering furnace according to the specification of the printed circuit board to be soldered, so that the width of the track of the reflow soldering furnace is wider than the width of the jig;
and S34, starting the reflow soldering furnace, and when the actual value of the temperature of the reflow soldering furnace is equal to the set value, placing the printed circuit board to be soldered on the track of the reflow soldering furnace, and performing reflow soldering on the printed circuit board to be soldered.
Further, in the step S33, the temperature increase rate of the reflow furnace is 2.5 ℃/S or less.
Further, in S4, the segmentation process specifically includes the following steps:
s41, opening the cutting jig, and placing the printed circuit board to be cut on the corresponding cutting jig in the correct direction;
s42, covering the upper cover of the cutting jig, and simultaneously pressing a left plate-in and a right plate-out button of the cutting machine;
s43, observing that the path of the dividing knife on the dividing jig is consistent with the path of the printed circuit board, clicking a dividing operation button to divide the printed circuit board;
and S44, blowing clean the printed circuit board which is completely divided.
Further, in S5, the waterproofing specifically includes the following steps:
s51, laying an EVA film, and pasting the EVA film on one surface or the front and back surfaces of the printed circuit board to enable the EVA film to cover one surface or the two surfaces of the printed circuit board;
s52, laying PET films, and laying PET films on the front and back surfaces of the printed circuit board on which the EVA films are already laid respectively to cover the two surfaces of the printed circuit board;
s53, melting and sealing, namely putting the printed circuit board with the EVA film and the PET film laid in a laminating machine, heating to melt the EVA film, ensuring that the working cavity is in a vacuum state for 5-7min, and then pressurizing the inside of the working cavity to enable the EVA film to cling to the surface of the printed circuit board and to be melted and sealed with the PET film;
and S54, curing, opening the chamber, cooling, curing the EVA film and the PET film, and finishing the waterproof treatment.
Further, in the step S53, the heating temperature in the working chamber is 130-150 ℃, the heating time is 10-15min, and the vacuum degree in the vacuum state is-100 KPa.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) in the printed circuit board paster processing technology, before the printed circuit board paster is processed, the circuit board needs to be subjected to tinning treatment, the tinning treatment comprises primary tinning treatment and secondary tinning treatment, and the secondary tinning treatment is used for supplementing tin to an area with insufficient tin paste amount after the primary tinning treatment, so that the tin paste amount of a welding area on the printed circuit board meets the welding requirement, and then the paster and reflow soldering treatment is carried out, so that the problems of insufficient soldering, short circuit and the like are avoided, and the reliability of the welding and paster processing of the printed circuit board is improved.
(2) In the printed circuit board paster processing technology, when the circuit board is subjected to one-time tinning treatment, the covering length of the tin paste on the steel mesh does not exceed the length of the scraper, but exceeds the length of the printed circuit board, and the thickness of the tin paste on the steel mesh is 15-25mm, so that the phenomenon of less tin on the printed circuit board can be effectively prevented when the tinning treatment is carried out, and the reliability of the whole technology is further improved.
(3) In the printed circuit board paster processing technology, when the printed circuit board is subjected to reflow soldering, the temperature rise speed of the reflow soldering furnace is controlled to be less than or equal to 2.5 ℃/S, so that the printed circuit board and the soldering components can be effectively prevented from being heated and deformed in the reflow soldering furnace, the production effect of the whole technology is ensured, and the generation of defective products is effectively reduced.
(4) In the printed circuit board paster processing technology, the EVA film layer and the PET film layer are utilized to carry out waterproof treatment on the printed circuit board at the end of the technology, the EVA film and the PET film are tightly attached to the printed circuit board, so that the sealing and waterproof effects are realized, the waterproof effect is good, the service life is long, in addition, the thickness of the printed circuit board after the waterproof treatment is carried out is not changed too much compared with the thickness of the printed circuit board without the waterproof treatment, and the normal use of the printed circuit board cannot be influenced.
(5) In the printed circuit board patch processing technology, when waterproof treatment is carried out, certain heating temperature and vacuum degree are controlled, so that the EVA film and the PET film can be tightly attached to the printed circuit board, and the technology is simple and convenient, low in cost, high in yield and high in efficiency.
Drawings
FIG. 1 is a process flow diagram of the present invention.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
Example 1:
referring to fig. 1, a printed circuit board mounting process includes the following steps:
and S1, performing tinning treatment on the area to be welded of the printed circuit board, wherein the tinning treatment is divided into primary tinning treatment and secondary tinning treatment, and the secondary tinning treatment is used for supplementing tin to the area with insufficient tin paste amount after the primary tinning treatment.
