CN103203957B - A kind of manufacture method of stepped formwork - Google Patents
A kind of manufacture method of stepped formwork Download PDFInfo
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- CN103203957B CN103203957B CN201210010731.5A CN201210010731A CN103203957B CN 103203957 B CN103203957 B CN 103203957B CN 201210010731 A CN201210010731 A CN 201210010731A CN 103203957 B CN103203957 B CN 103203957B
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- electroforming
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- region
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- 238000009415 formwork Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000005323 electroforming Methods 0.000 claims abstract description 73
- 238000000034 method Methods 0.000 claims abstract description 35
- 238000005530 etching Methods 0.000 claims abstract description 26
- 238000005554 pickling Methods 0.000 claims abstract description 20
- 238000002203 pretreatment Methods 0.000 claims abstract description 15
- 238000005488 sandblasting Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 15
- 238000005516 engineering process Methods 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 10
- 239000010959 steel Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive Effects 0.000 claims description 3
- 238000005422 blasting Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 239000011162 core material Substances 0.000 claims 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 239000002253 acid Substances 0.000 claims 1
- 230000003213 activating Effects 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 1
- 210000003141 Lower Extremity Anatomy 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 33
- 238000007639 printing Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000006071 cream Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 241001646071 Prioneris Species 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive Effects 0.000 description 1
- 125000004429 atoms Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 230000003247 decreasing Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Abstract
A kind of manufacture method of stepped formwork.Concrete technological process is as follows: electroforming the first electroformed layer: 1 → exposure, 1 → surface development, the 1 → electroforming 1 of core process → pre-treatment (oil removing, pickling, sandblasting) → pad pasting；Electroforming PCB surface raised step (up step): pre-treatment (pickling, sandblasting) → pad pasting 2 → exposure 2 → surface development, 2 → electroforming 2 → take off film → stripping；The recess step (down step) of etching PCB surface: the two-sided pad pasting of electroformed layer → PCB surface exposure → PCB surface development → PCB surface etching → lower limb film → subsequent treatment (oil removing, pickling).The electroforming template prepared by process above flow process, PCB surface has raised step (up step) and recess step (down step), and step region has opening figure.The technique that the present invention relates to solves the technical problem that as follows: the figure opening in raised step (up step) region prepared and the aligning accuracy of the first electroformed layer opening are high；The opening hole wall of the integral electroforming template prepared is smooth, the bad phenomenon such as impulse-free robustness, plating, the bad defects such as surface quality is good, free of pinholes, pit；The thickness evenness COV in plate face is within 10%；Plate face one-level light；The cast layer in raised step (up step) region and the adhesion of the first electroformed layer are big, difficult drop-off.
Description
Technical field
The present invention relates to the manufacture method of a kind of stepped formwork, belong to material manufacture and manufacture field, be specifically related to SMT neck
In territory, a kind of PCB surface has raised step and recess step and a stepped area and plane domain is respectively provided with the printing of opening figure
By the processing technology of mask plate.
Background technology
Along with electronic product pursues miniaturization, the piercing insert element used in the past cannot reduce；Electronic product function
More complete, the integrated circuit (IC) used cannot punctured element, the most on a large scale, highly integrated IC, it has to use table
Face surface mount elements, therefore stencil print process has obtained rapid development at electronics manufacturing, and SMT printing is exactly typical case.Template
Buying be not only the first step of SMT assembly technology, be also a most important step.The major function of template is to aid in the heavy of tin cream
Long-pending, it is therefore an objective to the material of accurate quantity is transferred on tabula rasa position accurately.Tin cream is blocked in template the fewest, is deposited on electricity
On the plate of road the most.Therefore the port quality of template is required smooth.Particularly with the pcb board that some are special, have on pcb board
Some privileged sites need the amount of tin cream more than other positions or few, it is therefore necessary to must add the position of corresponding templates
Thickness or reduction processing.
