CN103203967B - A kind of electrocasting prepares the manufacture craft of stepped formwork - Google Patents
A kind of electrocasting prepares the manufacture craft of stepped formwork Download PDFInfo
- Publication number
- CN103203967B CN103203967B CN201210010735.3A CN201210010735A CN103203967B CN 103203967 B CN103203967 B CN 103203967B CN 201210010735 A CN201210010735 A CN 201210010735A CN 103203967 B CN103203967 B CN 103203967B
- Authority
- CN
- China
- Prior art keywords
- electroforming
- region
- treatment
- exposure
- electroformed layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
A kind of electrocasting prepares the manufacture craft of stepped formwork.Concrete technology flow process is as follows：The electroformed layer of electroforming first：Core treatment → pre-treatment（Oil removing, pickling, sandblasting）→ pad pasting 1 → 1 → surface development of exposure, 1 → electroforming 1；Electroforming PCB surface raised step (up step) region：Pre-treatment（Pickling, sandblasting）→ pad pasting 2 → 2 → surface development of exposure, 2 → electroforming 2 → stripping；The electroformed layer of electroforming second（Form printing surface recess step（down step）Region）：Pre-treatment（Pickling, sandblasting）→ printing mask → 3 → leg of exposure 3 → surface development, 3 → electroforming film → stripping → subsequent treatment（Oil removing, pickling）.Thus prepare and can obtain PCB surface there is raised step (up step), printing surface has recess step（down step）, and step regions have the electroforming template of opening figure.Either substrate graphics field should step graphics fields port quality, hole wall is smooth, impulse- free robustness；Board surface quality is good, surface one-level light, pin-free, pit；Step figures open area is high with the positional precision of the open area of the first electroformed layer；Raised step (up step) region is big with the adhesion of substrate, difficult for drop-off；The thickness evenness of electroforming template graphics field is good.
Description
Technical field
The present invention relates to a kind of manufacture craft of stepped formwork, belong to material manufacture and manufacture field, and in particular to PCB systems
A kind of PCB surface has raised step region in making field, and printing surface has the electroforming of the mask used for printing plate in recess step region
Manufacture craft.
Background technology
As China's electron trade rapidly develops, stencil print process is also applied in electronics manufacturing, SMT printings
It is exactly typical case.The buying of template is not only the first step of SMT assembly technologies, and it is also a most important step.The main work(of template
The deposition of tin cream can be to aid in.Purpose is that the material of accurate quantity is transferred on tabula rasa into accurate position.Tin cream is blocked in mould
It is fewer on plate, deposit more on circuit boards.Therefore the port quality requirement to template is more smooth better.But, for
Having some privileged sites on some special pcb boards, such as pcb board needs the amount of tin cream more than other positions or few, therefore
Up or down treatment must must be carried out to the position of corresponding templates, in general, up regions need to make figure, down regions one
As need not make figure.
It is a kind of to be incremented by rather than the technique successively decreased using electroforming process, a metal form is produced, with uniqueness
Sealing characteristics, reduce the need for being cleaned to Xi Qiao and template bottom surface.The technique provides the positioning of almost Perfect, does not have geometric form
The limitation of shape, with inherent trapezoidal smooth hole wall and low surface tension, improves tin cream release.Perforate is formed by one
Substrate（Or core）Upper lithographic glue, then one by one atom, electroforming goes out template around photoresist layer by layer.For part
For the technology of thickening, the aperture position precision for being opened on substrate graphics field that it focuses on up step graphics fields will
Height, big in combination with power, the otherwise life-span will substantially reduce.
Therefore, when producing PCB surface using electroforming process there is up steps, printing surface to have the template of down steps, protect
The precision for demonstrate,proving aperture position seems particularly significant, is also the critical process place of electroforming stepped formwork.
The content of the invention
Present invention seek to address that above technical problem, invents a kind of electroforming manufacture craft of stepped formwork.Using this making
The template that technique is made, PCB surface has up step, and printing surface has down step, and with opening figure；Printing
The stepped area of face and PCB surface is respectively provided with aligning accuracy higher with figure opening and base openings.The substrate material of stepped formwork
Expect to be the one kind in pure nickel, dilval.
