CN110831334A - Method for manufacturing circuit board with selective resin hole plugging - Google Patents
Method for manufacturing circuit board with selective resin hole plugging Download PDFInfo
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- CN110831334A CN110831334A CN201911023842.8A CN201911023842A CN110831334A CN 110831334 A CN110831334 A CN 110831334A CN 201911023842 A CN201911023842 A CN 201911023842A CN 110831334 A CN110831334 A CN 110831334A
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- circuit board
- hole
- resin
- holes
- metal layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for manufacturing a circuit board with selective resin plug holes, which comprises the following steps: drilling a through hole needing copper plating in the circuit board; carrying out first copper deposition treatment on the circuit board so as to arrange a first metal layer on the surface of the circuit board and the surface of the inner wall of the through hole; patterning the first metal layer on the surface of the circuit board; selectively filling the through-hole with a resin; and grinding the surface of the circuit board to remove the resin on the surface of the circuit board. The manufacturing method of the circuit board with the selective resin plug holes can reduce the production flow and the production cost.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a circuit board through selective resin hole plugging.
Background
In high-density connection technology, HDI circuit boards play an important role, and the manufacture of HDI circuit boards involves a plurality of complicated processes such as providing through holes, metal layers, and filling with resin. The resin filling step is to fill all through holes in the HDI circuit board with resin, and the resin filling step for all through holes requires complex pretreatment steps, such as making an outer layer dry film, pattern plating, and outer layer etching.
The manufacture of the outer dry film involves a plurality of processing steps such as outer pretreatment, dry film setting, exposure, development and the like, and the problems of open circuit of metal wiring and the like caused by insufficient adhesive force of the dry film are solved by pattern electroplating. The multiple and complicated steps increase the processing cost and prolong the production period, thereby increasing the burden of enterprises.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a method for manufacturing a circuit board with selective resin plug holes, which can reduce the production flow and the production cost.
According to a first aspect embodiment of the invention, the method for manufacturing the circuit board with the selective resin plug holes comprises the following steps:
drilling a through hole needing copper plating in the circuit board;
carrying out first copper deposition treatment on the circuit board so as to arrange a first metal layer on the surface of the circuit board and the surface of the inner wall of the through hole;
patterning the first metal layer on the surface of the circuit board;
selectively filling the through-hole with a resin;
and grinding the surface of the circuit board to remove the resin on the surface of the circuit board.
The method for manufacturing the circuit board with the selective resin plug holes, provided by the embodiment of the invention, has at least the following beneficial effects: the production flow is reduced, and the production cost and the production period are reduced.
According to some embodiments of the invention, the selectively filling the through hole is to fill the through hole with resin by using a selective hole plugging aluminum sheet so as to fill the through hole to be filled with resin.
According to some embodiments of the invention, selectively filling the via further comprises: performing resistance welding pretreatment on the surface of the circuit board;
the pre-treatment of the solder mask is to perform acid cleaning on the surface of the circuit board so as to remove oxides on the surface of the circuit board;
and washing with water to remove residual acid on the surface of the circuit board.
According to some embodiments of the invention, the patterning process comprises a positive etch and a negative etch.
According to some embodiments of the invention, the method further comprises a second copper deposition treatment to form a second metal layer on the surface of the circuit board.
According to some embodiments of the invention, the second copper deposition process comprises a chemical copper deposition process and a full-plate electroplating process.
According to some embodiments of the present invention, the method further comprises forming an outer dry film on a surface of the second metal layer. According to some embodiments of the invention, the fabricating the outer dry film comprises pre-treating, coating photosensitive ink, exposing, developing, curing, and etching.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a manufacturing flow chart of an embodiment of the present invention.
Fig. 2 is a schematic structural view of the aluminum plug hole in the embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
Referring to fig. 1, fig. 1 is a manufacturing flow chart of an embodiment of the invention, and referring to fig. 1, a method for manufacturing a circuit board with selective resin plug holes includes:
step S1, drilling a through hole needing copper plating in the circuit board;
step S2, carrying out first copper deposition treatment on the circuit board to arrange a first metal layer on the surface of the circuit board and the inner wall surface of the through hole;
step S3, patterning the first metal layer on the surface of the circuit board;
a step S4 of selectively filling the through hole with resin;
and step S5, grinding the surface of the circuit board to remove the resin on the surface of the circuit board.
