CN103205714A - A metal mask for vapor plating and a production method thereof - Google Patents

A metal mask for vapor plating and a production method thereof Download PDF

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Publication number
CN103205714A
CN103205714A CN2012100107635A CN201210010763A CN103205714A CN 103205714 A CN103205714 A CN 103205714A CN 2012100107635 A CN2012100107635 A CN 2012100107635A CN 201210010763 A CN201210010763 A CN 201210010763A CN 103205714 A CN103205714 A CN 103205714A
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Prior art keywords
metal mask
evaporation
mask plate
preparation
electroforming
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CN2012100107635A
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CN103205714B (en
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魏志凌
高小平
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Kunshan Power Stencil Co Ltd
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Kunshan Power Stencil Co Ltd
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Abstract

The present invention relates to the technical filed of electroformed alloy deposition, and discloses a metal mask for vapor plating. Materials for the metal mask for vapor plating include iron and nickel, wherein the iron content is 63%-65%. The metal mask for vapor plating has good surface brightness, and a coating surface is good in quality; and compared with an etched invar alloy, the metal mask for vapor plating is low in the cost, simple in the process and energy-saving, and has a high opening precision, and openings with good quality. Meanwhile, the present invention also provides a production method for the metal mask for vapor plating.

Description

A kind of evaporation metal mask plate and preparation method thereof
Technical field
The invention belongs to electromolding alloy codeposition technique field, be specifically related to high Fe content evaporation metal mask plate and preparation method thereof of making by electroforming process.
Background technology
Invar alloy contains 32%~36% nickel usually, and Invar alloy also is invar, and its average coefficient of expansion is generally 1.5 * 10 -6℃.Nickeliferously reached 1.8 * 10 at 36% o'clock -8℃, and in the time of-80 ℃ to+100 ℃, all do not change.Nickel content increase and decrease within the specific limits can cause the rapid variation of iron, the nickeline wire coefficient of expansion.Therefore for the very high evaporation mask plate of accuracy requirement, Invar alloy is first-selected material.Other materials all can be because of being heated and the expansion effects precision in evaporate process, thereby influenced quality product greatly.
But Invar alloy all is to adopt the method for melting to obtain simultaneously, and power consumption is high, the technical requirements height, thereby price also is quite high.Seriously limited the Invar alloy development prospect.
At present, traditional technology generally adopts the method for chemical milling directly to etch the opening figure that can satisfy evaporation process at Invar alloy, but there is certain shortcoming in it: be unfavorable for the demoulding, the opening low precision, therefore hole wall is rough etc., is badly in need of a kind of opening quality is good, precision is high, tapering is good evaporation with mask plate and corresponding preparation method.
Summary of the invention
(1) technical problem that will solve
The technical problem to be solved in the present invention provides a kind of evaporation mask plate that approaches with the Invar alloy iron level, its cost reduces, the homogeneity height, and coated sheet face and opening quality are good, and thermal linear expansion coefficient is little, satisfy the evaporation requirement, also need to provide the preparation method of this kind of preparation mask plate simultaneously.
(2) technical scheme
In order to solve the problems of the technologies described above, the invention provides a kind of evaporation metal mask plate, described evaporation comprises iron and nickel with the material of metal mask plate, wherein iron level is 63%~65%.
Preferred as technique scheme, described evaporation is the one-level light with the surface brightness of metal mask plate, described plate surface uniformity≤5%.
Preferred as technique scheme, described evaporation is with having the opening figure zone that meets the evaporation requirement on the metal mask plate; Described evaporation is 20~70 μ m with the thickness range of metal mask plate.
The present invention also provides the preparation method of a kind of above-mentioned evaporation with metal mask plate, and described method comprises: select stainless steel core, washing, activation, electroforming, stripping operation; Described washing operation specifically comprises oil removing, pickling, sandblast and ultrasonic embathing.
Preferred as technique scheme, described electroforming is specially, and as electroforming solution, metal anode is nickel block with sulfate system, is placed in the described electroforming solution, and described stainless steel core forms the evaporation metal mask plate as negative plate in the negative plate galvanic deposit;
The composition range of described electroforming solution is:
Single nickel salt 220~260g/L
Nickelous chloride 30~50g/L
Boric acid 40~50g/L
Ferrous sulfate 35~45g/L.
Preferred as technique scheme, the composition that also adds in the described electroforming solution has:
Stablizer 0.5~1ml/L
Wetting agent 0.5~1ml/L
Agent 1~5ml/L walks.
Preferred as technique scheme, described electroforming solution:
pH 3.0~3.4
35~40 ℃ of temperature
Current density 1~3A/dm 2
Plating speed 9~12 μ m/h.