A kind of electrocasting prepares the manufacture craft of stepped formwork, and its concrete technology flow process is as follows：
（1）The electroformed layer of electroforming first：Core treatment → pre-treatment（Oil removing, pickling, sandblasting）→ pad pasting 1 → exposure 1 → mono-
Face development 1 → electroforming 1；
（2）Electroforming PCB surface up step regions：Pre-treatment（Pickling, sandblasting）→ pad pasting 2 → 2 → surface development of exposure 2 →
Electroforming 2 → stripping；
（3）The electroformed layer of electroforming second（Form printing surface down step regions）：Pre-treatment（Pickling, sandblasting）→ printing surface
Pad pasting → 3 → surface development of exposure, 3 → electroforming 3 → take off film → stripping → subsequent treatment（Oil removing, pickling）.
Specifically, the concrete technology flow process of each step is：
（1）The electroformed layer of electroforming first：
A. core treatment:Substrate is cut into required size by selection 1.8mm stainless steels as core；
B. pre-treatment:The steel disc that will be cut carries out two sides blasting treatment, surface roughness is improved, so as to improve pad pasting
When dry film and steel disc adhesion；
C. pad pasting 1：Adhesive force dry film high is selected, pad pasting is carried out in mandrel surface；
D. 1 is exposed：Institute's patch dry film is exposed, exposure area is opening figure region, and exposure dry film is used as electroforming
Protective layer in journey, prevents material deposition；
E. surface development 1：Unexposed dry film is developed and is removed；
F. electroforming 1：Electroforming material is deposited on without dry film region, clones the opening figure consistent with exposure figure.
（2）Electroforming PCB surface up step regions：
A. pre-treatment：Pickling, sandblasting are carried out in the first electroforming layer surface；
B. pad pasting 2：First electroforming layer surface continues pad pasting, because the up step region areas of wanted electroforming are smaller, institute
Press mold is repeated with pad pasting, it is ensured that dry film is close to the first electroformed layer, that is, ensure that up step regions are not easily disconnected from；
By the lateral opening contrapositions of CCD, the opening figure region of accurate contraposition up step regional locations and up step；
C. 2 are exposed：The opening figure in the region beyond wanted electroforming up step and up step regions is exposed black；
D. surface development 2：Unexposed dry film is removed in development, it would be desirable to deposit the region of electroforming material（That is up step areas
Domain）It is exposed;
E. electroforming 2:Shunting auxiliary template is carefully aligned onto the first electroformed layer（Described flow distribution plate, i.e., with core
On size identical stainless steel plate by be cut by laser method cut out one it is identical with up step regional locations, size is identical
Through hole, play a part of share current, mitigate edge effect）, secondary electroforming is carried out, in unexposed area（I.e. without dry film area
Domain）Deposition electroforming material, forms the up step of PCB surface.
F. peel off:After the completion of secondary electroforming, electroformed layer is stripped down from core.
（3）The electroformed layer of electroforming second（Form printing surface down step regions）：
A. pre-treatment：After the completion of secondary electroforming, electroformed layer is stripped down from core, overturn cast layer, by PCB surface with
Mandrel surface is contacted, and pickling, sandblasting are carried out in the first electroforming layer surface；
B. mask is printed：The pad pasting on printing surface；
C. 3 are exposed：Exposure will do the region of down step, as electroforming diaphragm, prevent deposition materials from being deposited on
Down regions；
D. surface development 3：Partial development on printing surface in addition to the region of down step, removes quick-fried black dry film, with
The standby electroforming for carrying out the region；
E. electroforming 3：The adhesion between two coating is improved by increasing the modes such as soak time before electroforming, plating is prevented
Layer comes off, and by set anode baffle come control electric current density line, is allowed to the first electroformed layer in the range of graphics field
Deposit thickness, uniformity COV is controlled within 10%；Ensure quality of coating, such as coating light by adjusting the amount of electroforming additive
