CN103203980B - A kind of metal otter board with multiple step and preparation method thereof - Google Patents
A kind of metal otter board with multiple step and preparation method thereof Download PDFInfo
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- CN103203980B CN103203980B CN201210010723.0A CN201210010723A CN103203980B CN 103203980 B CN103203980 B CN 103203980B CN 201210010723 A CN201210010723 A CN 201210010723A CN 103203980 B CN103203980 B CN 103203980B
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Abstract
A kind of metal otter board with multiple step and preparation method thereof.This kind has the web plate of multiple step, it is characterised in that has raised step (up step) and/or recessed step (down step) at metal otter board printing surface and/or PCB surface and has opening figure.Its preparation method includes multiple: the method combining for raised step, available electroforming, etching or electroforming and etching；The method that recessed step, available electroforming, etching or electroforming and etching are combined；The method that opening figure, available electroforming, laser cutting or electroforming and laser cutting are combined.This kind of metal otter board has high precision；The port quality of graphics field is good, and hole wall is smooth, the bad phenomenon such as impulse-free robustness, sawtooth；The positional precision in opening figure region is high；Thickness evenness is good, and uniformity COV is within 10%.
Description
Technical field
The present invention relates to a kind of metal otter board with multiple step and preparation method thereof, belong to material preparation and processing neck
Territory, is specifically related to a kind of mask used for printing plate for SMT field and preparation technology thereof.
Background technology
With China, electron trade develops rapidly, and stencil print process is also applied at electronics manufacturing, and SMT prints
It is exactly typical case.During Electronic products manufacturing, electronic component and PCB are welded needs first tin is placed on PCB, and
Having hundreds of pad to need tin on PCB, the position of each pad correspond to electronic component, be the weldering needing upper tin
The disposable first-class accurately tin of dish, the best way prints exactly.Method usual in electronics manufacturing is to make one piece
Having the stainless steel substrates of numerous small holes, each hole correspond to a pad needing tin, then stainless steel substrates is attached to stretch tight
On grenadine, grenadine is attached on the bottom surface of print stencil net frame.
Printing stencil is used to the mould of print solder paste, general at present employing steel mesh.And traditional handicraft passes through laser cutting
The punching block Aperture precision of fabrication techniques can not reach requirement, and board surface quality is also not high enough.Electroformed nickel mask plate is then because plate face is easy
Forming pin hole, rough point, and solution unstable, cost is high, and energy consumption is big.
Whether the tin cream on pad is smooth, uniform, the whether suitable effect of electronic component SMT that will directly affect of consumption, special
When not being to have precision electronic element pad and hot pressing finger, printing stencil is required higher.
The development of PCB industry is not limited solely to plane template, and existing PCB industry development is rapid, and some have particular requirement
Position need spill position, such as B2it printed board.Prepared 3-dimensional metal mask plate has the complete phase with substrate
Same 3-D in male structure, with the corresponding concavo-convex position in protective substrate surface, and is using prepared 3-dimensional metal mask
In substrate surface relief region edge during plate transfer, mask open can contact with substrates into intimate thus exactitude position.Simultaneously
Make and there is the development trend following after the metal mask plate corresponding with concaveconvex shape on pcb board is.
The template of chemical etching is the main Types in the template world.Their costs are minimum, have enough to meet the need the fastest.Chemical etching is not
Being made by of rust steel form expose on metal steel disc light-sensitive surface, with the pin photosensitive instrument of positioning by graph exposure at metal
Metal steel disc is corroded on steel disc two sides, then use double-side technology simultaneously from two sides.The defect of etching template itself and difficulty of processing
Determine etching template and be gradually backed out market.Therefore and present stage etch process is mainly used in ladder template.
Electrotyping forming, a kind of technique being incremented by rather than successively decreasing, produce a metal form, the sealing with uniqueness is special
Property, reduce the needs cleaning Xi Qiao and template bottom surface.This technique provides the positioning of almost Perfect, does not has the limit of geometry
System, has inherent trapezoidal smooth hole wall and low surface tension, improves tin cream release.By the substrate a perforate to be formed
(or core) upper lithographic glue, then one by one atom, around photoresist, electroforming goes out template layer by layer.
For the formation of opening, its principal mode is electroforming and laser cutting, with sending out of laser cutting technique and equipment
Exhibition, adds electricity throwing technology, and the opening that laser cutting is formed is also smooth very close to hole wall as electroforming, adds its cycle
Short, yield high, laser cut stencil accounts for more than the 80% of world's template.
How to develop a kind of printing stencil even metallic nickel printing stencil making than common steel mesh, and have accurately
Depth-to-width ratio and the good concavo-convex position of port quality are most important.I.e. more preferably, produce quickly there is up step and down step
Metal form enjoy people to pay close attention to.
Content of the invention
Present invention seek to address that above technical problem, invent a kind of metal otter board with multiple step and preparation side thereof
Method, this kind of preparation technology can meet opening figure that is that have multiple raised or sunken feature and that have complexity and (include projection
Or sunk area) the making of metal otter board, this kind of metal otter board has high precision；The port quality of graphics field is good, hole
Wall is smooth, the bad phenomenon such as impulse-free robustness, sawtooth；The positional precision in opening figure region is high；Thickness evenness is good, uniformity COV
Within 10%.
A kind of metal otter board with multiple step of invention.It is characterized in that, this web plate has multiple step, i.e.
Printing surface and/or PCB surface have raised step (up step) and/or recessed step (down step), and web plate has opening
Figure.
Wherein, there is printing surface raised step feature schematic diagram
Wherein, there is PCB surface raised step feature schematic diagram
Wherein, there is printing surface recessed step-feature schematic diagram
Wherein, there is PCB surface recessed step-feature schematic diagram
A kind of metal otter board with multiple step, its material is pure iron metal, the one in dilval.
Metal otter board substrate can be obtained by directly cutting out the metal plate of suitable dimension or electrocasting method.
Preparing metal otter board substrate for electrocasting method, its technological process is as follows:
1 → exposure, 1 → surface development, the 1 → electroforming 1 of core process → pre-treatment (oil removing, pickling, sandblasting) → pad pasting
Specifically, comprise the steps:
(1) select 1.8mm stainless steel as core, and substrate is cut into required size, the steel disc that will cut
After oil removing, pickling, carry out two sides blasting treatment, improve surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting；
(2) select the dry film that adhesive force is high, during preventing electroforming, fall film phenomenon.After choosing dry film, at core
Surface carries out pad pasting.
