CN103966632A - Manufacture method for mask plate - Google Patents
Manufacture method for mask plate Download PDFInfo
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- CN103966632A CN103966632A CN201410170560.1A CN201410170560A CN103966632A CN 103966632 A CN103966632 A CN 103966632A CN 201410170560 A CN201410170560 A CN 201410170560A CN 103966632 A CN103966632 A CN 103966632A
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- mask plate
- metal sheet
- electroforming
- film
- making method
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Abstract
The invention discloses a manufacture method for a mask plate. The manufacture method comprises an electroforming plate making step and a laser cutting opening step, and is characterized in that the electroforming plate making step is that electroforming is performed on a baseplate to form a meal plate through an electroforming technology, and the laser cutting opening step is that thermal ablation is performed on the meal plate through laser to form an opening according a preset opening pattern, so that the mask plate is formed. Through the adoption of the method provided by the invention to manufacture the mask plate, the plate surface is not easy in solder paste adhering during printing, and the pulp outlet effect of the opening is good, so that the printing quality of the SMT (Surface Mount Technology) is improved.
Description
Technical field
The present invention relates to electronic printing field, relate in particular to a kind of making method of mask plate.
Background technology
Electronic circuit surface installation technique (Surface Mount Technology, SMT) be a kind of being arranged on the surface of printed circuit board or the surface of other substrate without pin or short leg surface-assembled components and parts, by the methods such as Reflow Soldering or the immersed solder circuit load technology of welding assembly in addition.Its perforation plug-in unit relatively in the past has following advantage: packing density is high, electronic product volume is little, lightweight, the volume and weight of surface mount elements only has 1/10 left and right of traditional inserting element, after general employing SMT, electronic product volume-diminished 40%～60%, weight saving 60%～80%.
In SMT industry, using SMT mask plate printing process (by SMT mask plate, tin cream being transferred to pcb board) is an important link.SMT mask plate quality directly has influence on tin cream transfer effect, and the crystal grain that conventionally forms SMT mask plate metal material is finer and smoother, and the quality of SMT mask plate is higher, and its printing effect is better.Traditional fabrication SMT mask plate has laser cutting, electroforming, the large technique of etching three.Wherein etch process is on the metal sheet of stainless steel, to adopt the mode of etching solution selective corrosion to make SMT mask plate; Laser cutting parameter is by laser cutting opening, to form SMT mask plate on the metal sheet of stainless steel (SUS) material; Electroforming process forms SMT mask plate by nickel additive process.But the stainless steel crystal grain using in etching and laser cutting parameter is larger, and plate face is smooth not, in SMT printing process, exist plate face easily to glue the defects such as tin cream, lower slurry weak effect; Electroforming process is made SMT mask plate and is often existed electroforming opening to retain residual film to cause the ropy problem of opening.
The present invention proposes a kind of making method of mask plate for above problem, solve preferably the above problem.
Summary of the invention
In view of this, need to overcome at least one in above-mentioned prior art defect.The invention provides a kind of making method of mask plate, comprise electroforming making sheet step, laser cutting opening step, wherein:
Described electroforming making sheet step is at the substrate cast that powers on, to become metal sheet by electroforming process;
Described laser cutting opening step is on described metal sheet, by default patterns of openings ablation, to form opening by laser, thereby forms described mask plate.
Further, described electroforming process comprises:
S1, substrate pre-treatment step: the surface cleaning of substrate is clean;
S2, electroforming step: using the described substrate through pre-treatment step as negative electrode, put into electrotyping bath and carry out electroforming formation electroformed layer;
S3, strip step: by described electroformed layer and described strippable substrate, the described electroformed layer after peeling off is described metal sheet.
Further, after described strip step, also comprise cleaning step, baking step.
Further, described electroformed layer thickness is 20 μ m≤a1≤200 μ m.
Preferably, described electroformed layer thickness is 50 μ m≤a1≤150 μ m.
Further, before or after described laser cutting opening step, also comprise by certain dimensional requirement and cutting out except described metal sheet periphery redundance.
Further, described sanction except the method for described metal sheet periphery redundance be mechanical cutting or laser ablation.
The material of the described metal sheet that further, described electroforming step forms is nickel or nickel-base alloy.
Further, before described laser cutting step, also comprise by etch process and make described mask plate projection portion or depressed part.
