CN103203952B - A kind of processing technology of stepped formwork - Google Patents
A kind of processing technology of stepped formwork Download PDFInfo
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- CN103203952B CN103203952B CN201210010724.5A CN201210010724A CN103203952B CN 103203952 B CN103203952 B CN 103203952B CN 201210010724 A CN201210010724 A CN 201210010724A CN 103203952 B CN103203952 B CN 103203952B
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- processing technology
- stepped
- stepped formwork
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- formwork
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Abstract
A kind of processing technology of stepped formwork.The technological process of this kind of processing technology is as follows: processing substrate (cutting) → pre-treatment (oil removing, pickling, sandblasting) → pad pasting → double-sided exposure → two-sided development → etching (printing surface has raised step (up step)) → take off film → pre-treatment (oil removing, pickling) → cut (plane opening and the opening of raised step (up step)).This kind of technique includes etching, laser cutting parameter, and thus technique preparation can prepare printing surface and has the metal otter board of raised step (up step).Applying the metal form that this kind of processing technology obtains, the figure opening in raised step (up step) region is high with the aligning accuracy of base openings；Require that the opening hole wall of integral mold plate is smooth, straight, the bad phenomenon such as impulse-free robustness, sawtooth；Surface quality is good, without bad defects such as deformation, whiting；The thickness evenness COV in plate face will be within 10%.
Description
Technical field
The present invention relates to the preparation technology of a kind of stepped formwork, belong to material manufacture and manufacture field, be specifically related to one
In SMT field, a kind of printing surface has raised step (up step) and raised step region has the printing of opening figure with covering
Template be mixed with technique.
Background technology
Along with China's electron trade develops rapidly, stencil print process is also applied at electronics manufacturing, and SMT prints
It is exactly typical case.During Electronic products manufacturing, electronic component and PCB are welded needs first stannum is placed on PCB, and
Hundreds of pad is had to need stannum, the position of each pad to correspond to electronic component on PCB, be the weldering needing upper stannum
Dish the most first-class disposable stannum the best way prints exactly.Method usual in electronics manufacturing is to make one piece to have
The stainless steel substrates of numerous small holes, each hole correspond to a pad needing stannum, then stainless steel substrates is attached to stretch tight
On grenadine, grenadine is attached on the bottom surface of print stencil net frame.
Printing stencil is used to the mould of print solder paste, the most typically uses steel mesh.And traditional handicraft passes through cut
The punching block Aperture precision of fabrication techniques can not reach requirement, and board surface quality is the most not high enough.Electroformed nickel mask plate is then easy because of plate face
Forming pin hole, rough point, and solution is unstable, cost is high, the defects such as energy consumption is big.
Tin cream on pad is the most smooth, uniform, consumption the most suitably will directly affect the effect of electronic component SMT, special
When not being to have precision electronic element pad and hot pressing finger, printing stencil is required higher.
The development of PCB industry is not limited solely to plane template, and existing PCB industry development is rapid, and some have particular requirement
Position need spill position, such as B2it printed board.Prepared 3-dimensional metal mask plate has phase complete with substrate
Same 3-D in male structure, with corresponding concavo-convex position, protective substrate surface, and at the 3-dimensional metal mask prepared by use
In substrate surface relief region edge during plate transfer, mask open can contact with substrates into intimate thus exactitude position.Simultaneously
Make and there is the development trend following after the metal mask plate corresponding with concaveconvex shape on pcb board is.The mould of chemical etching
The main Types in the Ban Shi template world.They costs are minimum, have enough to meet the need the fastest.Being made by of the Stainless Molding Board of chemical etching
Metal steel disc exposes light-sensitive surface, position with pin photosensitive instrument by graph exposure on metal steel disc two sides, then use double
Face technique corrodes metal steel disc simultaneously from two sides.The defect of etching template itself and difficulty of processing determine etching template and gradually move back
Go out market.Etch process is then applied to ladder template.
For the formation of opening, its principal mode is electroforming and cut, along with sending out of laser cutting technique and equipment
Exhibition, adds electricity throwing technology, and the opening that cut is formed is also smooth very close to hole wall as electroforming, adds its cycle
Short, yield high, laser cut stencil accounts for more than the 80% of world's template.
