CN103203969A - A three-dimensional mask plate and a production process thereof - Google Patents
A three-dimensional mask plate and a production process thereof Download PDFInfo
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- CN103203969A CN103203969A CN2012100107531A CN201210010753A CN103203969A CN 103203969 A CN103203969 A CN 103203969A CN 2012100107531 A CN2012100107531 A CN 2012100107531A CN 201210010753 A CN201210010753 A CN 201210010753A CN 103203969 A CN103203969 A CN 103203969A
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- mask plate
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Abstract
The present invention discloses a three-dimensional mask plate characterized by having double layers of three-dimensional structures, i.e. a printing surface has a convex area with a structure formed by a three-dimensional core mold, and a PCB surface has a three-dimensional structural concave area. The production process for the three-dimensional mask plate comprises the following steps of: core mold pre-treatment (degreasing, pickling, and blasting) -> film mounting -> exposure -> developing -> electroforming -> film stripping -> double sided film mounting -> double sided exposure -> double sided developing -> double sided etching -> mold stripping. By using the process to produce mask plates, useless products and masks caused by huge deviations of a position precision and a size precision and mask deformation during the course of transferring solder paste to the convex and concave positions can be effectively reduced; while the mask plate obtained by using the process has high surface quality, smooth pattern openings, no blurs or deformation, and high brightness and low surface roughness. Additionally, the production process of the invention has simple steps, convenient operation, high processing efficiency, and low production cost, thus being accordance with economic benefit principles, and conductive to large-scale production and promotion.
Description
Technical field
The present invention relates to a kind of 3 D stereo mask plate and preparation technology thereof for printed circuit board (PCB), belong to the material preparation and make the field with part, specifically, relate to a kind of for printed circuit board (PCB) have a single face projection, have 3 D stereo mask plate and the preparation technology thereof of intricate detail on it.
Background technology
Surface mounting technology, be the abbreviation of SMT(Surface Mounted Technology), be that electronic component is positioned over printed circuit board surface, the pad that uses scolding tin to connect the pin of electronic component and printed circuit board (PCB) then metallizes and becomes a kind of technology of one.
Surface mounting technology stems from the device fabrication in the military electronics of the sixties U.S. and aviation electronics field.Early stage because this technology is still immature and with high costs, so only be applied to only a few manufacturers such as Boeing Co. and Hughes Electronics, its development has been subjected to very big restriction.Yet up to late nineteen seventies, popularization and the universal possibility that provides of surface mounting technology is provided the high speed development of high-density printed circuit board and large scale integrated circuit technology.So surface mounting technology enters consumer and the info class product scope because its incomparable advantage has replaced traditional Through-Hole Technology rapidly.At present light popular notebook computer, mobile phone etc., none does not have benefited from this.
The technological process of SMT technology comprises: printing (or some glue)--〉mounts--〉(curing)--〉reflow soldering--〉and cleans--〉detect, wherein Yin Shua effect is that soldering paste or Heraeus are bitten on the pad of PCB, for the welding of components and parts is prepared.Device therefor is printing machine, is positioned at the SMT production line foremost.As the first step of SMT technology, its effect is most important.And along with the variation in market, trend complicated, three-dimensional highlight day by day, product develops into curved surface, height table top gradually by single plane of past, and with hollow out or convex design.Therefore, traditional plane serigraphy can not have been satisfied the demand of existing market.In the prior art, often adopt the mode of bat printing for nonplanar printing, but there is printing in bat printing mode problems such as effective area is little, printing effect difference, and therefore, traditional bat printing mode can not satisfy now the requirement to the special-shaped product serigraphy.And the mask that uses two dimension matrix surface relief region edge's mask open accurately contraposition owing to can't closely contact with substrate when shifting causes the transfer of shifting or misplace of the deviation of material for transfer.
Summary of the invention
The objective of the invention is to address the above problem, based on above polytechnic limitation, propose a kind of instrument---3 D stereo mask plate and preparation technology thereof who is fit to carry out the three-dimensional space of a whole page printing of convex design and Pattern Design in the patent of the present invention.This mask plate can effectively be reduced in and carry out to printed panel convex-concave position in the soldering paste transfer process causing scrapping of product and mask owing to the very large deviation of positional precision and dimensional accuracy and the distortion of mask; Simultaneously, the mask plate that this technology obtains has great surface quality, and the figure opening is level and smooth, and no burr, distortion have high brightness and low surface roughness.
A kind of 3 D stereo mask plate is characterized in that mask plate has double-decker, and namely printing surface is made of the 3 D stereo core, and PCB face close attachment is one deck electroformed layer of 3 D stereo mandrel surface electroforming on printing surface.
Preferably, the thickness of 3 D stereo core mold plate is 1.8mm, and the thickness of electroformed layer is 0.025mm.
