CN115767934A - Manufacturing method of micro-space bonding pads - Google Patents

Manufacturing method of micro-space bonding pads Download PDF

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CN115767934A
CN115767934A CN202211404805.3A CN202211404805A CN115767934A CN 115767934 A CN115767934 A CN 115767934A CN 202211404805 A CN202211404805 A CN 202211404805A CN 115767934 A CN115767934 A CN 115767934A
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copper
board
etching
electroplating
mils
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温锦洪
陈志新
刘生根
位珍光
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Yixing Silicon Valley Electronic Technology Co Ltd
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Yixing Silicon Valley Electronic Technology Co Ltd
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Abstract

The invention discloses a method for manufacturing a bonding pad with a micro-space, which comprises the following steps: s1, pressing an inner-layer daughter board and an outer-layer copper foil into a whole through a prepreg, and performing laser drilling according to design data to form a high-density interconnection board, namely an HDI board for short; s2, firstly, depositing copper, then, carrying out whole-plate electroplating on the HDI plate, and controlling the surface copper and uniformity of electroplating during electroplating; s3, optimizing the graphic data, namely changing the bound PADs with the widths of 3 mils and the intervals of 3 mils into bound PADs with the widths of 4.3 mils and the intervals of 1.7 mils on the data by presetting the widths of 1.3 mils; s4, transferring the pattern, namely transferring an outer layer circuit pattern onto the surface layer of the HDI board by adopting a negative film process and manufacturing a special photosensitive dry film for LDI and an automatic LDI exposure machine, wherein the outer layer circuit pattern comprises a bound PAD; the method is simple and easy to implement, and effectively solves the technical problem of manufacturing the binding PAD with the micro spacing of 3/3 mil.

Description

Manufacturing method of micro-space bonding pads
Technical Field
The invention belongs to the technical field of printing production, relates to manufacturing of a bonding pad, and particularly relates to a manufacturing method of a bonding pad bound at a micro-interval.
Background
PAD PAD is the basic unit of surface mount assembly, which is used to form the PAD pattern of circuit board, i.e. various PAD combinations designed for special element type; along with the high-speed development of electronic technology, the integration degree of printed products of the PCB is higher and higher, the design of the binding PAD of the PCB is required to be smaller and smaller, the size volume production manufacturing capacity of the binding PAD in the industry is 4/4mil, the requirements of the industry on development cannot be met, and the exploration of smaller and smaller PADs is a trend in the industry, so that the patent CN105405770A provides a manufacturing method of a binding PAD with ultra-small size, the etching difficulty can be reduced by strictly controlling the thickness of copper on the surface layer of a multilayer board in the manufacturing process, the proper compensation is carried out on the binding PAD, the etching precision can be better controlled, the difficulty of manufacturing the binding PAD with ultra-small size and tolerance is further reduced, but the patent only controls the thickness of surface copper, the uniformity of the copper during copper plating is not explained, the uniformity of the copper thickness is poor, the uniformity of the size of the PAD during etching cannot be easily ensured, the quality precision of the binding PAD is not explained, the manufacturing materials, the manufacturing equipment and the manufacturing parameters are not detailed enough; therefore, the development of a 3/3mil bound PAD with smaller tolerance is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the method for manufacturing the bonding PAD with the micro spacing, the method is simple and easy to implement, and the technical problem of manufacturing the bonding PAD with the micro spacing of 3/3mil is effectively solved.
In order to solve the technical problem, the invention provides a method for manufacturing a bonding pad with a micro-space, which specifically comprises the following steps:
s1, pressing an inner-layer daughter board and an outer-layer copper foil into a whole through a prepreg, and performing laser drilling according to design data to form a high-density interconnection board, namely an HDI board for short;
s2, firstly, copper deposition is carried out, then the HDI board is subjected to whole board electroplating, and the surface copper and uniformity of electroplating need to be controlled during electroplating, and the method specifically comprises the following steps:
controlling the copper of the electroplating surface: the thickness of the surface copper plating is 23 μm, and the copper of the whole surface of the electroplating is controlled to be 30 +/-3 um;
controlling the uniformity of electroplating: the uniformity is ensured to be within 4 mu m, and the HDI board is clamped and immersed in the electroplating bath in the electroplating process, and the control is as follows:
Figure 100002_DEST_PATH_IMAGE001
controlling the distance between two clamping plates on the HDI plate to be 10mm in the electroplating process;
Figure 308090DEST_PATH_IMAGE002
controlling the liquid level of the chemical plating solution in the plating tank to cover 5mm above the top of the HDI plate in the plating process;
Figure 100002_DEST_PATH_IMAGE003
setting positive compensation 3cm according to the size of the HDI board, namely the height of the floating frame from the board;
Figure 639845DEST_PATH_IMAGE004
titanium blue with copper balls at the anode in the electroplating bath is arranged in order;
s3, optimizing the graphic data, namely changing the width of the binding PADs with the width of 3 mils and the distance of 3 mils into the width of the binding PADs with the width of 4.3 mils and the distance of 1.7 mils on the data by pre-increasing 1.3 mils;
and S4, transferring the pattern, namely, adopting a negative film process, manufacturing a special photosensitive dry film for LDI and an automatic LDI exposure machine, and transferring the outer layer circuit pattern to the surface layer of the HDI board, wherein the outer layer circuit pattern comprises a bound PAD.
