CN104289817A - Metal mask plate cutting equipment - Google Patents

Metal mask plate cutting equipment Download PDF

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Publication number
CN104289817A
CN104289817A CN201410501860.3A CN201410501860A CN104289817A CN 104289817 A CN104289817 A CN 104289817A CN 201410501860 A CN201410501860 A CN 201410501860A CN 104289817 A CN104289817 A CN 104289817A
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CN
China
Prior art keywords
guide rail
axis guide
mask plate
metal mask
cutting equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410501860.3A
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Chinese (zh)
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CN104289817B (en
Inventor
魏志凌
王武怀
孙杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Power Stencil Co Ltd
Original Assignee
Kunshan Power Stencil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Power Stencil Co Ltd filed Critical Kunshan Power Stencil Co Ltd
Priority to CN201410501860.3A priority Critical patent/CN104289817B/en
Publication of CN104289817A publication Critical patent/CN104289817A/en
Application granted granted Critical
Publication of CN104289817B publication Critical patent/CN104289817B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels

Abstract

The invention discloses metal mask plate cutting equipment. The metal mask plate cutting equipment comprises an equipment platform, a stretching assembly and a motion guide rail, and further comprises a laser inclined-cutting device. A laser cutting head capable of rotating around the axis parallel to a Z-axis guide rail is obliquely arranged on the laser inclined-cutting device, the laser inclined-cutting device is directly or indirectly installed on the Z-axis guide rail and can move on an X-axis guide rail and a Y-axis guide rail in the X-axis direction and the Y-axis direction along with the Z-axis guide rail and can also move on the Z-axis guide rail in the Z-axis direction, the laser inclined-cutting device can be used for cutting metal mask plates stretched on the stretching assembly, and mask openings are formed. The metal mask plate cutting equipment can be used for cutting the mask plates, side walls of the openings of the mask plates are inclined planes, the sections of the openings of the mask plates are each of a trapezoidal structure, and an evaporation effect generated when the mask plates are used for evaporation and deposition of organic materials can be avoided.

Description

A kind of metal mask plate cutting equipment
Technical field
The invention belongs to laser cutting field, be specifically related to a kind of metal mask plate cutting equipment.
 
Background technology
OLED (Organic Light-Emitting Diode, be called for short OLED) be follow-on Display Technique, with liquid crystal display (the Liquid Crystal Display used at present, being called for short LCD) Display Technique compares, there is angle of visibility large, beautiful in colour, the advantage such as low in energy consumption, can substitute the lcd technology of current main flow gradually.
In the manufacturing process of OLED display panel, wherein the deposition of organic layer can use mask plate, Figure 1 shows that the schematic diagram adopting mask plate evaporation organic material.Mask plate 10, due to thinner, can be fixed in mask outer frame 11 by related process, Figure 2 shows that mask plate is fixed on the floor map in mask outer frame 11 before evaporation.During evaporation, mask plate 10 is fixed on brace table 12 by mask outer frame 11, organic material in vapor deposition source 13 is by below evaporation and diffusion to mask plate 10, mask plate 10 is provided with opening 100 in certain position, organic material is deposited on position corresponding in deposition substrate 14 by opening 100, forms deposited organic layer.
In technical requirement, the deposition quality of deposited organic layer has very large impact to later product quality, thus in vapor deposition process to the edge definition of deposition region in deposition substrate 14 and uniformity requirement very high.In order to the good evaporation of organic material can be realized in deposition substrate 14, the impact of mask plate edge of opening on deposited organic layer must be reduced, namely (what deposit organic material 130 due to mask plate edge of opening blocks impact to the evaporation effect reducing as shown in Figure 3, cause deposited organic layer 131 edge thickness uneven), the opening section of mask plate is often designed to " spill " structure shown in Fig. 4, should " spill " structure be generally obtained by chemical etching process, but pollution can be brought to environment based on the mask plate manufacturing technology of etch process.
Based on this, industry wishes to adopt eco-friendly technique to make mask plate, to making the mask plate that can meet OLED organic layer deposition under environmentally friendly prerequisite, make mask plate by laser cutting parameter and there is eco-friendly advantage, but the opening pattern that conventional laser equipment cutting thin material is formed as shown in Figure 3, the defect that the opening of pattern like this brings is described above, and it can not meet the requirement of OLED display panel organic layer high-quality deposition.