Bright, pin-free, pit；
F. film is taken off：Removal dry film, cleaning；
G. peel off：Electroformed layer is peeled off from core.
H. subsequent treatment：Oil removing, pickling electrotyping plate.
The design parameter of each technique in wherein each step is as follows：
Handling process parameter：
| The oil removing time | 1~2min |
| Pickling time | 1~2min |
| Blast time 1 | 2~3min |
| Blast time 2 | 5~10min |
| Blast time 3 | 5~10min |
| Pressure（pis） | 1~5 |
Exposure imaging technological parameter
| Core size（mm） | 800*600*1.8 |
| 1 amount of exposure（mj） | 1000~2000 |
| Time for exposure 1（s） | 800~2500 |
| The time of surface development 1（s） | 120~240 |
| 2 amounts of exposure（mj） | PCB surface 1200~2000 |
| 3 amounts of exposure（mj） | Printing surface 1000~1200 |
| Time for exposure 2（s） | PCB surface 1500~2500 |
| Time for exposure 3（s） | Printing surface 800~1500 |
| The time of surface development 2/3（s） | 90~120 |
Electroforming process parameter
The electroforming manufacture craft of a kind of stepped formwork of invention, with conventional general electroforming, etch process system
The standby template for obtaining, there is following being obviously improved：
（1）Either substrate graphics field should step graphics fields port quality, hole wall is smooth, impulse- free robustness；
（2）Board surface quality is good, surface one-level light, pin-free, pit；
（3）Step figures open area is high with the positional precision of the open area of the first electroformed layer；
（4）Up step regions are big with the adhesion of substrate, difficult for drop-off；
（5）The thickness evenness of electroforming template graphics field is good.
Brief description of the drawings
Of the invention above-mentioned and/or additional aspect and advantage will become from description of the accompanying drawings below to embodiment is combined
Substantially and be readily appreciated that.
The opening sectional view in Fig. 1 PCB surface up regions
1-PCB substrates
2- templates
3a- welds base station
3b- welds base station
4- planes opening
5-PCB faces up regions
6-PCB faces up region openings
7- mould printings face
8- template PCB surfaces step part patterns example 1
The opening sectional view in Fig. 2 printing surface down regions
1-PCB substrates
2- templates
3a- welds base station
3b- welds base station
4- planes opening
5- printing surface down regions
6- printing surface down region openings
7- mould printings face
8- template PCB surfaces
Fig. 3 mould printings face down schematic diagrames
1- templates
2- stencil planes opening
3- mould printings face down regions
4- mould printings face down region openings
5- mould printings face
Fig. 4, template PCB surface up schematic diagrames
1- templates
2- stencil planes opening
3- template PCB surface up regions
4- template PCB surface up region openings
5- template PCB surfaces
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
It is exemplary to scheme the embodiment of description, is only used for explaining the present invention, and is not considered as limiting the invention.
During Noticed Problems in the specific technological process of this religious name and the present invention in technological process will be described below
It is more detailed.
Electroforming PCB surface has a up step regions, and there is printing surface the concrete technology flow process of the template in down step regions to be：
（1）The electroformed layer of electroforming first：
A. core treatment:Substrate is cut into required size by selection 1.8mm stainless steels as core；
B. pre-treatment：The steel disc that will be cut carries out two sides blasting treatment, surface roughness is improved, so as to improve pad pasting
When dry film and steel disc adhesion；
C. pad pasting 1：Selection adhesive force dry film high, prevents from falling film phenomenon during electroforming, after choosing dry film,
Pad pasting is carried out in mandrel surface；
D. 1 is exposed：Institute's patch dry film is exposed, exposure area is opening figure region, and exposure dry film is used as electroforming
Protective layer in journey, prevents material deposition；
E. surface development 1：Unexposed dry film is developed and is removed；
F. electroforming 1：Electroforming material is deposited on without dry film region, clones the opening figure consistent with exposure figure.