The preparation technology of above-mentioned 3 D stereo mask plate comprises the steps:
Core pre-treatment (oil removing, pickling, sandblast) → pad pasting → exposure → development → electroforming → peel off → two-sided pad pasting → double-sided exposure → two-sided development → two-sided etching → demoulding
Specifically, the step of preparation process of 3 D stereo mask plate is as follows:
(1) core pre-treatment: choose the thick corrosion resistant plate of 1.8mm as the core material, core is cut into the size of 800mm*600mm, with core oil removing, pickling, sandblast, removing the oil stain impurity on surface, and surface finish is smooth;
(2) pad pasting: the single face of core carries out pad pasting;
(3) exposure: the single face of core is exposed, be about to the open area exposure on the electroformed layer;
(4) develop: the unexposed portion in the step (3) is developed remove, stay the part of exposure to make the diaphragm of follow-up electroforming step, form the mask plate electroformed layer at core;
(5) electroforming: metal material in electro-deposition on the core, the electroformed layer substrate of formation 3 D stereo mask plate;
(6) peel off: mask plate is peeled off from core;
(7) two-sided pad pasting: the two-sided pad pasting of mask plate electroformed layer;
(8) double-sided exposure: will expose behind the two-sided pad pasting of mask plate electroformed layer, namely in the zone of printing surface exposure except elevated regions, at PCB face exposure sunk area;
(9) two-sided development: the development of the unexposed portion in the step (8) is removed, stay the black part of exposing to the sun to make the diaphragm of follow-up electroforming step, in order to forming the mask plate electroformed layer at core;
(10) two-sided etching: etching area is the unexposed area of two-sided development, can form the 3 D stereo mask plate of thickness homogeneous after the etching;
(11) demoulding.
The technological parameter of preferably, oil removing, pickling, sandblast is:
| The oil removing time | 1-2min |
| The pickling time | 1-2min |
| The sandblast time | 1-2min |
Preferably, the technological parameter of exposure and development is:
| Stainless steel-based board size (mm) | 800*600*1.8 |
| Light exposure (mj) | 80-300 |
| Time for exposure (s) | 180-480 |
| Developing time (s) | 120-240 |
Preferably, the technological parameter of electroforming is:
Preferably, etched technological parameter is:
| The etching solution temperature (℃) | 50 |
| Etching solution expulsion pressure (psi) | 14 |
| Etching period (min) | 40-80 |
Use the present invention to carry out the preparation of 3 D stereo mask plate, make that can accurately carry out soldering paste shifts to printed panel convex-concave position, and mask can not be out of shape; Simultaneously, the mask plate that this technology obtains has great surface quality, and the figure opening is level and smooth, and no burr, distortion have high brightness and low surface roughness.
In addition, step of preparation process of the present invention is simple, the working (machining) efficiency height, and production cost is low, meets principle of economic benefit.Because it is also very simple to obtain the method for matrix of the present invention, easy operating has reduced manufacturing cost, and is economical and practical, is beneficial to large-scale production and popularization.
Description of drawings
Fig. 1 two-dimensional mask sheet material material shifts diagram:
The 1-scraper
The 2-material for transfer
The 3-pcb board
Elevated regions on the 4-pcb board
5-two-dimensional mask plate
Figure opening on the 6-two-dimensional mask plate
7-soldering copper platform
The printing surface of 8-mask plate
The PCB face of 9-mask plate
Fig. 23 D stereo mask plate material transfer diagram:
The 1-scraper
The 2-material for transfer
The 3-pcb board
Elevated regions on the 4-pcb board
5-two-dimensional mask plate
The printing surface of 6-mask plate
The PCB face of 7-mask plate
The 3-D solid structure of 8-mask plate
Fig. 3 mask plate 3 D stereo area schematic:
8-mask plate printing surface
9-mask plate PCB face
11-mask plate printing surface elevated regions
The spill of 22-mask plate PCB face
Fig. 4 mask plate schematic diagram:
The figure opening of 111-mask plate 2 dimensional region
The 5-mask plate
3-D solid structure on the 10-mask plate
The specific embodiment
Following examples are used for explanation the present invention, but are not used for limiting the scope of the invention.
Embodiment 1
Among a kind of embodiment of the present invention, a kind of parameter of pre-treating technology of preferred core is as follows:
| The oil removing time | 1.5min |
| The pickling time | 1.5min |
| The sandblast time | 1.5min |
Embodiment 2
Among a kind of embodiment of the present invention, a kind of preferred technological parameter of exposure imaging step is as follows:
| Light exposure (mj) | 120 |
| Time for exposure (s) | 240 |
| Developing time (s) | 120 |
Among a kind of embodiment of the present invention, a kind of preferred technological parameter of electroforming step is as follows:
Embodiment 4
Among a kind of embodiment of the present invention, a kind of preferred technological parameter of etching step is as follows:
| The etching solution temperature (℃) | 50 |
| Etching solution expulsion pressure (psi) | 14 |
| Etching period (min) | 40-80 |
Though above the present invention is described in detail with a general description of the specific embodiments, on basis of the present invention, can make some modifications or improvements it, this will be apparent to those skilled in the art.Therefore, these modifications or improvements all belong to the scope of protection of present invention without departing from theon the basis of the spirit of the present invention.