Preferred as technique scheme, also be provided with the anode baffle parallel with described negative plate between described electroforming solution inner cathode and the anode, described anode baffle is provided with a plurality of perforates that the casting solution of can powering passes through, and described anode baffle is used for the homogeneity that the control evaporation is used metal mask plate coating.
Preferred as technique scheme, described activation act is specially: soak time 2~5min, activation solution concentration 1~2mol/L, 30 ℃ of activation temperatures.
Preferred as technique scheme, described stripping means is the ultrasonic wave demoulding, and is concrete, ultrasonic time 1~3min, 65 ℃ of calcining temperatures, releasing liquid concentration 1~2mol/L.
(3) beneficial effect
A kind of evaporation metal mask plate that technique scheme provides, described evaporation comprises iron and nickel with the material of metal mask plate, wherein iron level is 63%~65%.The present invention also provides the preparation method of a kind of this evaporation with metal mask plate.This kind evaporation can access the evaporation metal mask plate of high Fe content with metal mask plate, and plate face luminance brightness is good, and coating surface quality is good; Cost than etching Invar alloy plate is low, and technology is simple, saves the energy; Than the opening precision height of etching Invar alloy plate, the opening quality is good.
Description of drawings
Fig. 1 is the process flow diagram that the evaporation of the embodiment of the invention is used the metal mask plate preparation method.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples are used for explanation the present invention, but are not used for limiting the scope of the invention.
A kind of evaporation metal mask plate that the embodiment of the invention provides, evaporation comprises iron and nickel with the material of metal mask plate, wherein iron level is 63%~65%.Preferred iron level is that 63.8% steaming is crossed and use metal mask plate, and its performance more is similar to the component percentages of Invar alloy, can better meet the evaporation requirement, the quality of raising evaporation product.
Evaporation is the one-level light with the surface brightness of metal mask plate, plate surface uniformity≤5%.This evaporation has control magnetic property height with metal mask plate, plasticity, toughness height, material surface brighting, plate surface uniformity 5% with characteristic such as interior.Kind of evaporation can access the evaporation metal mask plate of high Fe content with metal mask plate, and plate face luminance brightness is good, and coating surface quality is good; Cost than etching Invar alloy plate is low, and technology is simple, saves the energy; Than the opening precision height of etching Invar alloy plate, the opening quality is good.
Evaporation is with having the opening figure zone that meets the evaporation requirement on the metal mask plate; Evaporation is 20~70 μ m with the thickness range of metal mask plate.
Present embodiment also provides the preparation method of a kind of above-mentioned evaporation with metal mask plate, in conjunction with Figure of description 1, it comprises: select the stainless steel core, the stainless steel core can be selected as 304,306 or 430 stainless steels, the principle of choosing is minute surface light and surperficial no marking for the stainless steel mandrel surface, thickness can select 1.8 or 2.0cm as the core material.Be the electroforming better effects if, need carry out following operation washing, activation, electroforming, stripping operation to core.Concrete washing operation mainly comprises oil removing, pickling, sandblast and ultrasonic embathing.Core after the process washing is handled for the bonding force between increase coating and the core, need carry out activation treatment to core before the electroforming operation.Concrete activation parameter: soak time 2~5min, activation solution concentration 1~2mol/L, 30 ℃ of activation temperatures.Control soak time well, can be so that the better combination of coating and core, making it both is not easy to come off also easily peels off.
Core after overactivation can carry out the electroforming operation, but is can preferably once not wash operation again owing to existing the impurity substances in the activation act to be attached to mandrel surface when guaranteeing electroforming, and mandrel surface is cleaned again.
After above-mentioned steps, can carry out the electroforming step.As negative plate, nickel block is metal anode to 430, the 306 or 304 material stainless steels of the wide size 600mm*800mm of the preferred plate face length of present embodiment as the electroforming core.
The Fe-Ni alloy electrodeposition belongs to unusual codeposition, the Fe(E that current potential is negative 0=-0.44V) is on the contrary than the Ni(E of current potential calibration 0=-0.25V) preferentially separated out, and makes alloying constituent wayward.In addition, different galvanic deposit parameters also has a significant impact alloying constituent as solution composition, current density, bath temperature, pH and additive, and control well the deposition layer composition be the preparation high-quality alloy material key.So the composition range of preferred electroforming solution is in the present embodiment:
Single nickel salt 220~260g/L
Nickelous chloride 30~50g/L
Boric acid 40~50g/L
Ferrous sulfate 35~45g/L.
The addition manner of concrete ferro element is by ferrous sulfate being dissolved in the pure water, pouring in the electroforming solution after treating to dissolve fully.