The process of one tinning treatment comprises the following steps: taking a steel mesh and solder paste, adding the solder paste onto the steel mesh, installing the steel mesh added with the solder paste onto a solder paste printer, placing a printed circuit board to be printed with the solder paste into an upper plate machine, starting the solder paste printer, and printing the solder paste on the printed circuit board; wherein, the covering length of the solder paste on the steel mesh does not exceed the length of the scraper, but exceeds the length of the printed circuit board, and the thickness of the solder paste on the steel mesh is 15-25 mm.
The method also comprises solder paste pretreatment before the primary tinning treatment, wherein the solder paste pretreatment process comprises the following steps: and taking out the solder paste from the refrigerated cabinet, returning the temperature of the solder paste to 4-6h at normal temperature, and stirring the solder paste by using a stirrer or a manual stirring mode until the solder paste is drawn to 8-10 cm.
The process of the secondary tinning treatment comprises the following steps: the solder paste is applied to the soldering area of the printed circuit board with insufficient solder paste amount by hot melt application, wherein the volume of the solder paste is matched with the volume of the solder paste amount required to be supplemented, and the composition of the solder paste is the same as that of the solder paste used in one-time soldering treatment.
And S2, performing surface mounting processing on each component to be welded of the printed circuit board.
S3, performing reflow soldering treatment on the printed circuit board after the chip mounting, which specifically comprises the following steps:
s31, selecting a corresponding welding method according to the type of the solder paste used in the tinning treatment;
s32, setting a furnace temperature curve of the reflow soldering furnace;
s33, adjusting the track width of the reflow soldering furnace according to the specification of the printed circuit board to be soldered, so that the track width of the reflow soldering furnace is wider than the width of the jig, and the temperature rise speed of the reflow soldering furnace is less than or equal to 2.5 ℃/S;
and S34, starting the reflow soldering furnace, and when the actual value of the temperature of the reflow soldering furnace is equal to the set value, placing the printed circuit board to be soldered on the track of the reflow soldering furnace, and performing reflow soldering on the printed circuit board to be soldered.
S4, the printed circuit board after the reflow soldering treatment is completed is divided, and the method specifically comprises the following steps:
s41, opening the cutting jig, and placing the printed circuit board to be cut on the corresponding cutting jig in the correct direction;
s42, covering the upper cover of the cutting jig, and simultaneously pressing a left plate-in and a right plate-out button of the cutting machine;
s43, observing that the path of the dividing knife on the dividing jig is consistent with the path of the printed circuit board, clicking a dividing operation button to divide the printed circuit board;
and S44, blowing clean the printed circuit board which is completely divided.
S5, performing waterproof treatment on the printed circuit board after the segmentation treatment, wherein the waterproof treatment specifically comprises the following steps:
s51, laying an EVA film, and pasting the EVA film on one surface or the front and back surfaces of the printed circuit board to enable the EVA film to cover one surface or the two surfaces of the printed circuit board;
s52, laying PET films, and laying PET films on the front and back surfaces of the printed circuit board on which the EVA films are already laid respectively to cover the two surfaces of the printed circuit board;
s53, melting and sealing, namely putting the printed circuit board with the EVA film and the PET film laid in a laminating machine, heating to melt the EVA film, ensuring that the working cavity is in a vacuum state for 5-7min, and then pressurizing the inside of the working cavity to enable the EVA film to cling to the surface of the printed circuit board and to be melted and sealed with the PET film; wherein, in S53, the heating temperature in the working chamber is 130-150 ℃, the heating time is 10-15min, and the vacuum degree in the vacuum state is-100 KPa.
And S54, curing, opening the chamber, cooling, curing the EVA film and the PET film, and finishing the waterproof treatment.
In the printed circuit board paster processing technology, before the printed circuit board paster is processed, the circuit board needs to be subjected to tinning treatment, the tinning treatment comprises primary tinning treatment and secondary tinning treatment, and the secondary tinning treatment is used for supplementing tin to an area with insufficient tin paste amount after the primary tinning treatment, so that the tin paste amount of a welding area on the printed circuit board meets the welding requirement, and then the paster and reflow soldering treatment is carried out, so that the problems of insufficient soldering, short circuit and the like are avoided, and the reliability of the welding and paster processing of the printed circuit board is improved.
In the printed circuit board paster processing technology, when the circuit board is subjected to one-time tinning treatment, the covering length of the tin paste on the steel mesh does not exceed the length of the scraper, but exceeds the length of the printed circuit board, and the thickness of the tin paste on the steel mesh is 15-25mm, so that the phenomenon of less tin on the printed circuit board can be effectively prevented when the tinning treatment is carried out, and the reliability of the whole technology is further improved.