（2）Electroforming PCB surface up step regions：
A. pre-treatment：Pickling, sandblasting are carried out in the first electroforming layer surface；
B. pad pasting 2：First electroforming layer surface continues pad pasting, because the up step region areas of wanted electroforming are smaller, institute
Press mold is repeated with pad pasting, it is ensured that dry film is close to the first electroformed layer, that is, ensure that up step regions are not easily disconnected from；
By the lateral opening contrapositions of CCD, the opening figure region of accurate contraposition up step regional locations and up step；
C. 2 are exposed：The opening figure in the region beyond wanted electroforming up step and up step regions is exposed black；
D. surface development 2：Unexposed dry film is removed in development, it would be desirable to deposit the region of electroforming material（That is up step areas
Domain）It is exposed;
E. electroforming 2:Because up step region areas are smaller, current density line is concentrated during electroforming, can cause electroforming up
The edge effect in step regions is serious, so ready shunting auxiliary template is carefully aligned onto the first electroformed layer, notes
Figure and electroformed layer should not be abraded, the first electroformed layer, one piece of flow distribution plate are fixed on winged bar, immerse electrotyping bath, control electroforming
Up step thickness；
Described flow distribution plate, i.e., with core size identical stainless steel plate on by be cut by laser method cut out one
Identical with up step regional locations, size identical through hole plays a part of share current, mitigates edge effect；
Secondary electroforming is carried out, in unexposed area（I.e. without dry film region）Deposition electroforming material, forms the up of PCB surface
step；
F. peel off:After the completion of secondary electroforming, electroformed layer is stripped down from core.
（3）The electroformed layer of electroforming second（Form printing surface down step regions）：
A. pre-treatment：After the completion of secondary electroforming, electroformed layer is stripped down from core, overturn cast layer, by PCB surface with
Mandrel surface is contacted, and pickling, sandblasting are carried out in the first electroforming layer surface；
B. mask is printed:The pad pasting on printing surface；
C. 3 are exposed：Exposure will do the region of down step, as electroforming diaphragm, prevent deposition materials from being deposited on
Down regions；
D. surface development 3：Partial development on printing surface in addition to the region of down step, removes quick-fried black dry film, with
The standby electroforming for carrying out the region；
E. electroforming 3：The adhesion between two coating is improved by increasing the modes such as soak time before electroforming, plating is prevented
Layer comes off, and by set anode baffle come control electric current density line, is allowed to the first electroformed layer in the range of graphics field
Deposit thickness, uniformity COV is controlled within 10%；Ensure quality of coating, such as coating light by adjusting the amount of electroforming additive
Bright, pin-free, pit；By controlling development point, impulse- free robustness, plating good to reach coating opening hole wall quality during development；
F. film is taken off：Removal dry film, cleaning；
G. peel off：Electroformed layer is peeled off from core.
H. subsequent treatment：Oil removing, pickling electrotyping plate.
The design parameter of each technique in wherein each step is as follows：
One group of preferred technological parameter is as follows：
Handling process parameter：
| The oil removing time | 2min |
| Pickling time | 2min |
| Blast time 1 | 3min |
| Blast time 2 | 8min |
| Blast time 3 | 8min |
| Pressure（pis） | 3 |
Exposure imaging technological parameter
| Core size（mm） | 800*600*1.8 |
| 1 amount of exposure（mj） | 1500 |
| Time for exposure 1（s） | 2000 |
| The time of surface development 1（s） | 200 |
| 2 amounts of exposure（mj） | PCB surface 1500 |
| 3 amounts of exposure（mj） | Printing surface 1000 |
| Time for exposure 2（s） | PCB surface 2000 |
| Time for exposure 3（s） | Printing surface 1000 |
| The time of surface development 2/3（s） | 100 |
Electroforming process parameter
Thus produce stepped formwork as shown in Figure 3,4, and this kind of printing process of printing stencil such as Fig. 1,2 institutes
Show, the raised step of PCB surface, its Main Function is to carry out material printing in pcb board sunk area, increase lower tin amount, in such as 1
6 shown in, and the recess step of printing surface, its Main Function is the lower tin amount that printing is reduced on welding copper platform on pcb board,
As shown in 26, for the welding of small element.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
Can these embodiments be carried out with various changes, modification, replacement and modification in the case of departing from principle of the invention and objective, this
The scope of invention is limited by claim and its equivalent.