Before the first copper deposition treatment of the circuit board, the surface of the circuit board is subjected to deburring treatment to remove burrs (metal wires or glass wires) remaining on the surface of the circuit board. The deburring treatment can avoid the unsmooth surface of the through hole or the aperture of the through hole is smaller than the preset aperture due to the residual burrs on the surface of the circuit board.
The deburring is carried out to the grinding roller that uses the burr-grinding machine and is got rid of the processing to avoid causing some burr to get into in the through-hole because of using the lapping plate.
The above-mentioned selective filling of through-hole still includes: performing resistance welding pretreatment on the surface of the circuit board; the pre-treatment of the solder mask is to perform acid cleaning on the surface of the circuit board so as to remove oxides on the surface of the circuit board; and washing with water to remove residual acid on the surface of the circuit board. The patterning process includes positive etching and negative etching. Through carrying out selective filling on the through holes, the problem that resin in the through holes which do not need to be filled with resin is removed in the traditional resin filling process is avoided.
And grinding the ceramic grinding plate to remove the resin attached to the surface of the circuit board, and performing secondary copper deposition treatment and full-plate electroplating to form a second metal layer on the surface of the circuit board. In addition, the thickness of the second metal layer disposed on the inner wall surface of the through hole needs to be measured to avoid the thickness of the second metal layer on the inner wall surface of the through hole from being too small. When the second metal layer is etched in the process of patterning the second metal layer, the solution completely dissolves the second metal layer on the inner wall surface of the through hole, so that the open circuit of the through hole corresponding to the circuit board is caused; for example, the circuit board is locally overheated due to overlarge local resistance in the working process of the circuit board, and then the circuit board is burned out differently.
In addition, the surface of the through hole has burrs, so that when selective resin plugging is easily caused, the round hole of the plugging aluminum sheet possibly does not correspond to the through hole of the circuit board.
And manufacturing an outer dry film on the surface of one side of the second metal layer, which is far away from the first metal layer. The preparation of the outer dry film comprises the steps of pretreatment, photosensitive ink coating, exposure, development, curing and the like.
And etching the second metal layer by presetting the shape of the outer layer dry film, and forming the metal wiring. After the metal wiring is formed, a mold stripping process is performed to remove the outer dry film. If the mode that the demolding treatment adopts is to use organic solution or acid solution to dissolve outer dry film, then need add the washing processing to guarantee that there is not solution residue on the circuit board surface.
The through hole is selectively filled by stacking the hole plugging aluminum sheet on the surface of the circuit board and filling resin, and the arrangement position of the round hole on the hole plugging aluminum sheet corresponds to the position of the through hole which needs to be filled with resin in the circuit board. The hole plugging aluminum sheet comprises a metal aluminum sheet main body and a plurality of round holes arranged on the metal aluminum sheet main body. Through the position and the size of the round hole, the round hole in the rectangular aluminum sheet corresponds to the through hole needing to be filled with resin, and the through hole is selectively filled with resin. The round holes correspond to the corresponding through holes in size, so that incomplete filling of the through holes or cracking of the through holes due to inconsistent pressure between the through holes and the round holes in the process of selectively filling resin into the through holes can be avoided. After the circuit board is selectively filled with resin, the hole plugging aluminum sheet can be stripped, and the hole plugging aluminum sheet attached to the surface of the hole plugging aluminum sheet is cleaned by using an organic solution so as to be recycled.
Through the selective filling of the through holes, a plurality of pretreatment steps brought by filling resin into the through holes in the circuit board in the traditional production flow are reduced, and the production flow is accelerated. In addition, the through holes are selectively filled, so that the using amount of resin is reduced, and the production cost is reduced.
As shown in fig. 2, the hole-plugging aluminum sheet 10 is provided with a circular hole only at a position corresponding to the position where the resin through-hole to be filled is provided in the wiring board 20. After the circuit board 20 is electroplated, the hole plugging aluminum sheet 10 is covered on the circuit board 20, and the relative position of the hole plugging aluminum sheet 10 and the hole plugging aluminum sheet is fixed through a limiting hole (not shown) arranged on the hole plugging aluminum sheet 10. Since the aluminum via hole sheet 10 can cover the through hole not to be filled in the wiring board 20, the resin can be prevented from entering.