So industry is needed the new mode of exploration badly and is made mask plate, to meeting under eco-friendly prerequisite, can meet the requirement of mask plate high-quality opening preferably.
Summary of the invention
In view of this, the invention provides a kind of metal mask plate cutting equipment, be intended to overcome defect of the prior art, to better meet the cutting application of the mask plate with high-accuracy opening.
According in this patent background technology to described in prior art, current OLED evaporation mask plate makes the method used two kinds: one, make by etching work the opening that cross section is " spill " structure, but pollution can be brought to environment based on the mask plate manufacturing technology of etch process; Its two, by laser cutting parameter make mask plate there is eco-friendly advantage, but conventional laser equipment cutting thin material formed opening can bring evaporation effect.
A kind of metal mask plate cutting equipment provided by the present invention, it comprises: board; Stretch tight screen component, described in the screen component that stretches tight be fixedly mounted on described board, be provided with some clamping devices, described metal mask plate side by the described screen component that stretches tight gripper mechanism grips and stretch tight to draw and reach surfacing; Motion guide rail, described motion guide rail comprises X-axis guide rail, Y-axis guide rail and Z axis guide rail, described Y-axis guide rail directly or is indirectly fixedly mounted on described board, described X-axis guide rail is arranged on described Y-axis guide rail, and the motion of Y direction can be carried out on described Y-axis guide rail, described Z axis guide rail is arranged on described X-axis guide rail, and described Z axis guide rail can carry out the motion of X-direction on X-axis guide rail; Described metal mask plate cutting equipment also comprises laser beveller, described laser beveller surface thereof is provided with the laser cutting head that the axis that can be parallel to Z axis guide rail around carries out rotating, described laser beveller is directly or indirectly arranged on described Z axis guide rail, the motion of X, Y direction can be carried out on X-axis guide rail, Y-axis guide rail with Z axis guide rail, also the motion of Z-direction can be done on Z axis guide rail, described in described laser beveller can be pulled in stretching tight, the metal mask plate stretched tight on screen component cuts, and forms mask open.
Metal mask plate cutting equipment provided by the invention can cut out the mask plate that opening sidewalls is inclined plane, and the opening section of described mask plate is trapezium structure, and it can avoid mask plate to produce evaporation effect when vapor deposition organic material.
Further, laser beveller involved in the present invention comprises supporting mechanism, rotating mechanism, slipway mechanism, laser cutting head, described supporting mechanism is used for supporting described laser beveller, other all parts of described laser beveller are all directly or indirectly arranged on described supporting mechanism, and described laser beveller is directly or indirectly arranged on described Z axis guide rail by described supporting mechanism; Described rotating mechanism is directly installed on described supporting mechanism, and described rotating mechanism comprises power rotary device, rotary end, and described rotary end can rotate under the drive of described power rotary device; Described slipway mechanism is fixed on below the described rotary end of described rotating mechanism; Described laser cutting head tilt be arranged on described slipway mechanism; By described slipway mechanism, the position of the pivot axis of the relatively described rotating mechanism of focus of described laser cutting head institute Emission Lasers can be adjusted.
For strengthening the automaticity of metal mask plate cutting equipment of the present invention, metal mask plate cutting equipment of the present invention also comprises control unit, and for controlling described control, described control unit stretches tight that screen component draws stretching tight of described metal mask plate, the working method of the motion path of described motion guide rail and described laser beveller.
Further, the involved in the present invention screen component that stretches tight comprises 4 groups of clamping devices and the mount pad for installing clamping device, described mount pad is provided with attachment rail, be provided with operation slide block bottom described clamping device, described 4 groups of clamping devices are installed on the described attachment rail of described mount pad by described operation slide block.
Further, described metal mask plate cutting equipment also comprises crossbeam and X/Z axle is dull and stereotyped, described crossbeam is arranged on Y-axis guide rail by the slide block 1 being arranged on two ends, described X-axis guide rails assembling is on described crossbeam, described X/Z axle flat board is arranged on described X-axis guide rail by slide block 2, and described Z axis guide rails assembling is on described X/Z axle flat board.
Further, described metal mask plate cutting equipment also comprises Y-axis guide supporting, described Y-axis guide supporting is directly installed on described board, and described Y-axis guide rails assembling is in described Y-axis guide supporting, and described Y-axis guide rail is indirectly fixedly mounted on described board by described Y-axis guide supporting.
