CN103203960A - A production method for a step stencil - Google Patents
A production method for a step stencil Download PDFInfo
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- CN103203960A CN103203960A CN2012100107438A CN201210010743A CN103203960A CN 103203960 A CN103203960 A CN 103203960A CN 2012100107438 A CN2012100107438 A CN 2012100107438A CN 201210010743 A CN201210010743 A CN 201210010743A CN 103203960 A CN103203960 A CN 103203960A
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Abstract
A production method for a step stencil and the specific process flow of the method is as follows: substrate processing (cutting)->pre-treatment (degreasing, pickling, and sandblasting)->film mounting->double sided exposure->double sided developing->etching (up step areas on a PCB surface, and a printing surface)->film stripping->pre-treatment (degreasing and pickling)->laser cutting (flat openings and openings of the up step areas). By using the method, a metal stencil having up step areas on the PCB surface and the printing surface can be produced. The pattern area of the metal stencil has good opening quality, smooth hole walls, no undesirable phenomena such as blurs or jags; the position alignment precision of the opening pattern area is high; and the thickness uniformity is good, with uniformity COV less than 10%.
Description
Technical field
The present invention relates to a kind of preparation method of step template, belong to material manufacturing and manufacture field, be specifically related to that a kind of PCB face and printing surface all have the manufacture craft of the mask used for printing plate of raised step (up step) in the PCB manufacturing field.
Background technology
Along with China's electron trade develops rapidly, mould printing technology also is applied at electronics manufacturing, and the SMT printing is exactly the typical case.In the electronic product manufacture process, to weld electronic component and PCB, need earlier tin to be placed on the PCB, and have hundreds of pad need go up tin on the PCB, the position of each pad corresponding electronic component, print the disposable first-class tin the best way accurately of the pad of tin on the needs exactly.Usually the method for usefulness is to make the stainless steel substrates that countless apertures are arranged in electronics manufacturing, each hole corresponding the pad of tin on needs, then stainless steel substrates is attached on the grenadine that stretches tight, grenadine is attached on the bottom surface of print stencil net frame.
Printing stencil is the mould of print solder paste, at present the general steel mesh that adopts.And the punching block opening precision that traditional handicraft is made by laser cutting technique can not reach requirement, and plate face quality is also not high enough.The electroformed nickel mask plate then exists the plate face easily to form pin hole, rough point, and the solution instability, cost height, defective such as energy consumption is big.
The template of chemical etching is the main type of template construct.Their costs are minimum, have enough to meet the need the fastest.The making of the stainless steel template of chemical etching be by light-sensitive surface on exposing to the sun at the metal steel disc, with pin location sensitization instrument with graph exposure on metal steel disc two sides, use double-side technology simultaneously from two sides corroding metal steel disc then.The defective of etching template itself and difficulty of processing have determined the etching template to withdraw from the market gradually.Etch process then is mainly used in the ladder template.
Formation for opening, its principal mode is electroforming and laser cutting, development along with laser cutting technique and equipment, add electric throwing technology, the formed opening of laser cutting is also very smooth close to hole wall as the electroforming, add characteristics such as its cycle weak point, yield height, the laser cutting template accounts for more than 80% of world's template.
The development of PCB industry not only is confined to plane template, and existing PCB industry development is rapid, and some have the position of particular requirement to need the spill position, as B2it printed board.Prepared 3-dimensional metal mask plate has and the identical 3-D in male structure of substrate; with corresponding concavo-convex position, protective substrate surface; and when using prepared 3-dimensional metal mask plate to shift in substrate surface relief region edge, thereby mask open can closely contact accurately contraposition with substrate.Make simultaneously have the metal mask plate corresponding with concaveconvex shape on the pcb board be after development in future trend.Whether the tin cream on the pad is smooth, even, whether consumption suitably will directly influence the effect of electronic component SMT, when precision electronic element pad and hot pressing finger is particularly arranged, requires higher to printing stencil.
How to develop a kind of printing stencil or even metallic nickel printing stencil of making than common steel mesh, the new product that performance is more excellent, and have accurate depth-to-width ratio and the measured concavo-convex position of opening matter is most important.
Summary of the invention
The present invention is intended to solve above technical problem, invents a kind of preparation method of step template.The metal form that utilizes this manufacture craft to be made, printing surface and PCB mask have raised step (up step), and figure opening and the base openings in raised step (up step) zone have higher aligning accuracy.