(3) being exposed pasted dry film, exposure area is opening figure region, during exposure dry film is as electroforming
Protective layer, stops material deposition.
(4) removing the development of unexposed dry film, entering electroforming process, electroforming material is deposited on without dry film region, clones
The opening figure consistent with exposure figure.
The concrete technological parameter that this electrocasting method uses is as follows:
Pre-treating technology parameter
| The oil removing time | 1～2min |
| Pickling time | 1～2min |
| Blast time 1 | 2～3min |
| Pressure (pis) | 1～5 |
Exposure imaging technological parameter
| Core size (mm) | 800*600*1.8 |
| Light exposure (mj) | 1200～2000 |
| Time for exposure (s) | 900～2500 |
| Surface development time (s) | 120～180 |
Electroforming process parameter
For the raised step (up step) of printing surface and/or PCB surface, use electrocasting method preparation technology flow process as follows:
(1) 2 → exposure, 2 → surface development, the 2 → electroforming 2 of electroforming PCB surface up step: pre-treatment (pickling, sandblasting) → pad pasting
→ peel off
(2) electroforming printing surface up step: printing surface pad pasting → exposure 3 → surface development, 3 → electroforming, 3 → leg film → stripping
→ subsequent treatment (oil removing, pickling)
Specifically, comprise the steps:
(1) electroforming PCB surface up step:
A. pickling, sandblasting are carried out to substrate；
B. pad pasting, because the up step region area of wanted electroforming is less, so repeat press mold when pad pasting, it is ensured that dry
Film is close to the first electroformed layer, i.e. guarantees that up step region is not easily disconnected from；
C. the lateral opening contraposition of CCD, the opening figure region of accurate contraposition up step regional location and up step are passed through;
D. then exposing black by the opening figure in the region beyond wanted electroforming up step and up step region, development is clear
Except unexposed dry film, it would be desirable to come out in the region (i.e. up step region) of deposition electroforming material;
E. deposit electroforming material at unexposed area (i.e. without dry film region), form the up step of PCB surface.
Flow distribution plate can be used if desired, i.e. cut by the method for laser cutting on the corrosion resistant plate equivalently-sized with core
Go out one identical with up step regional location, the identical through hole of size, play share current, mitigate edge effect effect.
F., after electroforming completes, electroformed layer is stripped down from core.
(2) electroforming printing surface up step:
A. PCB surface is contacted with mandrel surface, pad pasting on printing surface, because the up step region area of wanted electroforming
Less, so repeat press mold when pad pasting, it is ensured that dry film is close to the first electroformed layer, i.e. guarantees that up step region is not easily disconnected from;
B. the lateral opening contraposition of CCD, the opening figure region of accurate contraposition up step regional location and up step are passed through;
C. exposing black by the opening figure in the region beyond wanted electroforming up step and up step region, development is removed not
Exposure dry film, it would be desirable to come out in the region (i.e. up step region) of deposition electroforming material.
D. electroforming, deposits electroforming material at unexposed area (i.e. without dry film region), forms the up step of printing surface.
Flow distribution plate can be used if desired, i.e. cut by the method for laser cutting on the corrosion resistant plate equivalently-sized with core
Go out one identical with up step regional location, the identical through hole of size, play share current, mitigate edge effect effect.
In this step and when carrying out electroforming, increased blast time by pre-treatment, increase the modes such as soak time before electroforming
Improve the adhesion between two coating, prevent coating from coming off, control current density line by the ready-made anode baffle of experiment,
It is allowed in the range of graphics field the first electroformed layer deposit thickness uniformity COV within 10%；By adjusting electroforming additive
Amount ensures quality of coating, as bright in coating, free of pinholes, pit；Coating open pore is reached by control development point during development
Wall quality is good, impulse-free robustness, plating.
The concrete technological parameter that this electrocasting method uses is as follows:
Pre-treating technology parameter
| The oil removing time | 1～2min |
| Pickling time | 1～2min |
| Blast time | 5～10min |
| Pressure (pis) | 1～5 |
Exposure imaging technological parameter
| Core size (mm) | 800*600*1.8 |
| Exposure 2 amounts (mj) | PCB surface 1200～2000 |
| Exposure 3 amounts (mj) | Printing surface 1200～2000 |
| Time for exposure 2(s) | PCB surface 900～2000 |
| Time for exposure 3(s) | Printing surface 900～2000 |
| Surface development 2 time (s) | 120～180 |
| Surface development 3 time (s) | 120～180 |
Electroforming process parameter
For the preparation technology preparing one side (printing surface or PCB surface) raised step, it is possible to use in this technological process
Step (1).
For the raised step (up step) of printing surface and/or PCB surface, use engraving method preparation technology flow process as follows:
Pre-treatment (oil removing, pickling, sandblasting) → pad pasting → double-sided exposure → two-sided development → etching (PCB surface, printing mask
Have up step) → move back film → subsequent treatment (oil removing, pickling)
Specifically, comprise the steps:
A. substrate pre-treatment, the step such as including oil removing, pickling, sandblasting；
B. select the dry film that adhesive force is high, carry out two-sided pad pasting；
C. double-sided exposure, exposure area is the raised step region of printing surface and PCB surface, and the dry film after exposure is as rear
The diaphragm of continuous etch process, it is to avoid the substrate liquid that is corroded corrodes；
D. unexposed dry film is removed by two-sided developing process；
E. send in horizontal type double-side etching machine by the substrate after pad pasting, exposure, development, will by way of spraying up and down
Etching solution sprays the upper and lower surface of substrate, produces chemical reaction at the substrate surface without exposure dry film, etches away one layer of steel disc,
On printing surface and PCB surface, thus define raised step region；
F., after etching completes, Membrane cleaning is taken off；
G. subsequent treatment (oil removing, pickling).
The concrete technological parameter that this engraving method uses is as follows:
Pre-treating technology parameter
| The oil removing time | 1～2min |
| Pickling time | 1～2min |
| Blast time | 5～10min |
| Pressure (pis) | 2～5 |
Exposure imaging technological parameter
| Substrate size (mm) | 570*570 |
| Light exposure (mj) | 100～300 |
| Time for exposure (s) | 300～600 |
| Two-sided development 1 time (s) | 120～180 |
Etch process parameters
| Etching solution proportion | 1.30～1.50 |
| Fe3+Concentration (g/L) | 100～300 |
| pH | 1.4～1.8 |
| Temperature (DEG C) | 50～60 |
| Pressure (pis) | 10～20 |
| Etching speed | 8～20Hz |
For the preparation technology preparing one side (printing surface or PCB surface) raised step, it is possible to use in this technological process
One side etch, as diaphragm after the pad pasting exposure of i.e. other one side, prevent from being corroded during etching.