Use in the metal mask plate plating bath Fe at evaporation 2+Stablizer be very crucial, this is because in air or in the electroforming process, the Fe in the plating bath 2+Be oxidized to Fe easily at anode 3+, in having the plating bath of stablizer, when pH surpasses 2.5 left and right sides, just might not generate precipitation, the aspect is when using than high current density, because a large amount of hydrogen ion discharge cause Fe (OH) near the regional area of cathode surface in addition 3Precipitation take place, be adsorbed onto cathode surface and cause pin hole, burr and fragility.Therefore, in plating bath, must add a certain amount of Fe 2+The buffer reagent of stablizer and q.s just can make plating bath keep stable.Add function of stabilizer for to stablize plating bath in electroforming solution, it prevents Fe 2+Be oxidized to Fe 3+Concrete additive is formed and component content is:
Stablizer 0.5~1ml/L
Wetting agent 0.5~1ml/L
Agent 1~5ml/L walks.
Adjust ratio and the content of additive, the product surface quality good (free of pinholes, pit, coating light) that electroforming is formed.Electroforming solution is configured required electroformed nickel ferrous solution according to said ratio, it is stirred, be heated to temperature requiredly, can carry out electroforming operation.
Found through experiments: in the solution each factor the electroforming evaporation is closed with the influence of iron level in the metal mask plate is temperature current density pH.Fe 2+The increase of ionic concn is conducive to the raising of iron level in the alloy.In temperature was 35~50 ℃ of scopes, iron level reduced with the rising of temperature in the alloy.Totally in rising trend with iron level in the increase alloy of current density, and ascendant trend is obvious.With the rising of PH, iron level descends on the contrary in the alloy.So the preferred electroforming solution parameters of present embodiment is respectively:
pH 3.0~3.4
35~40 ℃ of temperature
Current density 1~3A/dm2
Plating speed 15~30 μ m/h.
Control the electroforming parameter well, comprise temperature, pH, current density, Fe 2+/ Ni 2+Concentration ratio etc., make the iron level of the mask plate coating that electroforming comes out reach above-mentioned requirements.
Concrete evaporation is controlled by electroforming time and current density in the control preparation process with the thickness of metal mask plate coating, evaporation is 20~70 μ m with the thickness range of metal mask plate in the present embodiment, and evaporation is controlled by ratio and the amount of control additive with the surface quality of metal mask plate coating.
The control evaporation is with the homogeneity of metal mask plate coating, also is provided with the anode baffle parallel with negative plate between electroforming solution inner cathode and the anode, and anode baffle is provided with a plurality of perforates that the casting solution of can powering passes through.During electroforming, subsidiary conditions comprise the anode baffle that can improve coating uniformity, are used for reducing vibrations and the stirring of pin hole, alleviate the cycling time of coating fringing effect and the combination of intercycle time and flow.
The evaporation metal mask plate coating that the core of finishing for electroforming and surface thereof form, can reclaim washing, be conducive to the compositions such as electroforming solution of its surface attachment are removed and efficient recovery, wash again subsequently it is removed totally fully, in order to enter following operation.
After finishing electroforming, need carry out the demoulding to coating and handle, the preferred stripping means of present embodiment is the ultrasonic wave demoulding, and is concrete, ultrasonic time 1~3min, 65 ℃ of calcining temperatures, releasing liquid concentration 1~2mol/L.Can also carry out following operation to the evaporation after the demoulding with metal mask plate, as washing, dispose coating surface because remaining impurity is handled in the demoulding, dry processing after cleaning finishes, namely can obtain the evaporation metal mask plates that need more.
As can be seen from the above embodiments, a kind of evaporation metal mask plate that the embodiment of the invention provides, evaporation comprises iron and nickel with the material of metal mask plate, wherein iron level is 63%~65%.The embodiment of the invention also provides a kind of electrocasting method that this kind evaporation is used metal mask plate for preparing simultaneously, and this electrocasting method can obtain the higher evaporation metal mask plate of iron-holder, and production cost is low, and controllability is strong.Owing to be deposition layer, it has unique high-density and low hole to the evaporation that while present method provides with metal mask plate; Can also control the moiety of material by conditions such as parameter, solution composition are changed on the technology; Higher productivity and excellent economy are arranged, easily a large amount of preparation thin-film materials; The required equipment investment is relatively low.This kind evaporation can access the evaporation metal mask plate of high Fe content with metal mask plate, and plate face luminance brightness is good, and coating surface quality is good; Cost than etching Invar alloy plate is low, and technology is simple, saves the energy; Than the opening precision height of etching Invar alloy plate, the opening quality is good.
It below only is preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the technology of the present invention principle; can also make some improvement and replacement, these improvement and replacement also should be considered as protection scope of the present invention.