Printing stencil is used to the mould of print solder paste, the most typically uses steel mesh.The template of chemical etching is template generation
The main Types on boundary.They costs are minimum, have enough to meet the need the fastest.Being made by metal steel disc of the Stainless Molding Board of chemical etching
On expose light-sensitive surface, position photosensitive instrument with pin by graph exposure on metal steel disc two sides, then use double-side technology simultaneously
Metal steel disc is corroded from two sides.The defect of etching template itself and difficulty of processing determine etching template and are gradually backed out market.And
Etch process is then applied to ladder template.
For the formation of opening, its principal mode is electroforming and cut, and traditional handicraft passes through laser cutting technique system
The punching block opening size quality made can not reach requirement, and opening is rough sawtooth, and stripping result is bad, and board surface quality is the most inadequate
Good.And be electroformed, a kind of technique being incremented by rather than successively decreasing, the metal form produced has the sealing characteristics of uniqueness, subtracts
Few needs that Xi Qiao and template bottom surface are cleaned.This technique provides the location of almost Perfect, does not has the restriction of geometry, has
Inherent trapezoidal smooth hole wall and low surface tension, improve tin cream release.By substrate (or the core a perforate to be formed
Mould) upper lithographic glue, the most one by one atom, around photoresist, electroforming goes out template layer by layer.
Therefore, utilize etching and electroforming process integration to prepare PCB surface and there is up step and the metal form of down step
Enjoy people to pay close attention to, also there is certain challenge simultaneously.
Summary of the invention
Present invention seek to address that above technical problem, invent the manufacture method of a kind of stepped formwork.Utilize this processing technology
The metal form being made, PCB surface has raised step (up step) and recess step (down step), and raised step
Region, regional peace face is respectively provided with opening figure.
A kind of manufacture method of stepped formwork.Its concrete technology flow process is as follows:
Electroforming the first electroformed layer: core process → pre-treatment (oil removing, pickling, sandblasting) → pad pasting 1 → exposure, 1 → one side shows
Shadow 1 → electroforming 1；
Electroforming PCB surface up step: pre-treatment (pickling, sandblasting) → pad pasting 2 → exposure 2 → surface development, 2 → electroforming 2 →
Take off film → stripping；
The two-sided pad pasting of down step: electroformed layer of etching PCB surface → PCB surface exposure → PCB surface development → PCB surface etching
→ lower limb film → subsequent treatment (oil removing, pickling).
Specifically, the concrete technology flow process of each step is:
Electroforming the first electroformed layer:
(1) core processes: selection 0.3mm rustless steel is as core, and substrate is cut into required size.
(2) pre-treatment: after core oil removing, pickling, carries out two sides blasting treatment, improves surface roughness, thus improves
Dry film and the adhesion of steel disc during pad pasting.
(3) pad pasting 1: select the dry film that adhesive force is high, fall film phenomenon during preventing electroforming.After choosing dry film,
Pad pasting is carried out at mandrel surface.
(4) exposure 1: being exposed pasted dry film, exposure area is opening figure region, exposure dry film is as electroforming
Protective layer in journey, stops material deposition.
(5) surface development 1: the development of unexposed dry film is removed, enters electroforming process.
(6) electroforming 1: electroforming material is deposited on without dry film region, clones the opening figure consistent with exposure figure.
Electroforming PCB surface up step:
(7) pre-treatment: by the first electroformed layer pickling, sandblasting.
(8) pad pasting 2: continue pad pasting on the first electroformed layer surface, because the up step region area of wanted electroforming is less,
So repeat press mold when pad pasting, it is ensured that dry film is close to the first electroformed layer, i.e. guarantees that up step region is not easily disconnected from.
(9) exposure 2: by the lateral opening para-position of CCD, accurate contraposition up step regional location and the opening figure district of up step
Territory.Then the opening figure in the region beyond wanted electroforming up step and up step region is exposed.
(10) surface development 2: unexposed dry film is removed in development, it would be desirable to (the i.e. up step district, region of deposition electroforming material
Territory) come out.
(11) electroforming 2: because up step region area is less, during electroforming, electric current density line is concentrated, and can cause electroforming up
The edge effect in step region is serious, so in the ready careful para-position of shunting auxiliary template to the first electroformed layer, noting
Not scratch figure and electroformed layer, the first electroformed layer, flow distribution plate one piece are fixed to fly on bar, immerse electrotyping bath, control electroforming up
Step thickness.
Described flow distribution plate, i.e. cuts out one by the method for cut on the corrosion resistant plate equivalently-sized with core
Identical with up step regional location, that size is identical through hole, plays share current, alleviates the effect of edge effect.
Carry out secondary electroforming, deposit electroforming material at unexposed area (i.e. without dry film region), form the up of PCB surface
step。
(12) film is taken off: remove clean by exposure dry film.
(13) peel off: after secondary electroforming completes, electroformed layer is stripped down from core.
The down step of etching PCB surface:
(14) the two-sided pad pasting of electroformed layer: by two-sided for electroformed layer pad pasting.
(15) PCB surface exposure: the Zone Full beyond down district that exposure will etch, as protecting film, prevents etching
Liquid corrodes.
(16) PCB surface development: unexposed dry film is removed by developing process, carry out after development development inspection (whether fall film,
Rub film, the development phenomenon such as to the greatest extent), if no problem enters the operation of etch printing face down step.
(16) PCB surface etching: by pad pasting, expose, develop after cast layer send in horizontal etching machine, by the side sprayed
Etching solution is sprayed PCB surface by formula, produces chemical reaction at the substrate surface without exposure dry film, etches away layer of metal, so
In PCB surface, just define recess step region, as shown in Fig. 34.
(17) take off film: after having etched, take off Membrane cleaning.
(18) subsequent treatment: template is carried out oil removing, pickling cleaning.
Preferably, the technological parameter of each step is as follows:
Pre-treating technology parameter is as follows:
| The oil removing time | 1～2min |
| Pickling time | 1～2min |
| Blast time | 3～5min |
| Pressure (pis) | 2 |
Exposure imaging technological parameter is as follows:
| Core size (mm) | 800*600*0.3 |
| Exposure 1 amount (mj) | 1000～2000 |
| Time of exposure 1(s) | 800～2500 |
| Surface development 1 time (s) | 120～180 |
| Exposure 2 amounts (mj) | PCB surface 500～1000 |
| Time of exposure 2(s) | PCB surface 300～600 |
| Surface development 2 time (s) | 60～120 |
Etch process parameters is as follows:
| Etching solution proportion | 1.30～1.50 |
| Fe3+Concentration (g/L) | 100～300 |
| pH | 1.4～1.8 |
| Temperature (DEG C) | 50～60 |
| Pressure (pis) | 10～20 |
| Etching speed | 8～20 |
Electroforming process parameter is as follows:
Apply above processing technology can prepare PCB surface and there is down step and the metal form of up step,
And step region has opening figure.
This patent, compared with conventional art, has a following beneficial effect:
(1) port quality is good, and hole wall is smooth, the bad phenomenon such as impulse-free robustness, sawtooth, and tapering is 5o～7oBetween；
(2) first electroformed layer opening figure are high with the positional precision of the opening figure of up step；
(3) thickness evenness is good, and uniformity COV is within 10%；
(4) adhesion of Up step and the first electroformed layer is high, difficult drop-off.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage are from combining the accompanying drawings below description to embodiment and will become
Substantially with easy to understand.