A kind of preparation method of step template.Its concrete technological process is as follows:
Processing substrate (cutting) → pre-treatment (oil removing, pickling, sandblast) → pad pasting → double-sided exposure → two-sided development → etching (PCB face, printing surface have raised step zone (up step)) → take off film → pre-treatment (oil removing, pickling) → laser cutting (opening of plane domain opening and raised step zone (up step))
Specifically, the concrete technological process of each step is:
(1) processing substrate: select a kind of as baseplate material in stainless steel, pure metallic nickel, the dilval, and substrate is cut into needed size;
(2) pre-treatment: after the sheet metal that cuts carried out oil removing, pickling, the two sides blasting treatment improved surface roughness, thus the adhesion of dry film and sheet metal when improving pad pasting.
Preferably, the pre-treating technology parameter is as follows:
| The oil removing time | 1～2min |
| The pickling time | 1～2min |
| The sandblast time | 2～3min |
| Pressure (pis) | 2～5 |
(3) pad pasting: select the high dry film of adhesive force, prevent that serious side corrosion phenomenon from taking place, and avoids consequent positional precision problem.After choosing dry film, carry out two-sided pad pasting;
(4) double-sided exposure: double-sided exposure, exposure area are the raised step zone of printing surface and PCB face, and the dry film after the exposure is as the diaphragm of subsequent etch technology, avoid the substrate liquid that is corroded to corrode.
(5) two-sided development: unexposed dry film is removed by two-sided developing process, and inspections of developing after the development requires not have the film of falling, rubs film, the phenomenon such as most of developing.
Preferably, the technological parameter of exposure imaging is as follows:
| Substrate size (mm) | 570*570 |
| Light exposure (mj) | 100～300 |
| Time for exposure (s) | 300～600 |
| Two-sided 1 time of development (s) | 120～180 |
(6) etching: send in the horizontal type double-side etching machine by the substrate after pad pasting, exposure, the development, etching solution is sprayed the upper and lower surface of substrate by the mode that sprays up and down, produce chemical reaction at the substrate surface that does not have the exposure dry film, etch away the layer of metal sheet, so just formed the raised step zone at printing surface and PCB face, shown in 4 among Fig. 3,4.
Preferably, etch process parameters is as follows:
| Etching solution proportion | 1.30～1.50 |
| Fe 3+Concentration (g/L) | 100～300 |
| pH | 1.4～1.8 |
| Temperature (℃) | 50～60 |
| Pressure (pis) | 10～20 |
| |
8～20Hz |
(7) take off film: after etching is finished, diaphragm cleaned to take off remove;
(8) pre-treatment: the sheet metal that cuts is carried out oil removing, pickling, and its technological parameter is identical with parameter in the step (2);
(9) laser cutting: metal otter board is cleaned up the back go up the laser cutting platform, in the raised step zone and base plan zone cutting opening, the laser cutting concrete steps are as follows:
A. after tightening, the substrate after above-mentioned operation being made is placed on the cutting base station;
B. adjust cutting parameter, adjust vertical height of laser cutting head, make its laser spot drop on printing surface;
C. launch laser by laser cutting head, cut in the open area of substrate surface.
Preferably, the technological parameter of laser cutting is as follows:
| Cutting speed (hole/hour) | 10000～20000 |
| Energy (mj) | 400～1000 |
| Gas pressure (MPa) | 0.5～5 |
| Electric current (mA) | 500～1000 |
| Laser frequency (Hz) | 6000～8000 |
| Straight cuts speed (cm.min -1） | 100～200 |
The manually compatible and semi-automatic SMT web plate measurement device of this patent invention is compared with SMT web plate measurement device in the past, and following obvious improvement is arranged:
(1) can make the metal form that PCB face, printing surface have up step;
(2) the opening quality of metal otter board graphics field is good, and hole wall is smooth, bad phenomenon such as no burr, sawtooth;
(3) the positional precision height in the opening figure zone of metal otter board;
(4) the metal otter board thickness evenness is good, and uniformity COV is in 10%.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing.