The technical scheme of the invention is further defined as follows:
further, in the method for manufacturing the fine pitch bonding pad, in the step S1, the thickness of the outer copper foil is 1/3oz, and 1/3oz =12 μm.
In the method for manufacturing the bonding pad with the small spacing, the step S2
Figure 143114DEST_PATH_IMAGE004
Between titanium blues containing copper ballsThe spacing was maintained at 8cm.
The technical effect is that because the titanium blue loaded with the copper balls is required to be spaced from the titanium blue, if the titanium blue is not uniform, the spacing can be different, and the copper plating is not uniform.
In the method for manufacturing the fine-pitch bonding pad, the pattern transfer process in the step S4 includes film sticking, exposure, development, etching, and film removal, and specifically includes:
Figure DEST_PATH_IMAGE005
pasting a film: firstly, roughening the board surface, pasting a film and pasting a dry film;
Figure 893027DEST_PATH_IMAGE006
exposure: transferring image information to a surface coated with a photosensitive material, i.e., a dry film, by emitting ultraviolet wavelengths;
Figure 100002_DEST_PATH_IMAGE007
developing: removing the dry film which is not polymerized and solidified through chemical reaction, wherein the part of the dry film is attached to the part outside the required pattern;
Figure 974115DEST_PATH_IMAGE008
etching: through chemical reaction, the required pattern stuck by the dry film is kept, copper outside the pattern is bitten and etched, a vacuum etching machine is adopted during etching, three nozzles are arranged above and below an etching line to spray etching liquid, and the pressure of the next three nozzles on the surface with the bound PAD is kept consistent;
Figure 100002_DEST_PATH_IMAGE009
film stripping: and removing the dry film attached to the pattern by a chemical reaction.
The method for manufacturing the bonding pad with the small space comprises the following steps
Figure 262008DEST_PATH_IMAGE005
When the film is pasted, a 30um acid development type dry film is adopted.
The technical effect is that the 30um acid developing dry film is selected, the resolving power of the dry film is stronger than that of the dry film of 40um, the dry film is suitable for manufacturing high-precision circuit printed boards, and the effect of the printed boards is guaranteed.
The method for manufacturing the bonding pad with the small space comprises the following steps
Figure 828688DEST_PATH_IMAGE006
And an automatic LDI exposure machine is adopted during medium exposure, and the exposure energy is 30mj.
The method for manufacturing the bonding pad with the small space comprises the following steps
Figure 603746DEST_PATH_IMAGE007
The speed of the conveyor belt was controlled to 3m/min during development.
The method has the technical effects that the dry film of the circuit to be etched is removed during development, the development is incomplete due to too high development speed, namely the dry film is not completely removed, the circuit is not etched to cause short circuit, the circuit is over developed due to too low speed, the circuit is thin or the circuit is completely corroded, the method limits the speed to be 3m/min, the optimal development effect of binding the PAD can be ensured, and the integrity of the PAD etching graph is ensured.
The manufacturing method of the bonding pad with the small space comprises the following steps
Figure 685097DEST_PATH_IMAGE008
The etching factor is more than or equal to 3.0 during etching.
The technical effect is that the etching factor and the etching liquid generate etching action downwards and towards the left and right directions in the etching process, the side etching is inevitable, the etching factor is the ratio of the side etching width to the etching depth and is called the etching factor, and the etching factor is more than 3.0 and is one of the standards for measuring the accuracy of the etched pattern.
The invention has the beneficial effects that:
the invention discloses a method for manufacturing a micro binding PAD in a negative film process of a mainstream HDI board, which is developed strictly and deeply by controlling the copper thickness range, selecting an outermost copper foil, plating copper thickness for electroplating, selecting material equipment and completely explaining parameters.