Fig. 1. the opening sectional view in PCB surface up region
1-PCB substrate
2-template
3a-welds base station
3b-welds base station
4-plane opening
Up region, 5-PCB face
6-PCB face up region openings
7-mould printing face
8-template PCB surface step local pattern example 1
Down region, Fig. 2 .PCB face sectional view
1-PCB substrate
2-template
3-welds base station
4-plane opening
Elevated regions on 5-PCB plate
Down region, 6-PCB face
7-printing surface
8-PCB face
Fig. 3. template schematic diagram
1-template
2-plane opening
3-PCB face sunk area
4-template PCB surface
The opening of 5-PCB face elevated regions
6-PCB face elevated regions
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
During in the concrete technological process of this religious name and the present invention, the Noticed Problems in technological process will be described below
More detailed.
A kind of manufacture method of stepped formwork.Its concrete technology flow process is as follows:
Electroforming the first electroformed layer: core process → pre-treatment (oil removing, pickling, sandblasting) → pad pasting 1 → exposure, 1 → one side shows
Shadow 1 → electroforming 1；
Electroforming PCB surface up step: pre-treatment (pickling, sandblasting) → pad pasting 2 → exposure 2 → surface development, 2 → electroforming 2 →
Take off film → stripping；
The two-sided pad pasting of down step: electroformed layer of etching PCB surface → PCB surface exposure → PCB surface development → PCB surface etching
→ lower limb film → subsequent treatment (oil removing, pickling).
Specifically, the concrete technology flow process of each step is:
Electroforming the first electroformed layer:
(1) core processes: selection 0.3mm rustless steel is as core, and substrate is cut into required size.
(2) pre-treatment: after core oil removing, pickling, carries out two sides blasting treatment, improves surface roughness, thus improves
Dry film and the adhesion of steel disc during pad pasting.
(3) pad pasting 1: select the dry film that adhesive force is high, fall film phenomenon during preventing electroforming.After choosing dry film,
Pad pasting is carried out at mandrel surface.
(4) exposure 1: being exposed pasted dry film, exposure area is opening figure region, exposure dry film is as electroforming
Protective layer in journey, stops material deposition.
(5) surface development 1: the development of unexposed dry film is removed, enters electroforming process.
(6) electroforming 1: electroforming material is deposited on without dry film region, clones the opening figure consistent with exposure figure.
Electroforming PCB surface up step:
(7) pre-treatment: by the first electroformed layer pickling, sandblasting.
(8) pad pasting 2: continue pad pasting on the first electroformed layer surface, because the up step region area of wanted electroforming is less,
So repeat press mold when pad pasting, it is ensured that dry film is close to the first electroformed layer, i.e. guarantees that up step region is not easily disconnected from.
(9) exposure 2: by the lateral opening para-position of CCD, accurate contraposition up step regional location and the opening figure district of up step
Territory.Then the opening figure in the region beyond wanted electroforming up step and up step region is exposed.
(10) surface development 2: unexposed dry film is removed in development, it would be desirable to (the i.e. up step district, region of deposition electroforming material
Territory) come out.
(11) electroforming 2: because up step region area is less, during electroforming, electric current density line is concentrated, and can cause electroforming up
The edge effect in step region is serious, so in the ready careful para-position of shunting auxiliary template to the first electroformed layer, noting
Not scratch figure and electroformed layer, the first electroformed layer, flow distribution plate one piece are fixed to fly on bar, immerse electrotyping bath, control electroforming up
Step thickness.
Described flow distribution plate, i.e. cuts out one by the method for cut on the corrosion resistant plate equivalently-sized with core
Identical with up step regional location, that size is identical through hole, plays share current, alleviates the effect of edge effect.
Carry out secondary electroforming, deposit electroforming material at unexposed area (i.e. without dry film region), form the up of PCB surface
step。
(12) film is taken off: remove clean by exposure dry film.
(13) peel off: after secondary electroforming completes, electroformed layer is stripped down from core.
The down step of etching PCB surface:
(14) the two-sided pad pasting of electroformed layer: by two-sided for electroformed layer pad pasting.
(15) PCB surface exposure: the Zone Full beyond down district that exposure will etch, as protecting film, prevents etching
Liquid corrodes.