Further, described etch process comprises:
A, step of membrane sticking: by two masks of described metal sheet;
B, step of exposure: selectivity exposure is carried out to according to predetermined pattern in the two sides of the described metal sheet through described step of membrane sticking, on the described film on described metal sheet two sides, form exposed film region and unexposed diaphragm area;
C, development step: the described metal sheet through described step of exposure is developed, the film of unexposed area in described step of exposure is removed, the metal sheet region that is removed film forms bare metal plate region;
D, etching step: the described metal sheet through described development step is carried out to etching, described bare metal plate region is etched into the etching area with certain depth;
E, take off film step: the described metal sheet through described etching step is taken off to film, by taking off film step, the film of described exposure area is removed.
The making method of mask plate provided by the present invention, it is advantageous that: the metal sheet crystal grain forming by electroforming process is finer and smoother, the opening sidewalls that plate face and laser cutting form is smooth, during printing, plate face is difficult for sticky tin cream, under opening, starch effective, thereby improve SMT printing quality, improved tradition coarse by the plate face of etching or laser cutting stainless steel art making SMT mask plate, the sticky tin cream of plate face of the rough generation of opening sidewalls, the phenomenons such as decline weak effect, eliminated simultaneously in traditional electrical casting process, exist because opening has residual film, cause the ropy defect of opening.
The aspect that the present invention is additional and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become from the following description of the accompanying drawings of embodiments and obviously and easily understand, wherein:
Figure 1 shows that the present invention completes the schematic cross-section of electroforming step;
Fig. 2 is depicted as the schematic cross-section that the present invention completes metal sheet after strip step;
Figure 3 shows that laser cutting process schematic cross-section of the present invention;
Figure 4 shows that the schematic cross-section of a kind of mask plate of the present invention;
Figure 5 shows that the present invention completes the schematic cross-section of step of membrane sticking;
Figure 6 shows that the present invention completes the schematic cross-section of step of exposure;
Figure 7 shows that the present invention completes the schematic cross-section of development step;
Shown in Fig. 8, be depicted as the schematic cross-section that the present invention completes etching step;
Figure 9 shows that the present invention completes the schematic cross-section that takes off film step;
Figure 10 shows that laser cutting process schematic cross-section of the present invention;
Figure 11 shows that the schematic cross-section of a kind of mask plate of the present invention;
Figure 12 shows that the structure for amplifying schematic diagram of 110 parts in Figure 11;
Figure 13 shows that the two dimensional structure schematic diagram of a kind of mask plate of the present invention.
Wherein, in Fig. 1,10 is substrate, and 11 is electroformed layer (being metal sheet);
In Fig. 3,30 is laser transmitter;
In Fig. 4,40 represent that mask plate is whole, and 41 is mask plate opening;
In Fig. 5,50 is film;
In Fig. 6,60 films that are exposure area;
In Fig. 7,70 is bare metal plate region;
In Fig. 8,80 is etching area;
In Fig. 9,90 is depressed part, and 91 is lug boss.
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the present invention, and can not be interpreted as limitation of the present invention.
According to embodiments of the invention, a kind of making method of mask plate is provided, comprise electroforming making sheet step (as shown in Fig. 1 ~ Fig. 2), laser cutting opening step (as shown in Fig. 3 ~ Fig. 4), electroforming making sheet step is at substrate 10 cast that powers on, to become metal sheet 11 by electroforming process; Laser cutting opening step is on metal sheet 11, by default patterns of openings ablation, to form opening by laser, thereby forms mask plate 40.
Below in conjunction with accompanying drawing, describe the making method of mask plate of the present invention in detail.
According to some embodiments of the present invention, as shown in Fig. 1 ~ Fig. 2, electroforming process described above comprises:
S1, substrate pre-treatment step: the surface cleaning of substrate 10 is clean, and for guaranteeing the quality on electroformed layer surface, substrate 10 surfaces need to be processed smooth clean, there is no pit, projection and impurity;
S2, electroforming step: as shown in Figure 1, using the substrate 10 through pre-treatment step as negative electrode, put into electrotyping bath and carry out electroforming formation electroformed layer 11;
S3, strip step: as shown in Figure 2, electroformed layer 11 and substrate 10 are peeled off, the electroformed layer 11 after peeling off is metal sheet.
According to some embodiments of the present invention, after strip step S3, also comprise cleaning step, baking step, guarantee that the plate face of metal sheet 11 in laser cutting opening step is clean, be dried.
Preferably, after electroforming step S2, before strip step S3, carry out cleaning step, baking step, electroforming solution is cleaned up and plate face dry.
According to some embodiments of the present invention, in electroforming step S3, electroformed layer 11 thickness are 20 μ m≤a1≤200 μ m.
Preferably, electroformed layer 11 thickness are 50 μ m≤a1≤150 μ m.