By arranging the hole plugging aluminum sheet 10, the problem that resin removal treatment is carried out on through holes which do not need to be filled after all through holes in the circuit board 20 need to be filled with resin in the traditional resin filling process can be avoided.
The manufacturing method of the circular holes of the hole plugging aluminum sheet can be realized by presetting a metal aluminum sheet main body on the surface of the circuit board, and drilling the hole plugging aluminum sheet and the circuit board together so as to enable the circular holes on the hole plugging aluminum sheet to correspond to the sizes of the through holes of the circuit board to be filled with resin one by one. In the process, the through holes needing to be filled with resin are only manufactured in the circuit board through drilling treatment, and after the hole plugging aluminum sheet is removed, the circuit board is independently drilled so as to arrange the through holes needing not to be filled in the circuit board.
The above manufacturing process is described in detail below with reference to specific setting parameters.
In order to avoid the reasons of burrs on the surface of the hole plugging aluminum sheet, non-correspondence of the hole diameter and the like, the hole diameters of different hole plugging aluminum sheets need to be compensated. Under the condition that the circuit board through hole is a common straight through hole, if the radius d of the circuit board through hole is larger than 0.45mm, the radius of the hole plugging aluminum sheet circular hole is equal to the radius d-0.1mm of the circuit board through hole; if the radius d of the through hole of the circuit board meets the following conditions: d is more than or equal to 0.25mm and less than or equal to 0.45mm, and the radius of the hole plugging aluminum sheet circular hole is set to be 0.4 mm; if the radius d of the through hole of the circuit board meets the following conditions: d is more than or equal to 0.2mm and less than 0.25mm, then the plug is formedThe radius of the round hole of the hole aluminum sheet is set to be 0.35 mm. . In the case that the circuit board through hole is a back-drilled through hole (i.e. the radius of different positions of the same through hole is not equal), such as the radius d of the circuit board through holemaxNot more than 0.5mm, the radius of the hole plugging aluminum sheet round hole is dmax(ii) a If the radius of the through hole of the circuit board meets the following requirements: d is more than 0.5mmmaxLess than or equal to 0.7mm, the radius of the hole plugging aluminum sheet circular hole is dmax-0.1 mm; if the radius of the through hole of the circuit board meets the following requirements: dmaxIf the diameter is more than 0.7mm, the radius of the hole plugging aluminum sheet circular hole is dmax-0.2mm。
In addition, the edge of the hole plugging aluminum sheet needs to be provided with a positioning hole, and the radius of the positioning hole is 3.175 mm.
The distance between the hole walls of the circuit board through hole subjected to resin plugging and the circuit board through hole not subjected to resin plugging is larger than or equal to 0.4mm, so that the situation that the resin enters the circuit board through hole not subjected to resin plugging and the hole plugging is caused due to the fact that a gap exists between the hole plugging aluminum sheet and the circuit board is avoided.
In order to avoid excessive decomposition of the metal layer by dissolution in the etching process, and to cause the thickness or width of the metal wiring to be smaller than a preset value, base copper compensation needs to be carried out on the metal layer. In the process of manufacturing the outer dry film, in order to avoid the phenomenon that after multi-layer lamination, metal wiring is opened or through holes between the circuit board layers are displaced due to the fact that expansion coefficients of the circuit board layers are different. Therefore, the line width and the spacing of the outer dry film need to be compensated to avoid the open circuit of the metal wiring caused by excessive etching or dislocation of the board layers of the circuit board after the manufacture.
In the etching process, the problem that the metal wiring line width in the circuit board is smaller than a preset range and even causes the metal wiring pattern to deviate from the preset wiring pattern greatly is solved by adjusting the compensation amount of the base copper, the line width before compensation, the distance after compensation and the compensation value in the circuit board.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (8)
1. A method for manufacturing a circuit board with selective resin hole plugging is characterized by comprising the following steps:
arranging a through hole in the circuit board;
carrying out first copper deposition treatment on the circuit board so as to arrange a first metal layer on the surface of the circuit board and the surface of the inner wall of the through hole;
patterning the first metal layer on the surface of the circuit board;
selectively filling the through-hole with a resin;
and grinding the surface of the circuit board to remove the resin on the surface of the circuit board.
