CN114340183A - Circuit board processing technology and circuit board prepared by same - Google Patents
Circuit board processing technology and circuit board prepared by same Download PDFInfo
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- CN114340183A CN114340183A CN202111188798.3A CN202111188798A CN114340183A CN 114340183 A CN114340183 A CN 114340183A CN 202111188798 A CN202111188798 A CN 202111188798A CN 114340183 A CN114340183 A CN 114340183A
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- circuit board
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- reinforcing plate
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Abstract
The invention discloses a circuit board processing technology and a circuit board prepared by the same, which reduce pollution by simplifying the flow and improving the copper-clad process, and improve the bending resistance and deformation resistance of the circuit board (substrate) in the processing process by a reinforcing plate, so that the whole technology is reliable and reasonable. The processing technology disclosed by the invention comprises the following steps: (1) cutting a substrate: cutting the substrate, edging, drilling, cleaning and drying the substrate; (2) pasting a reinforcing plate: adhering a reinforcing plate on the back surface of the substrate, wherein the area of the reinforcing plate is at least 85% of the area of the back surface of the substrate, and the peel strength between the substrate and the reinforcing plate is more than 35.0gf/mm at 80-170 ℃; (3) screen printing; (4) cleaning the circuit board; (5) drilling; (6) secondarily cleaning the circuit board; (7) matching; (8) processing a finished product; (9) and (5) removing the reinforcing plate from the back of the circuit board obtained in the step (8) to obtain a finished product.
Description
Technical Field
The invention relates to a circuit board processing technology, which is particularly used for preparing a circuit board.
Background
A PCB is a product for providing mechanical support for fixing and assembling various electronic components such as an integrated circuit, realizing wiring, electrical connection, or electrical insulation between various electronic components such as an integrated circuit, and providing desired electrical characteristics (such as characteristic impedance).
In the existing circuit board preparation process, complex equipment, processes and a large number of workers are needed, such as chemical copper, electrolytic copper plating, dust-free room wet dry film pressing, alignment, exposure and development, etching and the like, and the equipment is high in cost, difficult to maintain, long in process flow, high in capital, time and labor cost, wherein chemical agents are needed for chemical copper, electrolytic copper plating, development, etching and the like, so that the environment is polluted, and the body health of the workers during working is damaged;
in addition, as people pursue flat and ultra-thin electronic products, the existing circuit board is thinner and thinner, so that the bending resistance and the deformation resistance in the processing process are poor, and the yield is reduced; some prior arts adopt a release film with toughness adhered during the processing to increase the deformation resistance, but we find in the actual production that the deformation resistance of the release film is still relatively limited, especially under the prior art that the thickness of the circuit board is required to be further reduced along with the requirement of the circuit board.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a circuit board processing technology and a circuit board prepared by the same, aiming at the defects in the prior art, the pollution is reduced by simplifying the flow and improving the copper-clad process, and the bending resistance and deformation resistance of the circuit board (substrate) in the processing process are improved by a reinforcing plate, so that the whole technology is reliable and reasonable.
In order to achieve the purpose, the processing technology disclosed by the invention adopts the following technical scheme:
a circuit board processing technology comprises the following steps:
(1) cutting a substrate: cutting the substrate, edging, drilling, cleaning and drying the substrate;
(2) pasting a reinforcing plate: adhering a reinforcing plate on the back surface of the substrate, wherein the area of the reinforcing plate is at least 85% of the area of the back surface of the substrate, and the peel strength between the substrate and the reinforcing plate is more than 35.0gf/mm at 80-170 ℃;
(3) screen printing: and screen-printing copper paste on the front surface of the substrate according to a preset circuit pattern, baking and pasting a film to obtain the circuit board, wherein the copper paste comprises the following components in percentage by weight:
70-90% of copper particles;
9-30% of a propagation medium;
0.1-1% of an additive;
(4) cleaning the circuit board: corroding the redundant copper sheets which are not covered by the copper paste in the step (3);
(5) drilling: drilling a printing positioning hole and a punching positioning hole on the substrate to be used as a reference hole for printing;
(6) secondary cleaning of the circuit board: polishing and cleaning the circuit board and drying the circuit board by hot air;
(7) matching: matching the reference hole with a printed picture which is made in advance, and judging whether the reference hole and the printed picture can be overlapped;
(8) and (3) finished product treatment: printing solder resist ink on the separation groove on the circuit board, and polishing, cleaning and drying the solder resist ink;
(9) and (5) removing the reinforcing plate from the back of the circuit board obtained in the step (8) to obtain a finished product.
As a preferred embodiment of the processing technology disclosed by the invention: the step (3) adopts a screen printer to perform screen printing, and the mesh number of the screen is in the range of 36T-51T; the tension range of the silk screen is 22N-88N; the included angle between the scraper and the silk screen of the silk screen printing machine is 10-25 degrees; the running pressure of the scraper is within the range of 1.5kg/cm 2-3 kg/cm 2.