At the same time it can also be the method using electroforming and etch process to combine is carried out.
Play step (down step) under convex-concave for printing surface and/or PCB surface, use engraving method preparation technology stream
Journey is as follows:
Pre-treatment (oil removing, pickling, sandblasting) → pad pasting → double-sided exposure → two-sided development → etching (PCB surface, printing mask
Have up step) → move back film → subsequent treatment (oil removing, pickling)
Specifically, comprise the steps:
A. substrate pre-treatment, the step such as including oil removing, pickling, sandblasting；
B. select the dry film that adhesive force is high, carry out two-sided pad pasting；
C. double-sided exposure, exposure area be two-sided recess step region beyond region, the dry film after exposure is as rear
The diaphragm of continuous etch process, it is to avoid the cast layer liquid that is corroded corrodes；
D. unexposed dry film is removed by developing process；
E. send in horizontal etching machine by the substrate after pad pasting, exposure, development, by way of spray, etching solution is sprayed
Pour the printing surface of substrate, produce chemical reaction at the substrate surface without exposure dry film, etch away one layer of steel disc, thus formed
Recess step region；
F., after etching completes, Membrane cleaning is taken off;
G. subsequent treatment (oil removing, pickling).
During electroforming, by pre-treatment increase blast time, increase before electroforming the modes such as soak time improve two coating it
Between adhesion, prevent coating from coming off, control current density line by the ready-made anode baffle of experiment, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Ensure coating matter by the amount adjusting electroforming additive
Amount, as bright in coating, free of pinholes, pit；Coating opening hole wall quality is reached by control development point good, without hair during development
Thorn, plating.
The concrete technological parameter that this engraving method uses is as follows:
Pre-treating technology parameter
| The oil removing time | 1～2min |
| Pickling time | 1～2min |
| Blast time 2 | 5～10min |
| Pressure (pis) | 2～5 |
Exposure imaging technological parameter
| Light exposure (mj) | 500～1200 |
| Time for exposure (s) | 1200～1800 |
| Developing time (s) | 180～300 |
Etch process parameters
| Etching solution temperature (DEG C) | 45-50 |
| Etching solution expulsion pressure (psi) | 10-15 |
| Etching period (min) | 5～10 |
For the preparation technology preparing one side (printing surface or PCB surface) recessed step, it is possible to use in this technological process
One side etch, as diaphragm after the pad pasting exposure of i.e. other one side, prevent from being corroded during etching.
For the opening figure of web plate, the preparation technology of electrocasting method is used i.e. to complete at web plate substrate electroforming step.
For the opening figure of web plate, the method preparation technology flow process using laser cutting is as follows:
(1) diaphragm cleans to take off and removes, and upper laser cutting platform after cleaning up, in raised step region and base plan region
Cutting openings, laser cutting specifically comprises the following steps that
(2) substrate after making above-mentioned operation is placed on after tightening on cutting base station；
(3) adjust cutting parameter, adjust the longitudinally height of laser cutting head so that it is laser spot falls at printing surface；
(4) launch laser by laser cutting head, cut in the open area of substrate surface.
Specifically, laser technical parameters is as follows:
| Rate of cutting (hole/hour) | 10000～20000 |
| Energy (mj) | 400～1000 |
| Gas pressure (MPa) | 0.5～5 |
| Electric current (mA) | 500～1000 |
| Laser frequency (Hz) | 6000～8000 |
| Linear cutting rate (cm.min-1) | 100～200 |
For the procedure of processing of opening figure, the method that electroforming and laser cutting can be used to be combined with each other is prepared.
The step of the metal otter board in the present invention include the raised step (up step) of printing surface, recessed of printing surface
Rank (down step), the raised step (up step) of PCB surface, PCB surface recessed step (down step) in one or many
Plant the architectural feature of step combination.
The full process stream journey of the preparation technology of the metal otter board with multiple step in the present invention is including but not limited to each
Some technological process can be merged and carry out or be combined optimizing by the technological process of individual part.
Brief description
Above-mentioned and/or the additional aspect of the present invention and advantage are from combining the description to embodiment for the accompanying drawings below and will become
Obvious and easy to understand.
Fig. 1, the opening sectional view in printing surface up region
1-PCB substrate
2-template
3a-welds base station
3b-welds base station
4-plane opening
5-printing surface up region
The opening in 6-printing surface up region
7-printing surface
8-PCB face
Fig. 2, the opening sectional view in PCB surface up region
1-PCB substrate
2-template
3a-welds base station
3b-welds base station
4-plane opening
Up region, 5-PCB face
6-PCB face up region openings
7-mould printing face
8-template PCB surface
Fig. 3, PCB surface down region sectional view
1-PCB substrate
2-template
3-welds base station
4-plane opening
Elevated regions on 5-PCB plate
Down region, 6-PCB face
7-printing surface
8-PCB face
Fig. 4, the opening sectional view in printing surface down region
1-PCB substrate
2-template
3a-welds base station
3b-welds base station
4-plane opening
5-printing surface down region
6-printing surface down region openings
7-mould printing face
8-template PCB surface
Fig. 5, mould printing face up schematic diagram
1-template
2-stencil plane opening
Up region, 3-mould printing face
4-mould printing face up region openings
5-mould printing face
Fig. 6, template PCB surface up schematic diagram
1-template
2-stencil plane opening
3-template PCB surface up region
4-template PCB surface up region openings
5-template PCB surface
Fig. 7, template PCB surface down schematic diagram
1-template
2-stencil plane opening
3-template PCB surface down region
4-template PCB surface
Fig. 8, mould printing face down schematic diagram
1-template
2-stencil plane opening
Down region, 3-mould printing face
4-mould printing face down region openings
5-mould printing face
Fig. 9, template schematic diagram
1-template
2-plane opening
3-PCB face sunk area
4-template PCB surface
The opening of 5-PCB face elevated regions
6-PCB face elevated regions
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
Embodiment 1
Printing surface has up step, and PCB surface has up step, and up step region has the electroformed mould of opening figure
Plate:
Concrete technology flow process is as follows:
Electroforming the first electroformed layer: core process → pre-treatment (oil removing, pickling, sandblasting) → pad pasting 1 → exposure, 1 → one side shows
Shadow 1 → electroforming 1
Electroforming PCB surface up step: pre-treatment (pickling, sandblasting) → pad pasting 2 → exposure 2 → surface development, 2 → electroforming 2 →
Peel off
Electroforming printing surface up step: printing surface pad pasting → exposure 3 → surface development, 3 → electroforming, 3 → leg film → stripping → after
Continuous process (oil removing, pickling)
Design parameter is as follows:
Pre-treating technology parameter
| The oil removing time | 1min |
| Pickling time | 2min |
| Blast time 1 | 3min |
| Blast time 2 | 7min |
| Pressure (pis) | 3 |
Exposure imaging technological parameter
| Core size (mm) | 800*600*1.8 |
| Light exposure 1(mj) | 1500 |
| Time for exposure 1(s) | 2000 |
| Surface development 1 time (s) | 150 |
| Exposure 2 amounts (mj) | PCB surface 1500 |
| Exposure 3 amounts (mj) | Printing surface 1500 |
| Time for exposure 2(s) | PCB surface 1500 |
| Time for exposure 3(s) | Printing surface 1500 |
| Surface development 2 time (s) | 150 |
| Surface development 3 time (s) | 150 |
Electroforming process parameter
Specifically:
Select 1.8mm stainless steel as core, and substrate is cut into required size, the steel disc cutting is carried out
Two sides blasting treatment, improves surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting.