The thickness of electroformed layer 11 can change the electroforming time constant in the situation that at electroforming solution parameter and current parameters according to specific requirement and control, the electroforming time, longer electroformed layer 11 was thicker, and for example the thickness a1 of electroformed layer 11 can be 25 μ m, 50 μ m, 60 μ m, 75 μ m, 88 μ m, 100 μ m.
According to embodiments of the invention, as shown in Fig. 3 ~ Fig. 4, above-mentioned laser cutting opening step is that the laser of launching by laser transmitter 30 forms opening 41 by default patterns of openings ablation on metal sheet 11, thereby forms mask plate 40.
According to embodiments of the invention, before or after laser cutting opening step, also comprise by certain dimensional requirement and cut out metallic plate 11 periphery redundance (not shown)s, make the requirement of the size conforms regulation of metal sheet 11, for example the length dimension of rectangle mask plate is that 375mm, width dimensions are 400mm.
According to embodiments of the invention, the method for cutting out metallic plate 11 periphery redundances is mechanical cutting or laser ablation.
According to embodiments of the invention, the material of the metal sheet 11 that electroforming step forms is nickel or nickel-base alloy.For example electroforming material is Rhometal or nickel cobalt (alloy) or Perminvar.
In SMT print field, SMT mask plate is designed on the normal masks plate (as shown in Figure 4) of even thickness or plate face as required with structures such as lug boss or depressed parts, and lug boss and depressed part can be made by etch process.Below in conjunction with accompanying drawing, describe the etch process of making mask plate projection portion and depressed part in detail.
According to some embodiments of the present invention, before laser cutting step, also comprise by etch process and make mask plate projection portion or depressed part.
According to some embodiments of the present invention, as shown in Fig. 5 ~ Figure 11, etch process described above comprises:
A, step of membrane sticking: as shown in Figure 5, by two masks of metal sheet 11, in Fig. 5,50 is film;
B, step of exposure: as shown in Figure 6, selectivity exposure is carried out to according to predetermined pattern in the two sides through the metal sheet 11 of step of membrane sticking, on the film 50 on metal sheet 11 two sides, form exposed film region and unexposed diaphragm area, 60 films that are exposure area;
C, development step: as shown in Figure 7, the metal sheet through step of exposure is developed, the film of unexposed area in step of exposure 50 is removed, the metal sheet region that is removed film forms bare metal plate region 70, the film 60 of exposure area continues to retain;
D, etching step: as shown in Figure 8, the metal sheet through development step is carried out to etching, bare metal plate region 70 is etched into the etching area 80 with certain depth;
E, take off film step: as shown in Figure 9, the metal sheet 11 through etching step is taken off to film, by taking off film step, the film of exposure area 60 is removed, metal sheet surface forms lug boss 91 and depressed part 90.
Figure 9 shows that metal sheet 11 completes the schematic cross-section of making lug boss 91 and depressed part 90 through etch process, the making of lug boss 91 and depressed part 90 can form by two-sided etching, also can form by twice one side etching.
In the situation that etching solution parameter is identical, by adjusting etching speed and etching pressure, control etch depth, not etched for guaranteeing metal sheet 11, etch depth a2 is less than the thickness a1 of metal sheet 11.
When the lug boss shown in two-sided etching construction drawing 9 and depressed part, the height a2(of lug boss 91 is the etched degree of depth of face 1 in Fig. 9), the degree of depth a3(of depressed part 90 is the etched degree of depth of face 2 in Fig. 9) by adjusting the etching pressure parameter on two sides, control a2+a3<a1 in the example depicted in fig. 9.
When the lug boss shown in twice one side etching construction drawing 9 and depressed part, for example, when etching face 1 is made lug boss 91, by a backing plate (being generally plastic plate) that can not react with etching solution of face 2 pads.
As shown in figure 10, complete after etching step, through cleaning, baking step, the metal sheet 11 with lug boss 91 and depressed part 90 is carried out to laser cutting and form opening 41 steps.
As shown in figure 11, for completing laser, cut the schematic cross-section of the mask plate of step, Figure 12 shows that in Figure 11 110 structure for amplifying schematic diagram.
Figure 13 shows that mask plate shown in Fig. 9 is with the two dimensional structure schematic diagram of depressed part 90 one sides (face 2), 41 is opening, and 90 is depressed part.
Beneficial effect of the present invention is, metal sheet 11 crystal grain that form by electroforming process are finer and smoother, opening 41 sidewalls that plate face and laser cutting form are smooth, during printing, plate face is difficult for starching under sticky tin cream, opening effective, thereby improve SMT printing quality, improved the SMT mask plate of tradition by etching or the making of laser cutting stainless steel art because of phenomenons such as plate face is coarse, the sticky tin cream of the rough generation of opening sidewalls, decline weak effects, eliminated simultaneously in traditional electrical casting process, exist because opening has residual film, cause the ropy defect of opening.