Claims (8)
1. a kind of electrocasting prepares the manufacture craft of stepped formwork, and concrete technology flow process is as follows：
（1）The electroformed layer of electroforming first：Core treatment → pre-treatment → pad pasting 1 → 1 → surface development of exposure, 1 → electroforming 1；
（2）Electroforming PCB surface raised step region：Pre-treatment → pad pasting 2 → 2 → surface development of exposure, 2 → electroforming 2 → stripping；
（3）The electroformed layer of electroforming second：Pre-treatment → printing mask → 3 → surface development of exposure, 3 → electroforming 3 → take off film → stripping
→ subsequent treatment；
Wherein, the electroformed layer of electroforming first：Core treatment is to select stainless steel as core, and substrate is cut into required size；
Pre-treatment is that the steel disc that will be cut carries out oil removing, pickling and blasting treatment；Pad pasting 1 is the dry film for selecting adhesive force high, in core
Mould surface carries out pad pasting；Exposure 1 is that institute's patch dry film is exposed, and exposure area is open area；Surface development 1 is not expose
The development of light dry film is removed；Electroforming 1 is that electroforming material is deposited on without dry film region, clones the opening figure consistent with exposure figure
Shape；
Electroforming PCB surface raised step region：Pre-treatment is that the first electroformed layer is carried out into pickling, blasting treatment；Pad pasting 2 is first
Electroforming layer surface repeats press mold, it is ensured that dry film is close to the first electroformed layer, that is, ensure that raised step region is not easily disconnected from, by CCD
Lateral opening contraposition, the regional location of accurate contraposition raised step and the opening figure region in raised step region；Exposure 2 is to want
The opening figure exposure in region and raised step region beyond electroforming raised step region；Surface development 2 is that development is removed not
Exposure dry film, it would be desirable to which the region for depositing electroforming material is exposed；Electroforming 2 is that carefully contraposition is electric to first shunting accessory plate
On cast layer, second electroforming is carried out, in unexposed area area deposition electroforming material, form the raised step region of PCB surface；Stripping is
After the completion of secondary electroforming, electroformed layer is stripped down from core；Described shunting accessory plate, i.e., identical with core size
Stainless steel plate on by be cut by laser method cut out, a size identical through hole identical with raised step regional location,
Play a part of share current, mitigate edge effect；
The electroformed layer of electroforming second：The electroformed layer of electroforming second is to form printing surface recess step region；Locate before the electroformed layer of electroforming second
After the completion of reason is secondary electroforming, electroformed layer is stripped down from core, overturn cast layer, PCB surface is contacted with mandrel surface,
First electroforming layer surface carries out pickling, sandblasting；Printing mask is the pad pasting on printing surface；Exposure 3 is to expose to do to be recessed
The region of step；Surface development 3 is that, by the partial development on printing surface in addition to the region of recess step, removal exposes black dry film,
In case carrying out the electroforming in the region；Electroforming 3 is the first electroformed layer deposit thickness in the range of graphics field；It is that residual is dry to take off film
Film is taken off except cleaning；Subsequent treatment is by electrotyping plate oil removing, pickling.
2. electrocasting according to claim 1 prepares the manufacture craft of stepped formwork, it is characterised in that the platform for preparing
The PCB surface of rank template has raised step region, and printing surface has recess step region.
3. electrocasting according to claim 1 prepares the manufacture craft of stepped formwork, it is characterised in that stepped formwork prints
The face that the scraper that face, i.e. stepped formwork are shifted with material is in contact.
4. electrocasting according to claim 1 prepares the manufacture craft of stepped formwork, it is characterised in that stepped formwork PCB
The face that face, i.e. stepped formwork are in contact with pcb board.
5. electrocasting according to claim 1 prepares the manufacture craft of stepped formwork, it is characterised in that the platform for preparing
Rank stencil plane region, PCB surface raised step region, printing surface recess step region are respectively provided with the opening for meeting print request.
6. electrocasting according to claim 1 prepares the manufacture craft of stepped formwork, it is characterised in that core material is pure
One kind in nickel, dilval.
7. electrocasting according to claim 1 prepares the manufacture craft of stepped formwork, it is characterised in that electroforming PCB surface is convex
Pre-treatment when playing the second electroformed layer of stepped area and electroforming must strengthen sandblasting dynamics, improve the adhesion of coating surface.