The vacuum etching machine is used for production during etching, so that when the machine sprays etching liquid medicine to etch a PCB, a vacuum pump can be fully utilized to pump away redundant etching liquid on the board surface, the newly sprayed etching liquid can quickly react with the copper surface of the PBC board, incomplete etching caused by accumulation of the etching liquid medicine on the board surface, residual copper on the edge of a PAD (PAD edge) and an etching factor of more than 3.0 can be effectively avoided.
Compared with the prior art, the uniformity of the copper thickness is poor, the PAD is bound by 3/3mil, and the uniformity of the size is not easy to ensure during etching.
In the prior art, the original design values are bound with 3mil bonding PADs, 3mil spacing and 2.4mil conventional compensation spacing, which means that the bound PAD compensation is only 0.6mil, and the etched bound PAD is difficult to reach the width of 3 mil; the etching amount in the etching process is reduced, and the compensation of binding PADs is increased to solve the technical problem of manufacturing the binding PADs with the micro spacing of 3/3 mil.
Drawings
FIG. 1 is a diagram of a bound PAD structure for an original design requirement;
FIG. 2 is a diagram illustrating a binding PAD structure for a pre-determined size of a design during manufacture according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a bonding PAD structure actually made by the method for making a fine pitch bonding PAD according to the present invention;
fig. 4 is a schematic diagram of an etching factor calculation formula in the method for manufacturing a fine pitch bonding pad according to the embodiment of the invention.
Detailed Description
Example 1
The method for manufacturing the micro-space bonding pad provided by the embodiment specifically comprises the following steps:
s1, pressing an inner-layer daughter board and an outer-layer copper foil into a whole through a prepreg in the prior art, and performing laser drilling according to design data to form a high-density interconnection board, namely an HDI board for short;
the thickness of the outer layer copper foil is 1/3OZ,1/3OZ =12 μm;
s2, firstly, copper deposition is carried out, then the HDI board is electroplated in a whole board mode, the manufacturing difficulty of binding PAD etching is reduced, and the surface copper and uniformity of electroplating need to be controlled during electroplating, and the method specifically comprises the following steps:
controlling the copper of the electroplating surface: the thickness of the surface copper plating is 23 μm, and the copper of the whole surface of the electroplating is controlled to be 30 +/-3 um;
controlling the uniformity of electroplating: the uniformity is ensured to be within 4 mu m, the HDI plate is clamped by two clamping plates and immersed in the electroplating bath during the electroplating process, and the control is as follows:
Figure 647236DEST_PATH_IMAGE001
controlling the distance between two clamping plates on the HDI plate to be 10mm in the electroplating process;
Figure 557555DEST_PATH_IMAGE002
controlling the liquid level of the chemical plating solution in the plating bath to cover 5mm above the top of the HDI plate in the plating process;
Figure 921540DEST_PATH_IMAGE003
setting positive compensation 3cm according to the size of the HDI board, namely the height of a floating frame from the board, wherein the floating frame is a lowermost power generation board in the electroplating bath;
Figure 750956DEST_PATH_IMAGE004
titanium blues with copper balls at the anodes in the electroplating bath are arranged in order, and the space between the titanium blues with the copper balls is kept at 8cm;
s3, optimizing the graphic data, namely changing the bound PADs with the widths of 3 mils and the intervals of 3 mils into bound PADs with the widths of 4.3 mils and the intervals of 1.7 mils on the data by pre-increasing the width by 1.3 mils as shown in FIGS. 1-3;
s4, transferring the pattern, namely, adopting a negative film process in the prior art, manufacturing a special photosensitive dry film for LDI and an automatic LDI exposure machine, and transferring an outer layer circuit pattern onto the surface layer of the HDI board, wherein the outer layer circuit pattern comprises a bound PAD;
the pattern transfer process comprises film pasting, exposure, development, etching and film stripping, and specifically comprises the following steps:
Figure 682615DEST_PATH_IMAGE005
pasting a film: according to the prior art, firstly, a plate surface is roughened, a film is pasted, and a dry film is pasted, wherein the dry film is a 30-micrometer acidic development type dry film;
Figure 255679DEST_PATH_IMAGE006
exposure: an automatic LDI exposure machine is adopted during exposure, the exposure energy is 30mj, and the image information is transferred to the surface coated with the dry film by emitting ultraviolet wavelength;
Figure 490482DEST_PATH_IMAGE007
developing: removing the dry film which is not polymerized and solidified through chemical reaction, wherein the part of the dry film is attached to the part outside the required pattern, and controlling the speed of the conveyor belt to be 3m/min during development;
Figure 756379DEST_PATH_IMAGE008
etching: through chemical reaction, a required pattern attached to the dry film is reserved, copper outside the pattern is bitten off, a vacuum etching machine in the prior art is adopted during etching, the etching speed is 3.8m/min, three nozzles are arranged above and below an etching line to spray etching liquid, in order to ensure the uniformity of binding PAD, the pressure of the next three nozzles on the surface with the bound PAD is kept consistent, and the etching factor is more than or equal to 3.0;
Figure 224269DEST_PATH_IMAGE009
stripping: and removing the dry film attached to the pattern through a chemical reaction.
