CN104532183A - Manufacturing method of high-precision mask - Google Patents
Manufacturing method of high-precision mask Download PDFInfo
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- CN104532183A CN104532183A CN201510039433.2A CN201510039433A CN104532183A CN 104532183 A CN104532183 A CN 104532183A CN 201510039433 A CN201510039433 A CN 201510039433A CN 104532183 A CN104532183 A CN 104532183A
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- mask
- mask substrate
- mask plate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
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- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a manufacturing method of a high-precision mask, which comprises the following steps: thinning the perforated region of a mask substrate to a thickness penetrable for laser by using a half-etching process, applying tensile force to the periphery of the mask substrate to flatten the surface, welding the mask substrate to a mask frame, and cutting the mask plate with a laser to obtain a hole with required pattern. The lasing beam with the diameter of 1 micrometer is utilized to perforate the mask substrate so as to enhance the perforation precision of the mask and the perforation position accuracy, thereby more accurately manufacturing the mask plate with designed perforation size. The lasing beam with the diameter of 1 micrometer can be utilized to make a hole with minimal linewidth in the mask plate, thereby enhancing the resolution of the display device. Besides, the equipment cost required by production is lowered, thereby obviously lowering the production cost of the mask. The manufacturing process is shortened, thereby greatly enhancing the production efficiency of the mask.
Description
Technical field
The present invention relates to the making field of organic light emitting diode display, particularly relate to a kind of making method of high-precision mask plate.
Background technology
Organic light emitting diode indicating meter (Organic Light Emitting Diode, OLED) be a kind of flat panel display having development prospect, it has very excellent display performance, particularly luminous, structure are simple, ultra-thin, fast response time, wide viewing angle, reduce power consumption and can realize the characteristics such as Flexible Displays, be described as " dreamlike indicating meter ", add its investment of production equipment much smaller than TFT-LCD, obtain the favor of Ge great indicating meter producer, become the main force of third generation display device in technique of display field.Current OLED has been in the eve of scale of mass production, and along with going deep into further of research, continuing to bring out of new technology, OLED display device will have a breakthrough development.
OLED has the anode be formed at successively on substrate, organic luminous layer and negative electrode.The each function material layer of OLED and cathodic metal layer film are prepared by vacuum thermal evaporation technique, and vacuum thermal evaporation technique needs to use mask plate (Mask).The effect of mask plate makes OLED material evaporation to the position of design, and therefore the position of opening of mask plate, shape and surface finish are all quite important.Figure 1 shows that the schematic diagram of OLED material vacuum thermal evaporation process, add OLED material 200 to be deposited in crucible 100, be less than 10
-5under the vacuum tightness environment of Pa, crucible 100 slowly heats up, after arriving the gasification temperature of OLED material 200, OLED material 200 slowly becomes gaseous state distillation and comes up, through the perforate of mask plate 300, gaseous molecular is at substrate 400 surface deposition, and cooling condenses into solid-state molecular.The continuous accumulation of OLED material molecule slowly forms film on substrate 400.
Referring to Fig. 2 to Fig. 6, is the schematic diagram of the mask plate making processes of existing OLED material vacuum thermal evaporation.This making processes generally comprises: step 1, as shown in Figure 2, makes stainless steel mask frame (Frame) 10; Step 2, as shown in Figure 3, provide mask substrate 20 ', this mask substrate 20 ' is generally the stainless steel of 20 μm to 100 μm or the thin slice of Rhometal steel; Step 3, as shown in Figure 4, patterned process is carried out to mask substrate 20 ', in mask substrate 20 ', namely open some apertures 21; Step 4, as shown in Figure 5, apply certain tension force in mask substrate 20 ' surrounding, make its surfacing, and perforate 21 is without distortion, then by good to mask substrate 20 ' and mask frame 10 contraposition; Step 5, as shown in Figure 6, laser spot welding, makes mask substrate 20 ' and mask frame 10 weld together, makes mask plate 20.After completing above-mentioned making processes, the surfacing of the mask plate 20 obtained, perforate 21 is undeformed.
