CN103205697B - Vapor deposition mask plate and manufacture method thereof - Google Patents

Vapor deposition mask plate and manufacture method thereof Download PDF

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Publication number
CN103205697B
CN103205697B CN201210010757.XA CN201210010757A CN103205697B CN 103205697 B CN103205697 B CN 103205697B CN 201210010757 A CN201210010757 A CN 201210010757A CN 103205697 B CN103205697 B CN 103205697B
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China
Prior art keywords
electroformed layer
mask plate
vapor deposition
exposure
deposition mask
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Expired - Fee Related
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CN201210010757.XA
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Chinese (zh)
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CN103205697A (en
Inventor
魏志凌
高小平
赵录军
郑庆靓
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Kunshan Power Stencil Co Ltd
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Kunshan Power Stencil Co Ltd
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Priority to CN201210010757.XA priority Critical patent/CN103205697B/en
Publication of CN103205697A publication Critical patent/CN103205697A/en
Application granted granted Critical
Publication of CN103205697B publication Critical patent/CN103205697B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The present invention relates to a kind of manufacture method of Vapor deposition mask plate, successively through core pre-treatment, pad pasting, exposure, development, electroforming, aftertreatment, secondary pad pasting, exposure, development, secondary electroforming, take off the steps such as film, washing, drying, stripping.The invention still further relates to a kind of Vapor deposition mask plate, it is characterized in that, comprise the first electroformed layer and the second electroformed layer, the little opening of described first electroformed layer is less than the big uncork of described second electroformed layer.The mask plate manufactured by the present invention can ensure in electroforming mask plate evaporate process indeformable, and can improve welding property; Traditional masks plate thickeies one deck, neither affects particle deposition effect in evaporation, play reinforcement effect again simultaneously, improve positional precision.

Description

Vapor deposition mask plate and manufacture method thereof
Technical field
The present invention relates to a kind of mask plate and manufacture method thereof, particularly relate to Vapor deposition mask plate and manufacture method thereof.
Background technology
Along with the development of science and technology, the utilization of organic light emitting display (OLED) is more and more wider, due to its not only possess the brightness of CRT monitor high, consume the frivolous of the few and LCD display of the energy, also have not by environmental limit, the outstanding advantages not needing backlight.Even if also easily pattern can be seen clearly under sunlight again and have the function of convolution.The manufacture key link of OLED luminous organic material is applied to ITO surface, and its quality directly determines the quality of OLED, needs to use two kinds of mask plates in making, and wherein one is metal mask plate, as deposition mask evaporation metal strip negative electrode on device; This template generally adopts CRT shadow mask fine etching technique to make metal mask plate, and its method has following steps: pre-treatment, pad pasting, development, etching, demoulding, cleaning, drying.The defect of this method is: need to carry out on certain thickness metal sheet, make mask thickness at least at more than 0.05mm, there is sideetching, and etching is based on chemical dissolution, the open surface formed is crude, hole wall is not too smooth, and be unfavorable for that organic granular transfers to ITO surface completely, precision comparison is low.
The mode of current electroforming makes the existing application of evaporation mask plate, but electroforming this kind of mask plate exists inborn deficiency: if electroformed layer is blocked up, then can there is occlusion effect, affect the effect of evaporation; If electroformed layer does thin, the generation of occlusion effect can be reduced, meet evaporation requirement, but thin mask plate is yielding in making and welding process, and cause product rejection, stability is very poor, wayward, and because thermal expansion causes positional precision deviation in evaporate process.
Summary of the invention
The invention provides a kind of manufacture method of Vapor deposition mask plate and the manufacture method of organic light emitting display, can ensure in electroforming mask plate evaporate process indeformable, and solve the problem of position deviation in evaporate process, the technical problem of not easily welding in the not high and electroforming mask plate assembling process of the two-layer bonding force of electroforming can also be solved.
For above problem, the present invention proposes following scheme:
A manufacture method for Vapor deposition mask plate, is characterized in that, at twice electroforming this kind of mask plate.
Preferably, the concrete steps of described manufacture method are followed successively by: core pre-treatment, pad pasting, exposure, development, electroforming, aftertreatment, secondary pad pasting, exposure, development, secondary electroforming, take off film, washing, drying, stripping.
First electroformed layer in little opening figure region is had in the described core Cast Strip that powers on.
Control described first electroformed layer thickness range in 20 ~ 50um.
Described aftertreatment is for carrying out surface sand-blasting process.
Secondary pad pasting, exposure on described first electroformed layer, the graphics field of described step of exposure exposure is big uncork, namely the little opening figure region of described first electroformed layer is only exposed, do not expose the non-graphic region of described first electroformed layer, the big uncork of described exposure is greater than the little opening of described first electroformed layer.
Control described second electroformed layer thickness range in 30 ~ 50um.
A kind of Vapor deposition mask plate, is characterized in that, formed by above-mentioned manufacture method manufacture.
Preferably, Vapor deposition mask plate comprises the first electroformed layer and the second electroformed layer, and the little opening of described first electroformed layer is less than the big uncork of described second electroformed layer.
The opening of described the first layer is made up of a lot of elongate strip opening.
The mask plate manufactured by the present invention can ensure in electroforming mask plate evaporate process indeformable, and can improve welding property; Traditional masks plate thickeies one deck, neither affects particle deposition effect in evaporation, play reinforcement effect again simultaneously, improve positional precision.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
Fig. 1 is individual layer Vapor deposition mask plate;
Fig. 2 is double-deck Vapor deposition mask plate;
Fig. 3 is double-deck Vapor deposition mask plate opening figure region partial enlarged drawing.
In figure, 1 is big uncork, and 2 is little opening, and 3 is elongate strip opening.
Embodiment
Embodiment
The Vapor deposition mask plate through secondary electroforming according to Fig. 2, the concrete steps of manufacture are followed successively by: core pre-treatment → pad pasting → exposure → development → electroforming → aftertreatment → secondary pad pasting → exposure → development → secondary electroforming → take off film → washing → drying → stripping.
By 1.8mm core after oil removing, washing, sandblasting, washing, air-dry pretreatment procedure, stick dry film, expose required opening figure region by exposure machine, after put into electrotyping bath electroforming the first layer coating; By controlling the electroforming time, the parameters such as electroforming solution concentration, by the first electroformed layer gauge control within the scope of 20 ~ 50um; After first time electroforming completes, sandblasting is carried out to plate face, to strengthen the bonding force between electroformed layer.
Secondary pad pasting, exposure on the first electroformed layer again, the graphics field of the second electroformed layer is big uncork, does not cover the graphics field of the first layer, only covers without graphics field.
By controlling the electroforming time, the parameters such as electroforming solution concentration, by second time electroformed layer gauge control within the scope of 30 ~ 50um.So just can producing the Vapor deposition mask plate to having thickening effect, the opening effect of electroformed layer can not be affected simultaneously.
As Figure 2-3, a kind of Vapor deposition mask plate, Vapor deposition mask plate comprises the first electroformed layer and the second electroformed layer, and the little opening 2 of described first electroformed layer is less than the big uncork 1 of described second electroformed layer.The little opening 2 of described first electroformed layer is made up of a lot of elongate strip opening 3.
Above embodiment object is the present invention is described, but not limits the scope of the invention, and all simple transformation made under the condition without prejudice to spiritual principles of the present invention all fall within the scope of protection of the present invention.