Claims (8)
1. a 3 D stereo mask plate is characterized in that, mask plate has the double-decker 3-D solid structure, and namely printing surface constitutes the elevated regions of structure by having the 3 D stereo core, and the PCB mask has the sunk area of 3-D solid structure.
2. according to the described 3 D stereo mask plate of claim 1, it is characterized in that the preparation technology of described 3 D stereo mask plate comprises the steps:
Core pre-treatment (oil removing, pickling, sandblast) → pad pasting → exposure → development → electroforming → peel off → two-sided pad pasting → double-sided exposure → two-sided development → two-sided etching → demoulding.
3. according to claim 1 and 2 described pre-treating technology steps, it is characterized in that the technological parameter of oil removing, pickling, sandblast is as follows:
。
4. according to the preparation technology of claim 1 and 2 described 3 D stereo mask plates, it is characterized in that, two-sided development is will etched zone, being about to the two-sided of electroforming mask plate develops, the concave regions dry film in the 3 D stereo zone of the one side (PCB face) of the electroformed layer under being about to peel off on the core develops and removes, and the exposure of the convex region dry film in the 3 D stereo zone of corresponding reverse side (printing surface) keeps therewith, so that the core electroformed layer is etched into the mask plate with 3 D stereo zone of thickness homogeneous.
5. according to the preparation technology of claim 1 and 2 described 3 D stereo mask plates, it is characterized in that exposure and the technological parameter that develops are as follows:
。
6. according to the preparation technology of claim 1 and 2 described 3 D stereo mask plates, it is characterized in that two-sided etching area is the unexposed area of two-sided development, can form the 3 D stereo mask plate of thickness homogeneous after the etching.
7. according to the preparation technology of claim 1 and 2 described 3 D stereo mask plates, it is characterized in that the electroforming step is the deposit metallic material that powers at core, form the cast layer substrate of 3 D stereo mask plate.
8. according to the preparation technology of claim 1 and 2 described 3 D stereo mask plates, it is characterized in that the technological parameter of electroforming is:
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010753.1A CN103203969B (en) | 2012-01-16 | 2012-01-16 | A kind of Three-dimensional mask plate and its preparation technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010753.1A CN103203969B (en) | 2012-01-16 | 2012-01-16 | A kind of Three-dimensional mask plate and its preparation technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203969A true CN103203969A (en) | 2013-07-17 |
| CN103203969B CN103203969B (en) | 2017-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010753.1A Expired - Fee Related CN103203969B (en) | 2012-01-16 | 2012-01-16 | A kind of Three-dimensional mask plate and its preparation technology |
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| Country | Link |
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| CN (1) | CN103203969B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109733051A (en) * | 2019-02-20 | 2019-05-10 | 安徽地势坤光电科技有限公司 | A kind of method for platemaking and forme-producing system without net netting version |
| CN113246597A (en) * | 2021-04-08 | 2021-08-13 | 昆山乐邦精密科技有限公司 | 3D structure composite screen printing plate and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2307446A (en) * | 1995-11-25 | 1997-05-28 | Ibm | Solder paste deposition |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| CN201703016U (en) * | 2010-05-24 | 2011-01-12 | 彰绅精密工业股份有限公司 | Multilayer metal printing template |
| CN201824658U (en) * | 2009-06-09 | 2011-05-11 | Nb科技股份有限公司 | Silk screen forme |
| CN103207515A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A three-dimensional mask plate and a production process thereof |
-
2012
- 2012-01-16 CN CN201210010753.1A patent/CN103203969B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2307446A (en) * | 1995-11-25 | 1997-05-28 | Ibm | Solder paste deposition |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| CN201824658U (en) * | 2009-06-09 | 2011-05-11 | Nb科技股份有限公司 | Silk screen forme |
| CN201703016U (en) * | 2010-05-24 | 2011-01-12 | 彰绅精密工业股份有限公司 | Multilayer metal printing template |
| CN103207515A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A three-dimensional mask plate and a production process thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109733051A (en) * | 2019-02-20 | 2019-05-10 | 安徽地势坤光电科技有限公司 | A kind of method for platemaking and forme-producing system without net netting version |
| CN113246597A (en) * | 2021-04-08 | 2021-08-13 | 昆山乐邦精密科技有限公司 | 3D structure composite screen printing plate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103203969B (en) | 2017-04-05 |
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