CN103205781B - A kind of manufacture craft of step electroforming template - Google Patents
A kind of manufacture craft of step electroforming template Download PDFInfo
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- CN103205781B CN103205781B CN201210010732.XA CN201210010732A CN103205781B CN 103205781 B CN103205781 B CN 103205781B CN 201210010732 A CN201210010732 A CN 201210010732A CN 103205781 B CN103205781 B CN 103205781B
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- electroforming
- region
- exposure
- treatment
- raised step
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Abstract
A kind of manufacture craft of step electroforming template.Technological process is as follows：The electroformed layer of electroforming first：Core treatment → pre-treatment（Oil removing, pickling, sandblasting 1）→ pad pasting 1 → 1 → surface development of exposure, 1 → electroforming 1；Electroforming PCB surface raised step（up step）：Pre-treatment（Pickling, sandblasting 2）→ pad pasting 2 → 2 → surface development of exposure, 2 → electroforming 2 → take off film → stripping → subsequent treatment（Oil removing, pickling）.Thus the template that technique is prepared, mould material is any one in pure nickel, ferronickel, and its PCB surface has raised step（up step）Region, and plane domain and raised step region are respectively provided with opening figure.Either the first electroformed layer graphics field or raised step（up step）The opening of graphics field is respectively provided with surface quality high, and hole wall is smooth, impulse- free robustness；Board surface quality is good, surface one-level light, pin-free, pit；Raised step（up step）Figure open area is high with the positional precision of the open area of the first electroformed layer；Raised step（up step）Region is big with the adhesion of the first electroformed layer, difficult for drop-off；The thickness evenness of electroforming template graphics field is good.
Description
Technical field
The present invention relates to a kind of manufacture craft of step electroforming template, belong to material manufacture and manufacture field, and in particular to
A kind of PCB surface has raised step in PCB manufactures field（up step）Mask used for printing plate manufacture craft.
Background technology
Pursued with electronic product and minimized, the piercing insert element for using in the past cannot reduce；Electronic product function
It is more complete, the integrated circuit for being used（IC）Cannot punctured element, particularly on a large scale, highly integrated IC, it has to use table
Face surface mount elements, therefore stencil print process has obtained rapid development in electronics manufacturing, SMT printings are exactly typical case.Template
Buying be not only the first step of SMT assembly technologies, it is also a most important step.The major function of template is to aid in tin cream
Deposition, it is therefore an objective to which the material of accurate quantity is transferred on tabula rasa accurate position.Tin cream is blocked in fewer in template, is deposited on
It is more on circuit board.Therefore the port quality requirement to template is smooth.But, for some special pcb boards, such as pcb board
On there are some privileged sites to need the amount of tin cream more than other positions or few, it is therefore necessary to the position of corresponding templates must be entered
Row thickeies or reduction processing.
Traditional handicraft can not reach requirement, board surface quality by the punching block opening size quality that laser cutting technique makes
It is not good enough.And the metal form for making is electroformed has unique sealing characteristics, reduce and Xi Qiao and template bottom surface are cleaned
The need for.The technique provides the positioning of almost Perfect, does not have the limitation of geometry, with inherent trapezoidal smooth hole wall and low
Surface tension, improves tin cream release.By the substrate that perforate is formed at（Or core）Upper lithographic glue, then one by one
Atom, electroforming goes out template around photoresist layer by layer.For the technology for locally thickening, it focuses on raised step figure
The aperture position precision for being opened on substrate graphics field in shape region is high, for the auxiliary of raised step graphics field share current
Flow distribution plate is helped, big in combination with power, the otherwise life-span will substantially reduce.
Therefore, how more preferably, quickly the electroforming metal template produced PCB surface and have raised step has important meaning
Justice.
The content of the invention
Present invention seek to address that above technical problem, invents a kind of manufacture craft of stepped formwork.Using this manufacture craft
The metal form being made, PCB surface has raised step（up step）, and raised step region figure opening and substrate
Opening has aligning accuracy higher.The opening hole wall of obtained integral electroforming template is smooth, and impulse- free robustness, plating etc. are bad existing
As surface quality is good, the bad defect such as pin-free, pit；The thickness evenness COV of plate face will be within 10%；Plate face one-level light
It is bright；The adhesion of the cast layer in raised step region and the first electroformed layer is big, difficult for drop-off.
A kind of preparation method of stepped formwork.Its concrete technology flow process is as follows：
（1）The electroformed layer of electroforming first：Core treatment → pre-treatment（Oil removing, pickling, sandblasting 1）→ pad pasting 1 → exposure 1 → mono-
Face development 1 → electroforming 1；
（2）Electroforming PCB surface raised step（up step）：Pre-treatment（Pickling, sandblasting 2）→ pad pasting 2 → 2 → one side of exposure
Development 2 → electroforming 2 → take off film → stripping → subsequent treatment（Oil removing, pickling）.