Claims (5)

1. the manufacture method of a Vapor deposition mask plate, described method is Vapor deposition mask plate described in electroforming at twice, its concrete steps are followed successively by: core pre-treatment, pad pasting, exposure, development, electroforming, aftertreatment, secondary pad pasting, exposure, development, secondary electroforming, take off film, washing, drying, stripping
It is characterized in that there is first electroformed layer in little opening figure region in the described core Cast Strip that powers on; Secondary pad pasting, exposure on described first electroformed layer, the graphics field of described step of exposure exposure is big uncork, namely the little opening figure region of described first electroformed layer is only exposed, do not expose the non-graphic region of described first electroformed layer, the big uncork of described exposure is greater than the little opening of described first electroformed layer; Described aftertreatment is for carrying out surface sand-blasting process.
2. manufacture method according to claim 1, is characterized in that, controls described first electroformed layer thickness range in 20 ~ 50um.
3. manufacture method according to claim 1, is characterized in that, controls the second electroformed layer thickness range in 30 ~ 50um.
4. a Vapor deposition mask plate, it is characterized in that, formed by the manufacture method manufacture described in any one of claim 1-3, described Vapor deposition mask plate comprises the first electroformed layer and the second electroformed layer, and the little opening of described first electroformed layer is less than the big uncork of described second electroformed layer.
5. Vapor deposition mask plate according to claim 4, is characterized in that, the opening of described first electrolytic coating is made up of a lot of elongate strip opening.
CN201210010757.XA 2012-01-16 2012-01-16 Vapor deposition mask plate and manufacture method thereof Expired - Fee Related CN103205697B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210010757.XA CN103205697B (en) 2012-01-16 2012-01-16 Vapor deposition mask plate and manufacture method thereof

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Application Number Priority Date Filing Date Title
CN201210010757.XA CN103205697B (en) 2012-01-16 2012-01-16 Vapor deposition mask plate and manufacture method thereof

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CN103205697A CN103205697A (en) 2013-07-17
CN103205697B true CN103205697B (en) 2016-03-02

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103589994A (en) * 2013-10-09 2014-02-19 昆山允升吉光电科技有限公司 Preparation method of evaporation mask plate
CN104451537B (en) * 2014-12-19 2017-02-22 昆山工研院新型平板显示技术中心有限公司 Manufacturing method and structure of mask plate for evaporation process
KR102474454B1 (en) * 2015-02-10 2022-12-06 다이니폰 인사츠 가부시키가이샤 Deposition mask manufacturing method and deposition mask
WO2019014947A1 (en) * 2017-07-21 2019-01-24 深圳市柔宇科技有限公司 Mask manufacturing method and mask
CN108486616B (en) * 2018-03-13 2020-05-05 阿德文泰克全球有限公司 Metal shadow mask and method for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1804138A (en) * 2005-11-14 2006-07-19 深圳市允升吉电子有限公司 Mask electro-forming method for vaporization coating of organic light-emitting display
CN101230472A (en) * 2007-01-26 2008-07-30 富准精密工业(深圳)有限公司 Method for manufacturing airtight cavity structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002266094A (en) * 2001-03-08 2002-09-18 Ricoh Co Ltd Plating or electroforming method, and method for forming test specimen as well as method for improving adhesion property of plating formed by the plating or electroforming method
CN202530147U (en) * 2012-01-16 2012-11-14 昆山允升吉光电科技有限公司 Mask plate for vapor deposition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1804138A (en) * 2005-11-14 2006-07-19 深圳市允升吉电子有限公司 Mask electro-forming method for vaporization coating of organic light-emitting display
CN101230472A (en) * 2007-01-26 2008-07-30 富准精密工业(深圳)有限公司 Method for manufacturing airtight cavity structure

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