The dry film that adhesive force is high must be selected, during preventing electroforming, fall film phenomenon.After choosing dry film, at core
Surface carries out pad pasting.
Being exposed pasted dry film, exposure area is opening figure region, and exposure dry film is as the guarantor during electroforming
Sheath, stops material deposition.
Removing the development of unexposed dry film, entering electroforming process, electroforming material is deposited on without dry film region, clones and exposes
The consistent opening figure of light figure.
After electroforming completes for the first time, continue pad pasting on the first electroformed layer surface, because the up step area surface of wanted electroforming
Long-pending less, so repeat press mold when pad pasting, it is ensured that dry film is close to the first electroformed layer, i.e. guarantees that up step region is not easily disconnected from.
By the lateral opening contraposition of CCD, the opening figure region of accurate contraposition up step regional location and up step.
Then exposing black by the opening figure in the region beyond wanted electroforming up step and up step region, development is removed not
Exposure dry film, it would be desirable to come out in the region (i.e. up step region) of deposition electroforming material.
Because up step region area is less, during electroforming, current density line is concentrated, and can cause electroforming up step region
Edge effect is serious, so in the ready shunting careful contraposition of auxiliary template to the first electroformed layer, being careful not to scratch figure
Shape and electroformed layer, the first electroformed layer, flow distribution plate one piece are fixed to fly on bar, immerse electrotyping bath, control electroforming up step thickness.
Described flow distribution plate, i.e. cuts out one by the method for laser cutting on the corrosion resistant plate equivalently-sized with core
Identical with up step regional location, the identical through hole of size, plays share current, the effect mitigating edge effect.
Carry out secondary electroforming, deposit electroforming material at unexposed area (i.e. without dry film region), form the up of PCB surface
step。
After secondary electroforming completes, electroformed layer is stripped down from core, overturn cast layer, PCB surface is connect with mandrel surface
Touch, pad pasting on printing surface, because the up step region area of wanted electroforming is less, so repeat press mold when pad pasting, it is ensured that
Dry film is close to the first electroformed layer, i.e. guarantees that up step region is not easily disconnected from.
By the lateral opening contraposition of CCD, the opening figure region of accurate contraposition up step regional location and up step.
Then exposing black by the opening figure in the region beyond wanted electroforming up step and up step region, development is removed not
Exposure dry film, it would be desirable to come out in the region (i.e. up step region) of deposition electroforming material.
Because up step region area is less, during electroforming, current density line is concentrated, and can cause electroforming up step region
Edge effect is serious, so in the ready shunting careful contraposition of auxiliary template to the first electroformed layer, being careful not to scratch figure
Shape and electroformed layer, the first electroformed layer, flow distribution plate one piece are fixed to fly on bar, immerse electrotyping bath, control electroforming up step thickness.
Described flow distribution plate, i.e. cuts out one by the method for laser cutting on the corrosion resistant plate equivalently-sized with core
Identical with up step regional location, the identical through hole of size, plays share current, the effect mitigating edge effect.
Carry out three electroforming, deposit electroforming material at unexposed area (i.e. without dry film region), form the up of printing surface
step。
During electroforming, by pre-treatment increase blast time, increase before electroforming the modes such as soak time improve two coating it
Between adhesion, prevent coating from coming off, control current density line by the ready-made anode baffle of experiment, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Ensure coating matter by the amount adjusting electroforming additive
Amount, as bright in coating, free of pinholes, pit；Coating opening hole wall quality is reached by control development point good, without hair during development
Thorn, plating.
Thus produce stepped formwork as shown in Figure 5,6, and the printing process of this kind of printing stencil such as Fig. 1,2 institutes
Showing, the raised step of PCB surface, it primarily serves the purpose of and carries out material printing at pcb board sunk area, increases by 6 in lower tin amount such as 1
Shown in, and the raised step of printing surface, it primarily serves the purpose of the lower tin amount increasing printing on the welding copper platform on pcb board, uses
Welding in big element.
Embodiment 2
Printing surface, PCB surface have a preparation method of the metal mask plate of raised step (up step):
The concrete technology flow process of this kind of preparation method is as follows:
Processing substrate (cutting) → pre-treatment (oil removing, pickling, sandblasting) → pad pasting → double-sided exposure → two-sided development → erosion
Carve (PCB surface, printing surface have up step) → leg film → pre-treatment (oil removing, pickling) → laser cutting (plane opening and up
The opening of step)
Technological parameter is as follows:
Pre-treating technology parameter
| The oil removing time | 1min |
| Pickling time | 2min |
| Blast time | 3min |
| Pressure (pis) | 2 |
Exposure imaging technological parameter
| Substrate size (mm) | 570*570 |
| Light exposure (mj) | 300 |
| Time for exposure (s) | 600 |
| Two-sided development 1 time (s) | 120 |
Etch process parameters
| Etching solution proportion | 1.30 |
| Fe3+Concentration (g/L) | 100 |
| pH | 1.4 |
| Temperature (DEG C) | 60 |
| Pressure (pis) | 10 |
| Etching speed | 8Hz |
Laser technical parameters
| Rate of cutting (hole/hour) | 15000 |
| Energy (mj) | 8000 |
| Gas pressure (MPa) | 2 |
| Electric current (mA) | 750 |
| Laser frequency (Hz) | 7000 |
| Linear cutting rate (cm.min-1) | 150 |
Specifically:
Select stainless steel as baseplate material, and substrate is cut into required size, the steel disc cutting is carried out
Two sides blasting treatment, improves surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting.