Claims (10)

1. an evaporation metal mask plate is characterized in that, described evaporation comprises iron and nickel with the material of metal mask plate, and wherein iron level is 63%~65%.
2. according to the evaporation metal mask plate under the claim 1, it is characterized in that described evaporation is the one-level light with the surface brightness of metal mask plate, described plate surface uniformity≤5%.
3. according to the evaporation metal mask plate under the claim 1, it is characterized in that described evaporation is with having the opening figure zone that meets the evaporation requirement on the metal mask plate; Described evaporation is 20~70 μ m with the thickness range of metal mask plate.
4. the preparation method of the described evaporation usefulness of claim 1 metal mask plate is characterized in that described method comprises: select stainless steel core, washing, pad pasting, exposure, development, activation, electroforming, stripping operation; Described washing operation specifically comprises oil removing, pickling, sandblast and ultrasonic embathing.
5. evaporation according to claim 4 is with the preparation method of metal mask plate, it is characterized in that, described electroforming is specially, with sulfate system as electroforming solution, metal anode is nickel block, be placed in the described electroforming solution, described stainless steel core forms the evaporation metal mask plate as negative plate in the negative plate galvanic deposit;
The composition range of described electroforming solution is:
Single nickel salt 220~260g/L
Nickelous chloride 30~50g/L
Boric acid 40~50g/L
Ferrous sulfate 35~45g/L.
6. evaporation according to claim 5 is characterized in that with the preparation method of metal mask plate, and the composition that also adds in the described electroforming solution has:
Stablizer 0.5~1ml/L
Wetting agent 0.5~1ml/L
Agent 1~5ml/L walks.
7. evaporation according to claim 5 is characterized in that described electroforming solution with the preparation method of metal mask plate:
pH 3.0~3.4
35~40 ℃ of temperature
Current density 1~3A/dm 2
Plating speed 9~12 μ m/h.
8. evaporation according to claim 5 is with the preparation method of metal mask plate, it is characterized in that, also be provided with the anode baffle parallel with described negative plate between described electroforming solution inner cathode and the anode, described anode baffle is provided with a plurality of perforates that the casting solution of can powering passes through, and described anode baffle is used for the homogeneity that the control evaporation is used metal mask plate coating.
9. evaporation according to claim 4 is characterized in that described activation act is specially: soak time 2~5min, activation solution concentration 1~2mol/L, 30 ℃ of activation temperatures with the preparation method of metal mask plate.
10. evaporation according to claim 4 is characterized in that described stripping means is the ultrasonic wave demoulding, and is concrete, ultrasonic time 1~3min, 65 ℃ of calcining temperatures, releasing liquid concentration 1~2mol/L with the preparation method of metal mask plate.
CN201210010763.5A 2012-01-16 2012-01-16 A metal mask for vapor plating and a production method thereof Expired - Fee Related CN103205714B (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104451537A (en) * 2014-12-19 2015-03-25 昆山工研院新型平板显示技术中心有限公司 Manufacturing method and structure of mask plate for evaporation process
CN108796440A (en) * 2018-07-26 2018-11-13 京东方科技集团股份有限公司 A kind of preparation method of mask plate, mask plate, evaporated device
CN109402680A (en) * 2018-11-02 2019-03-01 徐州晶迪电子有限公司 A kind of preparation method of MOS transistor mask plate material
JP2019157264A (en) * 2018-03-13 2019-09-19 アドバンテック グローバル リミテッドAdvantech Global Ltd Iron nickel alloy shadow mask and manufacturing method thereof

