CN103203972A - A three-dimensional metal mask plate and a hybrid production process thereof - Google Patents
A three-dimensional metal mask plate and a hybrid production process thereof Download PDFInfo
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- CN103203972A CN103203972A CN2012100107705A CN201210010770A CN103203972A CN 103203972 A CN103203972 A CN 103203972A CN 2012100107705 A CN2012100107705 A CN 2012100107705A CN 201210010770 A CN201210010770 A CN 201210010770A CN 103203972 A CN103203972 A CN 103203972A
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- metal mask
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Abstract
The present invention discloses a three-dimensional metal mask plate and a hybrid production process thereof. The mask plate is a three-dimensional metal mask plate having a single-sided convex printing surface, while a corresponding single-sided concave PCB surface. The mask plate is made of one of pure nickel and a nickel-iron alloy. The production process of the three-dimensional metal mask plate includes steps of: A, electroforming a first electroformed layer: core mold processing -> pre-treatment -> film mounting 1a-> exposure 1 -> single sided developing 1 -> electroforming 1 -> film mounting 1b-> exposure 2 -> mold stripping; B, electroforming a convex area on the printing surface: pre-treatment -> reverse side film mounting 2 -> position aligning -> exposure 3 -> single sided developing 2 -> electroforming 2 -> mold stripping; and C, etching a concave area on the PCB surface: pre-treatment -> printing surface film mounting 3 -> single sided developing 3 -> etching -> film stripping. By using the hybrid production process to produce the three-dimensional metal mask plate, the interfacial bonding strength can be effectively improved to meet requirements of three-dimensional mounting; PCB surface down step area hole wall quality can be effectively improved, wherein etched down step area have smooth hole walls and no blurs; and metal mask plate openings and surface quality can be effectively improved, wherein the metal mask plate has a high uniformity and a COV less than 10%. The process is lead-free, thereby meeting environmental requirements.
Description
Technical field
The present invention relates to a kind of three-dimensional metal mask plate and mixing preparation method thereof, belong to field of material preparation, being specifically related to a kind of PCB mask has concave regions, corresponding printing surface to have the mixing preparation method of the three-dimensional metal mask plate of convex region.
Background technology
Surface mounting technology is called for short the abbreviation of SMT(Surface Mounted Technology), be most popular a kind of technology and technology in the present electronics assembling industry.Its characteristics are that packing density height, electronic product volume are little, in light weight, and the volume and weight of surface mount elements has only about 1/10 of traditional inserting element, generally adopt after the SMT electronic product volume-diminished 40% ~ 60%, weight saving 60% ~ 80%.Use the PSB plate that this kind technology makes, reliability height, antivibration ability are by force, the welding point defect rate is low, high frequency characteristics good, has reduced electromagnetism and Radio frequency interference simultaneously; Need not directly the surface-assembled components and parts to be pasted the dress connection technology that is soldered on the printing board surface assigned position to printing the twist drill plug-in opening.
At present, the location of surface mounting technology has progressively been developed into a key technology of the highly diversified electronic message unit of realization from general production technologies such as connection, assemblings.More high density, more small salient point, lead-free process etc. need brand-new surface mounting technology, more can adapt to the fast-changing demand in consumption electronic product market.The first step of surface mounting technology is not only in the use of template, also is a most important step.Its effect is that soldering paste or Heraeus are bitten on the pad of PCB, for the welding of components and parts is prepared.The template on plane is difficult to the soldering paste of accurate quantity is transferred on the PCB face, and the combined planar template can not satisfy its requirement equally by experiment.Therefore must make the mask plate corresponding with the pcb board boss, namely have the mask plate of 3-D solid structure.
The printing surface that obtains by continuous electroforming and etched hybrid technique has the three-dimensional metal mask plate that convex region, PCB mask have concave regions, and its concrete advantage is as follows:
(1) the continuous electric casting process can effectively improve interface binding power, and satisfies the requirement that 3 D stereo mounts;
(2) etching technique can effectively improve PCB face concave regions hole wall quality;
(3) electroforming process can effectively improve metal mask plate opening quality and surface quality;
(4) this technology is lead-free process, satisfies environmental requirement.