In order to improve the high resolving power of indicating meter, the size usually designed by light emitting pixel is all very little, so need the bore size of mask plate also very little.The making method of traditional mask plate usually adopts and is coated with photoresistance, exposure, development, first time chemical milling, cleaning, be again coated with the processing procedures such as photoresistance, exposure, development and second time chemical milling carries out perforate to mask substrate.But for the making method adopting chemical milling to carry out perforate, due to the restriction of processing condition, in general perforate precision is less than 2 μm, aperture widths is less than 20 μm and has been difficult to realize, and throw the net again after perforate and the shape of opening and size and size can be made to produce deviation, thus make the perforate precision of mask plate not high.
The mask plate adopting traditional technology to make has following shortcoming usually: live width (Critical Dimension, the CD) precision of perforate on mask plate is ± 2 μm ~ ± 3 μm; The minimum feature of described perforate is about 20 ~ 30 μm; There is the evaporation dead angle of 2 ~ 3 μm simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of high precision mask plate making method, by adopting laser, the opening area in mask substrate after half-etching is cut, the mask plate conforming with design bore size can be produced more accurately, improve the perforate precision of mask plate and the positional precision of perforate, reduce the production cost of mask plate, improve the production efficiency of mask plate.
For achieving the above object, the invention provides a kind of making method of high precision mask plate, comprise the steps:
Step 1, provide a mask substrate, described mask substrate be coated with photoresistance, the mask substrate scribbling photoresistance is exposed, developing manufacture process, thus form opening area and non-open area in described mask substrate;
Step 2, half-etching is carried out to the opening area of mask substrate, then remove photoresistance, and clean mask substrate;
Step 3, certain tension force is applied to mask substrate surrounding, makes its surfacing, then a mask frame is provided, by mask substrate and the contraposition of mask frame good, and mask substrate and mask frame to be welded together;
Step 4, according to design attitude and size, with the opening area in laser cutting mask substrate, cut out the perforate of the pattern of mask plate demand, complete the making of mask plate.
In described step 1, the material of mask substrate is stainless steel or Rhometal.
The thickness of described mask substrate is 20 μm to 100 μm.
Film light shield is adopted to complete exposure in described step 1.
Adopt chemical etching process to carry out half-etching to mask substrate in described step 2, thickness mask substrate being positioned at opening area after half-etching is less than or equal to 5 μm.
Adopt screen-tensioning machine to apply certain tension force to mask substrate surrounding in described step 3, make its surfacing.
The material of mask frame described in described step 3 is stainless steel.
Laser spot welding technique is adopted mask substrate and mask frame to be welded together in described step 3.
The diameter carrying out the laser beam of laser cutting in described step 4 is 1 μm.
The Line-width precision of the mask plate that described step 4 is obtained is less than or equal to 1.5 μm.
Beneficial effect of the present invention: the making method of a kind of high precision mask plate provided by the invention, the opening area of mask substrate is thinned to the thickness that laser can penetrate by first employing half-etching processing procedure, then tension force is applied in the surrounding of mask substrate, make its surfacing, and mask substrate is welded on mask frame, the perforate of the pattern of mask plate demand is gone out afterwards by laser cutting, utilize the lasing beam diameter of laser cutting can reach the characteristic of 1 micron to mask substrate perforate, improve the perforate precision of mask plate and the positional precision of perforate, thus the mask plate conforming with design bore size can be produced more accurately, utilize lasing beam diameter can reach the characteristic of 1 micron simultaneously, the perforate with minimal line width values can be produced on mask plate, thus improve the resolving power of indicating meter, in addition, reduce owing to producing required cost of equipment, thus significantly reduce the production cost of mask plate, because processing procedure operation shortens, thus significantly improve the production efficiency of mask plate.