The dry film that adhesive force is high must be selected, prevent serious side corrosion phenomenon from occurring, it is to avoid consequent positional precision
Problem.After choosing dry film, carry out two-sided pad pasting.
Double-sided exposure after two-sided pad pasting, exposure area is the raised step region of printing surface and PCB surface, the dry film after exposure
Diaphragm as subsequent etching processes, it is to avoid substrate be corroded liquid corrode.
And unexposed dry film is removed by two-sided developing process, carry out development after development and check (whether to fall film, rub film, aobvious
The phenomenons such as shadow is not most), if no problem enters the operation of etching up step.
Send in horizontal type double-side etching machine by the substrate after pad pasting, exposure, development, will erosion by way of spraying up and down
Carve liquid and spray the upper and lower surface of substrate, produce chemical reaction at the substrate surface without exposure dry film, etch away one layer of steel disc, this
Sample just defines raised step region on printing surface and PCB surface, such as Fig. 3, shown in 44.
After etching completes, cleaning to take off by diaphragm and removing, upper laser cutting platform after cleaning up, at raised step region and base
Board plane region cutting openings, laser cutting specifically comprises the following steps that
Substrate after making above-mentioned operation is placed on after tightening on cutting base station；
Adjust cutting parameter, adjust the longitudinally height of laser cutting head so that it is laser spot falls at printing surface；
Launch laser by laser cutting head, cut in the open area of substrate surface.
Thus produce stepped formwork as shown in Figure 5,6, and the printing process of this kind of printing stencil such as Fig. 1,2 institutes
Showing, printing surface has raised step, and its effect predominantly increases the number to be printed of printing material in printing process, is used for big element
Welding, shown in 6 in Fig. 1.And the raised step of PCB surface, it primarily serves the purpose of and carries out material print at pcb board sunk area
Brush, as shown in 26.
Embodiment 3
PCB surface has a up step, and up step region has an electroforming template of opening figure:
Concrete technology flow process is as follows:
Electroforming the first electroformed layer: core process → pre-treatment (oil removing, pickling, sandblasting 1) → pad pasting 1 → exposure, 1 → one side
Development 1 → electroforming 1
Electroforming PCB surface up step: pre-treatment (pickling, sandblasting 2) → pad pasting 2 → exposure 2 → surface development, 2 → electroforming 2 →
Leg film → stripping → subsequent treatment (oil removing, pickling)
Design parameter is as follows:
Pre-treating technology parameter
| The oil removing time | 2min |
| Pickling time | 2min |
| Blast time 1 | 3min |
| Blast time 2 | 10min |
| Pressure (pis) | 5 |
Exposure imaging technological parameter
| Core size (mm) | 800*600*1.8 |
| Light exposure 1(mj) | 2000 |
| Time for exposure 1(s) | 1500 |
| Surface development 1 time (s) | 180 |
| Exposure 2 amounts (mj) | PCB surface 2000 |
| Time for exposure 2(s) | PCB surface 900 |
| Surface development 1 time (s) | 120 |
| Surface development 2 time (s) | 180 |
Electroforming process parameter
Specifically:
Select 1.8mm stainless steel as core, and substrate is cut into required size, the steel disc cutting is carried out
Two sides blasting treatment, improves surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting.
The dry film that adhesive force is high must be selected, during preventing electroforming, fall film phenomenon.After choosing dry film, at core
Surface carries out pad pasting.
Being exposed pasted dry film, exposure area is opening figure region, and exposure dry film is as the guarantor during electroforming
Sheath, stops material deposition.
Removing the development of unexposed dry film, entering electroforming process, electroforming material is deposited on without dry film region, clones and exposes
The consistent opening figure of light figure.
After electroforming completes for the first time, continue pad pasting on the first electroformed layer surface, because the up step area surface of wanted electroforming
Long-pending less, so repeat press mold when pad pasting, it is ensured that dry film is close to the first electroformed layer, i.e. guarantees that up step region is not easily disconnected from.
By the lateral opening contraposition of CCD, the opening figure region of accurate contraposition up step regional location and up step.
Then exposing black by the opening figure in the region beyond wanted electroforming up step and up step region, development is removed not
Exposure dry film, it would be desirable to come out in the region (i.e. up step region) of deposition electroforming material.
Because up step region area is less, during electroforming, current density line is concentrated, and can cause electroforming up step region
Edge effect is serious, so in the ready shunting careful contraposition of auxiliary template to the first electroformed layer, being careful not to scratch figure
Shape and electroformed layer, the first electroformed layer, flow distribution plate one piece are fixed to fly on bar, immerse electrotyping bath, control electroforming up step thickness.
Described flow distribution plate, i.e. cuts out one by the method for laser cutting on the corrosion resistant plate equivalently-sized with core
Identical with up step regional location, the identical through hole of size, plays share current, the effect mitigating edge effect.
Carry out secondary electroforming, deposit electroforming material at unexposed area (i.e. without dry film region), form the up of PCB surface
step。
After secondary electroforming completes, take off Membrane cleaning, electroformed layer is stripped down from core.Thus produce such as Fig. 2 institute
The stepped formwork showing, and the printing process of this kind of printing stencil is as it is shown in figure 1, the raised step of PCB surface, it primarily serves the purpose of
Carry out material printing at pcb board sunk area, increase lower tin amount as shown in 16.
During electroforming, by pre-treatment increase blast time, increase before electroforming the modes such as soak time improve two coating it
Between adhesion, prevent coating from coming off, control current density line by the ready-made anode baffle of experiment, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Ensure coating matter by the amount adjusting electroforming additive
Amount, as bright in coating, free of pinholes, pit；Coating opening hole wall quality is reached by control development point good, without hair during development
Thorn, plating.