Summary of the invention
The objective of the invention is to propose a kind of three-dimensional metal mask plate and mixing preparation method thereof, the composition of this kind three-dimensional metal mask plate is pure nickel metal or dilval, and this kind mask plate is the three-dimensional metal mask with printing surface single face projection, simultaneously corresponding PCB face single face depression.Use continuous galvanoplastics and can guarantee between two electroformed layers good bonding force is arranged, satisfy the requirement that 3 D stereo mounts; And smooth, the no burr of concave regions hole wall that uses etching technique to form can effectively improve PCB face concave regions hole wall quality; Metal mask plate opening quality and the surface quality of using the continuous electric casting method to prepare are good; This technology of this kind is lead-free process, satisfies environmental requirement.
The concrete technological process of the mixing preparation method of three-dimensional metal mask plate is as follows:
A, electroforming first electroformed layer: core processing → pre-treatment → pad pasting 1a → exposure 1 → surface development 1 → electroforming 1 → pad pasting 1b → exposure 2 → peel off;
B, electroforming printing surface projection: pre-treatment → printing surface pad pasting 2 → contraposition → exposure 3 → surface development 2 → electroforming 2 → peel off;
C, etching PCB face concave regions: pre-treatment → printing surface pad pasting 3-surface development 3 → etching → move back film.
According to the 3 D stereo mask plate that above processing step prepares, its plate face good quality, COV is not more than 10%, and the surface is the one-level light.
Preferably, first electroformed layer for preparing by electrocasting method is of a size of 20-120um.
Specifically, the processing step of described electroforming first electroformed layer of steps A comprises as follows:
(1) core is handled: choose the thick corrosion resistant plate of 1.8mm as the core material, core is cut into the size of 800mm*600mm;
(2) pre-treatment: with core oil removing, pickling, sandblast, to remove the oil stain impurity on surface, and surface finish is smooth;
(3) pad pasting 1a: mandrel surface is carried out pad pasting;
(4) exposure 1: make figure open area and registration holes regional exposure, in order to unexposed area is removed by developing, stay the part of exposure to make the diaphragm of follow-up electroforming step;
(5) surface development 1: the dry film except figure open area and registration holes zone is washed, keep the exposed portion pad pasting;
(6) electroforming 1: adopt the method for electroforming that no dry film zone is arrived in the nickel metal plating;
(7) pad pasting 1b: be the PCB mask on the surface of electroformed layer, be about to zone in addition, etched 3 D stereo zone (concave regions) in order to exposure;
(8) exposure 2: with 3 D stereo zone (concave regions) regional exposure in addition;
(9) peel off: electroformed layer is peeled off from core.
Specifically, the processing step of the described electroforming printing surface of step B projection is as follows:
(1) pre-treatment: the mask plate that steps A is made carries out pickling, sandblast,
(2) the reverse side pad pasting 2: the electroformed layer printing surface pad pasting for preparing in steps A;
(3) contraposition: carry out the CCD contraposition by the electroformed layer registration holes, determine the exposure coordinate;
(4) exposure 3: the exposure area is for other zones except 3 D stereo zone (convex region), to make the diaphragm of follow-up electroforming step;
(5) surface development 2: the pad pasting cleaning of unexposed portion is removed, keep the pad pasting of exposed portion;
(6) electroforming 2: adopt the method for electroforming that no dry film zone (elevated regions) is arrived in metal plating;
(7) peel off: mask plate is peeled off from core.
Specifically, the described etching PCB of step C face concave regions processing step is as follows:
(1) pre-treatment: the printing surface that cleans the three dimensional mask plate;
(2) the printing surface pad pasting 3: the printing surface pad pasting of three dimensional mask plate is not corroded in follow-up etching process in order to protect the printing surface elevated regions;
(3) surface development 3: the pad pasting cleaning of PCB face unexposed area (sunk area) is removed, keep the pad pasting of exposed portion;
(4) etching: etching area is the unexposed area behind the PCB mask among the A (no dry film zone), forms PCB face concave regions;
(5) move back film.