Specifically, the concrete technology flow process of each step is：
（1）The electroformed layer of electroforming first：
A. core treatment:Substrate is cut into required size by selection 1.8mm stainless steels as core；
B. pre-treatment：After core oil removing, pickling, the steel disc that will be cut carries out two sides blasting treatment, improves rough surface
Degree, so as to improve the adhesion of dry film and steel disc during pad pasting；
C. pad pasting 1:Selection adhesive force dry film high, prevents from falling film phenomenon during electroforming, enters in mandrel surface
Row pad pasting；
D. 1 is exposed：Institute's patch dry film is exposed, exposure area is opening figure region, and exposure dry film is used as electroforming
Protective layer in journey, prevents material deposition；
E. surface development 1:Unexposed dry film is developed and is removed；
F. electroforming 1：Electroforming material is deposited on without dry film region, clones the opening figure consistent with exposure figure.
（2）Electroforming PCB surface raised step（up step）：
A. pre-treatment:By the first electroformed layer surface acid-washing, sandblasting；
B. pad pasting 2:The first electroforming layer surface continue pad pasting because the raised step region area of wanted electroforming compared with
It is small, so repeating press mold in pad pasting, it is ensured that dry film is close to the first electroformed layer, that is, ensure that raised step region is not easily disconnected from;
C. 2 are exposed：By the lateral opening contrapositions of CCD, the opening figure of accurate contraposition raised step regional location and raised step
Region, the opening figure in the region beyond electroforming raised step and raised step region is exposed；,
D. surface development 2:Unexposed dry film is removed in development, it would be desirable to deposit the region of electroforming material（That is up step areas
Domain）It is exposed；
E. electroforming 2：Shunting auxiliary template carefully contraposition on the first electroformed layer, by one piece of the first electroformed layer, flow distribution plate
It is fixed on winged bar, immerses electrotyping bath, secondary electroforming is carried out, in unexposed area（I.e. without dry film region）Deposition electroforming material,
Form the raised step of PCB surface；
Described flow distribution plate, i.e., with core size identical stainless steel plate on by be cut by laser method cut out one
Identical with raised step regional location, size identical through hole plays a part of share current, mitigates edge effect；
F. film is taken off:After the completion of secondary electroforming, Membrane cleaning is taken off；
G. peel off：Electroformed layer is stripped down from core；
H. subsequent treatment:By template oil removing, pickling.
Preferably, pre-treating technology parameter is as follows：
| The oil removing time | 1~2min |
| Pickling time | 1~2min |
| Blast time 1 | 2~3min |
| Blast time 2 | 5~10min |
| Pressure（pis） | 1~5 |
Preferably, exposure imaging technological parameter is as follows：
| Core size（mm） | 800*600*1.8 |
| 1 amount of exposure（mj） | 1200-2000 |
| Exposed for 1 time（s） | 900~2500 |
| The time of surface development 1（s） | 120~180 |
| 2 amounts of exposure（mj） | PCB surface 1200~2000 |
| Exposed for 2 times（s） | PCB surface 900~2000 |
| The time of surface development 2（s） | 120~180 |
Preferably, electroforming process parameter is as follows：
Thus produce stepped formwork as shown in Figure 2, and this kind of printing process of printing stencil as shown in figure 1,
The raised step of PCB surface, its Main Function is to carry out material printing in pcb board sunk area, increases by 6 institutes in lower tin amount such as 1
Show.
The manufacture craft of the step electroforming template of invention, compared with the manufacture craft of conventional electroforming template, have with
Lower beneficial effect：
（1）During electroforming, two coating are improved by increasing the modes such as soak time before pre-treatment increase blast time, electroforming
Between adhesion, prevent coating from coming off；
（2）By testing ready-made anode baffle come control electric current density line, the first electricity in the range of graphics field is allowed to
COV is within 10% for cast layer deposit thickness uniformity；
（3）Ensure quality of coating by adjusting the amount of electroforming additive, such as coating is bright, pin-free, pit；
（4）By controlling development point, impulse- free robustness, plating good to reach coating opening hole wall quality during development；
（5）Raised step figure open area is high with the positional precision of the open area of the first electroformed layer；
Brief description of the drawings
Of the invention above-mentioned and/or additional aspect and advantage will become from description of the accompanying drawings below to embodiment is combined
Substantially and be readily appreciated that.
The opening sectional view of Fig. 1 PCB surface elevated regions
1-PCB substrates
2- templates
3a- welds base station
3b- welds base station
4- planes opening
5-PCB faces elevated regions
6-PCB faces elevated regions opening
7- mould printings face
8- template PCB surfaces step part pattern example 1
Fig. 2 template PCB surface bump diagrams
1- templates
2- stencil planes opening
3- template PCB surface elevated regions
4- template PCB surface elevated regions opening
5- template PCB surface steps
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
It is exemplary to scheme the embodiment of description, is only used for explaining the present invention, and is not considered as limiting the invention.