Confirming the etching copper thickness and the line compensation value, and respectively calculating the etching factors, wherein the specific data is shown in table 1;
TABLE 1 design parameters
Figure DEST_PATH_IMAGE011
Three copper thicknesses, two pre-amplification values, were designed, and 5pnl was tested for each condition as follows:
(1) The outer layer is plated with 23 mu m of copper, the thickness of the surface layer copper of the outer layer is 1 mu m in advance when the circuit is etched, the etching factor is calculated through an etching factor formula in the prior art, as shown in fig. 4, the etching factor = A/B, 5 points are respectively taken from each block, the average value of the etching factor is 2.91, when the thickness of the outer layer copper is 1.3mil in advance, 5 points are respectively taken from each block, the average value of the etching factor is 3.89mil, and the etching precision effect of the bonding pad is good;
(2) Plating 28 micrometers of copper on the outer layer, pre-increasing by 1mil when the surface copper thickness of the outer layer is 35 micrometers during circuit etching, calculating by an etching factor formula, taking 5 points for each block respectively, wherein the average value of the etching factors is 2.75, and taking 5 points for each block when the surface copper thickness is pre-increased by 1.3mil, wherein the average value of the etching factors is 2.96mil;
(3) The outer layer is plated with 33 mu m copper, when the surface layer copper thickness of the outer layer is 40 mu m during circuit etching, the copper thickness is increased by 1mil in advance, 5 points are respectively taken for each block through the calculation of an etching factor formula, the average value of the etching factors is 2.86, when the copper thickness is increased by 1.3mil in advance, 5 points are respectively taken for each block, and the average value of the etching factors is 2.73mil.
When the copper thickness is 30um, the distance card is 1.7mil, and the compensation is 1.3mil, the etching factor can reach more than 3, the effect is optimal, subsequently, 200 PCBs are manufactured according to the process and the method, the width of the binding PAD is in the range of 2.85-2.91mil, the requirement is met, and therefore the corresponding copper thickness range and the binding PAD compensation value are determined.
Through detection, 200 bonding PADs are manufactured, the width of a finished product is 2.9mil, the minimum distance between two adjacent bonding PADs is 3.1mil, and the minimum distance accords with the specification of 3 +/-0.6 mil.
Comparative example 1
In the method for manufacturing the fine pitch bonding PADs provided by this embodiment, the specification requirements of the bonding PADs on the PCB are the same as those of embodiment 1, and the difference in the manufacturing process is that the predetermined width is different, that is, step S3 in embodiment 1, the graphic data is optimized, the bonding PADs with the width of 3mil and the pitch of 3mil on the data have the predetermined width of 1mil, the minimum pitch of two adjacent bonding PADs is 2.0mil, and other steps and parameters are completely the same as those of embodiment 1, 200 PCBs are manufactured by the method of comparative example 1, and the rejection rate of the bonding PADs with the specification requirements manufactured by the method of comparative example 1 is 90% through inspection.
According to the invention, through controlling the uniformity of the copper thickness, confirming the copper thickness range of 30 +/-3 mu m and binding PAD which is 1.3mil larger, the 3/3mil binding PAD can be manufactured by using the key elements, the technical difficulty is solved, the worry of receiving the order of the type in a factory is eliminated, the confidence of impacting a higher-end binding PAD PCB in the factory is greatly enhanced, and the size of the final finished binding PAD meets the requirement.
In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope of the claims of the present invention.