Preferably, the developing process parameter described in steps A and the step B is as follows:
Core size (mm) 800*600*1.8
Time for exposure 1(s) 800-1800
1 time (s) 80-170 develops
Time for exposure 2(s) 100-500
2 times (s) 200-700 develops
Time for exposure 3(s) 1000-2500
3 times (s) 100-200 develops
Preferably, the electroforming process parameter described in steps A and the step B is as follows:
Current density (A/m
2) 2.0-3.0
Electroforming time 1 (min) 100-300
Electroforming time 2 (min) 500-1000
Temperature (℃) 40-55
pH 3.5-5.0
Soak time 1 (min) 2-5
Soak time 2 (min) 5-10
Preferably, the electroforming solution described in steps A and the step B is composed as follows:
Nickel sulfamic acid (g/L) 50-80
Seven hydration nickel chloride (g/L) 10-20
Frerrous chloride (g/L) 30-50 (adding during the electroformed nickel ferroalloy)
Boric acid (g/L) 30-50
Brightener (ml/L) 0.5-3
Stabilizing agent (ml/L) 1-5
Wetting agent (ml/L) 0.5-3
Preferably, the PCB facet etch technological parameter described in the step C is as follows:
The etching solution temperature (℃) 25-55
Etching solution expulsion pressure (psi) 15-35
Etching period (min) 15-30
The printing surface that obtains by continuous electroforming and etched mixing preparation method among the present invention has the three-dimensional metal mask plate that convex region, PCB mask have concave regions, has remarkable advantages.As: the continuous electric casting process can effectively improve interface binding power, and satisfies the requirement that 3 D stereo mounts; Etching technique can effectively improve PCB face concave regions hole wall quality; Electroforming process can effectively improve metal mask plate opening quality and surface quality; This technology is lead-free process, satisfies environmental requirement.
Additional aspect of the present invention and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 prints schematic diagram
The 11-PCB plate
The 22-mask plate
33-pcb board elevated regions
The 44-scraper
The 55-material for transfer
66-mask plate 3 D stereo zone
4-mask plate PCB face
5-mask plate printing surface
Fig. 2 mask plate vertical view
2-first electroformed layer
3-figure open area
The 6-registration holes
66-mask plate 3 D stereo zone
Fig. 3 mask plate 3 D stereo zone profile
4-mask plate PCB face
5-mask plate printing surface
66-mask plate 3 D stereo zone
The concave regions of 111-PCB face
Fig. 4 electroforming first electroformed layer profile
The 1-core
2-first electroformed layer
Figure open area on the 3-electroformed layer
The PCB face of 4-first electroformed layer
The printing surface of 5-first electroformed layer
The 6-registration holes
Fig. 5 electroforming printing surface projection (step B) profile
The 1-core
2-first electroformed layer
Figure open area on the 3-electroformed layer
The PCB face of 4-first electroformed layer
The printing surface of 5-first electroformed layer
The 6-registration holes
The elevated regions of 7-printing surface
8-PCB face dry film is unexposed area
9-PCB face dry film
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
The present invention discloses a kind of technology that is mixed with of 3 D stereo mask plate.
Among a kind of embodiment of the present invention, a kind of optimizing technology parameters in electroforming first electroformed layer is as follows:
Exposure and developing process parameter:
Core size (mm) 800*600*1.8
Time for exposure 1(s) 1500
Develop 1 time (s) 150
Time for exposure 2(s) 600
The electroforming process parameter:
Current density (A/m
2) 2.3
The electroforming time 1 (min) 150
Temperature (℃) 45 ± 1
pH 4.0
Soak time 1 (min) 3
The composition of electroforming solution:
Nickel sulfamic acid (g/L) 55
Seven hydration nickel chlorides (g/L) 15
Frerrous chloride (g/L) 30 (adding during the electroformed nickel ferroalloy)
Boric acid (g/L) 35
Brightener (ml/L) 2.0
Stabilizing agent (ml/L) 3
Wetting agent (ml/L) 0.5-3
Among a kind of embodiment of the present invention, a kind of optimizing technology parameters of electroforming printing surface projection is as follows:
Exposure and developing process parameter:
Time for exposure 3(s) 2500
The electroforming process parameter:
Current density (A/m
2) 2.5
The electroforming time 2 (min) 900
Temperature (℃) 45 ± 1
pH 4.0
Soak time 2 (min) 7
The composition of electroforming solution:
Nickel sulfamic acid (g/L) 55
Seven hydration nickel chlorides (g/L) 15
Frerrous chloride (g/L) 30 (adding during the electroformed nickel ferroalloy)
Boric acid (g/L) 35
Brightener (ml/L) 2.0
Stabilizing agent (ml/L) 3
Wetting agent (ml/L) 0.5-3
Among a kind of embodiment of the present invention, a kind of optimizing technology parameters of electroforming printing surface projection is as follows:
The developing process parameter:
Time for exposure 3(s) 2000
The electroforming process parameter:
Current density (A/m
2) 2.5
The electroforming time 1 (min) 280
The electroforming time 2 (min) 950
Temperature (℃) 45 ± 1
pH 4.0
Soak time 2 (min) 7
The composition of electroforming solution:
Nickel sulfamic acid (g/L) 60
Seven hydration nickel chlorides (g/L) 12
Boric acid (g/L) 45
Brightener (ml/L) 2.5
Stabilizing agent (ml/L) 3
Wetting agent (ml/L) 0.5-3
Among a kind of embodiment of the present invention, a kind of optimizing technology parameters of etching PCB face concave regions is as follows:
The etching solution temperature (℃) 40
Etching solution expulsion pressure (psi) 35
Etching period (min) 20
In the description of this specification, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " illustrative examples ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.