2. The method for manufacturing a circuit board with selective resin plug holes according to claim 1, wherein the through holes are selectively filled, specifically, the through holes are filled with resin by using aluminum sheets with selective plug holes, so as to fill the through holes to be filled with resin.
3. The method of making a circuit board with selective resin plugging according to claim 1, wherein selectively filling said via holes further comprises: performing resistance welding pretreatment on the surface of the circuit board;
the pre-treatment of the solder mask is to perform acid cleaning on the surface of the circuit board so as to remove oxides on the surface of the circuit board;
and washing with water to remove residual acid on the surface of the circuit board.
4. The method of making a circuit board for selective resin plugging according to claim 1 wherein said patterning process comprises a positive etch and a negative etch.
5. A method of making a circuit board for selective resin plugging according to any of claims 1 to 3 further comprising a second copper deposition process to form a second metal layer on the surface of said circuit board.
6. The method of claim 5 wherein said second electroless copper plating process comprises a chemical electroless copper plating process and a full plate plating process.
7. The method of claim 6 further comprising forming an outer dry film on the surface of the second metal layer.
8. The method of claim 7 wherein said fabricating an outer dry film layer includes pre-treating, applying a photosensitive ink, exposing, developing, curing, and etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911023842.8A CN110831334A (en) | 2019-10-25 | 2019-10-25 | Method for manufacturing circuit board with selective resin hole plugging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911023842.8A CN110831334A (en) | 2019-10-25 | 2019-10-25 | Method for manufacturing circuit board with selective resin hole plugging |
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| Publication Number | Publication Date |
|---|---|
| CN110831334A true CN110831334A (en) | 2020-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911023842.8A Pending CN110831334A (en) | 2019-10-25 | 2019-10-25 | Method for manufacturing circuit board with selective resin hole plugging |
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| CN (1) | CN110831334A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111343553A (en) * | 2020-04-09 | 2020-06-26 | 江苏普诺威电子股份有限公司 | MEMS microphone cavity plate with high alignment precision and manufacturing method thereof |
| CN111988915A (en) * | 2020-08-17 | 2020-11-24 | 深圳市众阳电路科技有限公司 | Manufacturing process of PCB resin plug hole |
| CN115003026A (en) * | 2022-04-29 | 2022-09-02 | 胜宏科技（惠州）股份有限公司 | Two-in-one manufacturing method of resin hole plugging aluminum sheet |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533766A (en) * | 2013-10-22 | 2014-01-22 | 东莞生益电子有限公司 | Fabrication method of circuit board and circuit board fabricated by method |
| CN106973507A (en) * | 2017-04-20 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of filling holes with resin wiring board |
| JP2018181953A (en) * | 2017-04-06 | 2018-11-15 | 大日本印刷株式会社 | Manufacturing method of through electrode substrate and through electrode substrate |
-
2019
- 2019-10-25 CN CN201911023842.8A patent/CN110831334A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533766A (en) * | 2013-10-22 | 2014-01-22 | 东莞生益电子有限公司 | Fabrication method of circuit board and circuit board fabricated by method |
| JP2018181953A (en) * | 2017-04-06 | 2018-11-15 | 大日本印刷株式会社 | Manufacturing method of through electrode substrate and through electrode substrate |
| CN106973507A (en) * | 2017-04-20 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of filling holes with resin wiring board |
Non-Patent Citations (1)
| Title |
|---|
| 郑德海: "《现代网印油墨选择与使用手册》", 31 December 2000 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111343553A (en) * | 2020-04-09 | 2020-06-26 | 江苏普诺威电子股份有限公司 | MEMS microphone cavity plate with high alignment precision and manufacturing method thereof |
| CN111343553B (en) * | 2020-04-09 | 2021-02-19 | 江苏普诺威电子股份有限公司 | MEMS microphone cavity plate with high alignment precision and manufacturing method thereof |
| CN111988915A (en) * | 2020-08-17 | 2020-11-24 | 深圳市众阳电路科技有限公司 | Manufacturing process of PCB resin plug hole |
| CN115003026A (en) * | 2022-04-29 | 2022-09-02 | 胜宏科技（惠州）股份有限公司 | Two-in-one manufacturing method of resin hole plugging aluminum sheet |
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Application publication date: 20200221 |
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