As a preferred embodiment of the processing technology disclosed by the invention: the reinforcing plate is adhered to the back surface of the substrate through an adhesive layer, and the coating thickness of the adhesive layer is at least 20 micrometers; the continuous bonding time T of the bonding layer is more than or equal to 1 hour under the environment of 1kg/150 ℃.
As a preferred embodiment of the processing technology disclosed by the invention: in the step (9), specifically, the reinforcing plate is removed by peeling the reinforcing plate from the back surface of the circuit board after continuously cooling for 4 hours.
As a preferred embodiment of the processing technology disclosed by the invention: the reinforcing plate is a steel sheet, and the thickness of the reinforcing plate is more than or equal to 0.1mm and less than or equal to 0.2 mm.
As a preferred embodiment of the processing technology disclosed by the invention: in the step (7), if the reference hole and the picture are not overlapped, the step is shifted to overlap or cut off redundant parts.
A circuit board is prepared by any one of the circuit board processing technologies.
The invention has the beneficial effects that:
according to the processing technology of the circuit board and the circuit board prepared by the processing technology, the copper paste is printed on the substrate through screen printing to obtain the circuit board, so that the steps of curing, developing, etching and the like in the existing preparation technology are omitted, equipment, raw materials and manual use amount are saved, the production cost is greatly reduced, and meanwhile, the phenomena of dust falling and falling of the printed circuit board are avoided by selecting the specific copper paste; according to the invention, by controlling the ratio of the overlapping area of the reinforcing plate and the processed circuit board, the gluing amount is reduced, the subsequent stripping area is reduced and the stripping difficulty of the reinforcing plate is reduced on the premise of ensuring that the deformation of the circuit board in the processing process is smaller than the rated tolerance. According to the method of the present invention, when the area of the reinforcing plate is at least 85% of the area of the circuit board, and at the same time, the peel strength between the first surface and the reinforcing plate is greater than 35.0gf/mm at 80-170 ℃, the deformation of the circuit board generated in the processing process can be effectively controlled. The area ratio of the reinforcing plate to the processed circuit board is effectively controlled, the circuit board can be prevented from deforming in the reflow soldering process, the area of the reinforcing plate can be reduced, and then the stripping workload and the stripping difficulty of the reinforcing plate are simplified and reduced.
Detailed Description
The present invention is further illustrated by the following examples, which are intended to be illustrative, not limiting and are not intended to limit the scope of the invention.
The invention discloses a circuit board processing technology, which comprises the following steps:
(1) cutting a substrate: cutting the substrate, edging, drilling, cleaning and drying the substrate;
(2) pasting a reinforcing plate: adhering a reinforcing plate on the back surface of the substrate, wherein the area of the reinforcing plate is at least 85% of the area of the back surface of the substrate, and the peel strength between the substrate and the reinforcing plate is more than 35.0gf/mm at 80-170 ℃;
(3) screen printing: and screen-printing copper paste on the front surface of the substrate according to a preset circuit pattern, baking and pasting a film to obtain the circuit board, wherein the copper paste comprises the following components in percentage by weight:
70-90% of copper particles;
9-30% of a propagation medium;
0.1-1% of an additive;
(4) cleaning the circuit board: corroding the redundant copper sheets which are not covered by the copper paste in the step (3);
(5) drilling: drilling a printing positioning hole and a punching positioning hole on the substrate to be used as a reference hole for printing;
(6) secondary cleaning of the circuit board: polishing and cleaning the circuit board and drying the circuit board by hot air;
(7) matching: matching the reference hole with a printed picture which is made in advance, and judging whether the reference hole and the printed picture can be overlapped;
(8) and (3) finished product treatment: printing solder resist ink on the separation groove on the circuit board, and polishing, cleaning and drying the solder resist ink;
(9) and (5) removing the reinforcing plate from the back of the circuit board obtained in the step (8) to obtain a finished product.
In some preferred embodiments: the step (3) adopts a screen printer to perform screen printing, and the mesh number of the screen is in the range of 36T-51T; the tension range of the silk screen is 22N-88N; the included angle between the scraper and the silk screen of the silk screen printing machine is 10-25 degrees; the running pressure of the scraper is within the range of 1.5kg/cm 2-3 kg/cm 2. This example discloses specific screen printing parameters that can be controlled to achieve optimal results when screen printing copper pastes.
In some preferred embodiments: the reinforcing plate is adhered to the back surface of the substrate through an adhesive layer, and the coating thickness of the adhesive layer is at least 20 micrometers; the continuous bonding time T of the bonding layer is more than or equal to 1 hour under the environment of 1kg/150 ℃. The structure and the bonding method of the specific bonding layer are further disclosed privately, so that the bonding layer can be conveniently stripped in the subsequent process under the condition that the reliable reinforcing effect of the reinforcing plate is ensured.