Further, the supporting mechanism of described laser beveller is indirectly arranged on described Z axis guide rail by slide block 3.
For the ease of the port quality of monitoring mask plate opening, described metal mask plate cutting equipment also comprises machine vision assembly, and described machine vision assembly is arranged on described slide block 3, for capturing the pattern of described metal mask plate upper shed.
Further, described metal mask plate cutting equipment also comprises debris collection device, it is inner that it is arranged on described base station, for collecting the metal fragment produced in cutting process, scrap collecting process timely, prevent from chip in mask plate manufacturing process from normally running equipment to have an impact, such as, chip falls can affect orbital motion precision on orbit.
Because metal mask plate cutting equipment of the present invention has degree of precision requirement, it requires that board has higher stability, and in the present invention, described board comprises granite platform and pedestal, described granite platform is arranged on described pedestal, and described pedestal contacts with support base.
Concrete structure of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
 
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from the following description of the accompanying drawings of embodiments, wherein:
Figure 1 shows that the schematic diagram adopting mask plate evaporation organic material;
Figure 2 shows that the floor map of mask plate;
Figure 3 shows that the local vapor deposition schematic diagram of mask plate opening part when adopting traditional masks plate evaporation;
Fig. 4 is the mask plate opening schematic diagram (prior art) adopting etch process to make;
Fig. 5 is the signal of a kind of embodiment solid of metal mask plate cutting equipment provided by the present invention;
Fig. 6 is the front view of metal mask plate cutting equipment of the present invention;
It is metal mask plate cutting equipment top view of the present invention described in Fig. 7;
Fig. 8 is a kind of embodiment solid signal of laser beveller;
Fig. 9 is the schematic diagram that laser beveller is assemblied on motion guide rail;
Figure 10 shows that a kind of embodiment schematic diagram of the screen component that stretches tight of metal mask plate cutting equipment of the present invention;
Figure 11 shows that a kind of embodiment schematic diagram of the clamping device forming this screen component;
Figure 12 stretches tight by the screen component that stretches tight to draw the schematic diagram of metal mask plate;
Figure 13 shows that metal mask plate opening cutting partial schematic diagram;
Figure 14 shows that the schematic diagram of the metal mask plate evaporation OLED organic material adopting cutting equipment of the present invention cutting.
 
In figure,
10 is mask plate, and 100 is mask plate opening, 11 mask outer frame of fixing for mask plate, and 12 is brace table, and 13 is vapor deposition source, and 130 is organic material, and 131 is deposited organic layer, and 14 is deposition substrate;
51 is board, 511 for forming the granite platform of board 51, 512 for forming the pedestal of board 51, 52 is the screen component that stretches tight, 521 for forming the clamping device of the screen component 52 that stretches tight, 5211 is the chuck of clamping device 521, 5212 is the base plate of clamping device 521, 5213 is the chuck approach rail of clamping device 521, 5214 is the motor of clamping device 521, 5215 is the base plate slide block of clamping device 521, 5216 is the pulling force sensor of clamping device 521, 5217 is the motor movement position-limit mechanism of clamping device 521, 522 for installing the mount pad of clamping device 521, 523 for being arranged on the mounting guide rail on mount pad 522, 53 is motion guide rail, 531 for forming the X-axis guide rail of motion guide rail 53, 532 for forming the Y-axis guide rail of motion guide rail 53, 533 for forming the Z axis guide rail of motion guide rail 53, 54 is laser beveller, 55 is Y-axis guide supporting, 56 debris collection devices,
71 is X-axis guide rail fixed cross beam, 72 for the slide block 1,73 being arranged on crossbeam 71 two ends be linear electric motors;
81 supporting mechanisms that are laser beveller 54 in the present invention, 82 rotating mechanisms that are laser beveller 54 in the present invention, 83 slipway mechanisms that are laser beveller 54 in the present invention, 85 position-limit mechanisms that are laser beveller 54 in the present invention, wherein 851 is the moving component forming position-limit mechanism 85, 852 for forming the static component of position-limit mechanism 85, 86 fixed mechanisms that are fixed laser cutting head 541 in laser beveller 54 of the present invention, 87 fiber securing mechanism that are laser beveller 54 in the present invention, the pivot axis that O-O ' is whirligig in the present invention 82,
91 is that X/Z axle is dull and stereotyped, and 92 is machine vision assembly for being arranged on slide block 2,93 on X/Z axle flat board 91 for being arranged on Z axis guide rail 533 top shoe 3,94;
θ is the angle between laser and mask plate plate face 10.