In the printed circuit board paster processing technology, when the printed circuit board is subjected to reflow soldering, the temperature rise speed of the reflow soldering furnace is controlled to be less than or equal to 2.5 ℃/S, so that the printed circuit board and the soldering components can be effectively prevented from being heated and deformed in the reflow soldering furnace, the production effect of the whole technology is ensured, and the generation of defective products is effectively reduced.
In the printed circuit board paster processing technology, the EVA film layer and the PET film layer are utilized to carry out waterproof treatment on the printed circuit board at the end of the technology, the EVA film and the PET film are tightly attached to the printed circuit board, so that the sealing and waterproof effects are realized, the waterproof effect is good, the service life is long, in addition, the thickness of the printed circuit board after the waterproof treatment is carried out is not changed too much compared with the thickness of the printed circuit board without the waterproof treatment, and the normal use of the printed circuit board cannot be influenced.
In the printed circuit board patch processing technology, when waterproof treatment is carried out, certain heating temperature and vacuum degree are controlled, so that the EVA film and the PET film can be tightly attached to the printed circuit board, and the technology is simple and convenient, low in cost, high in yield and high in efficiency.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (10)
1. A printed circuit board paster processing technology is characterized in that: the method comprises the following steps:
s1, performing tinning treatment on the area to be welded of the printed circuit board;
s2, carrying out surface mounting processing on each component to be welded of the printed circuit board;
s3, carrying out reflow soldering treatment on the printed circuit board after being pasted with the sheet;
s4, carrying out segmentation processing on the printed circuit board after the reflow soldering processing is finished;
and S5, performing waterproof treatment on the printed circuit board after the segmentation treatment is completed, and completing the whole processing technology.
2. A printed circuit board patch processing technology according to claim 1, characterized in that: in S1, the tinning process is divided into a primary tinning process and a secondary tinning process, and the secondary tinning process is used to supplement tin in an area where the amount of the solder paste is insufficient after the primary tinning process.
3. A printed circuit board patch processing technology according to claim 2, characterized in that: the one-time tin coating treatment process comprises the following steps: taking a steel mesh and solder paste, adding the solder paste onto the steel mesh, installing the steel mesh added with the solder paste onto a solder paste printer, placing a printed circuit board to be printed with the solder paste into an upper plate machine, starting the solder paste printer, and printing the solder paste on the printed circuit board; wherein, the covering length of the solder paste on the steel mesh does not exceed the length of the scraper, but exceeds the length of the printed circuit board, and the thickness of the solder paste on the steel mesh is 15-25 mm.
4. A printed circuit board patch processing technology according to claim 3, characterized in that: the method also comprises solder paste pretreatment before the primary tinning treatment, wherein the solder paste pretreatment process comprises the following steps: and taking out the solder paste from the refrigerated cabinet, returning the temperature of the solder paste to 4-6h at normal temperature, and stirring the solder paste by using a stirrer or a manual stirring mode until the solder paste is drawn to 8-10 cm.
5. A printed circuit board patch processing technology according to claim 2, characterized in that: the secondary tin coating treatment process comprises the following steps: the solder paste is applied to the soldering area of the printed circuit board with insufficient solder paste amount by hot melt application, wherein the volume of the solder paste is matched with the volume of the solder paste amount required to be supplemented, and the composition of the solder paste is the same as that of the solder paste used in one-time soldering treatment.
6. A printed circuit board patch processing technology according to claim 1, characterized in that: in S3, the reflow soldering process specifically includes the steps of:
s31, selecting a corresponding welding method according to the type of the solder paste used in the tinning treatment;
s32, setting a furnace temperature curve of the reflow soldering furnace;
s33, adjusting the width of the track of the reflow soldering furnace according to the specification of the printed circuit board to be soldered, so that the width of the track of the reflow soldering furnace is wider than the width of the jig;
and S34, starting the reflow soldering furnace, and when the actual value of the temperature of the reflow soldering furnace is equal to the set value, placing the printed circuit board to be soldered on the track of the reflow soldering furnace, and performing reflow soldering on the printed circuit board to be soldered.
7. A printed circuit board patch processing technology according to claim 6, characterized in that: in S33, the temperature rise rate of the reflow soldering furnace is less than or equal to 2.5 ℃/S.