In some preferred embodiments: in the step (9), specifically, the reinforcing plate is removed by peeling the reinforcing plate from the back surface of the circuit board after continuously cooling for 4 hours. The mode of this embodiment is peeled off the effect better, can not cause the damage to the circuit board base plate.
In some preferred embodiments: the reinforcing plate is a steel sheet, and the thickness of the reinforcing plate is more than or equal to 0.1mm and less than or equal to 0.2 mm.
In some preferred embodiments: in the step (7), if the reference hole and the picture are not overlapped, the step is shifted to overlap or cut off redundant parts. The function of the basic processing technology is perfected, so that the whole technology is more reasonable and concise, manpower and material resources are saved, the cost is reduced, and the reliability is improved.
The invention also discloses a circuit board which is prepared by any one of the circuit board processing technologies. In the embodiment, the circuit board has the advantages of low cost, high preparation efficiency, more reliable structure and high preparation yield caused by a processing technology.
While the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and various changes, which relate to the related art known to those skilled in the art and fall within the protection scope of the present invention, can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Many other changes and modifications can be made without departing from the spirit and scope of the invention. It is to be understood that the invention is not to be limited to the specific embodiments, but only by the scope of the appended claims.
Claims (7)
1. A circuit board processing technology is characterized by comprising the following steps:
(1) cutting a substrate: cutting the substrate, edging, drilling, cleaning and drying the substrate;
(2) pasting a reinforcing plate: adhering a reinforcing plate on the back surface of the substrate, wherein the area of the reinforcing plate is at least 85% of the area of the back surface of the substrate, and the peel strength between the substrate and the reinforcing plate is more than 35.0gf/mm at 80-170 ℃;
(3) screen printing: and screen-printing copper paste on the front surface of the substrate according to a preset circuit pattern, baking and pasting a film to obtain the circuit board, wherein the copper paste comprises the following components in percentage by weight:
70-90% of copper particles;
9-30% of a propagation medium;
0.1-1% of an additive;
(4) cleaning the circuit board: corroding the redundant copper sheets which are not covered by the copper paste in the step (3);
(5) drilling: drilling a printing positioning hole and a punching positioning hole on the substrate to be used as a reference hole for printing;
(6) secondary cleaning of the circuit board: polishing and cleaning the circuit board and drying the circuit board by hot air;
(7) matching: matching the reference hole with a printed picture which is made in advance, and judging whether the reference hole and the printed picture can be overlapped;
(8) and (3) finished product treatment: printing solder resist ink on the separation groove on the circuit board, and polishing, cleaning and drying the solder resist ink;
(9) and (5) removing the reinforcing plate from the back of the circuit board obtained in the step (8) to obtain a finished product.
2. The circuit board processing technology of claim 1, wherein: the step (3) adopts a screen printer to perform screen printing, and the mesh number of the screen is in the range of 36T-51T; the tension range of the silk screen is 22N-88N; the included angle between the scraper and the silk screen of the silk screen printing machine is 10-25 degrees; the running pressure of the scraper is within the range of 1.5kg/cm 2-3 kg/cm 2.
3. The process for manufacturing a wiring board according to claim 1, wherein the reinforcing plate is adhered to the back surface of the substrate by an adhesive layer, and the thickness of the adhesive layer is at least 20 μm; the continuous bonding time T of the bonding layer is more than or equal to 1 hour under the environment of 1kg/150 ℃.
4. The process for manufacturing a circuit board according to claim 1, wherein in the step (9), the specific removal of the stiffener is to peel the stiffener from the back surface of the circuit board after continuously cooling for 4 hours.
5. The processing technology of the circuit board according to claim 1, wherein the stiffening plate is a steel sheet with a thickness of 0.1mm and H of 0.2 mm.
6. A circuit board processing technology according to claim 1, wherein in the step (7), if the reference hole and the picture are not overlapped, the step moves to overlap or cut off the redundant part.
7. A wiring board produced by the wiring board processing process as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111188798.3A CN114340183A (en) | 2021-10-12 | 2021-10-12 | Circuit board processing technology and circuit board prepared by same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111188798.3A CN114340183A (en) | 2021-10-12 | 2021-10-12 | Circuit board processing technology and circuit board prepared by same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114340183A true CN114340183A (en) | 2022-04-12 |
Family
ID=81045051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111188798.3A Withdrawn CN114340183A (en) | 2021-10-12 | 2021-10-12 | Circuit board processing technology and circuit board prepared by same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114340183A (en) |
-
2021
- 2021-10-12 CN CN202111188798.3A patent/CN114340183A/en not_active Withdrawn
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Application publication date: 20220412 |