Claims (11)
1. a three-dimensional metal mask is characterized in that, this kind mask plate is the three-dimensional metal mask with printing surface single face projection, simultaneously corresponding PCB face single face depression.
2. a kind of three-dimensional metal mask according to claim 1 is characterized in that, the composition of this metal mask plate is pure nickel metal or dilval.
3. a kind of three-dimensional metal mask according to claim 1 is characterized in that, the mixing preparation method of described three-dimensional metal mask is prepared from by following 3 processing steps:
A, electroforming first electroformed layer: core processing → pre-treatment → pad pasting 1a → exposure 1 → surface development 1 → electroforming 1 → pad pasting 1b → exposure 2 → peel off;
B, electroforming printing surface projection: pre-treatment → printing surface pad pasting 2 → contraposition → exposure 3 → surface development 2 → electroforming 2 → peel off;
C, etching PCB face concave regions: pre-treatment → printing surface pad pasting 3 → surface development 3 → etching → move back film.
4. the mixing preparation method of a kind of three-dimensional metal mask according to claim 3 is characterized in that, the pre-treatment among described steps A and the step B comprises pickling, sandblast.
5. the preparation method of a kind of three-dimensional metal mask according to claim 3 is characterized in that, the electroformed layer in the described steps A has figure open area and registration holes, and registration holes is through hole, and at least two registration holes.
6. the mixing preparation method of a kind of three-dimensional metal mask according to claim 3, it is characterized in that, contraposition is to carry out the CCD contraposition by the through hole registration holes of making among the A among the described step B, determines the exposure coordinate, and 3 the exposure area of exposing is other zones except convex region.
7. the mixing preparation method of a kind of three-dimensional metal mask according to claim 3 is characterized in that, has activating process before the electroforming process that carries out steps A and step B, improves the adhesion between two coating, prevents that coating from coming off.
8. the mixing preparation method of a kind of three-dimensional metal mask according to claim 3 is characterized in that, the etching area among the described step C is the exposure 1b zone behind the PCB mask 1a in the steps A, forms PCB face concave regions.
9. the mixing preparation method of a kind of three-dimensional metal mask according to claim 3 is characterized in that, the parameter area of exposure imaging is as follows:
Core size (mm) 800*600*1.8
1 energy (mj) 500-1500 exposes
Time for exposure 1(s) 800-1800
1 time (s) 80-170 develops
2 energy (mj) 150-800 exposes
Time for exposure 2(s) 100-500
2 times (s) 200-700 develops
3 energy (mj) 1000-2000 exposes
Time for exposure 3(s) 1000-2500
3 times (s) 100-200 develops.
10. the mixing preparation method of a kind of three-dimensional metal mask according to claim 3 is characterized in that, the parameter area of electroforming is as follows:
Current density (A/m
2) 2.0-3.0
Electroforming time 1 (min) 100-300
Electroforming time 2 (min) 500-1000
Temperature (℃) 40-55
pH 3.5-5.0
Soak time 1 (min) 2-5
Soak time 2 (min) 5-10
Electroforming solution is formed:
Nickel sulfamic acid (g/L) 50-80
Seven hydration nickel chloride (g/L) 10-20
Frerrous chloride (g/L) 30-50 (adding during the electroformed nickel ferroalloy)
Boric acid (g/L) 30-50
Brightener (ml/L) 0.5-3
Stabilizing agent (ml/L) 1-5
Wetting agent (ml/L) 0.5-3.