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Publication number Priority date Publication date Assignee Title
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JP2003253434A (en) * 2002-03-01 2003-09-10 Sanyo Electric Co Ltd Vapor deposition method, and method for manufacturing display device
CN1804138A (en) * 2005-11-14 2006-07-19 深圳市允升吉电子有限公司 Mask electro-forming method for vaporization coating of organic light-emitting display
JP2006347165A (en) * 2005-05-20 2006-12-28 Process Lab Micron:Kk Metal mask for making pattern
CN101376996A (en) * 2008-09-25 2009-03-04 上海交通大学 Micro-electroforming apparatus
CN201416042Y (en) * 2009-06-17 2010-03-03 赛特莱特(佛山)塑胶制品有限公司 Electroplating tank

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
CN2085293U (en) * 1991-04-05 1991-09-25 北京市印刷技术研究所 Electric casting device
JP2003253434A (en) * 2002-03-01 2003-09-10 Sanyo Electric Co Ltd Vapor deposition method, and method for manufacturing display device
JP2006347165A (en) * 2005-05-20 2006-12-28 Process Lab Micron:Kk Metal mask for making pattern
CN1804138A (en) * 2005-11-14 2006-07-19 深圳市允升吉电子有限公司 Mask electro-forming method for vaporization coating of organic light-emitting display
CN101376996A (en) * 2008-09-25 2009-03-04 上海交通大学 Micro-electroforming apparatus
CN201416042Y (en) * 2009-06-17 2010-03-03 赛特莱特(佛山)塑胶制品有限公司 Electroplating tank

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104451537A (en) * 2014-12-19 2015-03-25 昆山工研院新型平板显示技术中心有限公司 Manufacturing method and structure of mask plate for evaporation process
JP2019157264A (en) * 2018-03-13 2019-09-19 アドバンテック グローバル リミテッドAdvantech Global Ltd Iron nickel alloy shadow mask and manufacturing method thereof
CN108796440A (en) * 2018-07-26 2018-11-13 京东方科技集团股份有限公司 A kind of preparation method of mask plate, mask plate, evaporated device
CN109402680A (en) * 2018-11-02 2019-03-01 徐州晶迪电子有限公司 A kind of preparation method of MOS transistor mask plate material
CN109402680B (en) * 2018-11-02 2021-11-16 徐州晶迪电子有限公司 Preparation method of mask plate material for MOS transistor

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