8. electrocasting according to claim 1 prepares the manufacture craft of stepped formwork, it is characterised in that electroforming PCB surface is convex
Before playing stepped area and the electroformed layer of electroforming second, strengthen soak time to reach the adhesion between raising coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010735.3A CN103203967B (en) | 2012-01-16 | 2012-01-16 | A kind of electrocasting prepares the manufacture craft of stepped formwork |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010735.3A CN103203967B (en) | 2012-01-16 | 2012-01-16 | A kind of electrocasting prepares the manufacture craft of stepped formwork |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203967A CN103203967A (en) | 2013-07-17 |
| CN103203967B true CN103203967B (en) | 2017-06-13 |
Family
ID=48751462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010735.3A Expired - Fee Related CN103203967B (en) | 2012-01-16 | 2012-01-16 | A kind of electrocasting prepares the manufacture craft of stepped formwork |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103203967B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112549740A (en) * | 2020-12-21 | 2021-03-26 | 上海新倬壮印刷科技有限公司 | Manufacturing process for efficiently preparing solar screen printing plate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3865085B2 (en) * | 1996-07-24 | 2007-01-10 | 九州日立マクセル株式会社 | Manufacturing method of electroformed product |
| JP3786313B2 (en) * | 1997-05-08 | 2006-06-14 | 九州日立マクセル株式会社 | Metal mask manufacturing method |
| JP3516882B2 (en) * | 1999-06-01 | 2004-04-05 | 株式会社ムラカミ | Screen printing plate and its manufacturing method |
| CN1122601C (en) * | 2001-08-22 | 2003-10-01 | 魏志凌 | Preparation method of surface tiling and veneering technology form |
| CN100590232C (en) * | 2005-11-14 | 2010-02-17 | 昆山允升吉光电科技有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
-
2012
- 2012-01-16 CN CN201210010735.3A patent/CN103203967B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103203967A (en) | 2013-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103203955B (en) | A hybrid production process for a step stencil | |
| CN103203965A (en) | A hybrid production process for a printing stencil used in surface-mounting technology (SMT) | |
| CN103203980B (en) | A kind of metal otter board with multiple step and preparation method thereof | |
| CN103203967B (en) | A kind of electrocasting prepares the manufacture craft of stepped formwork | |
| CN103974548A (en) | Method for manufacturing mask plate | |
| CN103203954B (en) | A kind of mixing manufacture technique of stepped formwork | |
| CN103205781B (en) | A kind of manufacture craft of step electroforming template | |
| CN103889157A (en) | Method for making thick copper printed circuit board | |
| JP2010247500A (en) | Mask and method of manufacturing the same | |
| KR20170092598A (en) | Gravure cylinder and manufacturing method thereof | |
| CN103203964B (en) | A kind of manufacture craft of step electroforming template | |
| CN103203952B (en) | A kind of processing technology of stepped formwork | |
| CN103203968B (en) | A production process for a step stencil | |
| CN103207519B (en) | A kind of manufacture craft of the three-dimensional metal mask plate with figure opening | |
| CN103203953B (en) | A kind of mixing manufacture technique of stepped formwork | |
| CN103203959B (en) | A kind of it is mixed with technique and stepped formwork that this kind of technique prepares | |
| JPH05220920A (en) | Production of metal mask plate for printing | |
| KR102107599B1 (en) | Menufacturing method for three-dimensional shape metal mask using electroforming | |
| CN103203958B (en) | A kind of manufacture craft of electroforming template | |
| CN103203982B (en) | A kind of printing Three-dimensional mask plate | |
| CN115767934A (en) | Manufacturing method of micro-space bonding pads | |
| CN103207515A (en) | A three-dimensional mask plate and a production process thereof | |
| CN103203966B (en) | A kind of manufacture craft of step electroforming template | |
| CN103203960B (en) | A kind of manufacture method of stepped formwork | |
| CN103203957B (en) | A kind of manufacture method of stepped formwork |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20190808 Granted publication date: 20170613 |
|
| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20220808 Granted publication date: 20170613 |
|
| PD01 | Discharge of preservation of patent | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170613 Termination date: 20200116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |