CN1804138A - Mask electro-forming method for vaporization coating of organic light-emitting display - Google Patents
Mask electro-forming method for vaporization coating of organic light-emitting display Download PDFInfo
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- CN1804138A CN1804138A CNA2005101013809A CN200510101380A CN1804138A CN 1804138 A CN1804138 A CN 1804138A CN A2005101013809 A CNA2005101013809 A CN A2005101013809A CN 200510101380 A CN200510101380 A CN 200510101380A CN 1804138 A CN1804138 A CN 1804138A
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- 238000005323 electroforming Methods 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000011248 coating agent Substances 0.000 title claims description 14
- 238000000576 coating method Methods 0.000 title claims description 14
- 238000009834 vaporization Methods 0.000 title claims description 13
- 230000008016 vaporization Effects 0.000 title claims description 13
- 238000012856 packing Methods 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 51
- 239000002184 metal Substances 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 47
- 239000000243 solution Substances 0.000 claims description 45
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 238000007654 immersion Methods 0.000 claims description 18
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 12
- 230000004913 activation Effects 0.000 claims description 12
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 9
- 238000002161 passivation Methods 0.000 claims description 9
- 238000005238 degreasing Methods 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 7
- 239000008151 electrolyte solution Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000013527 degreasing agent Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000002203 pretreatment Methods 0.000 claims description 6
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 6
- 235000017550 sodium carbonate Nutrition 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- 238000005282 brightening Methods 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000000080 wetting agent Substances 0.000 claims description 4
- 239000003153 chemical reaction reagent Substances 0.000 claims description 3
- 239000003814 drug Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000006386 neutralization reaction Methods 0.000 claims description 3
- 230000003472 neutralizing effect Effects 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims description 3
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 claims description 3
- 238000007670 refining Methods 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 5
- 230000003213 activating effect Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 description 9
- 230000008020 evaporation Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical group [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 239000004141 Sodium laurylsulphate Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 125000005619 boric acid group Chemical group 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The mask electroforming method for OLED comprises: preparing module core, pre-treating the core; sticking mask; exposing; developing; deoiling; cleaning in water; activating/passivating; cleaning; electroforming mask; cleaning; removing mask; peeling mask; bonding with silk screen; detecting the product; packing. This invention can prepare the high-precise mask for OLED with thickness less than 0.5mm, and has opening tolerance up to +/-0.005mm; for example, for a 370mmx470mm mask plate, the crosshole position tolerance just is +/-0.008mm.
Description
Technical field
The present invention relates to the making of organic light emitting display, especially relate to the electro-forming method of a kind of vaporization coating of organic light-emitting display with mask.
Background technology
Organic light emitting display (Organic Light Emitting Display, be called for short OLED) not only possess the light and handy thin characteristics of the few and LCD display of brightness height, the consumes energy of CRT monitor, also have the environmental limit of not being subjected to, need not the outstanding advantage of backlight.Even if also can easily see pattern and character clearly in the sun, and has the function of convolution.The OLED display screen can be done lighter and thinnerly, and visible angle is bigger, and can significantly save electric energy.The composition of OLED comprises the glass substrate of 1 agreement that contracts a film or TV play to an actor or actress 1.3mm, less than high purity metal material and the ITO conductive glass of 0.3mm, total thickness is less than 2mm.The manufacturing key link of OLED is, luminous organic material is applied to the ITO surface, its coating quality has directly determined the quality of OLED, need to use two kinds of mask in the making: a kind of is photomask, be used for the ITO conductive glass is carried out photoetching, produce transparent conductive anode, adopt CRT shadow mask plate-making technology to make the chromium photomask usually, its method has following steps successively: photoetching chromium plate, development, etching, demoulding, cleaning, drying, finished product; Another kind is the metal mask version, as evaporation mask evaporation metal strip negative electrode on device, the general CRT of employing shadow mask fine etching technique is made the metal mask version, and its method has following steps successively: steel band cleans, is coated with photoresists, two-sided mask lithography, two-sided burn into stripping, cleaning, drying, finished product.The defective of this making method mainly contains: (1) must will carry out on certain thickness tinsel, makes mask thickness at least more than 0.05mm; (2) there is sideetching; (3) etching is based on chemical dissolution, and the open surface of formation is crude, and hole wall is not too smooth, is unfavorable for that luminescent material transfers to the ITO surface fully; (4) ratio of precision is low high, and the perforate tolerance reaches ± 0.005mm, and breadth is that the hole of the mask plate of 370mm * 470mm asks that position of related features is up to ± 0.008mm; (5) etching mask plate bore size tolerance is ± (0.010mm～0.015mm)
Summary of the invention
Technical problem to be solved by this invention is to overcome the defective that above-mentioned prior art exists, and proposes the electro-forming method of a kind of organic light emitting display OLED evaporation with mask.By the mask made of electroforming with micromolecular luminous organic material evaporation to ito glass.
Technical problem of the present invention is solved like this:
This OLED evaporation electro-forming method of mask has following steps successively:
Core preparation → core pre-treatment → pad pasting → exposure → development → oil removing → washing.
This OLED evaporation with the characteristics of the electro-forming method of mask is: following subsequent step is also arranged successively:
Activation/passivation → washing → electroforming mask → wash → take off film → stripping → silk screen is bonding → finished product detection → finished product packing.
Technical problem of the present invention is to solve according to qualifications like this:
Described activation step is metal substrate to be immersed in the activation solution activate, and Immersion time is 5 minutes～10 minutes, and described activation solution is the hydrochloric acid soln of concentration 30%, and this step is applicable to the electroforming nickel dam that comes off from core easily.
Described passivation step is that metal substrate is immersed in passivation in the passivating solution, and Immersion time is 1.8 minutes～2.2 minutes, and described passivating solution is the potassium bichromate solution of concentration 10%, and this step is applicable to and is difficult to the electroforming nickel dam peeled off from core.
Described electroforming mask step is core to be installed on the jig frame and with power cathode link to each other, and then framework is put into electrotyping bath, is anode with the nickel plate, and electroforming process middle frame and metal substrate can independent rotation.Electroforming solution concentration field around the core of energising back makes metallic nickel that uniform deposition last layer metallic nickel mask on the metal substrate of phase anti-graphics arranged through electroforming solution, its thickness was regulated by electroforming solution concentration, current density and electroforming time, the bonding force of electroformed layer and metal substrate is too little, can bubble in the electroforming process, bonding force can't be peeled off too greatly again or make and peel off distortion.
Preferred scheme is, described electroforming mask step is to adopt negative electrode to move to add the gas alr mode metallic nickel is deposited on the metal substrate.The metallic nickel mask of Xing Chenging can be more even like this.
The component and the content of described electroforming solution are respectively:
Nickel sulfamic acid concentrated solution (180g/l) 333.0ml/l～389.0ml/l
Nickelous chloride concentrated solution (500g/l) 25.0ml/l～35.0ml/l
1,4 butyleneglycol 0.30g/l～0.50g/l
Wetting agent 0.05g/l～0.80g/l
Brightening agent 0.60g/l～1.00g/l
PH value buffer reagent 35.00g/l～45.00g/l
Described wetting agent is a sodium lauryl sulphate.
Described brightening agent is an asccharin.
Described pH value buffer reagent is a boric acid.
The pH value of described electroforming solution is 3.8～5.4, temperature is 45 ℃～60 ℃, and the electroforming current density is 2A/dm
2～10A/dm
2, the electroforming time is by the thickness of mask plate requirement and the current density decision of employing.
The described film step that takes off is that earlier the core of established metallic nickel mask to be immersed in temperature be that Immersion time is 30 minutes～35 minutes in 50 ℃～55 ℃ the sodium hydroxide solution of concentration 8%～10%, then, temperature being arranged in metal substrate is placed is that the ultrasonic wave of GC-001 of 45 ℃～50 ℃ concentration 8%～12% takes off film cylinder ultrasonic wave and took off film 1.8 minutes～2.2 minutes.
Described stripping step is with mechanical means sedimentary metallic nickel mask to be separated with metal substrate.
Described silk screen bonding step is that the isolated metal refining that has figure is fixed on the metal outer frame by glue.Mask is very strict to status requirement, and the position is determined by silk screen tension force, tension force size impact position precision, and described silk screen tension force is 9N/cm～11N/cm.
Described finished product detection step is that mask thicknesses, perforate quantity and size, positional precision are detected.
Technical problem of the present invention is further to solve like this:
Described core preparation step is, selects metal substrate, and preferred the selection is stainless steel substrate.
Described core pre-treatment step is to have step by step following successively: electrochemical deoiling → electrolytic degreasing → hot water wash → cold wash → neutralization → cold wash → air-dry; Wherein
Electrochemical deoiling is step by step, it is oil removing in 70 ℃～90 ℃ the degreaser that metal substrate is immersed in temperature, Immersion time is 25 minutes～30 minutes, and the component of described degreaser comprises sodium hydroxide, yellow soda ash and tertiary sodium phosphate, and their weight ratio is (6～10): (2～4): (5～7):
Electrolytic degreasing is step by step, and it is oil removing in 60 ℃～70 ℃ the electrolytic solution that metal substrate is immersed in temperature, and Immersion time is 0.8 minute～1.2 minutes, and described electrolytic solution is that content is the electrolytic solution of the electrolytic degreasing powder (UDYPREP283) of 60g/l.
Neutralizing is step by step, metal substrate is immersed in the neutralizer neutralize, and Immersion time is 0.3 minute～0.4 minute, and described neutralizer is the hydrochloric acid soln of concentration 15%.
Described step of membrane sticking is, with laminator thickness entirely is attached to metallic substrate surfaces greater than the photosensitive dry film of mask.The model of described photosensitive dry film comprises the RY3225 of Hitachi, Ltd's product or the FX925 that E.I.Du Pont Company produces, and its minimum parallel line thickness that can differentiate is 10 μ m.
Described step of exposure is, with have on it with mask mutually the negative film chromium plate medicine face of anti-graphics be adjacent to the photosensitive dry film surface, with parallel exposure machine with the complete photosensitive dry film surface of transferring to of the figure on the negative film chromium plate.
Preferred scheme is that described step of exposure is with the complete photosensitive dry film surface of transferring to of the figure on the negative film chromium plate with parallel ultraviolet exposure machine.
Described development step is, metal substrate after the exposure is immersed in the developing solution and develops, remove that unexposed dry film shows figure on the metal substrate, make on metal substrate and mask anti-graphics mutually, described developing solution is the sodium carbonate solution of concentration 0.2%～1.0%.
The present invention adopts galvanoplastics can make the OLED evaporation high precision mask of thickness below 0.05mm, owing to be based on the principles of electro-deposition of Applied Electrochemistry, by a certain metal or alloy of galvanic deposit on core, so mask plate perforate uniformity, the smooth no burr of hole wall, no sideetching, help luminescent material and transfer to the ITO surface fully, significantly improve the goods precision, the perforate tolerance reaches ± 0.005mm, and breadth is that position of related features only is ± 0.008mm between the hole of mask plate of 370mm * 470mm.
Embodiment
A kind of small molecules OLED evaporation electro-forming method of high precision mask
This OLED evaporation electro-forming method of mask has following steps successively:
Core preparation → core pre-treatment → pad pasting → exposure → development → oil removing → washing → activation/passivation → washing → electroforming mask → wash → take off film → stripping → silk screen is bonding → finished product detection → finished product packing.
Described core preparation step is to select stainless steel substrate.
Described core pre-treatment step is to have step by step following successively: electrochemical deoiling → electrolytic degreasing → hot water wash → cold wash → neutralization → cold wash → air-dry.Wherein electrochemical deoiling is step by step, and it is oil removing in 80 ℃ the degreaser that metal substrate is immersed in temperature, and Immersion time is 28 minutes, and the component of described degreaser comprises sodium hydroxide, yellow soda ash and tertiary sodium phosphate, and their weight ratio is 8: 3: 6; Electrolytic degreasing is step by step, and it is oil removing in 65 ℃ the electrolytic solution that metal substrate is immersed in temperature, and Immersion time is 1.0 minutes, and described electrolytic solution is the UDYPREP 283 of 60g/l; Neutralizing is step by step, metal substrate is immersed in the neutralizer neutralize, and Immersion time is 0.3 minute, and described neutralizer is the hydrochloric acid soln of concentration 15%.
Described step of membrane sticking is, with laminator thickness entirely is attached to metallic substrate surfaces greater than the photosensitive dry film of mask.Described photosensitive dry film is the RY3225 that Hitachi, Ltd produces, and its minimum parallel line thickness that can differentiate is 10 μ m.
Described step of exposure is, negative film chromium plate medicine face is adjacent to the photosensitive dry film surface, with parallel ultraviolet exposure machine with the complete photosensitive dry film surface of transferring to of the figure on the negative film chromium plate.
Described development step is, the metal substrate after the exposure is immersed in the developing solution develops, and removes that unexposed dry film shows figure on the metal substrate, makes on metal substrate and mask anti-graphics mutually, and described developing solution is the sodium carbonate solution of concentration 0.8%.
Described activation step is metal substrate to be immersed in the activation solution activate, and Immersion time is 8 minutes, and described activation solution is the hydrochloric acid soln of concentration 30%, and this step is applicable to the electroforming nickel dam that comes off from core easily.
Described passivation step is that metal substrate is immersed in passivation in the passivating solution, and Immersion time is 2 minutes, and described passivating solution is the potassium bichromate solution of concentration 10%, and this step is applicable to and is difficult to the electroforming nickel dam peeled off from core.
Described electroforming mask step is to adopt negative electrode to move to add the gas alr mode metallic nickel is deposited on the metal substrate, core is installed on the jig frame and with power cathode links to each other, then framework is put into electrotyping bath, with the nickel plate is anode, electroforming process middle frame and metal substrate can independent rotation, electroforming solution concentration field around the core of energising back makes metallic nickel that uniform deposition last layer metallic nickel mask on the metal substrate of phase anti-graphics arranged through electroforming solution, and its thickness was regulated by electroforming solution concentration, current density and electroforming time.
The component and the content of described electroforming solution are respectively:
Nickel sulfamic acid concentrated solution (180g/l) 350.0ml/l
Nickelous chloride concentrated solution (500g/l) 30.0ml/l
Additive PC-3 7.5ml/l
Wetting agent NAW-4 0.7ml/l
Brightening agent NI-22 0.7ml/l
Boric acid 40.0g/l
The pH value of described electroforming solution is 4.5, temperature is 55 ℃, and the electroforming current density is 6A/dm
2, the electroforming time is by the thickness of mask plate requirement and the current density decision of employing.
The described film step that takes off is that earlier the core of established metallic nickel mask to be immersed in temperature be that Immersion time is 32 minutes in 52 ℃ the sodium hydroxide solution of concentration 9%, then, temperature being arranged in metal substrate is placed is that the ultrasonic wave of GC-001 of 48 ℃ concentration 10% takes off film cylinder ultrasonic wave and took off film 2.0 minutes.
Described stripping step is with mechanical means sedimentary metallic nickel mask to be separated with metal substrate.
Described silk screen bonding step is that the isolated metal refining that has figure is fixed on the metal outer frame by glue.Mask is very strict to status requirement, and the position is determined by silk screen tension force, tension force size impact position precision, and described silk screen tension force is 10N/cm.
Described finished product detection step is that mask thicknesses, perforate quantity and size, positional precision are detected.Detected result is as follows: the perforate tolerance that electroforming is made reaches ± 0.005mm, and breadth is that position of related features only is ± 0.008mm between the hole of mask plate of 370mm * 470mm, and the finished product contrast made from other method is significantly improved and improves.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the present invention is determined by claims of being submitted to.
Claims (10)
1. a vaporization coating of organic light-emitting display has following steps successively with the electro-forming method of mask:
Core preparation → core pre-treatment → pad pasting → exposure → development → oil removing → washing is characterized in that: following subsequent step is also arranged successively:
Activation/passivation → washing → electroforming mask → wash → take off film → stripping → silk screen is bonding → finished product detection → finished product packing.
2. according to the electro-forming method of the described vaporization coating of organic light-emitting display of claim 1, it is characterized in that with mask:
Described activation step is metal substrate to be immersed in the activation solution activate, and Immersion time is 5 minutes～10 minutes, and activation solution is the hydrochloric acid soln of concentration 30%.
3. according to the electro-forming method of the described vaporization coating of organic light-emitting display of claim 1, it is characterized in that with mask:
Described passivation step is that metal substrate is immersed in passivation in the passivating solution, and Immersion time is 1.8 minutes～2.2 minutes, and passivating solution is the potassium bichromate solution of concentration 10%.
4. use the electro-forming method of mask according to claim 1 or 2 or 3 described vaporization coating of organic light-emitting display, it is characterized in that:
Described electroforming mask step is core to be installed on the jig frame and with power cathode link to each other, and then framework is put into electrotyping bath, is anode with the nickel plate, and electroforming process middle frame and metal substrate can independent rotation.
5. according to the electro-forming method of the described vaporization coating of organic light-emitting display of claim 4, it is characterized in that with mask:
Described electroforming mask step is to adopt negative electrode to move to add the gas alr mode metallic nickel is deposited on the metal substrate.
6. according to the electro-forming method of the described vaporization coating of organic light-emitting display of claim 5, it is characterized in that with mask:
The component and the content of described electroforming solution are respectively:
Nickel sulfamic acid concentrated solution (180g/l) 333.0ml/l～389.0ml/l
Nickelous chloride concentrated solution (500g/l) 25.0ml/l～35.0ml/l
Additive PC-3 5.0ml/l～10.0ml/l
Wetting agent NAW-4 0.5ml/l～1.0ml/l
Brightening agent NI-22 0.5ml/l～1.0ml/l
PH value buffer reagent 35.0g/l～45.0g/l
The pH value of electroforming solution is 3.8～5.4, temperature is 45 ℃～60 ℃, and the electroforming current density is 2A/dm
2～10A/dm
2
7. according to the electro-forming method of the described vaporization coating of organic light-emitting display of claim 6, it is characterized in that with mask:
The described film step that takes off is that earlier the core of established metallic nickel mask to be immersed in temperature be that Immersion time is 30 minutes～35 minutes in 50 ℃～55 ℃ the sodium hydroxide solution of concentration 8%～10%, then, temperature being arranged in metal substrate is placed is that the ultrasonic wave of GC-001 of 45 ℃～50 ℃ concentration 8%～12% takes off film cylinder ultrasonic wave and took off film 1.8 minutes～2.2 minutes.
8. according to the electro-forming method of the described vaporization coating of organic light-emitting display of claim 7, it is characterized in that with mask:
Described stripping step is with mechanical means sedimentary metallic nickel mask to be separated with metal substrate.
9. according to the electro-forming method of the described vaporization coating of organic light-emitting display of claim 8, it is characterized in that with mask:
Described silk screen bonding step is, the isolated metal refining that has figure is fixed on the metal outer frame by glue, and silk screen tension force is 9N/cm～11N/cm.
10. according to the electro-forming method of the described vaporization coating of organic light-emitting display of claim 9, it is characterized in that with mask:
Described core preparation step is to select metal substrate;
Described core pre-treatment step is to have step by step following successively: electrochemical deoiling → electrolytic degreasing → hot water wash → cold wash → neutralization → cold wash → air-dry;
Wherein electrochemical deoiling is step by step, it is oil removing in 70 ℃～90 ℃ the degreaser that metal substrate is immersed in temperature, Immersion time is 25 minutes～30 minutes, and the component of degreaser comprises sodium hydroxide, yellow soda ash and tertiary sodium phosphate, and their weight ratio is (6～10): (2～4): (5～7);
Electrolytic degreasing is step by step, and it is oil removing in 60 ℃～70 ℃ the electrolytic solution that metal substrate is immersed in temperature, and Immersion time is 0.8 minute～1.2 minutes, and electrolytic solution is the UDYPREP 283 of 60g/l;
Neutralizing is step by step, metal substrate is immersed in the neutralizer neutralize, and Immersion time is 0.3 minute～0.4 minute, and neutralizer is the hydrochloric acid soln of concentration 15%;
Described step of membrane sticking is, with laminator thickness entirely is attached to metallic substrate surfaces greater than the photosensitive dry film of mask, and the minimum parallel line thickness that photosensitive dry film can be differentiated is 10 μ m;
Described step of exposure is, with have on it with mask mutually the negative film chromium plate medicine face of anti-graphics be adjacent to the photosensitive dry film surface, with parallel exposure machine with the complete photosensitive dry film surface of transferring to of the figure on the negative film chromium plate;
Described development step is, the metal substrate after the exposure is immersed in the developing solution develops, and removes that unexposed dry film shows figure on the metal substrate, makes on metal substrate and mask anti-graphics mutually, and developing solution is the sodium carbonate solution of concentration 0.2%～1.0%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510101380A CN100590232C (en) | 2005-11-14 | 2005-11-14 | Mask electro-forming method for vaporization coating of organic light-emitting display |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510101380A CN100590232C (en) | 2005-11-14 | 2005-11-14 | Mask electro-forming method for vaporization coating of organic light-emitting display |
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| CN1804138A true CN1804138A (en) | 2006-07-19 |
| CN100590232C CN100590232C (en) | 2010-02-17 |
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Cited By (61)
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