8. A printed circuit board patch processing technology according to claim 1, characterized in that: in S4, the segmentation process specifically includes the following steps:
s41, opening the cutting jig, and placing the printed circuit board to be cut on the corresponding cutting jig in the correct direction;
s42, covering the upper cover of the cutting jig, and simultaneously pressing a left plate-in and a right plate-out button of the cutting machine;
s43, observing that the path of the dividing knife on the dividing jig is consistent with the path of the printed circuit board, clicking a dividing operation button to divide the printed circuit board;
and S44, blowing clean the printed circuit board which is completely divided.
9. A printed circuit board patch processing technology according to claim 1, characterized in that: in S5, the waterproofing specifically includes the steps of:
s51, laying an EVA film, and pasting the EVA film on one surface or the front and back surfaces of the printed circuit board to enable the EVA film to cover one surface or the two surfaces of the printed circuit board;
s52, laying PET films, and laying PET films on the front and back surfaces of the printed circuit board on which the EVA films are already laid respectively to cover the two surfaces of the printed circuit board;
s53, melting and sealing, namely putting the printed circuit board with the EVA film and the PET film laid in a laminating machine, heating to melt the EVA film, ensuring that the working cavity is in a vacuum state for 5-7min, and then pressurizing the inside of the working cavity to enable the EVA film to cling to the surface of the printed circuit board and to be melted and sealed with the PET film;
and S54, curing, opening the chamber, cooling, curing the EVA film and the PET film, and finishing the waterproof treatment.
10. A printed circuit board patch processing technology according to claim 9, wherein: in the step S53, the heating temperature in the working chamber is 130-150 ℃, the heating time is 10-15min, and the vacuum degree in the vacuum state is-100 KPa.
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| CN202010270788.3A CN111417269A (en) | 2020-04-08 | 2020-04-08 | Printed circuit board paster processing technology |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975151A (en) * | 2020-07-29 | 2020-11-24 | 苏州浪潮智能科技有限公司 | Backboard through hole welding method based on gold needle |
| CN113695695A (en) * | 2021-09-27 | 2021-11-26 | 东莞市大为新材料技术有限公司 | Method for soldering tin paste for semiconductor chip |
| TWI785822B (en) * | 2021-08-06 | 2022-12-01 | 大陸商環維電子(上海)有限公司 | Hot melt adhesive wrapping protection method and device for electronic components |
| CN115635155A (en) * | 2022-10-20 | 2023-01-24 | 安徽钜芯半导体科技有限公司 | Processing technology of heat sink conducting strip of power device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104647844A (en) * | 2015-01-27 | 2015-05-27 | 中山市索伦太阳能光电有限公司 | Laminated waterproof circuit board and manufacturing method thereof |
| CN104780720A (en) * | 2015-04-20 | 2015-07-15 | 四川盟宝实业有限公司 | Circuit board manufacturing process based on SMT technology |
| CN105979719A (en) * | 2016-06-20 | 2016-09-28 | 努比亚技术有限公司 | Welding method for printed circuit board |
| CN109310012A (en) * | 2018-07-19 | 2019-02-05 | 广州市建筑科学研究院有限公司 | A kind of steel mesh and the manual reflow soldering method using the steel mesh |
-
2020
- 2020-04-08 CN CN202010270788.3A patent/CN111417269A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104647844A (en) * | 2015-01-27 | 2015-05-27 | 中山市索伦太阳能光电有限公司 | Laminated waterproof circuit board and manufacturing method thereof |
| CN104780720A (en) * | 2015-04-20 | 2015-07-15 | 四川盟宝实业有限公司 | Circuit board manufacturing process based on SMT technology |
| CN105979719A (en) * | 2016-06-20 | 2016-09-28 | 努比亚技术有限公司 | Welding method for printed circuit board |
| CN109310012A (en) * | 2018-07-19 | 2019-02-05 | 广州市建筑科学研究院有限公司 | A kind of steel mesh and the manual reflow soldering method using the steel mesh |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975151A (en) * | 2020-07-29 | 2020-11-24 | 苏州浪潮智能科技有限公司 | Backboard through hole welding method based on gold needle |
| TWI785822B (en) * | 2021-08-06 | 2022-12-01 | 大陸商環維電子(上海)有限公司 | Hot melt adhesive wrapping protection method and device for electronic components |
| CN113695695A (en) * | 2021-09-27 | 2021-11-26 | 东莞市大为新材料技术有限公司 | Method for soldering tin paste for semiconductor chip |
| CN115635155A (en) * | 2022-10-20 | 2023-01-24 | 安徽钜芯半导体科技有限公司 | Processing technology of heat sink conducting strip of power device |
| CN115635155B (en) * | 2022-10-20 | 2023-05-05 | 安徽钜芯半导体科技有限公司 | Processing technology of heat sink conducting strip of power device |
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