 
Detailed description of the invention
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
In describing the invention, it will be appreciated that, term " on ", D score, the orientation of the instruction such as " side " or position relationship be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.
In describing the invention, it should be noted that, unless otherwise clearly defined and limited, term " connection ", " connection ", " being connected ", " connection ", " cooperation " should be interpreted broadly, and such as, can be fixedly connected with, connecting integratedly, also can be removably connect; It can be the connection of two element internals; Can be directly be connected, also indirectly can be connected by intermediary; " cooperation " can be face and the coordinating of face, and also can be point and the coordinating of face or line and face, also comprise the cooperation of hole axle, for the ordinary skill in the art, concrete condition can understand above-mentioned term concrete meaning in the present invention.
Inventive concept of the present invention is as follows: as described in technical background, current OLED evaporation mask plate makes the method used two kinds: one, make by etching work the opening that cross section is " spill " structure, but pollution can be brought to environment based on the mask plate manufacturing technology of etch process; Its two, by laser cutting parameter make mask plate there is eco-friendly advantage, but conventional laser equipment cutting thin material formed opening can bring evaporation effect.Given this, the invention provides a kind of laser cutting device, it can overcome above problem, can meet the opening cutting application of OLED mask plate preferably.
A kind of embodiment schematic perspective view of metal mask plate cutting equipment provided by the present invention as shown in Figure 5,
It comprises: board 51; Stretch tight screen component 52, and the screen component 52 that stretches tight is fixedly mounted on board 51, and the screen component 52 that stretches tight is provided with some clamping devices 521, and the side of metal mask plate 10 clamps by the clamping device 521 of the screen component 52 that stretches tight and stretches tight to draw and reaches surfacing; Motion guide rail 53, motion guide rail 53 comprises X-axis guide rail 531, Y-axis guide rail 532 and Z axis guide rail 533, what Y-axis guide rail 532 was direct or indirect is fixedly mounted on board 51, X-axis guide rail is arranged on Y-axis guide rail 532, and the motion of Y direction can be carried out on Y-axis guide rail 532, Z axis guide rail 533 is arranged on X-axis guide rail 531, and Z axis guide rail 533 can carry out the motion of X-direction on X-axis guide rail 531; Metal mask plate cutting equipment also comprises laser beveller 54, laser beveller 54 surface thereof is provided with the laser cutting head 541 that the axis that can be parallel to Z axis guide rail 533 around carries out rotating, laser beveller 54 is directly or indirectly arranged on Z axis guide rail 533, the motion of X, Y-axis can be carried out on X-axis guide rail, Y-axis guide rail 532 with Z axis guide rail 533, also the motion of Z-direction can be done on Z axis guide rail 533, laser beveller 54 can be pulled in the metal mask plate 10 stretched tight on screen component 52 and cut to stretching tight, form mask open.Be the front view of metal mask plate cutting equipment of the present invention and top view described in Fig. 6, Fig. 7, composition graphs 5, Fig. 6 and Fig. 7, better can show the overall structure of the present embodiment metal mask plate cutting equipment.
Below that the present embodiment associated mechanisms is described in further detail.
Figure 8 shows that the laser beveller 54 1 kinds of embodiment solids signal forming metal mask plate cutting equipment, as shown in Figure 8, laser beveller 54 comprises: supporting mechanism 81, rotating mechanism 82, slipway mechanism 83, laser cutting head 541; Supporting mechanism 81 is used for supporting laser beveller, and other all parts of laser beveller are all directly or indirectly arranged on described supporting mechanism 81, and laser is cut sth. askew and filled 54 and put and be directly or indirectly arranged on Z axis guide rail 533 by supporting mechanism 81; Rotating mechanism 82 is directly installed on described supporting mechanism 81, and rotating mechanism 82 comprises power rotary device, rotary end (not shown), and rotary end can rotate under the drive of power rotary device; Slipway mechanism 83 is fixed on below the described rotary end of rotating mechanism 82; What laser cutting head 541 tilted is arranged on slipway mechanism 83.