Embodiment 4
PCB surface has down step and the metal form of up step；And step region has an opening figure:
Concrete technology flow process is as follows:
Electroforming the first electroformed layer: core process → pre-treatment (oil removing, pickling, sandblasting) → pad pasting 1 → exposure, 1 → one side shows
Shadow 1 → electroforming 1
Electroforming PCB surface up step: pre-treatment (pickling, sandblasting) → pad pasting 2 → exposure 2 → surface development, 2 → electroforming 2 →
Take off film → stripping
The two-sided pad pasting of down step: electroformed layer of etching PCB surface → PCB surface exposure → PCB surface development → PCB surface etching
→ leg film → subsequent treatment (oil removing, pickling)
Design parameter is as follows:
Pre-treating technology parameter
| The oil removing time | 1min |
| Pickling time | 2min |
| Blast time | 4min |
| Pressure (pis) | 2 |
Exposure imaging technological parameter
| Core size (mm) | 800*600*0.3 |
| Exposure 1 amount (mj) | 1500 |
| Time for exposure 1(s) | 1500 |
| Surface development 1 time (s) | 150 |
| Exposure 2 amounts (mj) | PCB surface 750 |
| Time for exposure 2(s) | PCB surface 450 |
| Surface development 2 time (s) | 90 |
Etch process parameters
| Etching solution proportion | 1.40 |
| Fe3+Concentration (g/L) | 200 |
| pH | 1.6 |
| Temperature (DEG C) | 55 |
| Pressure (pis) | 15 |
| Etching speed | 14 |
Electroforming process parameter
Specifically:
Select 0.3mm stainless steel as core, and substrate is cut into required size, the steel disc cutting is carried out
Two sides blasting treatment, improves surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting.
The dry film that adhesive force is high must be selected, during preventing electroforming, fall film phenomenon.After choosing dry film, at core
Surface carries out pad pasting.
Being exposed pasted dry film, exposure area is opening figure region, and exposure dry film is as the guarantor during electroforming
Sheath, stops material deposition.
Removing the development of unexposed dry film, entering electroforming process, electroforming material is deposited on without dry film region, clones and exposes
The consistent opening figure of light figure.
After electroforming completes for the first time, continue pad pasting on the first electroformed layer surface, because the up step area surface of wanted electroforming
Long-pending less, so repeat press mold when pad pasting, it is ensured that dry film is close to the first electroformed layer, i.e. guarantees that up step region is not easily disconnected from.
By the lateral opening contraposition of CCD, the opening figure region of accurate contraposition up step regional location and up step.
Then exposing black by the opening figure in the region beyond wanted electroforming up step and up step region, development is removed not
Exposure dry film, it would be desirable to come out in the region (i.e. up step region) of deposition electroforming material.
Because up step region area is less, during electroforming, current density line is concentrated, and can cause electroforming up step region
Edge effect is serious, so in the ready shunting careful contraposition of auxiliary template to the first electroformed layer, being careful not to scratch figure
Shape and electroformed layer, the first electroformed layer, flow distribution plate one piece are fixed to fly on bar, immerse electrotyping bath, control electroforming up step thickness.
Described flow distribution plate, i.e. cuts out one by the method for laser cutting on the corrosion resistant plate equivalently-sized with core
Identical with up step regional location, the identical through hole of size, plays share current, the effect mitigating edge effect.
Carry out secondary electroforming, deposit electroforming material at unexposed area (i.e. without dry film region), form the up of PCB surface
step。
Take off film, exposure dry film is removed clean.
After secondary electroforming completes, electroformed layer is stripped down from core, pad pasting in PCB surface, expose and will etch
Zone Full beyond down district, as diaphragm, prevents etching solution from corroding.
Unexposed dry film is removed by developing process, carries out development and check (whether to fall film, rub film, development not to the greatest extent after development
Etc. phenomenon), if no problem enters the operation of etch printing face down step.
Send in horizontal etching machine by the cast layer after pad pasting, exposure, development, by way of spray, etching solution is sprayed
To PCB surface, produce chemical reaction at the substrate surface without exposure dry film, etch away one layer of steel disc, thus formed in PCB surface
Recess step region, as shown in Fig. 34.
After etching completes, take off Membrane cleaning.
During electroforming, by pre-treatment increase blast time, increase before electroforming the modes such as soak time improve two coating it
Between adhesion, prevent coating from coming off, control current density line by the ready-made anode baffle of experiment, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Ensure coating matter by the amount adjusting electroforming additive
Amount, as bright in coating, free of pinholes, pit；Coating opening hole wall quality is reached by control development point good, without hair during development
Thorn, plating.
Thus produce stepped formwork as shown in Figure 9, and the printing process of this kind of printing stencil be as shown in Figure 2,3,
The raised step of PCB surface, it primarily serves the purpose of and carries out material printing at pcb board sunk area, increases by 6 institutes in lower tin amount such as 3
Show, and the recess step of PCB surface, it primarily serves the purpose of the elevated regions avoided on pcb board face, as shown in Fig. 26.
Embodiment 5
Preparation PCB surface has up step and the template of down step.
Concrete technology flow process is as follows:
Electroforming the first electroformed layer: core process → pre-treatment (oil removing, pickling, sandblasting) → pad pasting 1 → exposure, 1 → one side shows
Shadow 1 → electroforming 1 → take off film → stripping
The two-sided pad pasting of down step: electroformed layer of etching PCB surface → PCB surface exposure → PCB surface development → PCB surface etching
→ take off film → subsequent treatment (oil removing, pickling)
Design parameter is as follows:
Pre-treating technology parameter
| The oil removing time | 2min |
| Pickling time | 2min |
| Blast time | 3min |
| Pressure (pis) | 5 |
Exposure imaging technological parameter
| Core size (mm) | 800*600*1.8 |
| Light exposure 1(mj) | 1500 |
| Time for exposure 1(s) | 1500 |
| Surface development 1 time (s) | 180 |
| Exposure 2 amounts (mj) | 300 |
| Time for exposure 2(s) | 300 |
| Two-sided development 2 time (s) | 160 |
Electroforming process parameter
Etch process parameters
| Etching solution proportion | 1.40 |
| Fe3+Concentration (g/L) | 200 |
| pH | 1.6 |
| Temperature (DEG C) | 55 |
| Pressure (pis) | 15 |
| Etching speed | 12 |
Detailed description of the invention is as follows:
Select 1.8mm stainless steel as core, and substrate is cut into required size, the steel disc cutting is carried out
Two sides blasting treatment, improves surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting.
The dry film that adhesive force is high must be selected, during preventing electroforming, fall film phenomenon.After choosing dry film, at core
Surface carries out pad pasting.
Being exposed pasted dry film, exposure area is opening figure region, and exposure dry film is as the guarantor during electroforming
Sheath, stops material deposition.
Removing the development of unexposed dry film, entering electroforming process, electroforming material is deposited on without dry film region, clones and exposes
The consistent opening figure of light figure.