How to develop a kind of printing stencil made than common steel mesh even metallic nickel printing stencil, performance is more excellent
Different new product, and there is accurate depth-to-width ratio and the good concavo-convex position of port quality is most important.
Summary of the invention
Present invention seek to address that above technical problem, invent the processing technology of a kind of stepped formwork.Utilize this processing technology
The metal form being made, printing surface has raised step (up step).
A kind of processing technology of stepped formwork.The technological process of this kind of processing technology is as follows: processing substrate (cutting) → front
Process (oil removing, pickling, sandblasting) → pad pasting → double-sided exposure → two-sided development → etching (printing surface has up step) → take off film
→ pre-treatment (oil removing, pickling) → cut (plane opening and the opening of up step).
This kind of stepped formwork is prepared from by being mixed with technique, including etching, laser cutting parameter, its concrete technology stream
Journey is as follows:
(1) processing substrate: selection rustless steel is as baseplate material, and substrate is cut into required size
(2) pre-treatment: after substrate oil removing, pickling, carries out two sides blasting treatment, improves surface roughness, thus improves
Dry film and the adhesion of steel disc during pad pasting.
(3) pad pasting: select the dry film that adhesive force is high, prevents serious side corrosion phenomenon from occurring, it is to avoid consequent position
Precision problem.After choosing dry film, carry out two-sided pad pasting.
(4) double-sided exposure: double-sided exposure after two-sided pad pasting, exposure area is printing surface raised step region, after exposure
Dry film is as the protecting film of subsequent etching processes, it is to avoid substrate be corroded liquid corrode.
(5) two-sided development: unexposed dry film is removed by two-sided developing process, carries out after development development checks (whether to fall
Film, rub film, the development phenomenon such as to the greatest extent), if no problem enters the operation of etching up step.
(6) etching: by pad pasting, expose, develop after substrate feeding horizontal type double-side etching machine in, by spraying up and down
Mode etching solution is sprayed the upper and lower surface of substrate, produce chemical reaction at the substrate surface without exposure dry film, etch away
Layer of metal, thus defines raised step region on printing surface.
(7) take off film: after having etched, clean to take off by protecting film and remove, clean up.
(8) pre-treatment: by metal form oil removing, pickling；
(9) cut: at raised step region and base plan region cutting openings, cut concrete steps are such as
Under:
Substrate after above-mentioned operation being made is placed on after tightening on cutting base station；
Adjust cutting parameter, adjust the longitudinally height of laser cutting head so that it is laser spot falls at printing surface；
Launch laser by laser cutting head, cut in the open area of substrate surface.
Preferably, the concrete technology parameter in each step is as follows:
Pre-treating technology parameter is as follows:
| The oil removing time | 1～2min |
| Pickling time | 1～2min |
| Blast time | 2～3min |
| Pressure (pis) | 2～5 |
Exposure imaging technological parameter is as follows:
Etch process parameters is as follows:
| Etching solution proportion | 1.30～1.50 |
| Fe3+Concentration (g/L) | 100～300 |
| pH | 1.4～1.8 |
| Temperature (DEG C) | 50～60 |
| Pressure (pis) | 10～20 |
| Etching speed | 8～20Hz |
The technological parameter of cut is as follows:
| Rate of cutting (hole/hour) | 10000～20000 |
| Energy (mj) | 400～1000 |
| Gas pressure (MPa) | 0.5～5 |
| Electric current (mA) | 500～1000 |
| Laser frequency (Hz) | 6000～8000 |
| Linear cutting rate (cm.min-1) | 100～200 |
Thus produce stepped formwork as shown in Figure 2, and the printing process of this kind of printing stencil is as it is shown in figure 1, print
Brush finish has raised step, and its effect predominantly increases the number to be printed of printing material in printing process, for the weldering of big element
Connect, shown in 6 in Fig. 1.
The printing surface of invention has the preparation technology of raised step, has the advantages that
(1) printing surface can be made and there is the metal form of up step；
(2) port quality of metal otter board graphics field is good, and hole wall is smooth, the bad phenomenon such as impulse-free robustness, sawtooth；
(3) positional precision in the opening figure region of metal otter board is high；
(4) metal otter board thickness evenness is good, and uniformity COV is within 10%
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage are from combining the accompanying drawings below description to embodiment and will become
Substantially with easy to understand.