With reference to figure 8 schematic diagram, the pivot axis of rotating mechanism 82 is O-O ', by adjustment slipway mechanism 83, can adjust the position of the pivot axis O-O ' of the relatively described rotating mechanism of focus 840 of described laser cutting head 541 Emission Lasers.In the present embodiment, slipway mechanism 83 is two-dimensional slipway, it has higher degree of regulation (micro-nano rank), by adjustment slipway mechanism 83, the focus 840 of laser cutting head 541 Emission Lasers can be made to drop on the pivot axis O-O ' of rotating mechanism 82, thus make described laser beveller have good mask plate opening turning cutting function.
In the present embodiment, the side of rotating mechanism 82 is provided with position-limit mechanism 85, position-limit mechanism 85 is made up of the moving component 851 moved with power rotary device and the static static component 852 of relatively described support component 81, moving component 851 can directly and rotating mechanism 82 bind, static component 852 can directly be fixed on bracing frame.Rotating mechanism 82 is in spinning movement process, its anglec of rotation is subject to the restriction of position-limit mechanism 85, namely when rotating mechanism 82 rotates along a direction, the moving component 851 of position-limit mechanism 85 moves with rotating mechanism 82, also trigger when the moving component 851 of position-limit mechanism 85 touches static component 852 switch be arranged on position-limit mechanism 85, rotating mechanism stops further rotating in the same direction immediately.
Owing to being provided with stopping means 85, laser cutting head 541 there will not be unconfined rotation under the drive of rotating mechanism 82, and the laser be connected on laser cutting head 541 imports optical fiber and there will not be around disconnected situation.In other words, increase stopping means 85 in the present embodiment, can effectively avoid the maloperation of rotary part and all kinds of accidents that cause.In the present embodiment, rotating mechanism 82 can rotate a circle under the restriction of position-limit mechanism 85, but its maximum angle rotated is less than 370 °.
In other embodiments of the present invention, transferring full by optical mirror slip transmission of laser, does not need optical fiber, therefore can not arrange position-limit mechanism 85.
Laser beveller 54 in the present embodiment also comprises fixed part 86, and fixed part 86 is fixed on described slipway mechanism 83 lower end, and what laser cutting head 541 was tilted by described fixed part 86 is arranged on slipway mechanism 83.
In laser beveller 54 1 specific embodiment, the power rotary device forming rotating mechanism 82 is electric rotating machine, and electric rotating machine is flexible, under the operation of PLC, can rotate at any angle.In another specific embodiment, forming the power rotary device of rotating mechanism 82 is rotary cylinders, rotary cylinder with low cost, can reduce overall cost.
In the laser beveller 54 being provided with optical fiber, in order to prevent optical fiber to be damaged in device operation process further, the bracing frame of laser beveller is provided with the fixed cover 87 of fixed fiber.
Figure 9 shows that laser beveller is assemblied in the schematic diagram on motion guide rail, in the present embodiment, metal mask plate cutting equipment comprises crossbeam 71 and X/Z axle flat board 91, crossbeam 71 represents with 72 by slide block 1(Fig. 7 of being arranged on two ends) be arranged on Y-axis guide rail 532, X-axis guide rail 531 is arranged on crossbeam 71, X/Z axle flat board 91 is by representing with 92 in slide block 2(Fig. 9) be arranged on X-axis guide rail 531, Z axis guide rail 533 is arranged on X/Z axle flat board 91.The supporting mechanism 81 of laser beveller 54 is by representing with 93 in slide block 3(Fig. 9) be indirectly arranged on Z axis guide rail 533.
In some embodiments of the invention, the X-axis guide rail 531 and the Z axis guide rail 533 that form operation guide rail 53 all at least respectively comprise a guide rail, and as shown in Figure 9 in embodiment, X-axis guide rail 531 and Z axis guide rail 533 all comprise two guide rails be arranged in parallel.In addition, in the present invention, the operation forming X-axis guide rail 531, Y-axis guide rail 532 and the Z axis guide rail 533 running guide rail 53 is all realized by the motor being arranged on guide rail side, as shown in Figure 7, crossbeam 71 is at the control realization moving through the linear electric motors 73 being arranged on Y-axis guide rail 532 side of Y direction.