Although the specific embodiment of the present invention is described in detail with reference to a plurality of illustrative examples of the present invention, but it must be understood that, those skilled in the art can design multiple other improvement and embodiment, and these improve and within embodiment will drop on spirit and scope.Particularly, within the scope of aforementioned open, accompanying drawing and claim, can aspect the layout of component and/or subordinate composite configuration, make rational modification and improvement, and can not depart from spirit of the present invention.Except modification and the improvement of component and/or layout aspect, its scope is limited by claims and equivalent thereof.
Claims (10)
1. a making method for mask plate, comprises electroforming making sheet step, laser cutting opening step, it is characterized in that:
Described electroforming making sheet step is at the substrate cast that powers on, to become metal sheet by electroforming process;
Described laser cutting opening step is on described metal sheet, by default patterns of openings ablation, to form opening by laser, thereby forms described mask plate.
2. the making method of mask plate according to claim 1, is characterized in that, described electroforming process comprises:
S1, substrate pre-treatment step: the surface cleaning of substrate is clean;
S2, electroforming step: using the described substrate through described pre-treatment step as negative electrode, put into electrotyping bath and carry out electroforming formation electroformed layer;
S3, strip step: by described electroformed layer and described strippable substrate, the described electroformed layer after peeling off is described metal sheet.
3. the making method of mask plate according to claim 2, is characterized in that, also comprises cleaning step, baking step after described strip step.
4. the making method of mask plate according to claim 2, is characterized in that, described electroformed layer thickness is 20 μ m≤a1≤200 μ m.
5. the making method of mask plate according to claim 4, is characterized in that, described electroformed layer thickness is 50 μ m≤a1≤150 μ m.
6. the making method of mask plate according to claim 1, is characterized in that, also comprised by certain dimensional requirement and cut out except described metal sheet periphery redundance before or after described laser cutting opening step.
7. the making method of mask plate according to claim 6, is characterized in that, the method that described sanction is removed described metal sheet periphery redundance is mechanical cutting or laser ablation.
8. the making method of mask plate according to claim 1, is characterized in that, the material of the described metal sheet that described electroforming step forms is nickel or nickel-base alloy.
9. the making method of mask plate according to claim 1, is characterized in that, before described laser cutting step, also comprises by etch process and makes described mask plate projection portion or depressed part.
10. the making method of mask plate according to claim 9, is characterized in that, described etch process comprises:
A, step of membrane sticking: by two masks of described metal sheet;
B, step of exposure: selectivity exposure is carried out to according to predetermined pattern in the two sides of the described metal sheet through described step of membrane sticking, on the described film on described metal sheet two sides, form exposed film region and unexposed diaphragm area;
C, development step: the described metal sheet through described step of exposure is developed, the film of unexposed area in described step of exposure is removed, the metal sheet region that is removed film forms bare metal plate region;
D, etching step: the described metal sheet through described development step is carried out to etching, described bare metal plate region is etched into the etching area with certain depth;
E, take off film step: the described metal sheet through described etching step is taken off to film, by the described film step that takes off, the film of described exposure area is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410170560.1A CN103966632A (en) | 2014-04-26 | 2014-04-26 | Manufacture method for mask plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410170560.1A CN103966632A (en) | 2014-04-26 | 2014-04-26 | Manufacture method for mask plate |
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| CN103966632A true CN103966632A (en) | 2014-08-06 |
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| CN201410170560.1A Pending CN103966632A (en) | 2014-04-26 | 2014-04-26 | Manufacture method for mask plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104532183A (en) * | 2015-01-26 | 2015-04-22 | 深圳市华星光电技术有限公司 | Manufacturing method of high-precision mask |
| CN113909494A (en) * | 2021-09-22 | 2022-01-11 | 寰采星科技(宁波)有限公司 | Preparation method of metal foil for metal mask plate and preparation method of metal mask plate |
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| CN103374680A (en) * | 2012-04-17 | 2013-10-30 | 昆山允升吉光电科技有限公司 | Electroforming nickel-ferrum alloy screen with high ferrum content for printing and preparation method |
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| CN113909494A (en) * | 2021-09-22 | 2022-01-11 | 寰采星科技(宁波)有限公司 | Preparation method of metal foil for metal mask plate and preparation method of metal mask plate |
| CN113909494B (en) * | 2021-09-22 | 2023-10-31 | 寰采星科技(宁波)有限公司 | Metal foil for metal mask plate and preparation method of metal mask plate |
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Application publication date: 20140806 |