(16) PCB surface development: unexposed dry film is removed by developing process, carry out after development development inspection (whether fall film,
Rub film, the development phenomenon such as to the greatest extent), if no problem enters the operation of etch printing face down step.
(16) PCB surface etching: by pad pasting, expose, develop after cast layer send in horizontal etching machine, by the side sprayed
Etching solution is sprayed PCB surface by formula, produces chemical reaction at the substrate surface without exposure dry film, etches away layer of metal, so
In PCB surface, just define recess step region, as shown in Fig. 34.
(17) take off film: after having etched, take off Membrane cleaning.
(18) subsequent treatment: template is carried out oil removing, pickling cleaning.
The technological parameter of one group of preferred each step is as follows:
Pre-treating technology parameter:
| The oil removing time | 2min |
| Pickling time | 2min |
| Blast time | 5min |
| Pressure (pis) | 2 |
Exposure imaging technological parameter is as follows:
| Core size (mm) | 800*600*0.3 |
| Exposure 1 amount (mj) | 1500 |
| Time of exposure 1(s) | 1500 |
| Surface development 1 time (s) | 150 |
| Exposure 2 amounts (mj) | PCB surface 750 |
| Time of exposure 2(s) | PCB surface 450 |
| Surface development 2 time (s) | 100 |
Etch process parameters is as follows:
| Etching solution proportion | 1.40 |
| Fe3+Concentration (g/L) | 200 |
| pH | 1.6 |
| Temperature (DEG C) | 55 |
| Pressure (pis) | 15 |
| Etching speed | 14 |
Electroforming process parameter is as follows:
During electroforming, increased by pre-treatment increase before blast time, electroforming the modes such as soak time improve two coating it
Between adhesion, prevent coating from coming off, by test ready-made anode baffle control electric current density line, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Coating matter is ensured by the amount adjusting electroforming additive
Amount, as bright in coating, free of pinholes, pit；Coating opening hole wall quality is reached by control development point good, without hair during development
Thorn, plating.
Thus produce stepped formwork as shown in Figure 3, and the printing process of this kind of printing stencil is as shown in Figure 1, 2.
The raised step of PCB surface, it primarily serves the purpose of and carries out material printing at pcb board sunk area, increases lower stannum amount, such as 6 institutes in 1
Show；And the recess step of PCB surface, it primarily serves the purpose of the elevated regions avoided on pcb board face, as shown in Fig. 26.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
These embodiments can be carried out multiple change in the case of departing from the principle of the present invention and objective, revise, replace and modification, this
The scope of invention is limited by claim and equivalent thereof.
Claims (11)
1. a manufacture method for stepped formwork, concrete technological process is as follows:
Electroforming the first electroformed layer: core process → pre-treatment → pad pasting 1 → exposure, 1 → surface development, 1 → electroforming 1；
Electroforming PCB surface raised step: pre-treatment → pad pasting 2 → exposure 2 → surface development, 2 → electroforming 2 → take off film → stripping；
The recess step of etching PCB surface: the two-sided pad pasting of electroformed layer → PCB surface exposure → PCB surface development → PCB surface etches → take off film
→ subsequent treatment；Wherein subsequent treatment includes oil removing, acid pickling step；
Wherein, the core of electroforming the first electroformed layer is processed as selecting rustless steel as core, and substrate is cut into required size；
After the pre-treatment of electroforming the first electroformed layer is core oil removing, pickling, the substrate cut is carried out two sides blasting treatment；Pad pasting 1
For selecting the dry film that adhesive force is high, carry out pad pasting at mandrel surface；Exposure 1 is to be exposed pasted dry film, and exposure area is
Opening figure region；Surface development 1 is the development of unexposed dry film to be removed；Electroforming 1 is to be deposited on electroforming material without dry film district
Territory, clones the opening figure consistent with exposure figure；The pre-treatment of electroforming PCB surface raised step is by the first electroformed layer surface
Pickling, sandblasting；Pad pasting 2 is to continue patch dry film on the first electroformed layer；Exposure 2 be by wanted electroforming raised step beyond region
And the opening figure exposure in raised step region；Surface development 2 is that unexposed dry film is removed in development, it would be desirable to deposition electroforming material
Come out in the region of material；Electroforming 2 is in the ready careful para-position of shunting accessory plate to the first electroformed layer, by the first electroforming
Layer, flow distribution plate one piece are fixed to fly on bar, immerse electrotyping bath, control electroforming raised step thickness；Stripping is general after secondary electroforming
Electroformed layer strips down from core；The film that takes off in the recess step step of etching PCB surface is, after etching completes, to take off Membrane cleaning；
Described flow distribution plate, i.e. cuts out one with convex by the method for cut on the corrosion resistant plate equivalently-sized with core
Play stepped area position identical, through hole that size is identical, plays share current, alleviates the effect of edge effect
The manufacture method of stepped formwork the most according to claim 1, it is characterised in that core material be rustless steel, pure nickel,
Any one in dilval.