In the present embodiment, metal mask plate cutting equipment also comprises Y-axis guide supporting 55, and as shown in Figure 5, Y-axis guide supporting 55 is directly installed on board 51, Y-axis guide rail 532 is arranged in Y-axis guide supporting 55, and Y-axis guide rail 532 is indirectly fixedly mounted on board 51 by Y-axis guide supporting 55.
Figure 10 shows that a kind of embodiment schematic diagram of the screen component 52 that stretches tight of metal mask plate cutting equipment of the present invention, the screen component 52 that stretches tight is fixedly mounted on board 51, in the present embodiment, the screen component 52 that stretches tight comprises 4 groups of clamping devices and the mount pad 522 for installing clamping device 521, often organize clamping device and comprise some clamping devices 521, mount pad 522 is provided with attachment rail 523, the operation slide block (namely in Figure 11 5215) mated with attachment rail 523 is provided with bottom clamping device 521, clamping device 521 can be slided by the operation slide block being arranged on bottom on attachment rail 523.In the present embodiment, 4 groups of clamping devices 521 and mount pad 522 are symmetrical set on board 51, and specifically as shown in Figure 10,4 groups are arranged on clamping device 521 on mount pad 522 and are separately positioned on 4 limits of rectangle.
As shown in Figure 10, the often group clamping device stretched tight in two groups of clamping devices of screen component 52 1 opposite side is all containing 3 clamping devices 521, and the often group clamping device in two groups of clamping devices of another opposite side is all containing 4 clamping devices 521; In another specific embodiment (without view), the often group clamping device in two groups of clamping devices of an opposite side is all containing 7 clamping devices 521, and the often group clamping device in two groups of clamping devices of another opposite side is all containing 8 clamping devices 521.In actual applications, the quantity that the often group clamping device stretching tight screen component 52 comprises clamping device 521 is generally 1 ~ 10, concrete quantity is determined according to the size of metal mask plate 10, when metal mask plate 10 size is enough large, the quantity that often group clamping device comprises clamping device 521 can more than 10; In addition in some embodiments of the invention, each clamping device 521 forming the screen component 52 that stretches tight is fixed on attachment rail 523 by fixed mechanism determines position, as a kind of fairly simple frame mode, its mode held out against by screw fixes (not shown).
In addition, consider the stability of installation in certain embodiments, each mount pad 522 is at least provided with on each mount pad 522 shown in 2 attachment rails 523, Figure 10 and namely has 2 attachment rails 523.
It is a kind of embodiment schematic diagram of clamping device 521 shown in Figure 11, clamping device 521 comprises chuck 5211, base plate 5212, chuck approach rail 5213, motor 5214, base plate slide block 5215, chuck approach rail 5213 is fixedly installed on base plate 5212, what slided by the slide block (not identifying in figure) matched with chuck approach rail 5213 in chuck 5211 lower end is arranged on chuck approach rail 5213, and on the mount pad 522 of the overall base plate slide block 5215 with the screen component 52 that stretches tight by being arranged on base plate 5212 bottom of clamping device, attachment rail 523 matches.Chuck 5211 under the drive of motor 5214 can on chuck approach rail 5213 back and forth movement, in addition, chuck 5211 self by air cylinder driven realize clamping and loosening up.By the clamping device 521 with the use of the screen component 52 that stretches tight, can stretch tight to draw and reach smooth in the surface of metal mask plate 10.Figure 12 stretches tight by the screen component 52 that stretches tight to draw the schematic diagram of metal mask plate 10.
The forming process of metal mask plate 10 is: metal sheet (base material of metal mask plate 10) to be cut is tightened Zhang Ping by the screen component 52 that stretches tight, laser beveller 54 is under the drive of motion guide rail 53, coordinate the rotation of laser beveller 54 self, the metal sheet tightening Zhang Ping forms default opening, thus forms metal mask plate.
In addition, for ease of the control of the screen component 52 that stretches tight, pulling force sensor 5216 and motor movement position-limit mechanism 5217 can also be provided with between the motor 5214 of clamping device 521 and chuck 5211, as shown in figure 11.
In an embodiment of the present invention, for strengthening the automaticity of metal mask plate cutting equipment of the present invention, metal mask plate cutting equipment also comprises control unit (not shown), and control unit for controlling to stretch tight, draw by stretching tight of screen component 52 pairs of metal mask plates 10, the motion path of motion guide rail 53 and the working method of laser beveller 54; In addition, in the present invention, the motion of motion guide rail 53 all matches with high-accuracy grating scale, to reach the effect that high accuracy controls.