In order to further understand feature of the present invention and technology contents, refer to following detailed description for the present invention and accompanying drawing, but accompanying drawing only provides reference and explanation use, is not used for being limited the present invention.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention describe in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In accompanying drawing,
Fig. 1 is the schematic diagram of OLED material vacuum thermal evaporation process;
Fig. 2 is the schematic diagram of existing mask plate making processes step 1;
Fig. 3 is the schematic diagram of existing mask plate making processes step 2;
Fig. 4 is the schematic diagram of existing mask plate making processes step 3;
Fig. 5 is the schematic diagram of existing mask plate making processes step 4;
Fig. 6 is the schematic diagram of existing mask plate making processes step 5;
Fig. 7 is the schema of the making method of high precision mask plate of the present invention.
Embodiment
For further setting forth the technique means and effect thereof that the present invention takes, be described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
Refer to Fig. 7, the invention provides a kind of making method of high precision mask plate, comprise the steps:
Step 1, provide a mask substrate, described mask substrate be coated with photoresistance, the mask substrate scribbling photoresistance is exposed, developing manufacture process, thus form opening area and non-open area in described mask substrate.
Concrete, in described step 1, the material of mask substrate is stainless steel or Rhometal.The thickness of described mask substrate is 20 μm to 100 μm.Film light shield is adopted to complete exposure in described step 1.
The mask substrate making method of traditional employing chemical milling perforate; owing to directly forming perforate in this stage; for ensureing perforate precision; therefore need to adopt high-precision quartz mask; and mask plate making method of the present invention, owing to directly not forming perforate in this stage, therefore do not need accurate exposure; use film light shield to carry out exposing, thus significantly reduce production cost.
Step 2, half-etching is carried out to the opening area of mask substrate, then remove photoresistance, and clean mask substrate.
Concrete, adopt chemical etching process to carry out half-etching to mask substrate in described step 2, the thickness that mask substrate is positioned at opening area after half-etching is less than or equal to 5 μm.
The reason of carrying out half-etching is, existing mask substrate the thinnest general being merely able to reaches 30 μm, but the thickness laser of 30 μm cannot be punched, first pass through half-etching, the thickness of the opening area of mask plate being reduced to 5 μm can effective head it off, for the laser cutting perforate of subsequent step is ready.
Step 3, adopt screen-tensioning machine to apply certain tension force to mask substrate surrounding, make its surfacing, then a mask frame is provided, the mask substrate after throwing the net and mask frame are carried out contraposition, and mask substrate and mask frame are welded together;
Concrete, the material of mask frame described in described step 3 is stainless steel; Laser spot welding technique is adopted mask substrate and mask frame to be welded together in described step 3.
By throwing the net to mask substrate, effectively can control the tenesmus amount of mask substrate, further, before applying tension force and welding step are placed on perforate, carry out the deformation that described opening is caused of throwing the net again after avoiding perforate, improve the perforate precision of mask plate and the positional precision of perforate; Simultaneously due to impact that the processing procedure that do not need to consider to throw the net causes perforate, thus the accurate screen-tensioning machine adopted when not needing employing prior art to make high-precision mask plate, only need adopt the common screen-tensioning machine used when making low precision mask plate, thus the cost of equipment of 1/3 can be saved.
Step 4, according to design attitude and size, with the opening area in laser cutting mask substrate, cut out the perforate of the pattern of mask plate demand, complete the making of mask plate.
Especially, in described step 4, the most I of the diameter of the laser beam of laser cutting reaches 1 μm, thus live width (the Critical Dimension of perforate on the obtained mask plate of described step 4, CD) precision (error) can Da Zhi≤1.5 μm, total spacing (TP of perforate on this mask plate, Total Pitch) precision (error) effectively can control Zhi≤1.5 μm by Bei, and the precision (error) by chemical milling perforate in prior art is generally greater than 2 μm, thus compared with prior art, the present invention can obtain the higher mask plate of perforate precision.