Fig. 1, the opening sectional view in printing surface up region
1-PCB substrate
2-template
3a-welds base station
3b-welds base station
4-plane opening
5-printing surface up region
The opening in 6-printing surface up region
7-printing surface
8-PCB face
Fig. 2, mould printing face up schematic diagram
1-template
2-stencil plane opening
Up region, 3-mould printing face
4-mould printing face up region openings
5-mould printing face.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
During in the concrete technological process of this religious name and the present invention, the Noticed Problems in technological process will be described below
More detailed.
A kind of processing technology of stepped formwork.This kind of stepped formwork is prepared from by being mixed with technique, including etching, swashs
Light cutting technique, its concrete technology flow process is as follows:
(1) processing substrate: selection rustless steel is as baseplate material, and substrate is cut into required size
(2) pre-treatment: after substrate oil removing, pickling, carries out two sides blasting treatment, improves surface roughness, thus improves
Dry film and the adhesion of steel disc during pad pasting.
(3) pad pasting: select the dry film that adhesive force is high, prevents serious side corrosion phenomenon from occurring, it is to avoid consequent position
Precision problem.After choosing dry film, carry out two-sided pad pasting.
(4) double-sided exposure: double-sided exposure after two-sided pad pasting, exposure area is printing surface raised step region, after exposure
Dry film is as the protecting film of subsequent etching processes, it is to avoid substrate be corroded liquid corrode.
(5) two-sided development: unexposed dry film is removed by two-sided developing process, carries out after development development checks (whether to fall
Film, rub film, the development phenomenon such as to the greatest extent), if no problem enters the operation of etching up step.
(6) etching: by pad pasting, expose, develop after substrate feeding horizontal type double-side etching machine in, by spraying up and down
Mode etching solution is sprayed the upper and lower surface of substrate, produce chemical reaction at the substrate surface without exposure dry film, etch away
Layer of metal, thus defines raised step region, on printing surface as shown in Fig. 24.
(7) take off film: after having etched, clean to take off by protecting film and remove, clean up.
(8) pre-treatment: by metal form oil removing, pickling；
(9) cut: at raised step region and base plan region cutting openings, cut concrete steps are such as
Under:
Substrate after above-mentioned operation being made is placed on after tightening on cutting base station；
Adjust cutting parameter, adjust the longitudinally height of laser cutting head so that it is laser spot falls at printing surface；
Launch laser by laser cutting head, cut in the open area of substrate surface.
Concrete technology parameter in one group of each step preferred is as follows:
Pre-treating technology parameter:
| The oil removing time | 2min |
| Pickling time | 2min |
| Blast time | 3min |
| Pressure (pis) | 5 |
Exposure imaging technological parameter is as follows:
Etch process parameters is as follows:
| Etching solution proportion | 1.40 |
| Fe3+Concentration (g/L) | 200 |
| pH | 1.6 |
| Temperature (DEG C) | 55 |
| Pressure (pis) | 15 |
| Etching speed | 14Hz |
The technological parameter of cut is as follows:
| Rate of cutting (hole/hour) | 15000 |
| Energy (mj) | 700 |
| Gas pressure (MPa) | 3.5 |
| Electric current (mA) | 800 |
| Laser frequency (Hz) | 7000 |
| Linear cutting rate (cm.min-1) | 150 |
Thus produce stepped formwork as shown in Figure 2, and the printing process of this kind of printing stencil is as it is shown in figure 1, print
Brush finish has raised step, and its effect predominantly increases the number to be printed of printing material in printing process, for the weldering of big element
Connect, shown in 6 in Fig. 1.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
These embodiments can be carried out multiple change in the case of departing from the principle of the present invention and objective, revise, replace and modification, this
The scope of invention is limited by claim and equivalent thereof.