After electroforming completes for the first time, electroformed layer is stripped down from core, pad pasting in PCB surface, expose and will etch
Down district beyond Zone Full, as diaphragm, and PCB surface ready-made up district adhesive plaster is touched, prevents etching solution
Corrode.
Stripping down the cast layer that electroforming is good from core, two-sided pad pasting, printing surface exposes, and exposure area is PCB surface
Region beyond recess step region, the dry film after exposure is as the diaphragm of subsequent etching processes, it is to avoid cast layer is corroded liquid
Corrode, outside the dry film of printing surface layer plastic protective film for plastics retain, it is to avoid cast layer be corroded liquid corrode.
Unexposed dry film is removed by developing process, carries out development and check (whether to fall film, rub film, development not to the greatest extent after development
Etc. phenomenon), if no problem enters the operation of etch printing face down step.
Send in horizontal etching machine by the substrate after pad pasting, exposure, development, by way of spray, etching solution is sprayed
To the PCB surface of substrate, produce chemical reaction at the substrate surface without exposure dry film, etch away one layer of steel disc, thus in PCB surface
On define recess step region, as shown in Fig. 24.
After etching completes, take off Membrane cleaning.
During electroforming, improve core and plating by increasing the modes such as soak time before pre-treatment increase blast time, electroforming
Adhesion between Ceng, prevents coating from coming off, and controls current density line by the ready-made anode baffle of experiment, is allowed at figure
In regional extent, the first electroformed layer deposit thickness uniformity COV is within 10%；Ensure plating by the amount adjusting electroforming additive
Layer quality, as bright in coating, free of pinholes, pit；Coating opening hole wall quality is reached by control development point good, nothing during development
Burr, plating.
Thus produce stepped formwork as shown in Figure 7, and the printing process of this kind of printing stencil is as it is shown on figure 3, PCB
The recess step in face, it primarily serves the purpose of the elevated regions avoided on pcb board face.
Embodiment 6
Available printing surface has up step, and PCB surface has down step, and up step region has opening figure
Metal form.
Concrete technology flow process is as follows:
Electroforming the first electroformed layer: core process → pre-treatment (oil removing, pickling, sandblasting) → pad pasting 1 → exposure, 1 → one side shows
Shadow 1 → electroforming 1 → stripping
Electroforming printing surface up step: two-sided pad pasting → double-sided exposure → two-sided development → electroforming 2 → stripping
The down step:PCB facet etch of etching PCB surface → take off film → subsequent treatment (oil removing, pickling)
Concrete technology parameter is as follows:
Pre-treating technology parameter
| The oil removing time | 1.2in |
| Pickling time | 1.5min |
| Blast time 1 | 2.5min |
| Blast time 2 | 7min |
| Pressure (pis) | 3 |
Exposure imaging technological parameter
Electroforming process parameter
Etch process parameters
| Etching solution proportion | 1.40 |
| Fe3+Concentration (g/L) | 2 |
| pH | 1.6 |
| Temperature (DEG C) | 55 |
| Pressure (pis) | 15 |
| Etching speed | 14 |
Detailed description of the invention is as follows:
Select 0.3mm stainless steel as core, and substrate is cut into required size, the steel disc cutting is carried out
Two sides blasting treatment, improves surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting.
The dry film that adhesive force is high must be selected, during preventing electroforming, fall film phenomenon.After choosing dry film, at core
Surface carries out pad pasting.
Being exposed pasted dry film, exposure area is opening figure region, and exposure dry film is as the guarantor during electroforming
Sheath, stops material deposition.
Removing the development of unexposed dry film, entering electroforming process, electroforming material is deposited on without dry film region, clones and exposes
The consistent opening figure of light figure.
After electroforming completes, electroformed layer is stripped down from core, two-sided pad pasting, because the up of wanted electroforming
Step region area is less, so repeat press mold when printing pad pasting, it is ensured that dry film is close to the first electroformed layer, i.e. guarantees up
Step region is not easily disconnected from.
By the lateral opening contraposition of CCD, the opening figure region of accurate contraposition up step regional location and up step.
Then the opening figure in the region beyond wanted electroforming up step and up step region is exposed black, will etch
Region beyond down step exposes black, and unexposed dry film is removed in development, it would be desirable to region (the i.e. up step of deposition electroforming material
Region) and need the region (i.e. down step region) etching to come out.
It is fixed on the electroformed layer adhesive tape having developed on core substrate, and printing surface is outwardly, carry out printing surface up step
Region electroforming.
Because up step region area is less, during electroforming, current density line is concentrated, and can cause electroforming up step region
Edge effect is serious, so in the ready shunting careful contraposition of auxiliary template to the first electroformed layer, being careful not to scratch figure
Shape and electroformed layer, the first electroformed layer, flow distribution plate one piece are fixed to fly on bar, immerse electrotyping bath, control electroforming up step thickness.
Described flow distribution plate, i.e. cuts out one by the method for laser cutting on the corrosion resistant plate equivalently-sized with core
Identical with up step regional location, the identical through hole of size, plays share current, the effect mitigating edge effect.
Carry out secondary electroforming, deposit electroforming material at unexposed area (i.e. without dry film region), form the up of printing surface
step。
During electroforming, by pre-treatment increase blast time, increase before electroforming the modes such as soak time improve two coating it
Between adhesion, prevent coating from coming off, control current density line by the ready-made anode baffle of experiment, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Ensure coating matter by the amount adjusting electroforming additive
Amount, as bright in coating, free of pinholes, pit；Coating opening hole wall quality is reached by control development point good, without hair during development
Thorn, plating.
After secondary electroforming completes, just electroformed layer strips down from core again, the printing being ready for adhesive tape
Up step region, face seals, and enters the operation of etch printing face down step.
Send in horizontal etching machine by the cast layer after pad pasting, exposure, development, by way of spray, etching solution is sprayed
To PCB surface, produce chemical reaction at the substrate surface without exposure dry film, etch away one layer of steel disc, thus formed in PCB surface
Recess step region, as shown in Fig. 34.
After etching completes, take off Membrane cleaning.
Thus produce such as Fig. 6, the stepped formwork shown in 8, and the printing process of this kind of printing stencil such as Fig. 2,3 institutes
Showing, the recess step of PCB surface, it primarily serves the purpose of avoids pcb board elevated regions, it is to avoid printing process template deformation, in 3
6 shown in, and the raised step of printing surface, it primarily serves the purpose of the lower tin amount increasing printing on the welding copper platform on pcb board,
For the welding of big element, as shown in 26.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
Multiple change, modification, replacement and modification can be carried out to these embodiments in the case of the principle and the objective that depart from the present invention, this
The scope of invention is limited by claim and equivalent thereof.