Fig. 1. the opening cutaway view in printing surface up zone
The 1-PCB substrate
The 2-template
3a-welds base station
3b-welds base station
4-plane opening
5-printing surface up zone
The opening in 6-printing surface up zone
The 7-printing surface
8-PCB face figure
Fig. 2. the opening cutaway view in PCB face up zone
The 1-PCB substrate
The 2-template
3a-welds base station
3b-welds base station
4-plane opening
5-PCB face up zone
6-PCB face up zone opening
7-mould printing face
8-template PCB face
Fig. 3. mould printing face up schematic diagram
The 1-template
2-stencil plane opening
3-mould printing face up zone
4-mould printing face up zone opening
5-mould printing face
Fig. 4. template PCB face up schematic diagram
The 1-template
2-stencil plane opening
3-template PCB face up zone
4-template PCB face up zone opening
5-template PCB face step
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
Attention problem among the concrete technological process of this religious name and the present invention in the technological process will be more detailed in the following description.
A kind of preparation method of step template.Its concrete technological process is as follows:
(1) selects a kind of as baseplate material in stainless steel, pure metallic nickel, the dilval, and substrate is cut into needed size;
(2) with after the sheet metal pickling that cuts, the polishing, carry out the two sides blasting treatment, improve surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting;
(3) simultaneously, the present invention must select the high dry film of adhesive force, prevents that serious side corrosion phenomenon from taking place, and avoids consequent positional precision problem;
(4) choose dry film after, carry out two-sided pad pasting;
(5) double-sided exposure behind the two-sided pad pasting, exposure area are the raised step zone (among Fig. 1,2 5) of printing surface and PCB face, and the dry film after the exposure is as the diaphragm of subsequent etch technology, avoid the substrate liquid that is corroded to corrode;
(6) unexposed dry film is removed by two-sided developing process, inspections of developing after the development (whether fall film, rub film, phenomenon such as develop to the greatest extent), the operation that enters etching up step as if no problem;
(7) send in the horizontal type double-side etching machine by the substrate after pad pasting, exposure, the development, etching solution is sprayed the upper and lower surface of substrate by the mode that sprays up and down, produce chemical reaction at the substrate surface that does not have the exposure dry film, etch away one deck steel disc, so just formed raised step zone (among Fig. 3,4 4) at printing surface and PCB face.
(8) after etching is finished, diaphragm cleaned to take off remove, clean up the back and go up the laser cutting platform, in the raised step zone and base plan zone cutting opening, the laser cutting concrete steps are as follows:
A. after tightening, the substrate after above-mentioned operation being made is placed on the cutting base station;
B. adjust cutting parameter, adjust vertical height of laser cutting head, make its laser spot drop on printing surface;
C. launch laser by laser cutting head, cut in the open area of substrate surface.
So just produce the step template shown in Fig. 3,4, and the printing process of this kind printing stencil as shown in Figure 1, 2, and printing surface has raised step, and its effect is mainly the number to be printed that increases printing material in printing process, be used for the welding of big element, shown in 6 among Fig. 1.And the raised step of PCB face, it mainly act as at the pcb board sunk area and carries out the material printing, shown in 6 in 2.
Carry out the processing of material according to above step, select in stainless steel, pure nickel, the dilval a kind ofly as baseplate material, adopt following preferred technological parameter, can prepare the template of high-quality, high dimensional accuracy.
The pre-treating technology parameter:
| The oil removing time | 2min |
| The pickling time | 2min |
| The sandblast time | 3min |
| Pressure (pis) | 4 |
The technological parameter of exposure imaging:
| Substrate size (mm) | 570*570 |
| Light exposure (mj) | 200 |
| Time for exposure (s) | 400 |
| Two-sided 1 time of development (s) | 160 |
Etch process parameters:
| Etching solution proportion | 1.40 |
| Fe 3+Concentration (g/L) | 200 |
| pH | 1.6 |
| Temperature (℃) | 55 |
| Pressure (pis) | 15 |
| Etching speed | 15Hz |
The technological parameter of laser cutting:
| Cutting speed (hole/hour) | 15000 |
| Energy (mj) | 600 |
| Gas pressure (MPa) | 3.5 |
| Electric current (mA) | 800 |
| Laser frequency (Hz) | 7000 |
| Straight cuts speed (cmmin -1） | 150 |
Through the web plate that above technological parameter prepares, PCB face, printing surface have the metal form of up step; The opening quality of metal otter board graphics field is good, and hole wall is smooth, bad phenomenon such as no burr, sawtooth; The positional precision height in the opening figure zone of metal otter board; The metal otter board thickness evenness is good, and uniformity COV is in 10%.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.