Claims (11)
1. a processing technology for stepped formwork, the technological process of this kind of processing technology is as follows: place before processing substrate → first time
Pre-treatment → the cut of reason → pad pasting → double-sided exposure → two-sided development → etch → take off film → for the second time；
Wherein, processing substrate is to select rustless steel as baseplate material, and substrate is cut into required size；Before described first time
Process is that substrate is carried out oil removing, pickling and blasting treatment；Pad pasting is the dry film selecting adhesive force high, carries out double at mandrel surface
Mask；Double-sided exposure is that pasted dry film is carried out double-sided exposure, and exposure area is printing surface raised step region；Two-sided development
It is that the development of unexposed dry film is removed；Etching is to produce chemical reaction at the substrate surface without exposure dry film, etches away one layer of gold
Belong to, on printing surface, thus define raised step region；Take off film be etched after, protecting film is cleaned and takes off and remove；Described
Pre-treatment for the second time is by metal form oil removing, pickling；Cut is to cut in raised step region and base plan region
Opening.
The processing technology of stepped formwork the most according to claim 1, it is characterised in that the stepped formwork printing prepared
Mask has raised step.
The processing technology of stepped formwork the most according to claim 1, it is characterised in that the stepped formwork prepared is protruding
All there is the opening meeting print request in stepped area and base plan region.
The processing technology of stepped formwork the most according to claim 1, it is characterised in that the material of substrate is rustless steel, pure
One in nickel, ferronickel.
The processing technology of stepped formwork the most according to claim 1, it is characterised in that it is blind that printing surface has at least two
Hole, and stepped formwork printing surface blind hole is in diagonal position.
The processing technology of stepped formwork the most according to claim 1, it is characterised in that base plan region and PCB surface are convex
Play region and there is the opening meeting print request.
The processing technology of stepped formwork the most according to claim 1, it is characterised in that pre-treating technology parameter is such as the first time
Under:
。
The processing technology of stepped formwork the most according to claim 1, it is characterised in that pre-treating technology parameter for the second time
As follows:
The oil removing time 1～2min
Pickling time 1～2min.
The processing technology of stepped formwork the most according to claim 1, it is characterised in that exposure imaging technological parameter is as follows:
。
The processing technology of stepped formwork the most according to claim 1, it is characterised in that etch process parameters is as follows:
。
The processing technology of 11. stepped formworks according to claim 1, it is characterised in that the technological parameter of cut is such as
Under:
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010724.5A CN103203952B (en) | 2012-01-16 | 2012-01-16 | A kind of processing technology of stepped formwork |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010724.5A CN103203952B (en) | 2012-01-16 | 2012-01-16 | A kind of processing technology of stepped formwork |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203952A CN103203952A (en) | 2013-07-17 |
| CN103203952B true CN103203952B (en) | 2016-12-14 |
Family
ID=48751447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010724.5A Expired - Fee Related CN103203952B (en) | 2012-01-16 | 2012-01-16 | A kind of processing technology of stepped formwork |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103556113A (en) * | 2013-10-30 | 2014-02-05 | 昆山允升吉光电科技有限公司 | Method for producing high-precision mask plate |
| CN103556150A (en) * | 2013-10-30 | 2014-02-05 | 昆山允升吉光电科技有限公司 | Method for producing high-precision mask plate |
| CN107422598B (en) * | 2017-06-02 | 2020-08-25 | 昆山国显光电有限公司 | Mask plate and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| CN2349218Y (en) * | 1998-11-18 | 1999-11-17 | 中国科学院长春光学精密机械研究所 | Attached type mask assembly for quasi-molecule laser etching |
| CN1958862A (en) * | 2006-10-13 | 2007-05-09 | 南京航空航天大学 | Electroforming method suitable to fine structure with high depth-width ratio |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59214623A (en) * | 1983-05-20 | 1984-12-04 | Nippon Kogaku Kk <Nikon> | Mold for molding fine pattern of plastic |
| KR100803455B1 (en) * | 2000-09-26 | 2008-02-14 | 이스트맨 코닥 캄파니 | Method for producing metal mask and metal mask |
-
2012
- 2012-01-16 CN CN201210010724.5A patent/CN103203952B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| CN2349218Y (en) * | 1998-11-18 | 1999-11-17 | 中国科学院长春光学精密机械研究所 | Attached type mask assembly for quasi-molecule laser etching |
| CN1958862A (en) * | 2006-10-13 | 2007-05-09 | 南京航空航天大学 | Electroforming method suitable to fine structure with high depth-width ratio |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103203952A (en) | 2013-07-17 |
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