For the ease of the port quality of monitoring mask plate opening, metal mask plate cutting equipment also comprises machine vision assembly 94, as shown in Figure 9, machine vision assembly 94 is arranged in slide block 3(figure and represents with 94) on, it is for capturing the pattern of described metal mask plate upper shed and matching track motion measurement mask plate needing the size of measured zone, and machine vision assembly 94 can be high-resolution CCD camera.
Metal mask plate cutting equipment of the present invention also comprises debris collection device 56, it is inner that it is arranged on described base station, for collecting the metal fragment produced in cutting process, scrap collecting process timely, prevent from chip in mask plate manufacturing process from normally running equipment to have an impact, such as, chip falls can affect orbital motion precision on orbit 53.In debris collection device 56, can adsorption plant be set.
Because metal mask plate cutting equipment of the present invention has degree of precision requirement, it requires that board 51 has higher stability, as shown in Figure 5, Figure 6, in the present invention, board 51 comprises granite platform 511 and pedestal 512, granite platform 511 is arranged on pedestal 512, pedestal 512 is steelframe mechanism, and pedestal 512 directly or by foot pad contacts with support base indirectly.
More than some specific embodiment of metal mask plate of the present invention, the mask plate that opening sidewalls is inclined plane can be cut out by metal mask plate cutting equipment provided by the invention, opening section is trapezium structure, and it can avoid mask plate 10 to produce evaporation effect when vapor deposition organic material.Described in specific as follows: adopt metal mask plate cutting equipment provided by the present invention to carry out adding man-hour, because laser cutting head is set to heeling condition, it becomes certain angle of inclination with processed sheet material (forming mask plate after sheet fabrication), thus the sidewall of its opening cut out on sheet material and plate face at an angle.As shown in figure 13, form angle theta between the sidewall of opening and the plate face of mask plate 10, the mask plate cut out by mode like this can be good at meeting the application of OLED display screen organic material evaporation, and the sidewall of inclination avoids evaporation effect when mask plate is applied.In some embodiments of the invention, the angle theta scope between the laser launched of laser cutting head 541 and cut surface (i.e. the plate face of mask plate 10) is: 15 °≤θ≤75 °; As more specifically some embodiments: angle theta is 15 °, 30 °, 45 °, 60 °, 75 °.
Figure 14 shows that the schematic diagram of the mask plate evaporation OLED organic material adopting laser beveller of the present invention cutting, it avoids evaporation effect in evaporate process, organic material 130 can uniformly vapor deposition to the specific region on substrate 14.
Concrete component, structure or the feature mentioning that " embodiment ", " embodiment ", " illustrative examples " etc. mean to describe in conjunction with this embodiment any in the present invention is contained at least one embodiment of the present invention.At this description, this schematic representation everywhere not necessarily refers to identical embodiment.And when describing concrete component, structure or feature in conjunction with any embodiment, advocate, the embodiment in conjunction with other realizes such component, structure or feature and all drops within the scope of those skilled in the art.
Although be described in detail the specific embodiment of the present invention with reference to multiple illustrative examples of the present invention, but it must be understood that, those skilled in the art can design multiple other improvement and embodiment, these improve and embodiment will drop within spirit and scope.Specifically, within the scope of aforementioned open, accompanying drawing and claim, rational modification and improvement can be made in the layout of parts and/or sub-combination layout, and spirit of the present invention can not be departed from.Except modification and the improvement of parts and/or layout aspect, its scope is by claims and equivalents thereof.

Claims (10)

1. a metal mask plate cutting equipment, it comprises:
Board;
Stretch tight screen component, described in the screen component that stretches tight be fixedly mounted on described board, be provided with some clamping devices, described metal mask plate side by the described screen component that stretches tight gripper mechanism grips and stretch tight to draw and reach surfacing;
Motion guide rail, described motion guide rail comprises X-axis guide rail, Y-axis guide rail and Z axis guide rail, described Y-axis guide rail directly or is indirectly fixedly mounted on described board, described X-axis guide rail is arranged on described Y-axis guide rail, and the motion of Y direction can be carried out on described Y-axis guide rail, described Z axis guide rail is arranged on described X-axis guide rail, and described Z axis guide rail can carry out the motion of X-direction on X-axis guide rail;
It is characterized in that, described metal mask plate cutting equipment also comprises laser beveller, described laser beveller surface thereof is provided with the laser cutting head that the axis that can be parallel to Z axis guide rail around carries out rotating, described laser beveller is directly or indirectly arranged on described Z axis guide rail, the motion of X, Y direction can be carried out on X-axis guide rail, Y-axis guide rail with Z axis guide rail, also the motion of Z-direction can be done on Z axis guide rail, described in described laser beveller can be pulled in stretching tight, the metal mask plate stretched tight on screen component cuts, and forms mask open.