Claims (8)

1. A manufacturing method of a micro-space bonding pad is characterized by comprising the following steps:
s1, pressing an inner-layer daughter board and an outer-layer copper foil into a whole through a prepreg, and performing laser drilling according to design data to form a high-density interconnection board, namely an HDI board for short;
s2, firstly, copper deposition is carried out, then the HDI board is subjected to whole board electroplating, and the surface copper and uniformity of electroplating need to be controlled during electroplating, and the method specifically comprises the following steps:
controlling the copper of the electroplating surface: the thickness of the surface copper plating is 23 μm, and the copper of the whole surface of the electroplating is controlled to be 30 +/-3 um;
controlling the uniformity of electroplating: the uniformity is ensured to be within 4 mu m, and the HDI board is clamped and immersed in the electroplating bath in the electroplating process, and the control is as follows:
Figure DEST_PATH_IMAGE001
controlling two blocks on HDI board during electroplatingThe distance between the clamping plates is 10mm;
Figure 221120DEST_PATH_IMAGE002
controlling the liquid level of the chemical plating solution in the plating bath to cover 5mm above the top of the HDI plate in the plating process;
Figure DEST_PATH_IMAGE003
setting positive compensation 3cm according to the size of the HDI board, namely the height of the floating frame from the board;
Figure 155316DEST_PATH_IMAGE004
titanium blue with copper balls on the anode in the electroplating bath is arranged orderly;
s3, optimizing the graphic data, namely changing the bound PADs with the widths of 3 mils and the intervals of 3 mils into bound PADs with the widths of 4.3 mils and the intervals of 1.7 mils on the data by presetting the widths of 1.3 mils;
and S4, transferring the pattern, namely, adopting a negative film process, manufacturing a special photosensitive dry film for LDI and an automatic LDI exposure machine, and transferring the outer layer circuit pattern to the surface layer of the HDI board, wherein the outer layer circuit pattern comprises a bound PAD.
2. The method of making fine pitch bond pads of claim 1, further comprising: the thickness of the outer copper foil in step S1 was 1/3oz,1/3oz =, 12 μm.
3. The method of making fine pitch bond pads of claim 1, further comprising: step S2
Figure 661384DEST_PATH_IMAGE004
The spacing between the titanium blue loaded with copper balls was maintained at 8cm.
4. The method of making fine pitch bond pads of claim 1, further comprising: the image transfer process in the step S4 includes film sticking, exposure, development, etching, and film stripping, and specifically includes:
Figure 205497DEST_PATH_IMAGE006
pasting a film: firstly, roughening the surface of the board, pasting a film and pasting a dry film;
Figure DEST_PATH_IMAGE007
exposure: transferring image information to a surface coated with a photosensitive material, i.e., a dry film, by emitting ultraviolet wavelengths;
Figure 41997DEST_PATH_IMAGE008
developing: removing the non-polymerized and solidified dry film through chemical reaction, wherein the part of the dry film is attached to the part outside the required pattern;
Figure DEST_PATH_IMAGE009
etching: through chemical reaction, the required pattern stuck by the dry film is kept, copper outside the pattern is bitten and etched, a vacuum etching machine is adopted during etching, three nozzles are arranged above and below an etching line to spray etching liquid, and the pressure of the next three nozzles on the surface with the bound PAD is kept consistent;
Figure 597744DEST_PATH_IMAGE010
stripping: and removing the dry film attached to the pattern by a chemical reaction.
5. The method of making fine pitch bond pads of claim 4, further comprising: said step (c) is
Figure 399346DEST_PATH_IMAGE006
When the film is pasted, a 30um acid development type dry film is adopted.
6. According to claim 4The manufacturing method of the micro-space bonding pad is characterized in that: said step (c) is
Figure 306123DEST_PATH_IMAGE007
And an automatic LDI exposure machine is adopted during medium exposure, and the exposure energy is 30mj.
7. The method of making fine pitch bond pads of claim 4, wherein: said step (c) is
Figure 274210DEST_PATH_IMAGE008
The speed of the conveyor belt was controlled to 3m/min during development.
8. The method of making fine pitch bond pads of claim 4, further comprising: said step (c) is
Figure 605834DEST_PATH_IMAGE009
The etching factor is more than or equal to 3.0 during etching.
CN202211404805.3A 2022-11-10 2022-11-10 Manufacturing method of micro-space bonding pads Pending CN115767934A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117119709A (en) * 2023-09-08 2023-11-24 江苏博敏电子有限公司 Manufacturing process of MiniLED high-definition display screen circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117119709A (en) * 2023-09-08 2023-11-24 江苏博敏电子有限公司 Manufacturing process of MiniLED high-definition display screen circuit board
CN117119709B (en) * 2023-09-08 2024-03-22 江苏博敏电子有限公司 Manufacturing process of MiniLED high-definition display screen circuit board

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