Claims (15)
1. there is a metal otter board for multiple step,
It is characterized in that, this web plate has multiple step, i.e. printing surface and/or PCB surface and has raised step and/or recessed
Rank, and web plate has opening figure.
2. the metal otter board with multiple step according to claim 1, it is characterised in that the material of metal otter board is pure
One in nickel metal, dilval, stainless steel.
3. the metal otter board with multiple step according to claim 1, it is characterised in that metal otter board substrate can pass through
Directly cut out the metal plate of suitable dimension or electrocasting method obtains.
4. the metal otter board with multiple step according to claim 1, it is characterised in that printing surface and/or PCB surface
Raised step can be realized by the method that electroforming, etching or electroforming and etching combine.
5. the metal otter board with multiple step according to claim 1, it is characterised in that printing surface and/or PCB surface
Recessed step can lead to overetched method and realize.
6. the metal otter board with multiple step according to claim 1, it is characterised in that the opening figure of web plate can be led to
Cross electroforming, laser cutting or electroforming and method that laser cutting combines realizes.
7. the metal otter board with multiple step according to claim 3, it is characterised in that described substrate electroforming step
Rapid as follows: core process → pre-treatment → pad pasting → exposure → surface development → electroforming；Wherein pre-treatment include oil removing, pickling and
Sandblasting.
8. the metal otter board with multiple step according to claim 4, it is characterised in that by the step of electroforming such as
Under: pre-treatment → pad pasting → exposure → development → electroforming → move back film → stripping → subsequent treatment；Wherein pre-treatment includes oil removing, acid
Wash and sandblasting；Described subsequent treatment includes oil removing and pickling.
9. the metal otter board with multiple step according to claim 4, it is characterised in that lead to overetched step such as
Under: pre-treatment → pad pasting → expose → develop → etch → move back mould → subsequent treatment；Wherein pre-treatment includes oil removing, pickling and spray
Sand；Described subsequent treatment includes oil removing and pickling.
10. the metal otter board with multiple step according to claim 5, it is characterised in that lead to overetched step such as
Under: pre-treatment → pad pasting → expose → develop → etch → move back mould → subsequent treatment；Wherein pre-treatment includes oil removing, pickling and spray
Sand；Described subsequent treatment includes oil removing and pickling.
11. metal otter boards with multiple step according to claim 1, it is characterised in that the step bag of metal otter board
Include the one in the recessed step of the raised step of printing surface, the recessed step of printing surface, the raised step of PCB surface, PCB surface or
Multiple ledge structure features.
12. metal otter boards with multiple step according to claim 8, it is characterised in that need in electroforming to make auxiliary
Conductive plate carrys out the current density at dispersion of dry film location edge.
13. metal otter boards with multiple step according to right 1 to claim 11 is arbitrary, have the gold of multiple step
The full process stream journey of the preparation technology belonging to web plate includes but is not limited to the technological process of various piece, can be by some technological process
Merge and carry out or be combined optimizing, and the coordinate carrying out when each step is connected again is demarcated, and uses CCD para-position mode,
To guarantee the precision of Working position.
14. metal otter boards with multiple step according to right 1 to claim 11 is arbitrary, have the gold of multiple step
The full process stream journey of the preparation technology belonging to web plate includes but is not limited to the technological process of various piece, can be by some technological process
Merge and carry out or be combined optimizing, and carry out net polishing surface plate at the final step of technique.
15. metal otter boards with multiple step according to right 1 to claim 11 is arbitrary, have the gold of multiple step
The full process stream journey of the preparation technology belonging to web plate includes but is not limited to the technological process of various piece, can be by some technological process
Merge and carry out or be combined optimizing, and when carrying out continuous electroforming, in addition to first step electroforming step, all adopt before each electroforming
Strengthen the adhesion between each electroformed layer with activation method.
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| CN104837303A (en) * | 2015-04-25 | 2015-08-12 | 桐城运城制版有限公司 | Production technology of printing template |
| CN105463692A (en) * | 2015-11-19 | 2016-04-06 | 赫日光电（苏州）有限公司 | A knitting method of a silk screen with a moved screen silk yarn structure |
| CN111319346A (en) * | 2018-12-14 | 2020-06-23 | 天津环鑫科技发展有限公司 | GPP chip overprinting screen printing screen plate and process method thereof |
| CN113176702B (en) * | 2021-05-18 | 2024-05-07 | 深圳市志凌伟业光电有限公司 | Film, metal grid preparation method and metal grid |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096747A (en) * | 1993-06-24 | 1994-12-28 | 498775安大略有限公司 | Touch printed matter of silk screen process and typography thereof |
| CN1333130A (en) * | 2000-07-11 | 2002-01-30 | 松下电器产业株式会社 | Screen plate printing method, screen printer and container for storage for paste agent thereof |
| JP2003080859A (en) * | 2001-09-13 | 2003-03-19 | Rohm Co Ltd | Method for screen-printing paste on lead frame, and its apparatus |
| JP2006213000A (en) * | 2005-02-07 | 2006-08-17 | Bonmaaku:Kk | Screen printing plate and its manufacturing method |
| CN102248756A (en) * | 2010-12-31 | 2011-11-23 | 友达光电股份有限公司 | Printing system, printing screen plate and printing template contained in printing system, and printing method of printing screen plate and printing template |
-
2012
- 2012-01-16 CN CN201210010723.0A patent/CN103203980B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096747A (en) * | 1993-06-24 | 1994-12-28 | 498775安大略有限公司 | Touch printed matter of silk screen process and typography thereof |
| CN1333130A (en) * | 2000-07-11 | 2002-01-30 | 松下电器产业株式会社 | Screen plate printing method, screen printer and container for storage for paste agent thereof |
| JP2003080859A (en) * | 2001-09-13 | 2003-03-19 | Rohm Co Ltd | Method for screen-printing paste on lead frame, and its apparatus |
| JP2006213000A (en) * | 2005-02-07 | 2006-08-17 | Bonmaaku:Kk | Screen printing plate and its manufacturing method |
| CN102248756A (en) * | 2010-12-31 | 2011-11-23 | 友达光电股份有限公司 | Printing system, printing screen plate and printing template contained in printing system, and printing method of printing screen plate and printing template |
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