Claims (10)
1. the preparation method of a step template,
Its technological process is as follows:
Processing substrate (cutting) → pre-treatment (oil removing, pickling, sandblast) → pad pasting → double-sided exposure → two-sided development → etching (PCB face, printing surface have raised step (up step) zone) → take off film → pre-treatment (oil removing, pickling) → laser cutting (opening in plane domain opening and raised step (up step) zone).
2. the preparation method of step template according to claim 1 is characterized in that, baseplate material is any one in stainless steel, pure nickel, the dilval.
3. the preparation method of step template according to claim 1 is characterized in that, the PCB face of the metal otter board for preparing and printing surface all have raised step (up step) zone.
4. the preparation method of step template according to claim 1 is characterized in that, the metal otter board for preparing has opening figure, and opening figure is distributed in raised step (up step) regional peace face zone.
5. the preparation method of step template according to claim 1 is characterized in that, the pre-treating technology parameter is as follows:
。
6. the preparation method of step template according to claim 1 is characterized in that, the exposure imaging technological parameter is as follows:
。
7. the preparation method of step template according to claim 1 is characterized in that, etch process parameters is as follows:
。
8. the preparation method of step template according to claim 1 is characterized in that, the technological parameter of laser cutting is as follows:
。
9. the preparation method of step template according to claim 1 is characterized in that, when the PCB face is printing, and the one side of step template and PCB substrate contacts.
10. the preparation method of step template according to claim 1 is characterized in that, when printing surface is printing, and the one side that the step template contacts with scraper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010743.8A CN103203960B (en) | 2012-01-16 | 2012-01-16 | A kind of manufacture method of stepped formwork |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010743.8A CN103203960B (en) | 2012-01-16 | 2012-01-16 | A kind of manufacture method of stepped formwork |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203960A true CN103203960A (en) | 2013-07-17 |
| CN103203960B CN103203960B (en) | 2017-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010743.8A Expired - Fee Related CN103203960B (en) | 2012-01-16 | 2012-01-16 | A kind of manufacture method of stepped formwork |
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| Country | Link |
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| CN (1) | CN103203960B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104837303A (en) * | 2015-04-25 | 2015-08-12 | 桐城运城制版有限公司 | Production technology of printing template |
| CN110103568A (en) * | 2019-06-19 | 2019-08-09 | 赫日光电（苏州）有限公司 | A kind of production method of the laser imaging halftone of ladder shaped opening |
Citations (6)
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|---|---|---|---|---|
| WO1993018440A1 (en) * | 1992-03-12 | 1993-09-16 | Amtx, Inc. | Method for preparing and using a screen printing stencil having raised edges |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| CN1392905A (en) * | 2000-09-26 | 2003-01-22 | 伊斯曼柯达公司 | Method for producing metal mask and metal mask |
| US20040078968A1 (en) * | 2002-10-22 | 2004-04-29 | Wong Sul Kay | Printed circuit board manufacturing method |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| CN1958862A (en) * | 2006-10-13 | 2007-05-09 | 南京航空航天大学 | Electroforming method suitable to fine structure with high depth-width ratio |
-
2012
- 2012-01-16 CN CN201210010743.8A patent/CN103203960B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993018440A1 (en) * | 1992-03-12 | 1993-09-16 | Amtx, Inc. | Method for preparing and using a screen printing stencil having raised edges |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| CN1392905A (en) * | 2000-09-26 | 2003-01-22 | 伊斯曼柯达公司 | Method for producing metal mask and metal mask |
| US20040078968A1 (en) * | 2002-10-22 | 2004-04-29 | Wong Sul Kay | Printed circuit board manufacturing method |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| CN1958862A (en) * | 2006-10-13 | 2007-05-09 | 南京航空航天大学 | Electroforming method suitable to fine structure with high depth-width ratio |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104837303A (en) * | 2015-04-25 | 2015-08-12 | 桐城运城制版有限公司 | Production technology of printing template |
| CN110103568A (en) * | 2019-06-19 | 2019-08-09 | 赫日光电（苏州）有限公司 | A kind of production method of the laser imaging halftone of ladder shaped opening |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103203960B (en) | 2017-03-15 |
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