11. the preparation method of a kind of three-dimensional metal mask according to claim 3 is characterized in that, the etch process parameters scope described in the step C is as follows:
The etching solution temperature (℃) 25-55
Etching solution expulsion pressure (psi) 15-35
Etching period (min) 15-30.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010770.5A CN103203972B (en) | 2012-01-16 | 2012-01-16 | A kind of three-dimensional metal mask plate and mixing preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010770.5A CN103203972B (en) | 2012-01-16 | 2012-01-16 | A kind of three-dimensional metal mask plate and mixing preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203972A true CN103203972A (en) | 2013-07-17 |
| CN103203972B CN103203972B (en) | 2016-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010770.5A Expired - Fee Related CN103203972B (en) | 2012-01-16 | 2012-01-16 | A kind of three-dimensional metal mask plate and mixing preparation method thereof |
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| Country | Link |
|---|---|
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103966632A (en) * | 2014-04-26 | 2014-08-06 | 昆山允升吉光电科技有限公司 | Manufacture method for mask plate |
| CN109715834A (en) * | 2016-09-15 | 2019-05-03 | 日立金属株式会社 | Metal mask raw material and its manufacturing method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05275843A (en) * | 1992-03-26 | 1993-10-22 | Kofu Nippon Denki Kk | Method for printing cream solder and metal mask for printing cream solder |
| JPH0692053A (en) * | 1992-02-24 | 1994-04-05 | Kyushu Hitachi Maxell Ltd | Production of metal mask plate for printing |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| JP3141117B2 (en) * | 1992-02-12 | 2001-03-05 | 九州日立マクセル株式会社 | Manufacturing method of metal mask plate for printing |
| JP3141118B2 (en) * | 1992-02-12 | 2001-03-05 | 九州日立マクセル株式会社 | Manufacturing method of metal mask plate for printing |
| JP2003080859A (en) * | 2001-09-13 | 2003-03-19 | Rohm Co Ltd | Method for screen-printing paste on lead frame, and its apparatus |
| JP2004230785A (en) * | 2003-01-31 | 2004-08-19 | Matsushita Electric Ind Co Ltd | Multiple printing type mask plate and component mounting system using it |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| JP2006213000A (en) * | 2005-02-07 | 2006-08-17 | Bonmaaku:Kk | Screen printing plate and its manufacturing method |
-
2012
- 2012-01-16 CN CN201210010770.5A patent/CN103203972B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3141117B2 (en) * | 1992-02-12 | 2001-03-05 | 九州日立マクセル株式会社 | Manufacturing method of metal mask plate for printing |
| JP3141118B2 (en) * | 1992-02-12 | 2001-03-05 | 九州日立マクセル株式会社 | Manufacturing method of metal mask plate for printing |
| JPH0692053A (en) * | 1992-02-24 | 1994-04-05 | Kyushu Hitachi Maxell Ltd | Production of metal mask plate for printing |
| JPH05275843A (en) * | 1992-03-26 | 1993-10-22 | Kofu Nippon Denki Kk | Method for printing cream solder and metal mask for printing cream solder |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| JP2003080859A (en) * | 2001-09-13 | 2003-03-19 | Rohm Co Ltd | Method for screen-printing paste on lead frame, and its apparatus |
| JP2004230785A (en) * | 2003-01-31 | 2004-08-19 | Matsushita Electric Ind Co Ltd | Multiple printing type mask plate and component mounting system using it |
| JP2006213000A (en) * | 2005-02-07 | 2006-08-17 | Bonmaaku:Kk | Screen printing plate and its manufacturing method |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103966632A (en) * | 2014-04-26 | 2014-08-06 | 昆山允升吉光电科技有限公司 | Manufacture method for mask plate |
| CN109715834A (en) * | 2016-09-15 | 2019-05-03 | 日立金属株式会社 | Metal mask raw material and its manufacturing method |
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|---|---|
| CN103203972B (en) | 2016-01-20 |
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