2. metal mask plate cutting equipment according to claim 1, it is characterized in that, described laser beveller comprises supporting mechanism, rotating mechanism, slipway mechanism, laser cutting head, described supporting mechanism is used for supporting described laser beveller, other all parts of described laser beveller are all directly or indirectly arranged on described supporting mechanism, and described laser beveller is directly or indirectly arranged on described Z axis guide rail by described supporting mechanism; Described rotating mechanism is directly installed on described supporting mechanism, and described rotating mechanism comprises power rotary device, rotary end, and described rotary end can rotate under the drive of described power rotary device; Described slipway mechanism is fixed on below the described rotary end of described rotating mechanism; Described laser cutting head tilt be arranged on described slipway mechanism; By described slipway mechanism, the position of the pivot axis of the relatively described rotating mechanism of focus of described laser cutting head institute Emission Lasers can be adjusted.
3. metal mask plate cutting equipment according to claim 1 and 2, it is characterized in that, described metal mask plate cutting equipment also comprises control unit, and for controlling described control, described control unit stretches tight that screen component draws stretching tight of described metal mask plate, the working method of the motion path of described motion guide rail and described laser beveller.
4. metal mask plate cutting equipment according to claim 1, it is characterized in that, the described screen component that stretches tight comprises 4 groups of clamping devices and the mount pad for installing clamping device, described mount pad is provided with attachment rail, be provided with operation slide block bottom described clamping device, described 4 groups of clamping devices are installed on the described attachment rail of described mount pad by described operation slide block.
5. the metal mask plate cutting equipment according to claim 1,2 or 4, it is characterized in that, described metal mask plate cutting equipment also comprises crossbeam and X/Z axle is dull and stereotyped, described crossbeam is arranged on described Y-axis guide rail by the slide block 1 being arranged on two ends, described X-axis guide rails assembling is on described crossbeam, described X/Z axle flat board is arranged on described X-axis guide rail by slide block 2, and described Z axis guide rails assembling is on described X/Z axle flat board.
6. metal mask plate cutting equipment according to claim 5, it is characterized in that, described metal mask plate cutting equipment also comprises Y-axis guide supporting, described Y-axis guide supporting is directly installed on described board, described Y-axis guide rails assembling is in described Y-axis guide supporting, and described Y-axis guide rail is indirectly fixedly mounted on described board by described Y-axis guide supporting.
7. the metal mask plate cutting equipment according to claim 2 or 6, is characterized in that, the supporting mechanism of described laser beveller is indirectly arranged on described Z axis guide rail by slide block 3.
8. metal mask plate cutting equipment according to claim 7, it is characterized in that, described metal mask plate cutting equipment also comprises machine vision assembly, and described machine vision assembly is arranged on described slide block 3, for capturing the pattern of described metal mask plate upper shed.
9. the metal mask plate cutting equipment according to claim 1,2,6 or 8, is characterized in that, described metal mask plate cutting equipment also comprises debris collection device, and it is inner that it is arranged on described base station, for collecting the metal fragment produced in cutting process.
10. the metal mask plate cutting equipment according to claim 1,2,6 or 8, is characterized in that, described board comprises granite platform and pedestal, and described granite platform is arranged on described pedestal, and described pedestal contacts with support base.
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CN104532183A (en) * 2015-01-26 2015-04-22 深圳市华星光电技术有限公司 Manufacturing method of high-precision mask
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CN110814531A (en) * 2019-11-21 2020-02-21 杭州海容激光技术有限公司 Clamping device for laser cutting
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CN103207182A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Multifunctional assembly test machine
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CN111299857A (en) * 2020-02-26 2020-06-19 淮安信息职业技术学院 Computer screen panel cutting equipment

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