During Noticed Problems in the specific technological process of this religious name and the present invention in technological process will be described below
It is more detailed.
（1）The electroformed layer of electroforming first：
A. core treatment:Substrate is cut into required size by selection 1.8mm stainless steels as core；
B. pre-treatment：After core oil removing, pickling, the steel disc that will be cut carries out two sides blasting treatment, improves rough surface
Degree, so as to improve the adhesion of dry film and steel disc during pad pasting.
C. pad pasting 1：The dry film that adhesive force must be selected high, prevents from falling film phenomenon during electroforming.Choose dry film
Afterwards, pad pasting is carried out in mandrel surface.
D. 1 is exposed：Institute's patch dry film is exposed, exposure area is opening figure region, and exposure dry film is used as electroforming
Protective layer in journey, prevents material deposition；
E. surface development 1:Unexposed dry film is developed and is removed；
F. electroforming 1：Electroforming material is deposited on without dry film region, clones the opening figure consistent with exposure figure.
（2）Electroforming PCB surface raised step（up step）：
A. pre-treatment:By the first electroformed layer surface acid-washing, sandblasting.
B. pad pasting 2:The first electroforming layer surface continue pad pasting because the raised step region area of wanted electroforming compared with
It is small, so repeating press mold in pad pasting, it is ensured that dry film is close to the first electroformed layer, that is, ensure that raised step region is not easily disconnected from.
C. 2 are exposed：By the lateral opening contrapositions of CCD, the opening figure of accurate contraposition raised step regional location and raised step
Region, the opening figure in the region beyond electroforming raised step and raised step region is exposed.
D. surface development 2:Unexposed dry film is removed in development, it would be desirable to deposit the region of electroforming material（That is up step areas
Domain）It is exposed.
E. electroforming 2：Because raised step region area is smaller, current density line is concentrated during electroforming, and electroforming can be caused raised
The edge effect of stepped area is serious, so ready shunting auxiliary template is carefully aligned onto the first electroformed layer, notes
Figure and electroformed layer should not be abraded, the first electroformed layer, one piece of flow distribution plate are fixed on winged bar, immerse electrotyping bath, control electroforming is convex
Play step thicknesses.
Described flow distribution plate, i.e., with core size identical stainless steel plate on by be cut by laser method cut out one
Identical with up step regional locations, size identical through hole plays a part of share current, mitigates edge effect.
Secondary electroforming is carried out, in unexposed area（I.e. without dry film region）Deposition electroforming material, forms the raised platform of PCB surface
Rank.
F. film is taken off:After the completion of secondary electroforming, Membrane cleaning is taken off.
G. peel off：Electroformed layer is stripped down from core.
H. subsequent treatment:By template oil removing, pickling.
One of which optimizing technology parameters are as follows：
Pre-treating technology parameter：
| The oil removing time | 2min |
| Pickling time | 2min |
| Blast time 1 | 3min |
| Blast time 2 | 10min |
| Pressure（pis） | 3 |
Exposure imaging technological parameter：
| Core size（mm） | 800*600*1.8 |
| 1 amount of exposure（mj） | 1500 |
| Exposed for 1 time（s） | 1500 |
| The time of surface development 1（s） | 150 |
| 2 amounts of exposure（mj） | PCB surface 1500 |
| Exposed for 2 times（s） | PCB surface 1500 |
| The time of surface development 2（s） | 160 |
Electroforming process parameter：
Thus produce stepped formwork as shown in Figure 2, and this kind of printing process of printing stencil as shown in figure 1,
The raised step of PCB surface, its Main Function is to carry out material printing in pcb board sunk area, increases by 6 institutes in lower tin amount such as 1
Show.
During electroforming, by pre-treatment increase blast time, increase the modes such as soak time before electroforming improve two coating it
Between adhesion, prevent coating from coming off, by testing ready-made anode baffle come control electric current density line, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Ensure coating matter by adjusting the amount of electroforming additive
Amount, such as coating are bright, pin-free, pit；By controlling development point good to reach coating opening hole wall quality during development, without hair
Thorn, plating.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
Can these embodiments be carried out with various changes, modification, replacement and modification in the case of departing from principle of the invention and objective, this
The scope of invention is limited by claim and its equivalent.