Further, utilize lasing beam diameter can reach the characteristic of 1 micron, the perforate with minimal line width values can be produced on mask plate, make the resolving power of display panel can readily exceed 600PPI (Pixels PerInch, the number of pixels that per inch has).
Concrete, the present invention completes perforate by adopting laser cutting parameter, compared with the exposure machine adopted with existing chemical etch technique, with precision radium-shine laser machine comparatively exposure machine more cheaply, be only 2/3 of exposure machine expense.
It is worth mentioning that, compared with prior art, the making method of mask plate of the present invention not only increases perforate precision, effectively reduces production cost, and shortens many due to processing procedure operation, thus significantly improves production efficiency.
In sum, the making method of a kind of high precision mask plate provided by the invention, the opening area of mask substrate is thinned to the thickness that laser can penetrate by first employing half-etching processing procedure, then tension force is applied in the surrounding of mask substrate, make its surfacing, and mask substrate is welded on mask frame, the perforate of the pattern of mask plate demand is gone out afterwards by laser cutting, utilize the lasing beam diameter of laser cutting can reach the characteristic of 1 micron to mask substrate perforate, improve the perforate precision of mask plate and the positional precision of perforate, thus the mask plate conforming with design bore size can be produced more accurately, utilize lasing beam diameter can reach the characteristic of 1 micron simultaneously, the perforate with minimal line width values can be produced on mask plate, thus improve the resolving power of indicating meter, in addition, reduce owing to producing required cost of equipment, thus significantly reduce the production cost of mask plate, because processing procedure operation shortens, thus significantly improve the production efficiency of mask plate.
The above, for the person of ordinary skill of the art, can make other various corresponding change and distortion according to technical scheme of the present invention and technical conceive, and all these change and be out of shape the protection domain that all should belong to the claims in the present invention.
Claims (10)
1. a making method for high precision mask plate, is characterized in that, comprises the steps:
Step 1, provide a mask substrate, described mask substrate be coated with photoresistance, the mask substrate scribbling photoresistance is exposed, developing manufacture process, thus form opening area and non-open area in described mask substrate;
Step 2, half-etching is carried out to the opening area of mask substrate, then remove photoresistance, and clean mask substrate;
Step 3, certain tension force is applied to mask substrate surrounding, makes its surfacing, then a mask frame is provided, by mask substrate and the contraposition of mask frame good, and mask substrate and mask frame to be welded together;
Step 4, according to design attitude and size, with the opening area in laser cutting mask substrate, cut out the perforate of the pattern of mask plate demand, complete the making of mask plate.
2. the making method of high precision mask plate as claimed in claim 1, it is characterized in that, in described step 1, the material of mask substrate is stainless steel or Rhometal.
3. the making method of high precision mask plate as claimed in claim 1, it is characterized in that, the thickness of described mask substrate is 20 μm to 100 μm.
4. the making method of high precision mask plate as claimed in claim 1, is characterized in that, adopt film light shield to complete exposure in described step 1.
5. the making method of high precision mask plate as claimed in claim 1, it is characterized in that, adopt chemical etching process to carry out half-etching to mask substrate in described step 2, thickness mask substrate being positioned at opening area after half-etching is less than or equal to 5 μm.
6. the making method of high precision mask plate as claimed in claim 1, is characterized in that, adopt screen-tensioning machine to apply certain tension force to mask substrate surrounding, make its surfacing in described step 3.
7. the making method of high precision mask plate as claimed in claim 1, it is characterized in that, the material of mask frame described in described step 3 is stainless steel.
8. the making method of high precision mask plate as claimed in claim 1, is characterized in that, adopt laser spot welding technique mask substrate and mask frame to be welded together in described step 3.
9. the making method of high precision mask plate as claimed in claim 1, it is characterized in that, the diameter carrying out the laser beam of laser cutting in described step 4 is 1 μm.
10. the making method of high precision mask plate as claimed in claim 1, is characterized in that, the Line-width precision of the mask plate that described step 4 is obtained is less than or equal to 1.5 μm.
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