The manufacture method of stepped formwork the most according to claim 1, it is characterised in that the stepped formwork prepared
PCB surface has raised step region and recess step region.
The manufacture method of stepped formwork the most according to claim 1, it is characterised in that the stepped formwork prepared has
Opening figure, and opening figure is distributed in region, raised step regional peace face.
The manufacture method of stepped formwork the most according to claim 1, it is characterised in that electroforming process for the second time, uses and divides
Stream plate reduces electric current density, alleviates the edge effect in raised step region.
The manufacture method of stepped formwork the most according to claim 1, it is characterised in that stepped formwork material is pure nickel, nickel
Any one in ferrum.
The manufacture method of stepped formwork the most according to claim 1, it is characterised in that pre-treating technology parameter is as follows:
。
The manufacture method of stepped formwork the most according to claim 1, it is characterised in that exposure imaging technological parameter is as follows:
。
The manufacture method of stepped formwork the most according to claim 1, it is characterised in that etch process parameters is as follows:
。
The manufacture method of stepped formwork the most according to claim 1, it is characterised in that there is before electroforming activating process, electricity
Casting process parameter is as follows:
。
The manufacture method of 11. stepped formworks according to claim 1, it is characterised in that
Stepped formwork deposit thickness uniformity COV is within 10%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010731.5A CN103203957B (en) | 2012-01-16 | A kind of manufacture method of stepped formwork |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010731.5A CN103203957B (en) | 2012-01-16 | A kind of manufacture method of stepped formwork |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203957A CN103203957A (en) | 2013-07-17 |
| CN103203957B true CN103203957B (en) | 2016-11-30 |
Family
ID=
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63164327A (en) * | 1986-12-26 | 1988-07-07 | Kyushu Hitachi Maxell Ltd | Manufacture of film carrier with bump |
| CN1715455A (en) * | 2005-05-13 | 2006-01-04 | 大连理工大学 | Method for producing microelectromoulding metal mould |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| TWI306061B (en) * | 2006-04-27 | 2009-02-11 | Transonic Prec Ind Inc | Multi-layer metal printing stencil and its fabricating method |
| CN101419402A (en) * | 2008-11-21 | 2009-04-29 | 华中科技大学 | Method for making cemented carbide punching mold |
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63164327A (en) * | 1986-12-26 | 1988-07-07 | Kyushu Hitachi Maxell Ltd | Manufacture of film carrier with bump |
| CN1715455A (en) * | 2005-05-13 | 2006-01-04 | 大连理工大学 | Method for producing microelectromoulding metal mould |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| TWI306061B (en) * | 2006-04-27 | 2009-02-11 | Transonic Prec Ind Inc | Multi-layer metal printing stencil and its fabricating method |
| CN101419402A (en) * | 2008-11-21 | 2009-04-29 | 华中科技大学 | Method for making cemented carbide punching mold |
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