Claims (8)
1. a kind of manufacture craft of step electroforming template, its technological process is as follows：
（1）The electroformed layer of electroforming first：Core treatment → pre-treatment → pad pasting 1 → 1 → surface development of exposure, 1 → electroforming 1；
（2）Electroforming PCB surface raised step：Pre-treatment → pad pasting 2 → 2 → surface development of exposure, 2 → electroforming 2 → take off film → stripping →
Subsequent treatment；
Wherein, the electroformed layer of electroforming first：Core treatment is to select stainless steel as core, and core is cut into required chi
It is very little；After pre-treatment is core oil removing, pickling, the core that will be cut carries out two sides sandblasting；Pad pasting 1 is that selection adhesive force is high to be done
Film, pad pasting is carried out in mandrel surface；Exposure 1 is that institute's patch dry film is exposed, and exposure area is opening figure region；One side shows
Shadow 1 is that unexposed dry film develops to remove；Electroforming 1 is that electroforming material is deposited on without dry film region, is cloned and exposure figure
Consistent opening figure；
Electroforming PCB surface raised step：Pre-treatment is by the first electroformed layer surface acid-washing, sandblasting；Pad pasting 2 is in the first electroformed layer table
Continue pad pasting in face；Exposure 2 is to expose the opening figure in the region beyond wanted electroforming raised step and raised step region；
Surface development 2 is that unexposed dry film is removed in development, it would be desirable to which the region for depositing electroforming material is exposed；Electroforming 2 is shunting
Accessory plate is carefully aligned onto the first electroformed layer, and the first electroformed layer, one piece of accessory plate of shunting are fixed on winged bar, immerses electroforming
Groove carries out second electroforming, in unexposed area area deposition electroforming material, forms the raised step of PCB surface；Described shunting auxiliary
Plate, i.e., with core size identical stainless steel plate on by be cut by laser method cut out one with raised step regional location
Identical, size identical through hole plays a part of share current, mitigates edge effect；After the completion of taking off film and being secondary electroforming, film is taken off
Cleaning；Stripping is that electroformed layer is stripped down from core；Subsequent treatment is by template oil removing, pickling.
2. the manufacture craft of step electroforming template according to claim 1, it is characterised in that the electroforming template for preparing
PCB surface there is raised step region.
3. the manufacture craft of step electroforming template according to claim 1, it is characterised in that the electroforming template for preparing
With opening figure, and opening figure is distributed in raised step regional peace face region.
4. the manufacture craft of step electroforming template according to claim 1, it is characterised in that electroforming PCB surface raised step
During region, the current density that shunting accessory plate comes dispersion of dry film location edge need to be made.
5. the manufacture craft of step electroforming template according to claim 1, it is characterised in that electroforming PCB surface raised step
Before region, with activation step, strengthen soak time to reach the adhesion between raising coating.
6. the manufacture craft of step electroforming template according to claim 1, it is characterised in that pre-treating technology parameter is such as
Under：
。
7. the manufacture craft of step electroforming template according to claim 1, it is characterised in that exposure imaging technological parameter is such as
Under：
。
8. the manufacture craft of step electroforming template according to claim 1, it is characterised in that there is activation to walk before electroforming
Suddenly, electroforming process parameter is as follows：
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010732.XA CN103205781B (en) | 2012-01-16 | 2012-01-16 | A kind of manufacture craft of step electroforming template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010732.XA CN103205781B (en) | 2012-01-16 | 2012-01-16 | A kind of manufacture craft of step electroforming template |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103205781A CN103205781A (en) | 2013-07-17 |
| CN103205781B true CN103205781B (en) | 2017-06-13 |
Family
ID=48753182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010732.XA Expired - Fee Related CN103205781B (en) | 2012-01-16 | 2012-01-16 | A kind of manufacture craft of step electroforming template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103205781B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108271317A (en) * | 2017-12-29 | 2018-07-10 | 上海量子绘景电子股份有限公司 | A kind of preparation method of the wiring board based on gravure printing technique |
| CN109402682A (en) * | 2018-12-12 | 2019-03-01 | 常州大学 | A kind of method for the raising coating binding force that initialization layer and sandblasting combine |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2532075B2 (en) * | 1986-12-26 | 1996-09-11 | 九州日立マクセル株式会社 | Manufacturing method of film carrier with bump |
| US5359928A (en) * | 1992-03-12 | 1994-11-01 | Amtx, Inc. | Method for preparing and using a screen printing stencil having raised edges |
| US6981318B2 (en) * | 2002-10-22 | 2006-01-03 | Jetta Company Limited | Printed circuit board manufacturing method |
| CN100590232C (en) * | 2005-11-14 | 2010-02-17 | 昆山允升吉光电科技有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| TWI306061B (en) * | 2006-04-27 | 2009-02-11 | Transonic Prec Ind Inc | Multi-layer metal printing stencil and its fabricating method |
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2012
- 2012-01-16 CN CN201210010732.XA patent/CN103205781B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN103205781A (en) | 2013-07-17 |
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